The apparatus and method disclosed and claimed in this document pertains generally to sensors. More particularly, the new and useful on-board temperature/humidity sensor system disclosed and claimed in this document pertains to a sensor mounted in an enclosure on a vehicle used in conjunction with a mobile satellite communications system. The on-board temperature/humidity sensor is particularly, but not exclusively, useful for monitoring temperature and humidity within an enclosure on a vehicle that houses a satellite data modem, and is adapted to monitor structural integrity of the enclosure and functionality of the modem within the enclosure.
A system for at least two-way communications between one or more base stations such as a vehicle dispatcher, and a means of transport remote from the base station, is increasingly in demand. Users desire to track the location of vehicles, communicate with vehicle operators, and monitor various problems confronted by vehicle operators.
The term “means of transport” as used in this document includes but is not limited to not only ground-based motorized vehicles including trucks, cars, and trains, but also ships, boats, airborne means of transport, and the like (collectively in this document, “vehicle” or “vehicles”).
The term “remote” as used in this document means that one object is removed in space from another systemically interrelated but distant object or objects, or that one object has the capability of acting on, controlling, sending data to, or acquiring data from, such other systemically interrelated but distant object or objects, without coming into physical contact with one another.
Efforts to locate, track, identify, and communicate with such vehicles has been enhanced by combining the U.S. Global Positioning System with a variety of hardware and software system components.
Demand in the industry now also requires a new, useful and improved mobile satellite communications system with enhanced capabilities for inter-communication between at least one base station and one or more vehicles, such as Qualcomm Incorporated's OMNIVISION™ system (in this document, “mobile satellite communications system”). The on-board temperature/humidity sensor system disclosed and claimed in this document provides new and useful features for such a mobile satellite communications system by providing an apparatus and system for monitoring temperature and humidity within an enclosure that houses a satellite data modem mounted on a vehicle (in this document, an “enclosure”).
The on-board temperature/humidity sensor within the enclosure solves several problems associated with earlier modem enclosures. For example, data collected from monitoring at least temperature and humidity within an enclosure allows continuous and substantially real-time diagnoses of seals in the modem enclosure for stress, cracks or other failures, as well as the structural integrity of components assembled to make an enclosure. Sensor output may be polled and relayed to a remote data collector included as part of the remote monitoring capabilities of the mobile satellite communications system. On-going diagnoses are useful not only for addressing problems associated with an individual enclosure, but also for assessing the durability and integrity of components used to manufacture and assemble the enclosures collectively. These capabilities and features currently are not available to the industry.
The on-board temperature/humidity sensor system includes a sensor mounted on a circuit board within a vehicle-mounted enclosure that includes a microprocessor with programmable sensor data acquisition capabilities. The system is capable of establishing monitored threshold limits of environmental properties within the enclosure, and transmitting data concerning environmental properties within the enclosure to a remote data collector.
It will become apparent to one skilled in the art that the claimed subject matter as a whole, including the structure of the apparatus, and the cooperation of the elements of the apparatus, combine to result in a number of unexpected advantages and utilities. The structure and co-operation of structure of the on-board temperature/humidity sensor will become apparent when read in conjunction with the following description, drawing figures, and appended claims.
The foregoing has outlined broadly the more important features of the invention to better understand the detailed description that follows, and to better understand the contributions to the art. The on-board temperature/humidity sensor system is not limited in application to the details of construction, and to the arrangements of the components, provided in the following description or drawing figures, but is capable of other embodiments, and of being practiced and carried out in various ways. The phraseology and terminology employed in this disclosure are for purpose of description, and therefore should not be regarded as limiting. As those skilled in the art will appreciate, the conception on which this disclosure is based readily may be used as a basis for designing other structures, methods, and systems. The claims, therefore, include equivalent constructions.
Further, the abstract associated with this disclosure is intended neither to define the on-board temperature/humidity sensor, which is measured by the claims, nor intended to limit the scope of the claims. The novel features of the on-board temperature/humidity sensor are best understood from the accompanying drawing, considered in connection with the accompanying description of the drawing, in which similar reference characters refer to similar parts, and in which:
Regarding
As shown in
More specifically, an on-board temperature/humidity sensor system 10 includes an enclosure 16. As shown, enclosure 16 includes a base unit 22 connectable to a cover 24. Base unit 22 is connectable to a cover 24 using at least one seal 26, as well as connectors 28a-h shown diagrammatically in
In an operative environment, circuit board 14 is located within enclosure 16. In a non-exclusive embodiment shown in
Sensor 12 is capable of monitoring at least temperature and relative humidity within enclosure 16 when enclosure 16. Non-exclusive examples of sensor 12 are manufactured by Sensirion AG of Switzerland as either model SHT10, SHT11, or model SHT15, both of which are surface-mountable leadless chip carrier, as shown at www.sensirion.com. Sensor 12 is preferably a single chip sensor with high reliability and long term stability, provide superior signal quality with low power consumption, fast response time, and insensitivity to external disturbances.
To place the on-board temperature/humidity sensor system 10 in an operational context and environment,
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Accordingly, as also shown diagrammatically in
The on-board temperature/humidity sensor system 10 shown in drawing
The present Application for Patent claims priority to Provisional Application No. ______ entitled “ON-BOARD TEMPERATURE/HUMIDITY SENSOR” filed Sep. 7, 2006, (attorney docket no. 061884P1) and assigned to the assignee hereof and hereby expressly incorporated by reference herein.
Number | Date | Country | |
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60843340 | Sep 2006 | US |