Nonreciprocal circuit device with an insulating adhesive tape on the yoke

Information

  • Patent Grant
  • 6417741
  • Patent Number
    6,417,741
  • Date Filed
    Friday, March 2, 2001
    23 years ago
  • Date Issued
    Tuesday, July 9, 2002
    21 years ago
Abstract
Insulating tape having an adhesive layer is applied to the lower face of the top wall of an upper yoke, by automated equipment or the like. The thickness of the insulating tape including the adhesive layer is set to a thin thickness, such as 0.01 to 0.05 mm for example, so that the height-wise dimensions of the product do not become great. Polyester resin, or material with deformation temperature of 200° C. or higher (e.g., polyimide resin, polyamide resin, fluororesin) is used for the material of the insulating tape. A silicone adhesive agent or an acrylic adhesive agent or the like is used for the adhesive layer of the insulating tape. Thus, short-circuiting between the matching capacitors and the yoke can be effectively prevented, thereby providing a nonreciprocal circuit device and communication device with high reliability at low costs.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a nonreciprocal circuit device, particularly to a nonreciprocal circuit device such as an isolator or circulator or the like used with microwave band communication devices, and to a communication device.




2. Description of the Related Art




Generally, lumped parameter isolators employed with mobile communication devices such as cellular telephones or the like have functions for allowing signals to pass only on the sending direction, and preventing sending thereof in the reverse direction. Also, demand for reductions in size, weight, and price has increased for recent mobile communication devices, which means that reductions in size, weight, and price is also demanded for isolators.




The following structure has been proposed for such lumped parameter isolators. That is, a resin terminal case is provided on a lower yoke formed of a magnetic metal, a center electrode assembly and matching capacitors and the like are accommodated in the terminal case, and an upper yoke formed of a magnetic metal is mounted. A permanent magnet is applied to the inner side of the upper yoke, and a DC magnetic field is applied to the center electrode assembly by this permanent magnet.




Now, this isolator prevents short-circuiting between the matching capacitor and upper yoke which are in close proximity, so a proposal has bene made to apply an insulating material (e.g., an epoxy resin) on the upper yoke so as to form an insulating film. However, in this case applying insulating material without irregularities so as to form a uniform film thickness is difficult, and in the event that there are irregularities in thickness, there is concern of the matching capacitor and the upper yoke short-circuiting at this portion. Also, the applying procedure would be complicated and inefficient, which would lead to increased cost.




SUMMARY OF THE INVENTION




Accordingly, it is an object of the present invention to prevent short-circuiting between the matching capacitor and yoke in a sure manner, and provide a nonreciprocal circuit device and a communication device with high reliability and low cost.




To this end, the nonreciprocal circuit device according to the present invention comprises:




a permanent magnet; a ferrite to which a direct current magnetic field is applied by the permanent magnet, the ferrite including a plurality of center electrodes; matching capacitors electrically connected to the center electrodes; a yoke for accommodating the permanent magnet, ferrite, center electrodes, and matching capacitors; wherein insulating tape having an adhesive layer is attached to a part of the yoke in the vicinity of the matching capacitors.




At least one of the matching capacitors is preferably arranged such that the electrode face of the capacitor defines an angle in a range of 60 degrees or more to 120 degrees or less with respect to said ferrite. Also, the insulating tape preferably comprises a material with a thermal deformation temperature of 200° C. or greater. Specifically, polyimide resin, polyamide resin, or fluororesin or the like may be used for the insulating tape, and a silicone adhesive agent or an acrylic adhesive agent may be used for the material of the adhesive layer of the insulating tape.




The above configuration prevents short-circuiting between the matching capacitor and the yoke with the insulating tape. The insulating tape has a uniform thickness, and there are no irregularities in film thickness, so short-circuiting between the matching capacitor and the yoke is reliably prevented.




Also, the communication device according to the present invention comprises a nonreciprocal circuit device with the above-described characteristics, and thus has high reliability with low manufacturing cost.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is an exploded perspective view of an embodiment of the nonreciprocal circuit device according to the present invention;





FIG. 2

is a frontal view of the center electrode assembly of the nonreciprocal circuit device shown in

FIG. 1

;





FIG. 3

is a plan view of the center electrode assembly shown in

FIG. 2

;





FIG. 4

is a plan view illustrating the internal structure of the nonreciprocal circuit device shown in

FIG. 1

;





FIG. 5

is a partial cross sectional view of the nonreciprocal circuit device shown in

FIG. 1

;





FIG. 6

is an electrical equivalency circuit of the nonreciprocal circuit device shown in

FIG. 1

; and





FIG. 7

is a block diagram illustrating an embodiment of the communication device according to the present invention.











