Patent Application
20240360583
The invention relates to the manufacturing field of sheet-type horizontal plating or sheet-type horizontal electrolytic cleaning machine, specifically relating to a novel installed conductive roller and anode plate device for sheet-type horizontal plating or sheet-type horizontal electrolytic cleaning machine.
The printed circuit board and the semiconductor product have to go through plating and electrolytic degreasing; traditionally, the surface treatment method of plating and electrolytic degreasing for the printed circuit board and the semiconductor product comprises the steps of respectively arranging conveying roller and water-blocking roller at two opposite sides in the plating tank, wherein the water-blocking rollers are vertically arranged and conveying roller is positioned below the water-blocking rollers; the vertically arranged water-blocking roller is utilized for blocking plating solution so that the liquid level of the plating solution is at least as high as the center of the uppermost water-blocking roller to form a soaking area, so that the conveying roller is immersed below the liquid level of the plating solution; in addition, a surge generator and an anode device are arranged between the water blocking rollers at two sides, and the opposite two sides outside the soaking area are respectively provided with a conductive roller connected with the cathode. The printed circuit board is held by the conductive rollers in contact with the printed circuit board and then fed into the soaking region, and the printed circuit board fed into the soaking region is held and conveyed by the conveying roller and the water-blocking roller, at time of which the printed circuit board is negatively charged; when the printed circuit board is conveyed to pass through the anode device and the surge generator, the plating solution sprayed by the surge generator passes through the anode device and enable metal ions in the plating solution to be positively charged, then the solution passes through the plate surface and the holes of the printed circuit board, enabling the positively charged metal ions attached to the negatively charged printed circuit board to achieve plating effect, although the early conductive roller is arranged outside the soaking area and cannot be directly soaked in the plating solution, in the running process of the machine, the plating solution can still be sprayed to the conductive roller through gaps at multiple positions, leading to metal being plated on the surface of the conductive roller and affect its roughness, the diameter of the conductive roller can also be increased and causing clamping plate. Other plating machines directly arrange the conductive rollers between two groups of water-blocking rollers, and when the conductive rollers are plated with metal to a certain degree, the conductive rollers are detached, cleaned and then returned to the original position; however, the need to frequently clean the conductive roller can significantly affect the efficiency of plating.
The technology problem to be solved by the invention is to design a novel installed conductive roller and anode plate device for sheet-type horizontal plating or sheet-type horizontal electrolytic cleaning machine.
In order to solve above-mentioned problems, the technology scheme provided by the invention is as follow: a novel installed conductive roller and anode plate device for sheet-type horizontal plating or sheet-type horizontal electrolytic cleaning machine comprises a soaking tank 1, a cathode conductive roller 2 (the cathode conductive roller doesn't generate circuit will suffice, no matter being soaked or not soaked in plating solution or electrolyte), a soaking tank 3, device's partial shell 4 and conductive plate 5; the device's partial shell is provided with a soaking tank device with an inner cavity shell; a cathode conductive roller 2 is arranged between the soaking tank 1 and the soaking tank 3 (the cathode conductive roller doesn't generate circuit will suffice, no matter being soaked or not soaked in plating solution or electrolyte); an anode plate device is arranged in the soaking tank; a matched anode conductive plate tank device is arranged below the cathode conductive roller.
Compared with the prior art, the invention has following advantages: the whole structure is simple and exquisite, the selection, connection and whole working modes of parts are reasonable and complete; when the product passes through the electrolyte in the soaking tank 1 and get in touch with the cathode conductive roller which is not soaked in plating solution or electrolyte, the product in the plating solution or electrolyte has current reaction and begin plating or electrolytic degreasing, when the product departs from the soaking tank 1, passes through the cathode conductive roller which is not soaked in plating solution or electrolyte, and enters into the soaking tank 3 plating solution or electrolyte for plating or electrolytic degreasing; the current is concentrated and uniformly distributed on semiconductor product or circuit board when the method is used for plating or electrolytic degreasing, achieving better product plating or electrolytic degreasing effect; the method not easily locks coating and oxide layer on the cathode conductive roller, the conductive plate arranged below the cathode conductive roller acts on the metal ions separated out from the anode to be uniformly distributed and enter the plating solution, and the other acts on the metal ions in the electrolyte to be attached to the plate during electrolytic degreasing process; this method has advantages of preventing exceeding metal ions in the electrolyte, prolonging the service life of the electrolyte, along with good applicability and easy to promote.
Furthermore, the pumps in the soaking tanks are circularly filtered and filled with plating solution or electrolyte.
As is shown in the figures, 1. soaking tank 1, 2. cathode conductive roller 2 (the cathode conductive roller doesn't generate circuit will suffice, no matter being soaked or not soaked in plating solution or electrolyte), 3. soaking tank 3, 4. device's partial shell 4, 5. conductive plate 5
The invention is further described in detail hereinafter with reference to the drawings.
When the invention is implemented, as is shown in the preferred embodiments of
In a preferred embodiment of the invention, as is shown in
The invention and its embodiments have been described above, but the description is not limited thereto; only one embodiment of the invention is shown in the drawings, and the actual structure is not limited thereto. In general, it is to be understood by those skilled in the art that non-creative design of structural forms and embodiments that are similar to the technical solutions without departing from the spirit of the invention shall all fall within the protective scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202320953744X | Apr 2023 | CN | national |
| 2023104522279 | Apr 2023 | CN | national |
