Claims
- 1. A laser processing method for processing a workpiece, the method comprising the steps of:applying a transparent overlay material to the workpiece; and directing a pulse of coherent energy to contact the solid material through the transparent overlay material to create a shock wave; positioning the workpiece in a particular orientation; controlling the shape of the contacting pulse based on the incident angle of the pulse to the workpiece.
- 2. A laser processing method for processing a workpiece having two sides, the method comprising the steps of:applying a laser beam to one side of the workpiece to create a first pressure pulse; applying a laser beam to the other side of the workpiece on a substantially opposite side thereof to create a second pressure pulse; and controlling said laser beams so that said first and second pressure pulses are substantially aligned through the workpiece and the workpiece experiences substantially identical conditions on said substantially opposite sides of the workpiece, said controlling step comprises offsetting said laser beams from one another based on the thickness and surface curvature of the workpiece.
- 3. The laser processing method of claim 2 in which said first pressure pulse and said second pressure pulse overlap by greater than 75 percent of the volume of a said pressure pulse.
- 4. A laser processing method for processing a workpiece having two sides, the method comprising the steps of:applying a laser beam to one side of the workpiece to create a first pressure pulse; applying a laser beam to the other side of the workpiece on a substantially opposite side thereof to create a second pressure pulse; and controlling said laser beams so that said first and second pressure pulses are substantially aligned through the workpiece and the workpiece experiences substantially identical conditions on said substantially opposite sides of the workpiece, said controlling step comprises offsetting said laser beams from one another.
- 5. The laser processing method of claim 4 in which said first pressure pulse and said second pressure pulse overlap by greater than 75 percent of the volume of a said pressure pulse.
- 6. A laser processing method for processing a workpiece having two sides, the method comprising the steps of:applying a laser beam to one side of the workpiece to create a first pressure pulse; applying a laser beam to the other side of the workpiece on a substantially opposite side thereof to create a second pressure pulse; and controlling said laser beams so that said first and second pressure pulses are substantially aligned through the workpiece and the workpiece experiences substantially identical conditions on said substantially opposite sides of the workpiece, said controlling step comprises offsetting said laser beams from one another based on the desired combined compressive residual stress profile from said pressure pulses applied to the workpiece.
Parent Case Info
This is a continuation-in-part of patent application Ser. No. 09/234,381, filed on Jan. 20, 1999, now U.S. Pat. No. 6,236,016, the disclosure of which is herein explicitly incorporated by reference.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0 666 326 |
Dec 1994 |
EP |
1 088 903 |
Sep 2000 |
EP |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/234381 |
Jan 1999 |
US |
Child |
09/861419 |
|
US |