Claims
- 1. A mounting substrate for a non-reciprocal circuit element comprising:(a) at least two input/output land patterns to which external input/output terminals for inputting/outputting signals are connected as land patterns on which the non-reciprocal circuit element is mounted and (b) at least one grounding land pattern to which external ground terminals are connected as land patterns on which the non-reciprocal circuit element is mounted, and (c) said mounting substrate having an upper surface; and said non-reciprocal circuit element configured as an assembly and having a bottom surface; wherein said bottom surface of the assembly is mounted on the upper surface of the mounting substrate; said assembly having at least a ferrite and transmission lines folded over the ferrite; and at least two external input/output terminals for transferring a signal to and from an external unit; and at least one of the external grounding terminals for grounding, wherein at least one of the external grounding terminals is set between the two external input/output terminals; and a part of the at least one grounding land pattern is set between the at least two input/output land patterns.
- 2. A method of mounting a circuit for non-reciprocally transmitting a signal on a substrate, comprising the steps of:(a) forming the circuit as an assembly having at least a ferrite and transmission lines folded over the ferrite; (b) forming at least two input/output land patterns for input and output terminals on the mounting substrate; (c) forming at least one grounding land pattern for a grounding terminal on the mounting substrate, and positioning the ground land pattern between the two input/output land patterns; (d) connecting the transmission lines to the input/output land patterns on the mounting substrate; and (e) connecting the circuit to the least one grounding land pattern on the mounting substrate.
- 3. The method of claim 2 in which step (c) includes forming the at least one grounding land pattern at one end of the mounting substrate; andforming additional grounding land patterns at an opposing end of the mounting substrate.
- 4. The method of claim 3 in which the additional grounding land patterns formed at the opposing end of the mounting substrate are formed free-of any input/output land pattern.
Priority Claims (3)
Number |
Date |
Country |
Kind |
10-270858 |
Sep 1998 |
JP |
|
10-344613 |
Dec 1998 |
JP |
|
10-349108 |
Dec 1998 |
JP |
|
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 09/406,260 filed Sep. 24, 1999 now U.S. Pat. No. 6,396,361.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4236125 |
Bernard et al. |
Nov 1980 |
A |
5159294 |
Ishikawa et al. |
Oct 1992 |
A |
Foreign Referenced Citations (2)
Number |
Date |
Country |
06-164212 |
Jun 1994 |
JP |
10-084203 |
Mar 1998 |
JP |