Nonvolatile semiconductor memory device having verify function

Abstract

A non-volatile semiconductor memory device comprises a flip-flop circuit for holding write data in one of first and second states, a bit line connected to the flip-flop circuit via a switching element, a transistor for charging the bit line, a non-volatile memory cell, connected to the bit line and having a MOS transistor structure, for storing data when a threshold thereof is set in one of first and second threshold ranges, wherein at the time of a write mode said threshold of the memory cell is shifted from the first threshold range towards the second threshold range while the flip-flop circuit remains in the first state and the shift of the threshold is not effected while the flip-flop circuit remains in the second state, and at the time of a verify mode following the write mode the bit line is kept at a charge potential by the charging transistor while the threshold remains in the second threshold range, and a data setting circuit for connecting one of first and second signal nodes of the flip-flop circuit to a predetermined potential when the bit line is at the charge potential in the verify mode, thereby setting the flip-flop circuit in the second state irrespective of the state prior to the verify mode.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a non-volatile semiconductor memory device having a rewrite data setting function (i.e. a verify function), and more particularly to a sense amplifier type circuit used for write and read operations.

2. Description of the Related Art

Since a non-volatile semiconductor memory device has an advantage in which data is not lost even if power is turned off, a demand for such non-volatile semiconductor memories has recently increased more and more. Unlike a two-transistor byte-type non-volatile semiconductor memory device, a flash memory or an electronically batch-erasable non-volatile semiconductor memory device may have a memory cell constituted by a single transistor. As a result, the size of the memory cell can be decreased, and it is expected to substitute the flash memory for a large-capacity magnetic disk.

In this type of non-volatile semiconductor memory device, a memory cell array is constituted by arranging memory cells comprising MOS transistors with floating gates in a matrix. A threshold value of the MOS transistor is varied by accumulating a charge in the floating gate, and data is stored by the threshold value. At the time of data write or data read, an electric current is let to flow to the gate insulative film to control data. Thus, a write time varies greatly, depending on a change in process or use condition. This is a principal difference between the above non-volatile semiconductor memory device and a DRAM or SRAM. As a result, a single chip may comprise cells with a short write time and cells with a long write time.

In order to describe the above problems in detail, a conventional non-volatile semiconductor memory device with reference to a NAND type flash memory.

FIG. 1 is a circuit diagram showing a cell structure of the NAND type flash memory. Non-volatile memory cells M 1 to M 16 , each comprising a MOS transistor having a floating gate, are connected in series. The memory cell M 1 at one end of the group of the memory cells M 1 to M 16 is connected to a bit line BL via a selector transistor Q 1 , and the memory cell M 16 at the other end thereof is connected to a common source line S via a selector transistor Q 2 . Each transistor constituting each cell is formed on a single well substrate W. Control gates of memory cells M 1 to M 16 are connected to word lines WL 1 to WL 16 , a control electrode of the selector transistor Q 1 is connected to a selector line SL 1 , and a control gate of the selector transistor Q 2 is connected to a selector line SL 2 .

Each of the memory cells M 1 to M 16 has a threshold value corresponding to data to be stored when “0” data is stored, the threshold value is set at more than 0V and less than 5V. When “1” data is stored, the threshold value is set at less than 0V. (More appropriately, these threshold values are set in narrow ranges in order to provide some margin.)

FIG. 2 is a graph illustrating a threshold distribution of an N-number of memory cells having threshold values corresponding to the above data “0” and “1”. In the case of a NAND type flash memory, the state in which “1” data is stored is normally called “erase state”, and the state in which “0” data is stored is called “write state”. An operation of shifting the threshold value of a memory cell storing “1” data in a positive direction so that the memory cell may store “0” data is called is “write operation”. An operation of shifting the threshold value (Vth) of a memory cell storing “0” data in a negative direction so that the memory cell may store “1” data is called “erase operation”. This definition of. operations may differ in the case of NOR type memory devices.

FIG. 3 is a table showing voltages to be applied to the memory cells at the time of erase and write operations. In the read operation, the bit line BL is precharged at 5V in a floating state. Then, 5V is applied to the selector line SL 1 , 0V is applied to the work line WL of the selected memory cell, 5V is applied to the word lines WL of the non-selected memory cells, 5V is applied to the selector line SL 2 , 0V is applied to the well substrate W, and 0V is applied to the common source line S. Thus, the transistors of all non-selected memory cells, other than the selected memory cell, are turned on. When “0” data is stored in the selected memory cell, this memory cell is in the non-conductive state and the bit line potential remains at 5V. If “1” data is stored in the selected memory cell, this memory cell is in the conductive state and the bit line potential is discharged and dropped. A data sense operation is effected by sensing the bit line potential at the time of read-out.

FIGS. 4 , 5 A and 5 B show distributions of thresholds of memory cells at the time of erase and write operations. In the erase operation, the bit line BL is opened, 0V is applied to the selector line SL 1 , 0V is applied to the word line WL of the memory cell, 0V is applied to the selector line SL 2 , 18V is applied to the well substrate W, and 18V is applied to the common source line S. Thus, a tunnel current flows across the floating gate and the well via the gate insulative film, and the threshold value lowers to 0V or less. FIG. 4 shows a shift of the threshold value distribution.

At the time of the write operation, different voltages are applied in accordance with write data. Specifically, in the case of “0” data write (i.e. in the case of shifting the threshold value), 0V is applied to the bit line BL. In the case of “1” data write (i.e. in the case of not shifting the threshold value), 9V is applied to the bit line BL. A potential of 11V is applied to the selector line SL 1 , 18V is applied to the word line WL of the selected memory cell, 9V is applied to the word line WL of the non-selected memory cell, 0V is applied to the selector line SL 2 , 0V is applied to the well W, and 0V is applied to the common source line S. As a result, the selector transistor Q 1 and all memory cells M 1 to M 16 are turned on and set at the same potential as the bit line potential (no consideration is given to a drop in threshold value of transistors). Accordingly, in the memory cell in which 0V is applied to the bit line BL, a high voltage of 18V is applied is between the channel and the control electrode, a tunnel current flows, and the threshold value shifts to the positive side. On the other hand, in the memory cell in which 9V is applied to the bit line BL, only 9V is applied between the channel and the control electrode. Thus, the threshold value is not shifted to the positive side. This “9V” is called “write prohibition voltage”. FIGS. 5A and 5B illustrate the shift of distribution of these threshold values.

As stated above, in the non-volatile semiconductor device, a write operation is effected by using purely physical means of a tunnel current (Fowler-Nordheim tunneling). Thus, the write speed varies from memory cell to memory cell. Even if the same write time is set, a threshold value of a certain memory cell may fall within a range of 0V to 5V, but a threshold value of another memory cell may exceed 5V. This phenomenon is illustrated in FIG. 6 .

Specifically, “0” data is written in a cell with low write speed at time t 1 . However, when “0” data is written in a cell with high write speed, the threshold voltage has exceeded 5V which is an upper limit value. As described above, at the time of read-out of the NAND type flash memory, 5V is applied to the word line of the non-selected memory cell to turn on the word line. If the threshold of a certain memory cell exceeds 5V, data in all memory cells connected in series to this memory cell cannot be read out because the series current path is cut off.

It is therefore necessary to narrow the distribution of thresholds to a predetermined value range. In order to keep a sufficient read-out margin, it is desirable to narrow this distribution to a smaller range.

A bit-by bit verify method has been proposed to solve this problem. According to this method, the write time is not made constant for all memory cells, unlike the above-described technique, and different write times are set for the respective memory cells. In principle, the write time is divided into short time periods, and the following steps are repeated: write→verify→rewrite data set→write→verify→rewrite data set . . . As regards the memory cell the threshold of which has been sufficiently increased by the verify operation, the rewrite data is set so as to prevent the write operation in the next cycle.

Thus, the cell with high write speed completes the write operation earlier, and the threshold thereof will not increase afterwards (in this case, an increase in threshold due to a potential difference of 9V is ignored). FIG. 7 illustrates this technique. The cell with high write speed completes the write operation at time t 0 , and the cell with low write speed completes the write operation at time t 1 . The threshold values are set near 3.5V.

The bit-by-bit verify method can be realized most easily by making use of an external system such as a CPU or software. However, in the NAND type flash memory wherein several-thousand bits are written simultaneously, it is not practical to input/output several-thousand bit data by using an I/O interface of 8 bits at most in each verify operation. In addition, a several-thousand bit register or comparator needs to be provided externally. Accordingly, it is most desirable to perform the verify operation and rewrite data set operation within the chip.

