Claims
- 1. A hot melt adhesive composition comprising:(a) from about 25 to about 90 percent by weight of at least one water dispersible copolyester; (b) from about 5 to about 50 percent by weight of a plasticizer wherein said plasticizer is solid at ambient temperature; and (c) from 0 to about 70 percent by weight of a compatible tackifier; wherein said adhesive composition is dispersible in water.
- 2. The adhesive composition of claim 1 wherein said plasticizer recrystallizes in the adhesive composition.
- 3. The adhesive composition of claim 1 wherein said plasticizer is a cyclohexane dimethanol dibenzoate compound.
- 4. The adhesive of claim 1 wherein said adhesive bonds at least one super absorbent polymer.
- 5. The hot melt adhesive of claim 1 wherein the viscosity of said adhesive is less than about 12,000 cps at 300° F.
- 6. The adhesive of claim 1 wherein said adhesives resists cold flow.
- 7. The hot melt adhesive of claim 1 wherein at least one of said water dispersible copolyesters has a viscosity less than about 7,000 cps at 177° C.
- 8. A hot melt adhesive composition comprising at least about 50 percent by weight of a blend of at least two branched water dispersible copolyesters wherein at least one of said copolyesters has a viscosity of less than about 7,000 cps at 177° C. and at lest one of said copolyesters has a viscosity of greater than about 28,000 cps at 177° C.
- 9. The hot melt adhesive of claim 8 wherein said first copolyester and said second copolyester are combined at a weight ratio of from about 0.25:1 to about 2:1.
- 10. The hot melt adhesive of claim 8 wherein said adhesive is water dispersible.
- 11. A pressure sensitive adhesive comprising:(a) from about 25 to about 90 percent by weight of at least one water dispersible copolyester; (b) from about 5 to about 50 percent by weight of a plasticizer; and (c) from about 3 to about 20 percent by weight of a block copolymer; wherein said adhesive is repulpable.
RELATED APPLICATIONS
This application is a continuation-in-part of U.S. Pat. No. 6,087,990, Ser. No. 08/562,038 filed Nov. 22, 1995, which issued on Jul. 11, 2000.
US Referenced Citations (12)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0 333 515 |
Mar 1989 |
EP |
2295553 |
Jun 1996 |
GB |
WO 9518191 |
Jul 1965 |
WO |
Non-Patent Literature Citations (1)
Entry |
“Water Dispersable Hot Melt Adhesive Raw Material,” Miller and George; Adhesive Age, Dec. 1995, pp. 30-32. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08/562038 |
Nov 1995 |
US |
Child |
08/851788 |
|
US |