Claims
- 1. A non-stick coating composition comprising:a silicone resin selected from the group consisting of dimethyl polysiloxanes, polyester-modified methylphenyl polysiloxanes and hydroxyl functional silicone resins; a zinc metal salt silicone resin curing agent; a polydimethylsiloxane liquid compound silicone release agent; a solvent; and an effective amount of a 2,6-disubstituted phenol antioxidant.
- 2. A non-stick coating composition comprising:a silicone resin selected from the group consisting of dimethyl polysiloxanes, polyester-modified methylphenyl polysiloxanes and hydroxyl functional silicone resins; a silicone resin curing agent; a silicone release agent; a solvent; and an effective amount of butylated hydroxy toluene antioxidant.
- 3. A non-stick coating composition comprising:a silicone resin selected from the group consisting of dimethyl polysiloxanes, polyester-modified methylphenyl polysiloxanes and hydroxyl functional silicone resins; a zinc neodecanoate silicone resin curing agent; a silicone release agent; a solvent; and an effective amount of a hindered phenol antioxidant.
- 4. A non-stick coating composition comprising:a silicone resin selected from the group consisting of dimethyl polysiloxanes, polyester-modified methylphenyl polysiloxanes and hydroxyl functional silicone resins; a silicone resin curing agent; a silicone release agent; a solvent; and an effective amount of a hindered phenol antioxidant, wherein said silicone resin release agent is used in an amount of from about 0.1 to about 5.0 percent by weight, said curing catalyst is used in an amount of from about 0.05 to about 2.0 percent by weight and said hindered phenol is used in an amount of from about 0.1 to about 4.0 percent by weight of the silicone resin.
RELATED APPLICATIONS
This a divisional application of application Ser. No. 09/576,886 filed on May 24, 2000, now U.S. Pat. No. 6,423,417. The disclosure of this application is herein incorporated by reference in its entirety.
US Referenced Citations (23)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0 471 589 |
Aug 1991 |
EP |
0 471 589 |
Aug 1991 |
EP |
0 471 589 |
Aug 1991 |
EP |
1512505 |
Jun 1978 |
GB |
08103913 |
Apr 1996 |
JP |
WO 9618497 |
Jun 1996 |
WO |
Non-Patent Literature Citations (1)
Entry |
abstract of JP 02-073893 A. |