In a most primitive method for achieving the bit-by-bit verify, it will suffice to provide only the same number of flip-flop circuits for latching write data, flip-flop circuits for latching read-out data and comparators for comparing both write data and read-out data as the number of bit lines (several thousand). However, this is impractical.

FIG. 8 shows schematically a circuit for achieving the bit-by-bit verify operation with-in the chip. This circuit comprises flip-flop circuits 1 (1−x; x=1-3) for temporarily storing write data; bit lines BL (BLx; x=1-3); NAND type memory cells 2 (2−x; x=1-3), as illustrated in FIG. 1 , connected to the bit lines BL; P-channel transistors Q 3 for charging the bit lines BL; N-channel transistors Q 4 for connecting the bit lines BL and flip-flops 1 ; and N-channel transistors Q 5 and Q 6 connected in series between a power supply potential of 5V and the bit lines BL. The gates of transistors Q 5 are connected to bit-line-side terminals of the flip-flops 1 .

For the purpose of simplicity, FIG. 8 shows the circuit corresponding to only three bit lines, but in fact there are several thousand bit lines. A signal line φ 1 is connected to the gates of all transistors Q 3 , a signal line φ 2 is connected to the gates of all transistors Q 6 , and a signal line φ 3 is connected to the gates of all transistors Q 4 . The sources of the transistors Q 3 are connected to a power supply having a potential of 9V at the time of write and a potential of 5V at the other time. In addition, a power supply for the flip-flop circuits has a potential of 9V at the time of write and a potential of 5V at the other time.

The operation of the circuit shown in FIG. 8 will now be described with reference to FIG. 9 showing wave-forms at the time of the write operation. Suppose that “0” data is written in the memory cell 2 - 1 , “0” data in the memory cell 2 - 2 , and “1” data in the memory cell 2 - 3 , and that data is written less easily in the memory cell 2 - 2 than in the memory cell 2 - 1 .

At first, write data supplied from the outside via column gates (not shown) is latched in the respective the flip-flop circuits 1 . Specifically, a bit-line-side node N 1 of the flip-flop circuit 1 - 1 is set at 0V, a bit-line-side node N 2 of the flip-flop circuit 1 - 2 is set at 0V, and a bit-line-side node N 3 of the flip-flop circuit 1 - 3 is set at 5V. In this state, a first write operation (WRITE- 1 ) starts.

At time t 10 , when the signal line φ 1 is set at 0V, the transistors Q 3 are rendered conductive and the bit lines BL are charged at 9V. Since the power supply for the flip-flop circuits rises to 9V, the node N 3 has a potential of 9V.

At time t 11 , the potential of signal line φ 1 rises to 10V, and the charge of the bit lines is completed. At the same time, the potential of signal line δ 3 rises to 10V, and the bit lines are discharged according to the potentials of nodes N (Nx; x=1-3). Specifically, since the potentials of nodes N 1 and N 2 are 0V, the bit lines BL 1 and BL 2 are discharged to 0V. Since the potential of node N 3 is 9V, the bit line BL 3 is discharged to 9V. This potential of 9V functions as a write prohibition potential for the memory cell 2 - 3 . Under this condition, a write voltage is applied to each memory cell 2 .

At time t 12 , the first write operation is completed, and a verify operation and a rewrite data set operation (“VERIFY”) start. The potential of the signal line φ 1 falls to 0V, and the bit lines are charged at 5V via the transistors Q 3 . At the same time, since the potential of the signal line δ 3 falls to 0V, the bit lines BL are electrically disconnected from the flip-flop circuits 1 .

At time t 13 , the charging for the bit lines is completed, and the bit lines in the floating state are discharged by the memory cells. The discharge speed varies depending on the threshold values of the memory cells. If the write operation is not fully effected, the threshold value does not rise and the bit line is discharged. In the first write operation, the write operation is not fully effected in either the memory cell 2 - 1 or memory cell 2 - 2 Since the write operation for the memory cell 2 - 3 is not effected, the bit line is necessarily discharged.

At time t 14 , the potential of the signal line δ 2 rises to 5V. Then, all transistors Q 6 are turned on. Since the potentials of nodes N 1 and N 2 are 0V, the corresponding transistors Q 5 are non-conductive and the bit lines BL 1 and BL 2 are not influenced. Since the potential of node N 3 is 5V, the bit line BL 3 is connected to a power supply potential of 5V via the transistors Q 5 and Q 6 . As a result, the bit line BL 3 is charged to 5V. This operation is referred to as “recharging of bit line of ‘0’ data write cell.”

At time t 15 , the signal line φ rises to 5V, the bit lines are connected to the flip-flop circuits, and the bit line potentials are-latched in the flip-flop circuits. The potentials latched at the nodes N 1 to N 3 of flip-flop circuits 1 are 0V, 0V and 5V, respectively, from the uppermost node N 1 . This state remains the same as before the write operation.

At time t 20 , a second write operation (WRITE- 2 ) starts. Specifically, 9V-charging of the bit lines is effected between time t 20 and time t 21 , and data write is effected in the memory cells between time t 21 and time t 22 .

At time t 22 , second verify and rewrite data set operations are performed. Specifically, 5V-charging of the bit lines is effected between time t 22 and time t 23 , discharge of the bit lines by the memory cells 2 is effected between time t 23 and time t 24 , and re-charging of the bit lines of “0” write cells is stated from time t 24 . It should be noted that the potential of the bit line BL 1 does not substantially decrease from 5V. This indicates that the data write in the memory cell 2 - 1 has been completed.

At time t 25 , the bit lines are connected to the flip-flop circuits, and the bit line potentials are latched in the flip-flop circuits 1 . The potentials latched in the nodes N 1 to N 3 of the flip-flop circuits are 5V, 0V, and 5V, respectively, from the uppermost node. It should be noted that the potential of the node N 1 has changed to 5V from 0V in the first operation.

The bits in which write is-completed are reset from 0V to 5V, and this 5V is raised to function as 9V-write prohibition voltage. Thus, no further write operations are effected in these bits.

At time t 30 , a third write operation (WRITE- 3 ) starts. Specifically, 9V-charging of the bit lines is effected between time t 30 and time t 31 , and write in memory cells is effected between time t 31 and time t 32 . It should be noted that the potential of the bit line BL 1 is 9V. This 9V is the same write prohibition voltage as for the bit line BL 3 .

At time t 32 , third verify and rewrite data set operations are performed Specifically, 5V-charging of the bit lines is effected between time t 32 and time t 33 , discharge of the bit lines by the memory cells 2 is effected between time t 33 and time t 34 , and re-charging of the bit lines of “0” write cells is started from time t 34 . It should be noted that the potential of the bit line BL 2 does not substantially decrease from 5V. This indicates that the data write in the memory cell 2 - 2 has been completed.

At time t 35 , the bit lines are connected to the flip-flop circuits,. and the bit line potentials are latched in the flip-flop circuits 1 . The potentials latched at the nodes N 1 to N 3 of the flip-flop circuits are 5V, 5V and 5V, respectively, from the uppermost node. It should ,be noted that the potential of node N 2 has changed to 5V from 0V in the second operation. Thus, all (three bits) write operations have been completed.

The operation of the bit-by-bit verify circuit has been described, on the supposition of the ideal case (no interference between adjacent bit lines). This circuit, however, has a serious problem, i.e. a malfunction occurs in the verify operation due to interference between adjacent bit lines. This problem will now be described.

FIG. 10 shows realistic wave-forms on the bit lines BL 2 and LB 3 between time t 12 and time t 15 in FIG. 9 . At time t 12 , the verify and rewrite data set operations start. The bit lines BL 2 and BL 3 are charged to 5V via the transistors Q 3 . Subsequently, charging of the bit lines is completed at time t 13 , and the bit lines in the floating state are discharged by the memory cells. The write in the memory cell 2 - 2 is not fully effected, the threshold value does not rise and the bit line BL 2 is discharged. The bit line BL 3 is necessarily discharged.

At time t 14 , the recharging of the bit lines of “0” write cells is performed. Specifically, the bit line BL 3 is connected to the power supply potential of 5V via the transistors Q 5 and Q 6 . As a result, the bit line BL 3 is charged to 5V.

In the meantime, the bit lines extend from end to s end of the memory cell array, and the capacitance between adjacent bit lines is not negligible. Thus, as shown in FIG. 11 , floating capacitances C 1 and C 2 occur parasitically. Consequently, when the bit line BL 3 is recharged, the potential of the bit line BL 2 will rise due to coupling of capacitance. If the bit line BL 2 is sensed in this state, distinction between the write-completed bit and write-incomplete bit becomes unclear. As a result, the potential of node N of the corresponding flip-flop circuit may be increased to 5V, although the write operation is not completed, and the subsequent write operation may be disabled.