DESCRIPTION OF THE PREFERRED EMBODIMENTS




The following is a description of embodiments of the nonreciprocal circuit device and communication device according to the present invention, with reference to the attached drawings.




(First Embodiment, With Reference to

FIGS. 1 through 6

)





FIG. 1

shows an exploded perspective view of the configuration of an embodiment of the nonreciprocal circuit device according to the present invention. As shown in

FIG. 1

, the nonreciprocal circuit device


41


is a lumped parameter isolator. The lumped parameter isolator


41


comprises a lower yoke


12


, resin terminal case


53


, center electrode assembly


54


, permanent magnet


16


, and an upper yoke


15


.




The lower yoke


12


is made of a magnetic metal, and comprises left and right side walls


12




a


and a bottom wall


12




b


. The terminal case


53


is arranged on the lower yoke


12


, with the center electrode assembly


54


being accommodated within the terminal case


53


, and the upper yoke


15


made of a magnetic metal is mounted. The upper yoke


15


has side walls


15




a


and a top wall


15




b.






Insulating tape


65


(shown as the hatched portion in

FIG. 1

) with an adhesive layer is attached to the lower face of the top wall


15




b


of the upper yoke


15


by automated equipment or the like. The thickness of the insulating tape


65


including the adhesive layer is set to a thin thickness, such as approximately 0.01 to 0.05 mm for example, so that the height dimension of the product does not become great. Polyester resin, or material with thermal deformation temperature of 200° C. or greater (e.g., polyimide resin, polyamide resin, fluororesin) is used for the material of the insulating tape


65


. Using material with deformation temperature of 200° C. or greater is preferable, since the insulating tape


65


is not deformed at the time of mounting the isolator


41


with solder. Also, a silicone adhesive agent or an acrylic adhesive agent or the like is suitably sued for the adhesive layer of the insulating tape


65


.




The permanent magnet


16


is attached to the surface of the insulating tape


65


, so a to apply a DC magnetic field to the center electrode assembly


54


from this permanent magnet


16


. The lower yoke


12


and the center electrode assembly


54


and upper yoke


15


form a magnetic path.




As shown in

FIGS. 2 and 3

, the center electrode assembly


54


has three center electrodes


21


through


23


intersecting one another at approximately 120 degree angles in an electrically insulating state on the upper face of the microwave ferrite


20


(the upper face being the first primary face, and also one magnetic pole face). Of the center electrodes


21


through


23


, the center electrodes


21


and


22


each have port portions P


1


and P


2


on one end thereof, which is bent at right angle, and the center electrode


23


has a port portion P


3


on one end thereof, which is extended horizontally. Further, the center electrodes


21


to


23


have a common shield portion


26


on the other end thereof, which is brought into contact with the lower face of the ferrite


20


(the second primary face, and also the other magnetic pole face). The common shield portion


26


substantially covers the entire lower face of the ferrite


20


.




A ground plate


42


is arranged at the lower face of the ferrite


20


, and comes into plane contact with the common shield portion


26


of the center electrodes


21


through


23


and is electrically connected thereto, if necessary solder or electroconductive adhesive agents or the like is used. Capacitor connecting portions


42




a


,


42




b


, and


42




c


extend from the end of the ground plate


42


. The capacitor connecting portions


42




a


and


42




b


are raised so as to be parallel to the port portions P


1


and P


2


of the center electrodes


21


and


22


, and the capacitor connecting portion


42




c


extends horizontally so as to be parallel to the port portion P


3


of the center electrode


23


. The ground plate


42


is connected to the bottom wall


12




b


of the lower yoke


12


through a window


53




a


of the terminal case


53


, and thus is grounded.




The hot-side capacitor electrodes


1


of the matching capacitors C


1


through C


3


are soldered to the port portions P


1


through P


3


, and the cold-side capacitor electrodes


2


thereof are soldered to the capacitor connecting portions


42




a


,


42




b


, and


42




c


of the ground plate


42


. At this time, the capacitor electrode surfaces


1


and


2


of the matching capacitors C


1


and C


2


are arranged so as to define an angle in a range of approximately 60 degrees or more to 120 degrees or less with respect to the upper surface of the ferrite


20


. The angle thereof was set to approximately 90 degrees for this first embodiment. On the other hand, the matching capacitor C


3


is arranged such that the capacitor electrodes surfaces


1


and


2


thereof are substantially parallel to the upper surface of the ferrite


20


. Each of the matching capacitors C


1


through C


3


are single plate capacitors with capacitor electrodes


1


and


2


formed on both sides of a dielectric substrate


3


.




