Patent Application
20230124524
The present disclosure relates to an optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region, a method for manufacturing an optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region at low cost without any complicated steps, and an optical device having excellent visibility over a wide wavelength range from the visible light region to the near-infrared region.
In recent years, sensor technology for image sensors, infrared sensors, and the like has been widely used in the fields of smartphones, automobiles, surveillance equipment, and the like. For example, conventional image sensors generally receive only light in the RGB (red, green, and blue) wavelength region (light in the visible light region), but in order to obtain higher sensing performance, there is a growing demand for technology for receiving light in the near-infrared region as well as light in the visible light region. However, it is known that silicon photodetectors used in image sensors are less sensitive to light in the near-infrared wavelength region than to light in the visible light region, and various types of technology have been developed for sensor chips, peripheral optical systems, and the like in order to enhance sensing performance.
Generally, in the peripheral optical systems, technology for forming antireflection multilayer films, which are designed to prevent reflection in the visible light region, on lenses and cover glass is known. When these antireflection multilayer films are designed to cover not only the visible light region but also the near-infrared region, an antireflection property deteriorates, as compared to antireflection films designed only for the visible light region. In other words, for the antireflection multilayer films, there is a trade-off between the width of a wavelength range and antireflection performance.
In addition, the number of layers and total film thickness required to expand an antireflection wavelength range increase, there are concerns about cost increases due to increased vacuum deposition time and lack of reliability such as peeling due to increased film stress.
As antireflection technology other than the multilayer film method described above, it is known to form a fine uneven shape (moth-eye structure) on a surface of cover glass.
For example, Patent Literature (PTL) 1 discloses technology for providing cover glass with a fine uneven structure formed by etching or the like in an electronic device module and electronic equipment.
PTL 1: JP 2010-153512 A
However, conventional antireflection technology with a fine uneven structure, such as the cover glass described in PTL 1, cannot achieve sufficient antireflection performance against light with wavelengths in the near-infrared region.
In the technology described in PTL 1, the fine uneven structure is formed by directly etching or other processing a glass plate (substrate), which expenses much time and effort and requires high cost during manufacturing. This hinders mass production.
It would be helpful to provide an optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region, a method for manufacturing an optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region at low cost without any complicated steps, and an optical device having excellent optical properties over a wide wavelength range from the visible light region to the near-infrared region.
The inventors have conducted intensive research to solve the above problems for an optical body including a transparent substrate and a fine uneven layer, formed on at least one surface of the substrate, with a fine uneven structure on its surface. As a result, the inventors have found that excellent antireflective performance can be achieved over a wide wavelength range from the visible light region to the near-infrared region, which could not be achieved with conventional antireflective structures such as moth-eye structure, by controlling reflectance for light in a wavelength region of 400 nm to 950 nm to have a lower maximum value (Ra) and to have a local minimum value (Rb) at a wavelength in a long wavelength region, and completed the present disclosure.
The present invention is made based on the above findings, the gist of which is as follows:
According to the present disclosure, it is possible to provide the optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region, the method for manufacturing an optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region at low cost without any complicated steps, and the optical device having excellent optical properties over a wide wavelength range from the visible light region to the near-infrared region.
In the accompanying drawings:
An example of an embodiment of the present disclosure will be described below using drawings as necessary. For convenience of explanation, each component disclosed in
First, one embodiment of the optical body according to the present disclosure will be described.
As illustrated in
The optical body 1 according to the present disclosure is characterized in that a maximum value (Ra) of reflectance for light in a wavelength region of 400 nm to 950 nm is 1 % or less, and a wavelength of light at which the reflectance is at a local minimum value (Rb) is 650 nm or more.
By lowering the maximum value (Ra) of reflectance to 1 % or less at the time of applying the light in the wavelength region of 400 nm to 950 nm to the surface of the optical body 1, when the optical body 1 is used as a sensor, the reflection can be prevented not only in the visible light range used for normal imaging but also in the near-infrared range used for sensing such as position and spatial recognition. This enables to prevent the occurrence of ghosts and flares and thereby to improve light-receiving efficiency.
