Claims
- 1. An epoxy resin having the formula: ##STR4## wherein R is a hydrogen atom or a methyl group, and n is an integer of 0 to 15, and wherein said resin has an epoxy equivalent in the range of 320-345g/eq.
- 2. A method preparing an epoxy resin having an epoxy equivalent in the range of 320-345g/eq. and having the formula: ##STR5## wherein R is a hydrogen atom or a methyl group, and n is an integer of from 0 to 15, which comprises:
- a) reacting a phenol with dicyclopentadiene in the presence of a Lewis acid catalyst to form a resin of t he formula: ##STR6## wherein R and n are as defined above, and then b) reacting said formed resin with epichlorohydrin in the presence of a catalyst selected from the group consisting of quarterly ammonium salts, tertiary amines, halogenated phosphonium salts and alkali metal halides.
- 3. The method of claim 2, wherein said phenol is selected from the group consisting of phenol, p-cresol, m-cresol, p-cresol, ethylphenol and isopropyl phenol.
- 4. The method of claim 3, wherein said phenol and dicyclopentadiene are reacted in the presence of a Lewis acid catalyst or a mixture of Lewis acid catalysts.
- 5. The method of claim 4, wherein said catalyst is a Lewis acid selected from the group consisting of .sub.AlCl3, BF.sub.3, ZnCl.sub.2, H.sub.2 SO.sub.4, TiCl.sub.4 and H.sub.3 PO.sub.4.
- 6. The method of claim 5, wherein the phenol is first melted and said catalyst is added thereto, and then said dicyclopentadiene is added dropwise at a temperature of about 50-180.degree. C. in the amount of about 0.005-0.1 mol of catalyst, and about 0.1-10.0 mol of said phenol to 1 mol of dicyclopentadiene.
- 7. The method of claim 2, wherein the resin obtained from the polymerization of said phenol and dicyclopentadiene is dissolved in a 1-20 molar excess of epichlorohydrin at a temperature of about 10-120.degree. C. in the presence of said catalyst.
- 8. The method of claim 7, wherein said catalyst is selected from the group consisting of tetramethylammonium bromide, benzyltriethylammonium bromide, tetraethylammonium chloride, trimethylamine, halogenated phosphonium salts, potassium bromide and sodium chloride; and is used in the amount of about 0.05-5.0 parts by weight per 100 parts by weight of resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
59-245795 |
Aug 1985 |
JPX |
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Parent Case Info
The present application is a continuation-in-part (CIP) of application Ser. No. 07/296,882 filed on Jan. 12, 1989, which is a file wrapper continuation (FWC) application of application Ser. No. 07/057,646 filed on June 26, 1987, now abandoned, which is a file wrapper continuation (FWC) application of application Ser. No. 06/767,434 filed on August 20, 1985, now abandoned.
US Referenced Citations (6)
Continuations (2)
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Number |
Date |
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Parent |
57646 |
Jun 1987 |
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Parent |
767434 |
Aug 1985 |
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Continuation in Parts (1)
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Number |
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296882 |
Jan 1989 |
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