The matching capacitors C


1


through C


3


can be mounted as described next, for example. That is, assuming that capacitor connection portions


42




a


and


42




b


are to be raised, bent portions are provided to the base portions of the ground plate


42


beforehand, so that there is leeway dimensions-wise. Solder paste is applied on the capacitor connection portions


42




a


through


42




c


of the ground plate


42


, and the matching capacitors C


1


through C


3


are placed thereupon with the cold-side capacitor electrodes


2


facing down.




Further, after solder paste is applied on the hot-side capacitor electrodes


1


of the matching capacitors C


1


through C


3


, the ferrite


20


including the center electrodes


21


through


23


is placed thereon. The common shield portion


26


of the center electrodes


21


through


23


is brought into plane contact with the upper face of the ground plate


42


, and the port portions P


1


through P


3


are brought into plane contact with the hot side capacitor electrodes


1


of the matching capacitors C


1


through C


3


respectively, by solder paste. In this state, the solder paste is heated, thereby the matching capacitors C


1


through C


3


are soldered. Next, the capacitor connection portions


42




a


and


42




b


and the port portions P


1


and P


2


are bent, and the matching capacitors C


1


and C


2


are arranged such that the capacitor electrode surfaces


1


and


2


define the angle in the range of approximately 60 degrees or more to 120 degrees or less with respect to the upper surface of the ferrite


20


. Thus, a center electrode assembly


54


is obtained.




Input/output electrodes


31


and


32


and ground terminals


33


are insert-molded to the terminal case


53


. The input/output electrodes


31


and


32


each have one end exposed from an outer side wall of the case


53


, and the other end is exposed at an inner wall of the case


53


so as to form input/output connection electrode portions


18




a


and


18




b


. In the same way, each of the ground terminals


33


has one end exposed from an outer side wall of the case


53


, and the other end is exposed at an inner bottom wall of the case


53


so as to form ground connection electrode portions


17




a


and


17




b


(see FIG.


4


).




As shown in

FIGS. 4 and 5

, the center electrode assembly


54


and a terminal electrode R are accommodated within the terminal case


53


thus configured. The port portions P


1


and P


2


of the center electrodes


21


and


22


are respectively connected to the input/output connection electrode portions


18




a


and


18




b


by soldering or the like. One end of the terminal electrode R is connected to the ground connection electrode portion


17




a


, and the other end thereof is connected to the port portions P


3


of the center electrode


23


. The capacitor connection portion


42




c


is connected to the ground connection electrode portion


17




b


.

FIG. 6

shows an electrical equivalent circuit for the isolator


41


.




The isolator


41


thus configured has matching capacitors C


1


through C


3


respectively mounted between the port portions P


1


through P


3


of the center electrodes


21


through


23


and the capacitor connection portions


42




a


through


42




c


of the ground plate


42


, so the matching capacitors C


1


through C


3


, the center electrodes


21


through


23


, and the ground plate


42


and the ferrite


20


can be handled as a single unit, thus facilitating manufacturing of the isolator


41


.




Also, as shown in

FIG. 5

, insulating tape


65


is attached on the face of the upper yoke


15


facing the matching capacitors C


1


and C


2


, on the face wherein the upper yoke


15


and the matching capacitors C


1


and C


2


come into close proximity, i.e., insulating tape


65


is arranged between the upper yoke


15


and the matching capacitors C


1


and C


2


, so short-circuiting between the upper yoke


15


and the matching capacitors C


1


and C


2


is prevented by the insulating tape


65


. The insulating tape


65


has a uniform thickness with no irregularities in the thickness thereof, so short-circuiting between the upper yoke


15


and the matching capacitors C


1


and C


2


can be effectively prevented. Moreover, the insulating tape


65


has been attached to the upper yoke


15


by an adhesive layer, so there is no undesired positional shifting of the insulating tape


65


, and short-circuiting between the upper yoke


15


and the matching capacitors C


1


and C


2


due to positional shifting of the insulating tape


65


can also be prevented. Consequently, the reliability of the isolator


41


improves.




The second embodiment will be described with a cellular phone serving as an example of the communication device according to the present invention.





