The present application is a reissue of U.S. patent application Ser. No. 11/423,761, filed Jun. 13, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.
The present application is based on, and claims priority from, FR Application Number 0505981, filed Jun. 14, 2005, the disclosure of which is hereby incorporated by reference herein in its entirety.
The invention concerns the area of printing without physical contact onto a substrate of which at least one face is in plastic, and more particularly a machine, independent from a printing system, which allows, before or after the printing system, the application by jet of a product having a viscosity going up to 1000 centipoises, and described as average to large, such as varnish, glue, conducting or scratchable ink, onto a substrate of variable thickness and dimensions.
There already exist jet printing systems operating with inks whose viscosity is low and of the order of ten or so centipoises.
The existing systems use different techniques to project a bubble of ink onto the medium. According to a first technique, the ink contained in a nozzle is expelled by a pressure created by a gaseous bubble formed at a heating resistance which creates a chemical reaction by converting the ink to the gaseous state. Another technique to create pressure is to use a piezo-electric component which curves inward under the effect of an electric voltage, so as to reduce the volume of the ink reservoir. A droplet of ink is thus expelled from the nozzle.
These systems are however limited to inks or products with a controlled fluidity and a low viscosity as well as molecules of very small dimension. For example, it is not possible with the existing appliances to apply, without contact with the medium, products such as varnish, scratchable ink, conducting ink or glue, in particular onto a plastic substrate or the plastic face of a substrate.
Up to the present, the application of such products onto substrates, possibly plastic or of which one face is plastic coated, has been done by spreading and not by projection, which renders complex the application to only a portion of surface of the substrate.
In addition, there is a real need, in particular for customisation purposes or to render documents hard to falsify, to be able to apply a layer of product easily onto a substrate, possibly with a plastic face, in a given zone, before or after printing of the substrate.
The present invention therefore has as its objective to overcome one or more of the drawbacks of previous designs by creating a machine that can be used to apply, without contact, onto a portion of a substrate, products or inks of average fluidity, such as varnish, glue, conducting or scratchable ink, onto a substrate of variable thickness and dimensions.
This objective is attained using a numerical jet machine for a viscous material, for the application of a coating onto a plastic face of a substrate, including an input magazine and an output magazine, a computer device to manage the operations on each of the work stations, a device for moving the substrate between the different work stations, a device for grasping and transferring the substrate from the input magazine to the movement device and from the movement device to the output magazine, wherein it includes at least:
with the control of the command device of the application station according to the position of the substrate, to the read station and to the drying station, and/or with the management of the information received at the different work stations to coordinate the operations, being effected by the management computer device in accordance with an established programming file.
According to another particular feature, the zone of application is specified for each substrate by a configuration file concerning the shape of the zone, its position on the substrate in relation to the substrate markers, the quantity of product to be projected, a machine control program making use of this information in order to translate it into parameters of relative movement of the substrate and of the nozzles, for selective control of the nozzles and of reiteration of offset passage of the substrate in front of the nozzles to produce joined-up lines if necessary.
According to another particular feature, the ramp in which the nozzles are arranged is equipped with a movement device in relation to the medium.
According to another particular feature, the projection site on the substrate is specified by the relative movement of the substrate in relation to the ramp in which the nozzles are arranged.
According to another particular feature, the product is glue and the drying is by heated air current.
According to another particular feature, the product is an aqueous varnish and the drying is by infra-red.
According to another particular feature, the product is a scratchable opaque ink and the drying is by heated air current.
According to another particular feature, the machine includes a device for pressurizing the product to be projected.
Another objective is to propose the use of this machine in a system for the preparation of identification documents (identity card, passport, driving license, etc.) or security documents (access badge, payment card, access key, etc.).
This objective is attained by the combination of a machine according to the invention, used upstream or downstream of an independent printing station or of a station for the installation of an electronic chip on the substrate.
According to another particular feature, the machine according to the invention is used upstream of the printing station for the application of glue in a zone other than that receiving the printing and a second machine is used downstream of the printing station for the application of a varnish on the printed part.
According to a variant, the machine is used upstream of the printing station for the application of varnish in a zone other than the zone receiving the printing and a second machine is used downstream of the printing station for the application of glue in a third zone.
According to a variant, the machine is used upstream of the station for the installation of an electronic chip on the substrate for the application of glue in the zone intended to receive the chip.
The invention, its characteristics and its advantages will appear more clearly on reading the description that follows with reference to the figures listed below:
Let us first consider
The next work station is the projection device (2, 9) for application of the product to the medium. The contactless projection device (2, 9) is detailed in
The application zone is specified for each substrate by a configuration file contained in a memory zone of the computer, concerning the shape of the zone, its position on the substrate in relation to the substrate markers, the quantity of product to be projected, a machine control program making use of this information in order to translate it into parameters of relative movement of the substrate and of the nozzles, selective control of the nozzles and reiteration of the offset passage of the substrate in front of the nozzles to produce joined-up lines if necessary.
The next station of the projection machine is the drying oven (7). The oven (7) is used to fully or partly dry the projected product. The drying, according to the applied product, can be performed by an infra-red radiation in the case of an aqueous varnish or by a heated air-current for glue or an scratchable ink or by UV, according to the projected product. The drying then allows the substrate (13) to be stored in the output magazine (8), so that the projected product is not transferred onto other substrates (13) or onto the magazine (8) with which the substrate (13) is in contact.
With reference to
Electro-acoustic control is used to adjust the projection of material in terms of duration and power. The application zones are then determined by this numerical process with a precision of the order of 0.1 mm. The machine can therefore apply a point or indeed can cover the whole surface of a substrate. The application zone is specified for each substrate by a configuration file concerning the shape of the zone, its position on the substrate in relation to the substrate markers, the quantity of product to be projected. A machine control program uses this information in order to translate it into parameters of relative movement of the substrate and of the nozzles, parameters for selective control of the nozzles and parameters for reiteration of the offset passage of the substrate in front of the nozzles to produce joined-up lines if necessary.
In another embodiment example, the working chain includes other additional work stations allowing, for example, the assembly of different parts together, in the case of application of glue to the specified contact zones it should be obvious to people well-versed in this area that this present invention allows methods of implementation in many other specific forms without moving outside the range of application of the invention as claimed. As a consequence, the present methods of realisation should be seen as illustrations only, and can be modified within the area specified by the scope of the attached claims, and the invention should not be limited to the details given above.
Number | Date | Country | Kind |
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05 05981 | Jun 2005 | FR | national |
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Number | Date | Country | |
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Parent | 11423761 | Jun 2006 | US |
Child | 12708806 | US |