In order to overcome the above problem, a verify method called “bit line leaking method” has been proposed. According to this method, over the entire verify operation time (time t 12 to time t 15 ), the potential of the signal line φ 2 is raised to render the transistors Q 6 conductive. Thus, the bit line BL 3 retains a potential of 5V from the beginning, and no abrupt change in potential occurs due to recharging.

Accordingly, no malfunction occurs due to interference between the bit lines. However, since the electric current is kept flowing through the conductive cell (memory cell 2 - 3 ), power consumption increases. Moreover, since the bit line potential at the time the current is kept flowing is determined by division of resistance between the transistors Q 5 and Q 6 and memory cell 2 - 3 , the bit line potential cannot perfectly be maintained at 5V and it is stabilized at a predetermined potential below 5V. Thus, recharging cannot be avoided and the same problem as stated above will occur. Furthermore, the source potential floats due to the leak current of the bit line, and the read-out margin of the read-out cell lowers.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a non-volatile semiconductor memory device which can overcome the above drawbacks and achieve a bit-by-bit verify operation without influence due to interference between bit lines or an increase in power consumption.

This object can be achieved by a non-volatile semiconductor memory device having a verify mode, the device comprising: bit line means; non-volatile memory cell means connected to said bit line means; setting means for setting the bit line means to a reference potential; flip-flop circuit means for holding latch data in one of first and second states; coupling means for coupling said flip-flop circuit means and the bit line means; latch control means for setting the latch data in the flip-flop circuit means in accordance with data to be written in said memory cell means; and data setting circuit means for forcibly inverting the latch data of the flip-flop circuit means in response to the reference is potential of the bit line means when the reference potential of the bit line means reaches a predetermined voltage value in the verify mode for the memory cell means.

According to the present invention, write data input from outside is held in the flip-flop circuit in the first state or second state. As regards the bit of the first state in the flip-flop circuit, a write operation is effected in the non-volatile memory cell, and the threshold is shifted. As regards the bit of the second state in the flip-flop circuit, the write operation is not effected, and the threshold is not shifted.

Subsequently, at the time of the verify operation, the data in the non-volatile memory cell is read out, the charging operation by the setting means is completed, and the potential bit line in the floating state is discharged. When the threshold value of the non-volatile memory cell which performs the write operation falls within the second range or desirable threshold range, the write operation is completed and the data setting circuit functioning as forcible inversion means inverts the state of the flip-flop circuit and maintains the second state. In this case, the subsequent write operation for the associated bit is not performed.

The threshold of the non-volatile memory cell which performs the write operation does not fall within the second range or desired threshold range, the first state of the flip-flop circuit is maintained. Accordingly, the subsequent write operation is performed. When data is not written in the non-volatile memory cell, the second state of the flip-flop is maintained from the beginning. Accordingly, the subsequent write operation is not performed.

As stated above, when the data write is completed by the single write/verify operation, the data in the flip-flop circuit is inverted by the forcible inversion type data setting circuit. As a result, a bit-by-bit verify operation is realized. In addition, unlike the prior art, the bit line potential is not varied, because the bit line potential is input to only the forcible inversion means. Furthermore, there is neither a need to provide a current through-path, nor an increase in power consumption.

Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate presently preferred embodiments of the invention, and together with the general description given above and the detailed description of the preferred embodiments give n below, serve to explain the principles of the invention.

FIG. 1 is a circuit diagram showing a cell structure of a NAND type flash memory;

FIG. 2 illustrates a distribution of threshold values, based on the number of threshold values of memory cells shown in FIG. 1 ;

FIG. 3 is a table showing voltages to be applied to memory cells at the time of read, erase and write in the memory cells shown in FIG. 1 ;

FIG. 4 shows a distribution of threshold values having the memory cells at the time of read;

FIG. 5A shows a distribution of threshold values of the memory cells in a first state at the time of write;

FIG. 5B shows a distribution of threshold values of the memory cells in a second state at the time of write;

FIG. 6 is a first characteristic diagram showing a variance in write speed among the memory cells;

FIG. 7 is a second characteristic diagram showing a variance in write speed among the memory cells;

FIG. 8 shows schematically a conventional circuit for achieving a bit-by-bit verify operation within a semiconductor chip;

FIG. 9 shows operational wave-forms at the time of write in the structure shown in FIG. 8 ;

FIG. 10 shows realistic wave-forms in a part of the time period shown in FIG. 9 ;

FIG. 11 is a circuit diagram illustrating a problem in the structure shown in FIG. 8 ;

FIG. 12 is a block diagram showing the entire circuit configuration of a non-volatile semiconductor memory device according to an embodiment of the present invention;

FIG. 13 is a circuit diagram showing a main part of a non-volatile semiconductor memory device according to a first embodiment of the invention;

FIG. 14 shows operational wave-forms at the time of write in the circuit shown in FIG. 13 ;

FIG. 15 to FIG. 18 are circuit diagrams showing structural modifications of a main part of the first embodiment;

FIG. 19 is a circuit diagram showing the main part of the first embodiment in greater detail;

FIG. 20 is a characteristic diagram showing gmN/gmP dependency of inverted voltage Vinv;

FIG. 21 is a characteristic diagram showing a variation in bit line potential Vbit at the time of operation of the circuit shown in FIG. 19 ;

FIG. 22 is a circuit diagram showing a main part of a non-volatile semiconductor memory device according to a second embodiment of the invention;

FIG. 23 shows operational wave-forms at the time of read-out in the circuit shown in FIG. 22 ;

FIG. 24 to FIG. 31 are circuit diagrams showing structures of first to eighth modifications of a main part of the second embodiment;

FIG. 32 to FIG. 35 are circuit diagrams showing structures of first to fourth modifications of a main part of a third embodiment;

FIG. 36 to FIG. 43 are circuit diagrams showing structures of first to eighth modifications of a main part of a fourth embodiment;

FIG. 44 is a circuit diagram showing a main part of a non-volatile semiconductor memory device according to a fifth embodiment of the invention;

FIG. 45 to FIG. 48 are circuit diagrams showing structures of first to fourth modifications of the main part of the fifth embodiment;

FIG. 49 is a circuit diagram showing a main part of a sixth embodiment of the invention;

FIG. 50 is a circuit diagram showing a main part of a seventh embodiment of the invention;

FIG. 51 to FIG. 54 are circuit diagrams showing structures of first to fourth applied examples of the main part of the first embodiment;

FIG. 55 to FIG. 62 are circuit diagrams showing structures of first to eighth applied examples of the main part of the second embodiment;

FIG. 63 to FIG. 66 are circuit diagrams showing structures of first to fourth applied examples of the main part of the third embodiment;

FIG. 67 to FIG. 74 are circuit diagrams showing structures of first to eighth applied examples of the main part of the fourth embodiment;

FIG. 75 to FIG. 78 are circuit diagrams showing structures of fifth to eighth applied examples of the main part of the first embodiment;

FIG. 79 to FIG. 86 are circuit diagrams showing structures of ninth to 16th applied examples of the main part of the second embodiment;

FIG. 87 to FIG. 90 are circuit diagrams showing structures of fifth to eighth applied examples of the main part of the third embodiment;

FIG. 91 to FIG. 98 are circuit diagrams showing structures of ninth to 16th applied examples of the main part of the fourth embodiment;

FIG. 99 to FIG. 102 are circuit diagrams showing structures of first to fourth applied examples of the main part of the fifth embodiment;

FIG. 103 to FIG. 106 are circuit diagrams showing structures of ninth to 12th applied examples of the main part of the first embodiment;

FIG. 107 to FIG. 114 are circuit diagrams showing structures of 17th to 24th applied examples of the main part of the second embodiment;

FIG. 115 to FIG. 118 are circuit diagrams showing structures of ninth to 12th applied examples of the main part of the third embodiment;

FIG. 119 to FIG. 126 are circuit diagrams showing structures of 17th to 24th applied examples of the main part of the fourth embodiment;

FIG. 127 is a circuit diagram showing the structure of a most desirable embodiment of the invention;

FIG. 128 is a circuit diagram showing a structure of the invention as applied to a NOR-type EEPROM; and

FIG. 129 is a characteristic diagram showing a distribution of threshold values among NOR-type memory cells.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 12 is a circuit block diagram showing an entire structure of a non-volatile semiconductor memory device according to a first embodiment of the present invention. This semiconductor device of the first embodiment is a NAND type flash memory 10 . Specifically, the non-volatile semiconductor memory device 10 comprises a memory cell array 11 , a row decoder 12 , sense circuit/write data latches 13 , a column decoder 14 , a column gate 15 , a booster circuit 16 , a control circuit 17 and an I/O buffer 18 .