FIG. 7

is an electric circuit block diagram of the RF unit of a cellular phone


120


. In

FIG. 7

, reference numeral


122


denotes an antenna device,


123


a duplexer,


131


a transmitting side isolator,


132


a transmitting side amplifier,


133


a transmitting side interstage band-pass filter,


134


a transmitting side mixer,


135


a receiving side amplifier,


136


a receiving side interstage band pass filter,


137


a receiving side mixer,


138


a voltage control oscillator (VCO), and


139


a local band-pass filter.




Now, the lumped parameter isolator


41


according to the first embodiment can be used as the transmitting side isolator


131


. Mounting this isolator


41


realizes a low-cost high-reliability cellular phone.




The present invention is by no means restricted to the above embodiments; rather, various configurations may be made within the spirit and scope of the present invention. For example, in the first embodiment, two matching capacitors C


1


and C


2


are positioned perpendicular and the other matching capacitor C


3


is positioned sideways (i.e., placed so that the capacitor electrode face is parallel to a horizontal plane), but all three of the matching capacitors C


1


through C


3


may be positioned perpendicularly (i.e., placed so that the capacitor electrode face is perpendicular to a horizontal plane). That is to say, at least one of the matching capacitors may be arranged such that the capacitor electrode face defines an angle of 60 degrees or more but 120 degrees or less as to the ferrite.




Also, mounting of the matching capacitors C


1


through C


3


may be performed by using an electroconductive adhesive agent instead of soldering. The matching capacitors C


1


through C


3


may be monolithic capacitors instead. Also, the present invention can also be applied to nonreciprocal circuit devices employed for other high-frequency parts such as circulators and the like, besides isolators. Further, in addition to forming by punching and bending a metal plate, the center electrodes can also be formed by providing pattern electrodes on a substrate (such as a dielectric substrate, magnetic substance substrate, laminated substrate, etc.).




As can be clearly understood from the above description, according to the present invention, short-circuiting of the yoke and capacitors is prevented by insulating tape. At this time, the insulating tape has uniform thickness with no irregularities in the thickness thereof, so short-circuiting between the yoke and the capacitors can be effectively prevented, thereby obtaining a nonreciprocal circuit device and communication device with high reliability. Also, the insulating tape is easily applied with an adhesive player, and thus the insulating tape can be applied to the yoke with automated equipment, thereby improving work efficiency and reducing manufacturing costs.



Claims
  • 1. A nonreciprocal circuit device, comprising:a permanent magnet; a ferrite to which a direct current magnetic field is applied by said permanent magnet, said ferrite including a plurality of center electrodes; matching capacitors electrically connected to said center electrodes; and a yoke for accommodating said permanent magnet, ferrite, center electrodes, and matching capacitors; wherein an insulating tape having an adhesive layer is attached to a part of said yoke in the vicinity of said matching capacitors.
  • 2. A nonreciprocal circuit device according to claim 1, wherein at least one of said matching capacitors is arranged such that the electrode surface of the capacitor defines an angle in a range of 60 degrees or more to 120 degrees or less with respect to said ferrite.
  • 3. A nonreciprocal circuit device according to either claim 1 or claim 2, wherein said insulating tape comprises a material with a thermal deformation temperature of approximately 200° C. or greater.
  • 4. A nonreciprocal circuit device according to claim 3, wherein said insulating tape comprises polyimide resin, polyamide resin, or fluororesin.
  • 5. A nonreciprocal circuit device according to claim 4, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 6. A communication device comprising at least one nonreciprocal circuit device according to any of the claims 1 and 2.
  • 7. A nonreciprocal circuit device according to claim 1, wherein said insulating tape comprises polyimide resin, polyamide resin, or fluororesin.
  • 8. A nonreciprocal circuit device according to claim 7, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 9. A nonreciprocal circuit device according to claim 2, wherein said insulating tape comprises polyimide resin, polyamide resin, or fluororesin.
  • 10. A nonreciprocal circuit device according to claim 9, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 11. A nonreciprocal circuit device according to claim 1, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 12. A nonreciprocal circuit device according to claim 2, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 13. A nonreciprocal circuit device according to claim 3, wherein said adhesive layer of said insulating tape comprises either a silicone adhesive agent or an acrylic adhesive agent.
  • 14. A communication device according to claim 6, further comprising at least one of a transmitting circuit and a receiving circuit, connected to said nonreciprocal circuit device.
Priority Claims (1)
Number Date Country Kind
2000-058576 Mar 2000 JP
US Referenced Citations (1)
Number Name Date Kind
6121851 Takane et al. Sep 2000 A
Non-Patent Literature Citations (1)
Entry
US 6,118,349, 09/2000, Okada et al. (withdrawn)