NSF Student Travel Grant for the 2017 International Convention on Shape, Solid, Structure & Physical Modeling (S3PM-2017)

Information

  • NSF Award
  • 1735149
Owner
  • Award Id
    1735149
  • Award Effective Date
    5/15/2017 - 7 years ago
  • Award Expiration Date
    2/28/2018 - 6 years ago
  • Award Amount
    $ 30,000.00
  • Award Instrument
    Standard Grant

NSF Student Travel Grant for the 2017 International Convention on Shape, Solid, Structure & Physical Modeling (S3PM-2017)

This proposed project will support student participation in S3PM-2017, the International Convention on Shape, Solid, Structure, and Physical Modeling, which will be hosted and co-sponsored by ICSI at UC Berkeley in June 2017. This event combines two prestigious symposia: SPM, the Solid and Physical Modeling Symposium (June 19-21), and SMI, the Shape Modeling International Conference (June 21-23). SPM is an annual international forum for the exchange of recent research in applications of solid modeling and processing in design, analysis, and manufacturing, as well as in biomedical, geophysical and other emerging application areas. SMI provides a forum for the dissemination of new computational techniques for modeling and processing digital representations of shapes and of their properties across a wide range of application areas. The two conferences have been attracting the top international researchers in their respective fields for two decades, advancing knowledge of mathematical and algorithmic principles for the design, modeling, representation, processing, analysis, and visualization of shapes, solids, structures, materials, properties, and behaviors.<br/><br/>The project will support registration, travel, and housing for approximately 20 student S3PM participants from U.S. institutions. Students will learn about cutting edge research in shape/material/structure models, including advances in representations of manufacturing knowledge, algorithmic innovations in CAD, and new interfaces for specifying and interacting with design and manufacturing services. It will give them the opportunity to present their work, obtain feedback from international experts, listen to presentations describing state of the art results, witness lively discussion panels, attend keynote lectures from world renowned speakers, and network with industry R&D leaders, training the next generation of the U.S. workforce to continue to lead in research and engineering innovation. Student selection will prioritize supporting female and underrepresented minority students to support their career development.

  • Program Officer
    Jack Snoeyink
  • Min Amd Letter Date
    5/8/2017 - 7 years ago
  • Max Amd Letter Date
    5/8/2017 - 7 years ago
  • ARRA Amount

Institutions

  • Name
    International Computer Science Institute
  • City
    Berkeley
  • State
    CA
  • Country
    United States
  • Address
    1947 CENTER ST STE 600
  • Postal Code
    947044115
  • Phone Number
    5106662900

Investigators

  • First Name
    Sara
  • Last Name
    McMains
  • Email Address
    mcmains@me.berkeley.edu
  • Start Date
    5/8/2017 12:00:00 AM

Program Element

  • Text
    CM - Cybermanufacturing System
  • Text
    ENGINEERING DESIGN AND INNOVAT
  • Code
    1464
  • Text
    ALGORITHMIC FOUNDATIONS
  • Code
    7796
  • Text
    Design of Eng Materials (DEMS)
  • Code
    8086

Program Reference

  • Text
    CONFERENCE AND WORKSHOPS
  • Code
    7556
  • Text
    COMPUTATIONAL GEOMETRY
  • Code
    7929