The memory cell array 11 comprises a plurality of NAND-type memory cells arranged in a matrix, several thousand bit lines BL extending in a column direction, and several thousand word lines WL extending in a row direction. The row decoder 12 selects the word line on the basis of an address input from the outside. Signal lines of the sense circuit/write data latch 13 are connected at one end to the bit lines and at the other end to the I/O buffer 18 via the column gate 15 . The column decoder 14 controls the column gate 15 on the basis of an address input from the outside, and selects the bit line and the corresponding sense circuit/write data latch circuit 13 . The booster circuit 16 supplies high voltages necessary for the write operation and erase operation. The control circuit 17 controls a write operation, an erase operation, a read-out operation, etc. The I/O buffer 18 functions as interface with the outside of the chip.

The details of the memory cell within the memory cell array 11 are as shown in FIG. 1 . Specifically, as shown in FIG. 1 , non-volatile memory cells M 1 to M 16 , each comprising a MOS transistor having a floating gate, are connected in series. The memory cell M 1 at one end of the group of the memory cells M 1 to M 16 is connected to a bit line BL via a selector transistor Q 1 , and the memory cell M 16 at the other end thereof is connected to a common source line S via a selector transistor Q 2 . Each transistor constituting each cell is formed on a single well substrate W. Control gates of memory cells M 1 to M 16 are connected to word lines WL 1 to WL 16 , a control electrode of the selector transistor Q 1 is connected to a selector line SL 1 , and a control gate of the selector transistor Q 2 is connected to a selector line SL 2 .

Each of the memory cells M 1 to M 16 has a threshold value corresponding to data to be stored. when “0” data is stored, the threshold value is set at more than 0V and less than 5V. When “1” data is stored, the threshold value is set at less than 0V. (More appropriately, these threshold values are set in narrow ranges in order to provide some margin.)

FIG. 2 shows a distribution of threshold values among the memory cells, and FIG. 3 shows the voltages to be applied to the memory cells at the time of read, erase and write operations.

In the read operation, the bit line BL is precharged at 5V in a floating state. Then, 5V is applied to the selector line SL 1 , 0V is applied to the work line WL of the selected memory cell, 5V is applied to the word lines WL of the non-selected memory cells, 5V is applied to the selector line SL 2 , 0V is applied to the well substrate W, and 0V is applied to the common source line S. Thus, the transistors of all non-selected memory cells, other than the selected memory cell, are turned on. When “1” data is stored in the selected memory cell, this memory cell is in the non-conductive state and the bit line potential remains at 5V. If “1” data is stored in the selected memory cell, this memory cell is in the conductive state and the bit line potential is discharged and dropped. A data sense operation is effected by sensing the bit line potential at the time of read-out.

In the erase operation, the bit line BL is opened, 0V is applied to the selector line SL 1 , 0V is applied to the word line WL of the memory cell, 0V is applied to the selector line SL 2 , 18V is applied to the well substrate W, and 18V is applied to the common source line S. Thus, a tunnel current flows across the floating gate and the well via the gate insulative film, and the threshold value lowers to 0V or less.

At the time of the write operation, different voltages are applied in accordance with write data. Specifically, in the case of “0” data write (i.e. in the case of shifting the threshold value), 0V is applied to the bit line BL. In the case of “0” data write (i.e. in the case of not shifting the threshold value), 9V is applied to the bit line BL. A potential of 11V is applied to the selector line SL 1 , 18V is applied to the word line WL of the selected memory cell, 9V is applied to the word line WL of the non-selected memory cell, 0V is applied to the selector line SL 2 , 0V is applied to the well W, and 0V is applied to the common source line S. As a result, the selector transistor Q 1 and all memory cells M 1 to M 16 are turned on and set at the same potential as the bit line potential (no consideration is given to a drop in threshold value of transistors). Accordingly, in the memory cell in which 0V is applied to the bit line BL, a high voltage of 18V is applied between the channel and the control electrode, a tunnel current flows, and the threshold value shifts to the positive side. On the other hand, in the memory cell in which 9V is applied to the bit line BL, only 9V is applied between the channel and the control electrode. Thus, the threshold value is not shifted to the positive side.

FIG. 13 is a circuit diagram showing a main part of the non-volatile semiconductor memory device of the present invention, and specifically shows circuit portions associated with three bit lines in the non-volatile semiconductor memory device 10 shown in FIG. 12 . FIG. 13 shows only those parts of the memory cell array 11 , sense circuit/write data latches 13 , column gate 15 and control circuit 17 shown in FIG. 12 , which are necessary for understanding the present invention.

As is shown in FIG. 13 , the circuit associated with one bit line comprises a flip-flop circuit 1 (1−x; x=1-3) for temporarily storing write data; a bit line BL (BLx; x=1-3); NAND-type memory cells 2 (2−x; x=1-3) connected to the bit line BL, as described in connection with FIG. 1 ; a P-channel transistor Q 3 for charging the bit line BL; an N-channel transistor Q 4 for connecting the bit line BL and flip-flop circuit 1 ; and N-channel transistors Q 7 and Q 8 connected in series between a 0V-ground potential and a node of the flip-flop circuit 1 on the opposite side to the bit line BL. The transistors Q 7 and Q 8 constitute forcible inversion means (data setting circuit). The gate of the transistor Q 7 is connected to the bit line BL.

The gates of all transistors Q 3 are connected to a signal line φ 1 . This transistor Q 3 constitutes charging unit ( 19 ). The gates of all transistors Q 4 are connected to a signal line φ 2 , and the gates of all transistors Q 8 are connected to a signal line φ 3 . A part of the control circuit 17 is extracted and shown as a clock generating circuit 5 . The clock generating circuit 5 activates the signal lines φ 1 , φ 2 and φ 3 at predetermined timing.

The sources of the transistors Q 3 are connected to a power supply having a potential of 9V at the time of write and a potential of 5V at the other time. In addition, a power supply for the flip-flop circuits has a potential of 9V at the time of write and a potential of 5V at the other time.

The operation of the circuit shown in FIG. 13 will now be described with reference to FIG. 14 showing wave-forms at the time of the write operation. Suppose that “0” data is written in the memory cell 2 - 1 , “0” data in the memory cell 2 - 2 , and “1” data in the memory cell 2 - 3 , and that data is written less easily in the memory cell 2 - 2 than in the memory cell 2 - 1 .

At first, write data supplied from the outside via IO lines/BIO lines (lines of inverted signals of IO) and the column gates 15 is latched in the respective the flip-flop circuits 1 . Specifically, a bit-line-side node N 1 of the flip-flop circuit 1 - 1 is set at 0V, a bit-line-side node N 2 of the flip-flop circuit 1 - 2 is set at 0V, and a bit-line-side node N 3 of the flip-flop circuit 1 - 3 is set at 5V. In this state, a first write operation (WRITE- 1 ) starts.

At time t 10 , when the signal line φ 1 is set at 0V, the transistors Q 3 are rendered conductive and the bit lines BL are charged at 9V. Since the power supply for the flip-flop circuits rises to 9V, the node N 3 has a potential of 9V.

At time t 11 , the potential of signal line φ 1 rises to 10V, and the charge of the bit lines is completed. At the same time, the potential of signal line φ 2 rises to 10V, and the bit lines are discharged according to the potentials of nodes N. Specifically, since the potentials of nodes N 1 and N 2 are 0V, the bit lines BL 1 and BL 2 are discharged to 0V. Since the potential of node N 3 is 9V, the bit line BL 3 is discharged to 9V. This potential of 9V functions as a write prohibition potential for the memory cell 2 - 3 . Under this condition, a write voltage is applied to each memory cell 2 .

At time t 12 , the first write operation is completed, and a verify operation and a rewrite data set operation (“VERIFY”) start. The potential of the signal line φ 1 falls to 0V, and the bit lines are charged at 5V via the transistors Q 3 . At the same time, since the potential of the signal line φ 2 falls to 0V, the bit lines BL are disconnected from the flip-flop circuits 1 .