From the same perspective, the maximum value (Ra) of reflectance (Ra) is preferably 0.8 % or less, and more preferably 0.6 % or less.
The reflectance for light incident on the optical body 1 can be measured with a commercially available spectrophotometer (for example, V-770 manufactured by JASCO).
Furthermore, the optical body 1 can be designed so that the reflectance in the region from red to near-infrared can be lowered by setting the wavelength at which the reflectance is at a local minimum value to the red wavelength range or more (650 nm or more), in the relationship between the wavelength range of light and reflectance (graph with wavelength on the horizontal axis and reflectance on the vertical axis). Therefore, the optical body 1 of the present disclosure can achieve excellent antireflection performance in a wide wavelength range from 400 nm to 950 nm.
In the optical body 1 according to the present disclosure, the fine uneven layer 20 is formed on the at least one surface of the substrate 10, and the other surface can be designed as appropriate according to the application and required characteristics. For example, the other surface may have a fine uneven layer 20 in the same manner as on the one side. Alternatively, the other surface can be formed with a multilayer film such as an antireflection filter, band-cut filter, or band-pass filter, or can be unprocessed. Furthermore, the other surface can be coated with a resin layer with some function, or can be formed with a film with a microstructure that has a function different from that of the fine uneven structure described above. The resin layer with some function includes hard coatings and layers that absorb or reflect specific wavelengths by containing fillers, pigments, or the like, but is not limited to these. The film with the microstructure includes, for example, wire grid polarizing elements, diffractive optical elements, micro-lens arrays, and the like, but is not limited to these.
Furthermore, in the optical body 1 according to the present disclosure, from the viewpoint of achieving excellent antireflection performance on the one surface and high transmittance or reflectance on the other surface, the sum of regular reflectance (RH (λ)) of a surface (higher reflective surface) with higher reflectance of a front surface 1a or a rear surface 1b and transmittance (Tr (λ)) of the optical body 1 for light in the wavelength region of 400 nm to 950 nm is preferably 97 % or more (RH (λ) + Tr (λ) ≥ 97 %).
Here, as for the front surface 1a and the rear surface 1b of the optical body 1, either of surfaces can be the front surface or the rear surface. In
Of the front surface 1a and the rear surface 1b of the optical body 1, for the higher reflective surface (the front surface 1b of the optical body 1 in
For a comparison of reflectance between the front surface 1a and the rear surface 1b of the optical body 1 to determine the higher reflective surface, a surface with a higher maximum value of regular reflectance is determined as the higher reflective surface.
For the reflectance of the front or rear surface of the optical body 1, the regular reflectance at 5° at wavelengths from 250 nm to 1600 nm is measured using a commercially available spectrophotometer (for example, V-770 manufactured by JASCO).
For Tr (λ) of the optical body 1, the transmittance at an incident angle of 0 ° can also be measured at wavelengths from 250 nm to 1600 nm using a commercially available spectrophotometer (for example, V-770 manufactured by JASCO).
Here, a method for adjusting the value of reflectance of the optical body 1 is not particularly limited, and can be set as appropriate to a desired range by controlling manufacturing conditions by known methods. For example, as described below, by controlling the height H of recesses and protrusions of the fine uneven layer 20, the values of R1, R2, and Rb of the optical body 1 can be adjusted so as to satisfy the above relationship.
Components of the embodiment of the optical body according to the present disclosure will be described below.
The optical body 1 according to the present disclosure includes the substrate 10, as illustrated in
Here, the substrate 10 is a transparent substrate. Using the transparent substrate has no adverse effect on light transmission and the like.
In this specification, “transparent” means that the transmittance of light at wavelengths belonging to a use band (the visible and near-infrared light bands) is high, for example, the transmittance of the light is 70 % or more.
A material of the substrate 10 includes, for example, various types of glass, quartz, crystal, sapphire, polymethyl methacrylate (PMMA), cyclo-olefin polymer, cyclo-olefin copolymer, and the like, but is not particularly limited and can be selected as appropriate according to performance and the like required of the optical body 1.
