Claims
- 1. A system for selectively applying a paste to an essentially planar microelectronic substrate having high aspect ratio openings, said substrate being an integrated circuit or integrated circuit carrier component, comprising:
- a flat screen having openings for conducting said paste to said substrate; and
- a paste extruding nozzle including:
- a nozzle body, said nozzle body having an inlet, an elongate outlet formed to receive an insert, and an internal passage in communication therewith; and
- a pliant insert formed to compliantly and sealably mount to said nozzle body outlet, said pliant insert having an elongate slit for the extrusion of paste through said nozzle body outlet and said screen onto said substrate, a flat surface located adjacent to said slit and contacting said flat screen, and a second surface joined to said flat surface at a position not in contact with said slit and angled between about 2 and about 4 degrees from said flat surface towards said nozzle body, said pliant insert establishing a positive and consistent seal to said flat screen during the application of said paste.
- 2. The nozzle of claim 1 further comprising a plurality of support strips fixably mounted in the nozzle body to retain the insert in the nozzle body.
- 3. The nozzle of claim 2 wherein the plurality of support strips are fixably mounted in the nozzle body by set screws.
- 4. The nozzle of claim 2 wherein the plurality of support strips are fixably mounted in the nozzle body by glue.
- 5. The nozzle of claim 2 wherein the plurality of support strips are bonded to at least one of the nozzle body and the insert.
- 6. The nozzle of claim 1 wherein the insert has an internal cavity wall and wherein the cavity walls are essentially perpendicular to the flat surface.
- 7. The nozzle of claim 1 wherein one or more lateral edges of said insert are beveled.
- 8. The nozzle of claim 1 wherein the insert comprises a material selected from the group consisting of elastomers and thermoplastics.
- 9. The nozzle of claim 1 further comprising a paste flow control means.
- 10. The nozzle of claim 1 further comprising a paste supply means.
- 11. The nozzle of claim 2 wherein said nozzle is formed of a pliant material and said support strips retain said pliant insert against deformation during use.
- 12. The system of claim 1 further comprising a plurality of support strips fixably mounted in said nozzle body to retain said insert in said nozzle body.
- 13. The system of claim 12 wherein said angled second surface terminates in a beveled edge.
- 14. A system for selectively applying a paste to an essentially planar microelectronic substrate having high aspect ratio openings, said substrate being an integrated circuit or integrated circuit carrier component, comprising:
- a flat screen having openings for conducting said paste to said substrate; and
- a paste extruding nozzle including:
- a nozzle body having an elongate outlet; and
- a pliant member sealably mounted to said nozzle body, said pliant member having an elongate slit for the extrusion of paste through said nozzle body outlet and said screen onto said substrate, a flat surface located adjacent to said slit and contacting said flat screen, and a second surface joined to said flat surface at a position not in contact with said slit and angled between about 2 and about 4 degrees from said flat surface towards said nozzle body, said pliant member establishing a positive and consistent seal to said flat screen during the application of said paste.
- 15. The system of claim 14 wherein said pliant member is bonded to said nozzle body.
- 16. The system of claim 14 wherein said pliant member has at least one beveled working edge.
- 17. The system of claim 14 wherein said flat surface has width in a range between about 0.020 inches to about 0.060 inches.
- 18. The system of claim 14 wherein said pliant member comprises a material selected from the group consisting of elastomers and thermoplastics.
RELATED APPLICATION
Copending U.S. patent application Ser. No. 08/753,127, entitled "Nozzle Apparatus for Extruding Conductive Paste" filed on even date herewith and assigned to the assignee hereof, discloses a similar nozzle apparatus and method of use.
US Referenced Citations (13)
Non-Patent Literature Citations (1)
Entry |
S. W. Cornell, et al., "Extrusion Screening Nozzle", IBM Technical Disclosure Bulletin vol. 14, No. 3, Aug. 1971, p. 739. |