At time t 13 , the charging for the bit lines is completed, and the bit lines in the floating state are discharged by the memory cells. The discharge speed varies depending on the threshold values of the memory cells. If the write operation is not fully effected, the threshold value does not rise and the bit line is discharged. In the first write operation, the write operation is not fully effected in either the memory cell 2 - 1 or memory cell 2 - 2 . Since the write operation for the memory cell 2 - 3 is not effected, the bit line is necessarily discharged.

At time t 14 , the potential of the signal line φ 3 rises to 5V. Then, all transistors Q 8 are turned on. In the first write operation, none of the three memory cells has completed the write operation, and all bit lines are discharged and have low levels. Accordingly, the transistor Q 7 is rendered non-conductive, and the flip-flop circuit 1 is not influenced at all. In addition, unlike the prior art, the “recharging of bit line of ‘0’ data write cell” is not performed. The potentials latched at the nodes N 1 to N 3 of flip-flop circuits 1 are 0V, 0V and 5V, respectively, from the uppermost node N 1 . This state is the same as before the write operation.

At time t 20 , a second write operation (WRITE- 2 ) starts. Specifically, 9V-charging of the bit lines is effected between time t 20 and time t 21 , and data write is effected in the memory cells between time t 21 and time t 22 .

At time t 22 , second verify and rewrite data set operations are performed. Specifically, 5V-charging of the bit lines is effected between time t 22 and time t 23 , and discharge of the bit lines by the memory cells 2 is effected between time t 23 and time t 24 . It should be noted that the potential of the bit line BL 1 does not substantially decrease from 5V. This indicates that the data write in the memory cell 2 - 1 has been completed.

At time t 24 , when the potential of the signal line φ 3 rises to 5V, the transistors Q 8 are turned on. Unlike the first operation, the potential of the bit line BL 1 is at high level. Thus, the transistor Q 7 associated with the bit line BL 1 is rendered conductive.

Then, the node of the flip-flop circuit 1 - 1 , which is opposed to the bit line BL, is decreased towards the ground potential, and the data retained in the flip-flop circuit is inverted. In other words, the retained data is inverted by the forcible inversion means. The potentials latched in the nodes N 1 to N 3 of the flip-flop circuit 1 are 5V, 0V, and 5V, respectively, from the uppermost node. It should be noted that the data-written bits are reset from 0V to 5V successively. This 5V is raised to function as 9V-write prohibition voltage. Thus, no further write operations are effected in these bits.

At time t 30 , a third write operation (WRITE- 3 ) starts. Specifically, 9V-charging of the bit lines is effected between time t 30 and time t 31 , and write in memory cells is effected between time t 31 and time t 32 . It should be noted that the potential of the bit line BL 1 is 9V. This 9V is the same write prohibition voltage as for the bit line BL 3 .

At time t 32 , third verify and rewrite data set operations are performed. Specifically, 5V-charging of the bit lines is effected between time t 32 and time t 33 , and discharge of the bit lines by the memory cells 2 is effected between time t 33 and time t 34 . It should be noted that the potential of the bit line BL 2 does not substantially decrease from 5V. This indicates that the data write in the memory cell 2 - 2 has been completed.

At time t 34 , when the potential of the signal line φ 3 rises to 5V, the transistors Q 8 are turned on. Unlike the second operation, the potential of the bit line BL 2 is at high level. Thus, the transistor Q 7 associated with the bit line BL 2 is rendered conductive. Then, the node of the flip-flop circuit 1 - 2 , which is opposed to the bit line BL 2 , is decreased towards the ground potential, and the data retained. in the flip-flop circuit 1 - 2 is inverted. In other words, the retained data is inverted by the forcible inversion means. The potentials latched in the nodes N 1 to N 3 of the flip-flop circuit 1 are 5V, 5V, and 5V, respectively, from the uppermost node. It should be noted that the potential of the node N 2 varied to 5V from 0V in the second operation. Thus, the write operations for all bits (three bits) have been completed.

As has been described above, when the data write is completed by every write and verify operation, the data in the flip-flop circuit is inverted by the forcible inverting means (data setting circuit). Thus, the bit-by-bit verify operation is achieved. Moreover, unlike the prior art, the bit line potential need not be varied, because the bit line potential is only input to the forcible inverting means. Furthermore, a through-passage for current is not provided, and power consumption does not increase.

Besides, since the gate of the transistor Q 7 is used as a sense node, the sensitivity is high, and the sense operation is performed with low voltage.

FIGS. 15 to 18 are circuit diagrams showing modifications of the first embodiment. The circuit shown in FIG. 15 has the same structure as that shown in FIG. 13 , and it is shown for comparison with other circuits.

In FIG. 16 , the order of transistors Q 7 and Q 8 is reversed. A variation in potential of the bit line BL is not transmitted to the flip-flop circuit 1 via a capacitance of the gate/drain of the transistor Q 7 , and the data retained in the flip-flop circuit 1 is stabilized. In addition, since the source of the transistor Q 7 is grounded, the flip-flop circuit 1 is inverted with a relatively low potential of the bit line BL, as compared to the circuit of FIG. 15 . As a result, the stable verify operation can be effected, and possibility of error of the verify operation is reduced. (Inversely, in FIG. 15 , as compared to FIG. 16 , switching noise of the transistor Q 8 , which may adversely affect the flip-flop circuit, is cut off by the transistor Q 7 , and therefore erroneous inversion of the flip-flop circuit due to noise can be prevented.)

In FIG. 17 , transistors Q 8 , Q 7 and Q 82 are connected in series, and the transistors Q 81 and Q 82 function as the transistor Q 8 in FIG. 15 . Accordingly, the advantages of both circuits shown in FIGS. 15 and 16 can be enjoyed, the stable verify operation is performed, and the erroneous inversion of the flip-flop circuit can be prevented.

In FIG. 18 , the transistor Q 8 shown in FIG. 15 is replaced by transistors Q 91 and Q 92 . Complementary signals φ 3 and Bφ 3 are input to the transistors Q 91 and Q 92 . Specifically, when the potential of signal φ 3 rises to 5V, the transistor Q 91 is turned on and the flip-flop circuit 1 is forcibly inverted according to the potential of the bit line BL. If the potential of signal Bφ 3 changes to 0V, the transistor Q 92 is turned on and the gate potential of the transistor Q 7 is set at ground potential of 0V. Since the transistors Q 91 and Q 92 are operated only by transfer of charge, the size thereof may be small. Accordingly, the area of the device can be made less than that in the series-connected transistor construction shown in FIGS. 15 to 17 . Since both circuits operate similarly with the circuit of FIG. 13 , A description of the details of the operation may be omitted.

Conditions for maintaining stability of the operation in the above-described first embodiment will now be described. FIG. 19 is a circuit diagram for illustrating in greater detail the flip-flop circuit 1 - 1 transistors Q 4 , Q 7 and Q 8 in FIG. 13 . The flip-flop circuit 1 - 1 is constituted by connecting in parallel in opposite directions an inverter comprising a P-channel transistor Q 01 and an N-channel transistor Q 02 and an inverter comprising a P-channel transistor Q 03 and an N-channel transistor Q 04 . It is the transistor Q 01 that charges a node N 01 connected to the transistors Q 7 and Q 8 functioning as forcible inversion means. An important factor for the stable operation is the magnitude of conductance of the transistor Q 01 and the transistors Q 7 and Q 8 .

Suppose that the conductance of the transistor Q 01 is gmP and the equivalent conductance of the series-connected transistors Q 7 and Q 8 is gmN. FIG. 20 shows a simulation result of the gmN/gmP dependency of an inversion voltage Vinv (a minimum voltage value which needs to be applied to the bit line when the flip-flop is inverted) at the time Vcc (power supply voltage) is 5V. The -inversion voltage Vinv decreases steeply in the vicinity of gmN/gmP=1 and approaches gradually to the threshold value Vth of the transistors Q 7 and transistor Q 8 . Even in the case where an input signal or bit line potential Vbit is precharged to, e.g. Vcc and then the conductance of the cell comes into free-running in an ideal “0” state (“0” cell read-out), the bit line potential Vbit is influenced by the capacitance between adjacent bit lines (according to this embodiment a problem of influence of capacitance between adjacent bit lines at the bit line charging time after the verify operation can be solved, but a problem of influence of capacitance at the time of free-running remains unsolved). If the potential of one of the adjacent bit lines decreases, the bit line potential Vbit decreases, as shown in FIG. 21 . Specifically, when a “0” cell is connected to both-side bit lines, substantially no decrease occurs in potential Vbit across these bit lines. However, if a “1” cell is connected to either or both-side bit lines, a decrease occurs in bit line potential Vbit. Thus, in order to surely sense “0” in the bit line with decreased potential, it is desirable that potential Vinv be low. In FIG. 20 , from a point at which the gmN/gmP exceeds 1.8, the gmN/gmP dependency of inversion voltage decreases steeply and approaches a low Vth. Accordingly, it is desirable that the value of gmN/gmP be 1.8 or above. As a result, the operation of the flip-flop is stabilized, and a circuit hardly susceptible to fluctuation in power supply voltage, noise, etc. can be obtained. In addition, by setting this value as described above, the inversion voltage can be set with little influence of conductance fluctuation due to misalignment of masks and a fluctuation in gmN/gmP. These merits in manufacture can also be enjoyed.

In brief, the above advantages can be obtained if the equivalent conductance gmN of the series-connected MOS transistors serving as forcible inversion means and the conductance gmP of the MOS transistor for charging/discharging the junction node in the flip-flop circuit meet the formula:

gmN/gmP >1.8  (i)

FIG. 22 is a circuit showing a second embodiment of the present invention. The circuit elements common to those in the first embodiment are denoted by like reference numerals. A circuit portion associated with one bit line comprises a flip-flop circuit 1 for temporarily storing write data; a bit line BL, a NAND-type memory cell 2 (illustrated in FIG. 1 ) connected to the bit line BL; a P-channel transistor Q 3 for charging the bit line BL; a transistor Q 4 for connecting the bit line BL and the flip-flop circuit 1 ; and transistors Q 7 and Q 8 connected in series between the node of the flip-flop circuit 1 , which is located on the opposite side of the bit line BL, and the ground potential of 0V.

The transistors Q 7 and Q 8 constitute forcible inversion means (data setting circuit). The gate of the transistor Q 7 is connected to the bit line BL. The gates of all transistors Q 3 are connected to a signal line φ 1 . This transistor Q 3 constitutes charging means. The gates of all transistors Q 4 are connected to a signal line φ 2 , and the gates of all transistors Q 8 are connected to a signal line φ 3 . The second embodiment differs from the first embodiment in that transistors Q 10 having gates connected to a signal line δR are connected between nodes N of flip-flop circuits 1 and the ground potential. The transistor Q 10 constitutes reset means. A part of the control circuit 17 is extracted and shown as clock generating circuit 6 for driving the signal lines φ 1 , φ 2 , φ 3 and φR at predetermined time, as described later.

The sources of the transistors Q 3 are connected to a power supply having a potential of 9V at the time of write and a potential of 5V at the other time. In addition, a power supply for the flip-flop circuits has a potential of 9V at the time of write and a potential of 5V at the other time.

With reference to FIG. 23 showing operational wave-forms at the time of read-out, the operation of the circuit shown in FIG. 22 will now be described. At time to, the potential of the signal line φ 1 lowers and the bit line BL is precharged at 5V. At the same time, the potential of the signal line φR rises and the flip-flop circuit 1 is reset. That is, the node N is set at 0V. At time t 2 , the potential of the signal line φ 1 rises and the bit line BL is set in the floating state. The bit line BL is discharged by the data retained in the memory cell 2 . When the potential of signal line φ 3 rises at time t 2 , the transistor Q 8 is turned on and the flip-flop 1 is forcibly inverted by the transistor Q 7 in accordance with the value of the bit line potential.

By adding only one transistor Q 10 in the first embodiment, the read-out operation can be effected through the same path as in the verify operation. Accordingly, the verify operation and the read-out operation correspond to each other exactly, and a circuit less susceptible to a fluctuation in power supply voltage, noise, etc. can be realized.

Furthermore, since the detection (sense) level of the bit line potential at the time of read-out can be set by controlling the threshold value of the transistor Q 7 , the detection can be effected with a lower potential than in the prior art (i.e. the detection using the threshold of the inverter). In other words, since the sense level is low, pre-charge up to Vcc is not necessary, unlike the prior art. As a result, the power supply potential can be decreased, and therefore the reliability of the circuit is enhanced.

FIGS. 24 to 31 are circuit diagram showing various modifications of the second embodiment. FIG. 24 shows the same structure as FIG. 22 , and FIG. 24 is prepared for the purpose of reference. FIG. 24 to FIG. 27 show examples in which N-channel transistors Q 10 are connected to bit-line-side nodes of the flip-flop circuits 1 , and FIG. 28 to FIG. 31 are examples in which P-channel transistors Q 11 are connected to the nodes of the flip-flop circuits, which are located on the opposite side to the bit lines. Each of these examples functions similarly with the second embodiment, and therefore a description thereof is omitted.

FIG. 32 to FIG. 35 are circuit diagram showing a third embodiment of the invention, wherein the bit line potential is sensed via an inverter 80 or a NAND gate 81 , thereby driving a transistor Q 80 for forcible inversion. Unlike the first embodiment, the bit line (BL)-side node of the flip-flop circuit 1 is forcibly inverted by the transistor Q 80 . Thus, a sensing circuit with higher sensitivity can be realized by the inverter 80 .

FIG. 36 to FIG. 43 are circuit diagrams showing a fourth embodiment of the invention, wherein a reset transistor driven by signal φR or BφR is provided in the third embodiment. The operation of the fourth embodiment is similar to that of the second embodiment, and a description thereof is omitted.

FIG. 44 is a circuit diagram showing the structure of a fifth embodiment having a butch verify function. In the first embodiment, no consideration is given of the detection of completion of data write in all bits. For example, the nodes (N 1 to N 3 ) of the flip-flop circuits are successively sensed, and if 5V is latched in all bits, the data write is completed. A circuit for sensing the nodes in a butch manner is referred to as “butch verify circuit.”

The butch verify circuit comprises transistors Q 201 , 202 and 203 , a transistor Q 21 and an inverter 20 , as shown in FIG. 20 . Specifically, a circuit portion associated with one bit line comprises a flip-flop circuit 1 for temporarily storing write data; a bit line BL, a NAND-type memory cell 2 (illustrated in FIG. 1 ) connected to the bit line BL; a P-channel transistor Q 3 for charging the bit line BL; a transistor Q 4 for connecting the bit line BL and the flip-flop circuit 1 ; and transistors Q 7 and Q 8 connected in series between the node BN (BN 1 to BN 3 ) of the flip-flop circuit 1 , which is located on the opposite side of the bit line BL, and the ground potential of 0V. The transistors Q 7 and Q 8 constitute forcible inversion means (data setting circuit). The gate of the transistor Q 7 is connected to the bit line BL.

The gates of all transistors Q 3 are connected to a signal line φ 1 . This transistor Q 3 constitutes charging means. The gates of all transistors Q 4 are connected to a signal line φ 2 , and the gates of all transistors Q 8 are connected to a signal line φ 3 . The source of the transistor Q 3 is connected to a power supply source having a potential of 9V at the time of write and having a potential of 5V at the other time. A power supply for the flip-flop circuit has a potential of 9V at the time of write and a potential of 5V at the other time. A part of the control circuit 17 is extracted and shown as clock generating circuit 8 for driving signal lines φ 1 , φ 2 , φ 3 and φ 5 at predetermined time.

The principle of the verify operation is the same as that in the first embodiment. The detection of completion of data write in all bits is performed as follows. Specifically, after the verify operation is completed, the signal φ 5 is lowered and a common verify line 26 is precharged to 5V. If any one of the transistors Q 201 to Q 203 is turned on and rendered conductive, the common verify line 26 is discharged. If all transistors Q 201 to Q 203 are turned off and rendered non-conductive, the potential of the common verify line 26 remains 5V.

The transistors Q 201 to Q 203 are connected to the nodes BN of the associated flip-flop circuits 1 , which are located on the side opposite to the nodes N.

Accordingly, if the potential of node N is 5V, the potential of node BN is 0V and the transistors Q 201 to Q 203 are rendered non-conductive. If the potential of node N is 0V, the potential of node BN is 5V and the transistors Q 201 to Q 203 are rendered conductive.

As a result, if any one of the bit lines associated with nodes N 1 to N 3 has a potential of 0V after the verify operation (i.e. if the write operation has not been completed), the common. verify line 26 is discharged and the output VFY becomes 5V. If the potentials of all nodes N 1 to N 3 reaches 5V after the verify operation (i.e. if the data write for all bits is completed), the common verify line 26 remains at 5V and the output VFY becomes 0V.

As described above, if the butch verify circuit is provided in the fifth embodiment, it is possible to detect the completion of data write for all bits in a butch manner. It is therefore possible to determine the timing for halting the write operation and the verify operation. In the fifth embodiment, the write operation and verify operation may be repeated until the output VFY reaches 0V.

If the butch verify circuit is combined with the above-mentioned forcible inversion type sense amplifier, the verify time can be decreased. For example, in FIG. 44 , as regards the latch data in the flip-flop circuit 1 in the forcible inversion type sense amplifier, the node N is at “H” level and the node BN is at “L” level before the verify operation. Thus, all transistors Q 201 to Q 203 are turned off. Accordingly, the timing for charging the common verify line 26 by signal φ 5 can be set during or before the verify read-out operation. In the various sense methods described in connection with the prior art, it is necessary to charge the common verify line 26 after the verify read-out operation is completed. However, in the present embodiment, the common verify line can be charged high a higher timing, and therefore the butch verify time and, accordingly, the write time can be decreased.

FIG. 45 to FIG. 48 are circuit diagrams showing main parts of various modifications of the fifth embodiment. FIG. 45 shows the same structure as FIG. 44 , FIG. 45 is prepared for the purpose of comparison. FIG. 46 shows an example wherein the butch verify circuit is constituted by connecting P-channel transistors Q 21 x (x=1, 2, 3) in series. FIG. 47 shows an example wherein a butch verify circuit comprising the same N-channel transistor Q 20 x (x=1, 2, 3) as shown in FIG. 45 is provided on the node (N)-side of the associated flip-flop circuit 1 . FIG. 48 shows an example wherein the same P-channel transistor Q 21 x (x=1, 2, 3) as shown in FIG. 46 is connected to the node N side of the associated flip-flop circuit 1 , thereby constituting the butch verify circuit. The circuits of these examples operate similarly with the circuit shown in FIG. 44 , and a detailed description of the operation is omitted.

In FIGS. 45 and 48 , since all sense transistors for discharge are connected in parallel, the butch verify operation can be effected at higher speed than in the other circuits. In the examples of FIGS. 46 and 47 , since the sense transistors are connected in series, the chip area can be reduced. The example shown in FIG. 45 is optimal, and the speed of the circuit operation is higher than that in FIGS. 46 to 48 , by virtue of the parallel connection and the use of N-channel transistors.

FIGS. 49 and 50 are circuit diagrams showing sixth and seventh embodiments of the invention, respectively. In these examples, a single flip-flop circuit 1 is shared by a plurality of bit lines. The circuit shown in FIG. 49 comprises a flip-flop circuit 1 ; bit lines BLL and BLR connected to the flip-flop circuit 1 ; a first verify read-out circuit 61 controlled by signals φ 11 , φ 12 and φ 13 ; and a second verify read-out circuit 62 controlled by signals φ 21 , φ 22 and φ 23 . The flip-flop circuit 1 can be shared by the bit lines BLL and BLR, and the pattern area can be reduced.

In the seventh embodiment shown in FIG. 50 , a single flip-flop circuit 1 is shared by bit lines BL 1 , BL 2 , BL 3 and BL 4 . The switching of the bit lines is effected by transistors Q 71 to Q 74 controlled by signals S 1 to S 4 . As a result, like the sixth embodiment, the pattern area can be reduced.

Moreover, since a sense amplifier is shared by a plurality of adjacent bit lines, a sense amplifier, which is relatively difficult to situate, can be provided easily in a pattern layout of the chip. This advantage is enhanced by the combination with the aforementioned forcible inversion type sense amplifier. Specifically, in the forcible inversion type sense amplifier, the forcible inversion means is connected to the node of the flip-flop which is located on the side opposite to the bit line, and consequently wiring is complex. If the sense amplifier is shared by every four bit lines, wiring can be made easily with allowance. From the standpoint of design, it is desirable to group the bit lines in units of four.

The circuit configurations of the first to seventh embodiment in the case where NAND-type memory cells are used have been described above. In these example, (1) the bit line is set at 0V when the threshold is shifted in the write mode, and the latch data in the flip-flop circuit is inverted if the bit line remains at 5V after read-out in the verify mode There may be other cases (2) to (4):

(2) The bit line is set at 0V when the threshold is shifted in the write mode, and the latch data in the flip-flop circuit is inverted if the potential of the bit line reaches 0V after read-out in the verify mode (for example, a NOR-type memory cell structure wherein electrons are injected in the floating gate at the time of erase, and write is effected by selectively extracting electrons from the drain and shifting the threshold to the negative side).

(3) The bit line is set at 5V when the threshold is shifted in the write mode, and the latch data in the flip-flop circuit is inverted if the potential of the bit-line remains 5V after read-out in the verify mode (for example, a NOR-type memory cell structure wherein electrons are extracted from the floating gate at the time of erase, and write is effected by selectively injecting electrons from the drain and shifting the threshold to the positive side).

(4) The bit line is set at 5V when the threshold is shifted in the write mode, and the latch data in the flip-flop circuit is inverted if the potential of the bit line reaches 0V after read-out in the verify mode (for example, a NAND-type memory cell structure wherein electrons are injected in the floating gate at the time of erase, and write is effected by selectively extracting electrons from the drain and shifting the threshold to the negative side).

The case (2) is illustrated in FIGS. 51 to 74 . FIGS. 51 to 54 are circuit diagrams showing main parts of applied examples corresponding to the first embodiment, FIGS. 55 to 62 are circuit diagrams showing main parts of applied examples of the second embodiment, FIGS. 63 to 66 are circuit diagrams showing main parts of applied examples of the third embodiment, and FIGS. 67 to 74 are circuit diagrams showing main parts of applied examples corresponding to the fourth embodiment. The operations of these circuits are the same as those of the above-described embodiments, and therefore a description thereof is omitted.

The case (3) is illustrated in FIGS. 75 to 98 . FIGS. 75 to 78 are circuit diagrams showing main parts of applied examples corresponding to the first embodiment, FIGS. 79 to 86 are circuit diagrams showing main parts of applied examples of the second embodiment, FIGS. 87 to 90 are circuit diagrams showing main parts of applied examples of the third embodiment, and FIGS. 91 to 98 are circuit diagrams showing main parts of applied examples corresponding to the fourth embodiment. The operations of these circuits are the same as those of the above-described embodiments, and therefore a description thereof is omitted. FIGS. 99 to 102 show examples of the structure of the batch verify circuit. These examples correspond to the fifth embodiment, and therefore a description thereof is omitted.

The case (4) is illustrated in FIGS. 103 to 126 . FIGS. 103 to 106 are circuit diagrams showing main parts of applied examples corresponding to the first embodiment, FIGS. 107 to 114 are circuit diagrams showing main parts of applied examples of the second embodiment, FIGS. 115 to 118 are circuit diagrams showing main parts of applied examples of the third embodiment, and FIGS. 119 to 126 are circuit diagrams showing main parts of applied examples corresponding to the fourth embodiment. The operations of these circuits are the same as those of the above-described embodiments, and therefore a description thereof is omitted.

FIG. 127 is a circuit diagram showing the structure of a most desirable embodiment of the present invention. A portion in a block 25 has a structure similar to that shown in FIG. 25 . Specifically., when the level of signal φR rises, the node BN of the flip-flop circuit 1 is set at “1”. If the level of signal φ 3 rises in the state in which the bit line BL is at “1”, the flip-flop circuit 1 is inverted.

As has been described above, in the actual applied mode, several thousand bit-by-bit verify-circuits are arranged in parallel. When read-out pulses φ 3 are input in the state in which all bit lines are at “1”, all flip-flop circuits 1 are inverted. At this time, a through-current flows in the flip-flop circuit 1 , and the power consumption of the chip may increase or the source potential of the P-channel transistor Q 33 may decrease due to wiring resistance. As a result, the operation may become unstable.

The P-channel transistors Q 35 and Q 36 connected between the transistors Q 31 and Q 33 and the power supply prevent the above undesirable operation and also prevent the through-current of a predetermined level or above from flowing. The gates of the transistors are separated to realize flexible structure. That is, when an intermediate potential is input to the bit line, a large current flows through the transistor Q 36 . Thus, the through-current is reduced by increasing the gate potential of the transistor Q 36 , and the gate potential of the transistor Q 35 is lowered to enhance stability of the flip-flop circuit 1 . Needless to say, the gates may be commonly used in consideration of the specifications, or the conductance may be controlled by the dimension of the P-channel MOS transistor.

If the through-current is reduced by the transistor Q 35 , the threshold of the bit line potential for inverting the flip-flop circuit 1 can be set in the vicinity of the threshold value of the transistor Q 7 , and influence of noise due to capacitance between bit lines can be decreased.

A high voltage is applied to the bit line at the time of programming/erasure. If conventional means for cutting off high voltage is adopted by inserting a depletion type MOS transistor Q 37 between the bit line and the input terminal of the sense amplifier, the sense amplifier circuit can be constituted by low-voltage type transistors. Accordingly, the area occupied by the circuit elements can be reduced and the performance of the circuit can be enhanced.

The data in the flip-flop circuit 1 is read out to the IO line via the transfer gate to which a column decode signal CS is input. If the potential of the IO line is fully swung from the outside, desired data can be written in the flip-flop circuit.

Electric current flowing from the IO/BIO line to the bit line can be measured by setting the bit line in the selected state, setting the potential of the node BN at “0” via the IO/BIO line, and setting the transistor Q 35 in the off state. The bit line current is a current flowing to the cell or a leak current due to defects. With this function, device information of the memory can be exactly acquired.

According to the above embodiment, the sense amplifier circuit is realized wherein the bit-by-bit verify operation can be performed, influence of noise is very low, power consumption is low, and a test function is provided.

Although mentioned in the above description, the present invention is applicable not only to the NAND type EEPROM cell but to the NOR type EEPROM. FIG. 28 is a circuit diagram showing a circuit wherein a NOR type memory cell is adopted in the structure shown in FIG. 115 . For example, a memory cell having a selector transistor, which makes use of FN (Fowler-Nordheim) tunnel current for erase and write operations, is used. The reason is that write operations can be simultaneously effected in a great number of cells (e.g. about 4000 bits) which make use of tunnel current for write operations. Thus, the effect of the bit-by-bit verify by the present invention can be exhibited to a maximum. It is more desirable to provide the selector transistor, because the drain stress of each transistor with floating gate is reduced. In the cell portion shown in FIG. 128 , “erase” is defined by the state in which electrons are injected in the floating gate at a time and the threshold is increased. The write operation is performed in the following manner. A voltage is applied to a selector gate SL 0 and the selector transistor is turned on. Then, a positive bias voltage is applied to the drain of the transistor in which data is to be written, and a negative bias voltage is applied to the control gate (one of word lines WL 0 , WL 1 . . . ) of the selected transistor. Thereby, electrons in the floating gate of the selected bit are released to lower the threshold value At this time, if the electrons are released from the floating gate excessively and the threshold value decreases to 0V or less, a current flows in the non-selected word line and data in the selected cell cannot be read. For this reason, like the NAND type cell, the stable operation can be expected by performing the bit-by-bit verify operation and writing “1” data while sensing the threshold value. FIG. 129 should be referred to with respect to the definition of the threshold value distribution.

In FIG. 128 , when. data is to be written in the selected cell M 11 (i.e. when electrons are to be released from the floating gate), the circuit is reset such that the bit line-side node of the flip-flop circuit 1 of the forcible inversion type sense amplifier is set at “H” level. This can be realized by using a reset transistor (not shown) or loading data from the outside via a column gate. In this state, the power supply for the flip-flop circuit 1 is set at high potential, e.g. about 7V, a high bias voltage is applied to the drain, and a negative bias voltage of about −10V is applied to the word line WL 0 . Thereby, electrons are released from the floating gate of the selected cell. In the subsequent verify operation, φ 2 is set at “L” to turn off the transistor Q 4 and SL 0 is set at “L” to turn off the selector transistor Q 05 . In this state, WL 0 is set at a predetermined verify potential, and the bit line BL is precharged by the transistor Q 3 . Thereafter, the selector transistor Q 05 is turned on to set the bit line in the free-running state. At this time, if the threshold value is lower than the verify potential, the bit line potential decreases and “H” signal is output from the inverter 50 . Accordingly, if φ 3 is set at “H” at a certain timing, the flip-flop 1 is forcibly inverted, and the bit line-side node is set at “L”. If this node is at “L”, the electrons in the floating gate are not released even if the negative bias is applied to the word line at the time of write, since the drain remains at 0V. On the other hand; if the threshold value of the cell is greater than the verify potential, the bit line pre-charge level is maintained. Thus, the flip-flop circuit 1 is not inverted, and the write operation is performed again. In the case where the selected cell needs to remain in the erase state, the cell keeps the threshold value in the erase state, if data is loaded to set the bit line (BL)-side node of the flip-flop circuit 1 at the “L” level, because no potential is applied to the drain.

A normal read-out operation is performed by applying a proper potential (e.g. Vcc) to the control gate of the cell, instead of the verify potential, and by performing the same operation as the verify operation. As stated above, the present invention is applicable to the NOR-type EEPROM of the type in which the threshold is lowered at the time of write, and the same advantage as with the NAND-t e device can be obtained. In particular, if this invention is applied to the cell which makes use of FN tunnel current at the time of write, the merit of multi-bit simultaneous write can be obtained, and the cell using the selector transistor is desirable in terms of stress.

As has been described above, according to the present invention, when a single write/verify operation has been completed, the data in the flip-flop circuit is inverted by the forcible inversion means (data setting circuit). As a result, the bit-by-bit verify operation is realized.

Moreover, unlike the prior art, the bit line potential is not varied, since the bit line potential is applied only to the forcible inversion means (data setting circuit). Besides, the through-current path is not provided, and the power consumption is not increased.

Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, and representative devices, shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

Claims

1. A non-volatile semiconductor memory device, comprising:a non-volatile memory cell; a bit line coupled to said non-volatile memory cell; a flip-flop circuit having first and second nodes, said flip-flop circuit holding write data supplied thereto; a switching circuit disposed between said bit line and said first node of said flip-flop circuit, said switching circuit responsive to a switching signal for electrically connecting said bit line and flip-flop circuit during a write operation for writing the write data to said non-volatile memory cell; and a MOS transistor circuit including first and second MOS transistors coupled in series between said first node of said flip-flop circuit and a first potential node, said first MOS transistor having a gate supplied with a potential of said bit line, and said second MOS transistor having a gate supplied with a clock signal.

2. The device according to claim 1, wherein said first and second MOS transistors are both n-channel MOS transistors.

3. The device according to claim 1, wherein said first MOS transistor is provided on said first potential node side and said second MOS transistor is provided on said flip-flop circuit side.

4. The device according to claim 1, further comprising a verify detection circuit including a verify signal line, and a third MOS transistor which is controlled to be conductive or non-conductive in accordance with whether said flip-flop circuit is set in a verify state in which the write data is written to said non-volatile memory cell during the write operation, said third MOS transistor being coupled between a second potential node and said verify signal line.

5. The device according to claim 4, wherein said verify detection circuit comprises a batch verify detection circuit.

6. The device according to claim 4, wherein said third MOS transistor includes a gate supplied with a potential of said first node of said flip-flop circuit.

7. The device according to claim 1, wherein the potential of said first potential node is ground potential.

8. A non-volatile semiconductor memory device, comprising: a non-volatile memory cell;a bit line coupled to said non-volatile memory cell; a flip-flop circuit including first and second inverter circuits whose input and output terminals are connected in opposite directions to each other at first and second nodes, said flip-flop circuit holding write data supplied thereto; a switching circuit disposed between said bit line and said first node of said flip-flop circuit, said switching circuit responsive to a switching signal for electrically connecting said bit line and said flip-flop circuit during a write operation; and a MOS transistor circuit including first and second MOS transistors coupled in series between said first node of said flip-flop circuit and a first potential node, said first MOS transistor having a gate supplied with a potential of said bit line, and said second MOS transistor having a gate supplied with a clock signal.

9. The device according to claim 8, wherein said first and second MOS transistors are each an n-channel MOS transistor.

10. The device according to claim 8, wherein said first MOS transistor is provided on said first potential node side and said second MOS transistor is provided on said flip-flop circuit side.

11. The device according to claim 8, further comprising a verify detection circuit including a verify signal line, and a third MOS transistor which is controlled to be conductive or non-conductive in accordance with whether said flip-flop circuit is set in a verify state in which the write data is written to said non-volatile memory cell during the write operation, said third MOS transistor being coupled between a second potential node and said verify signal line.

12. The device according to claim 11, wherein said verify detection circuit comprises a batch verify detection circuit.

13. The device according to claim 11, wherein said third MOS transistor includes a gate supplied with a potential of said first node of said flip-flop circuit.

14. The device according to claim 8, wherein the potential of said first potential node is ground potential.

15. The device according to claim 8, wherein said first and second inverter circuits each comprises a CMOS inverter circuit.