The surface shape of the substrate 10 is not particularly limited except for being platy, as illustrated in
Furthermore, the thickness of the substrate 10 is not particularly limited, and can be in the range of 0.1 to 2.0 mm, for example.
As illustrated in
The fine uneven layer 20 can then prevent the occurrence of reflected light and enhance the antireflection performance of the optical body 1 according to the present disclosure.
The arrangement of the fine uneven structure of the fine uneven layer 20 is not particularly limited. For example, as illustrated in
Furthermore, the shape of protrusions 21 is not particularly limited as long as the shape provides desired optical characteristics, and may be bullet-shape, pyramidal, columnar, needle-shape, or the like. The shape of the recesses means a shape formed by inner walls of the protrusions 21.
Here, the average uneven height (the depth of the recesses) H of the fine recesses and protrusions is an important condition in terms of obtaining excellent antireflection performance over a wide wavelength range. Specifically, the average uneven height H of the fine recesses and protrusions is preferably 180 nm or more. This is because excellent antireflection performance can be achieved more reliably over a wide wavelength range from the visible light region to near-infrared region. From the same viewpoint, the average uneven height H of the fine recesses and protrusions is more preferably 190 nm or more, and even more preferably 200 nm or more.
The average uneven height H of the fine uneven structure is preferably 300 nm or less from the viewpoint of release from the mold.
The uneven height H of the fine uneven structure is a distance from the bottom of a recess to the top of a protrusion 21, as illustrated in
The thickness of a support portion 22 under the fine uneven structure of the fine uneven layer 20, in which the fine uneven structure is not formed , is not particularly limited. However, when a resin and a base material have different linear expansion coefficients, there is concern that if the support portion 22 is too thick, problems may occur in adhesion and the like in terms of long-term reliability, so the thickness of the support portion 22 should be of the order of 10 to 9000 nm.
Each fine uneven structure formed on both sides of the fine uneven layer 20 preferably has an uneven period (uneven pitch) P that is equal to or less than a wavelength of visible light. The uneven pitch P is preferably 400 nm or less, and more preferably 250 nm or less. When the microstructure arrangement is aligned, if the uneven pitch is large, there is a concern that reflected diffracted light caused by the microstructure arrangement may be generated depending on the angle of incident light and affect image quality.
The uneven period P of the fine uneven structure is an arithmetic mean of distances between adjacent protrusions and between adjacent recesses. The uneven period P of the fine uneven structure can be obtained by cross sectional observation using, for example, scanning electron microscopy (SEM), transmission electron microscopy (TEM), or the like.
A method for deriving the arithmetic mean of the distances between the adjacent protrusions and between the adjacent recesses includes a method in which, for example, multiple combinations of the adjacent protrusions and/or the adjacent recesses are picked up, the distances between the protrusions and the recesses constituting each combination are measured, and the measured values are averaged.
The period P of the fine uneven structure formed in the fine uneven layer 20 can be the same period P, as illustrated in
Furthermore, for the fine uneven layer 20, it is preferable that a rate of change in the uneven height H of the fine uneven structure, after being subjected to reflow processing, is applied is 20 % or less. Although it is conceivable that the fine uneven layer 20 may shrink by heat processing such as the reflow processing depending on its material, a desired antireflection property may not be obtained when the uneven height H becomes too low, compared to an initial value, due to the processing. Therefore, it is preferable for the fine uneven structure to ensure durability to maintain the desired antireflection property even after the reflow processing. In order to maintain the desired antireflection property, the rate of change in the uneven height H of the fine uneven layer 20 is preferably 20 % or less, more preferably 15 % or less, and especially preferably 10 % or less.
The rate of change in the uneven height H of the fine uneven structure is calculated by measuring the average uneven height H of the fine uneven structure before and after the reflow processing, and then calculating the percentage (%) of change in height.
The reflow processing is processing of surface mounting of a device to board joints, and generally refers to a heat processing step of printed solder paste or a ball grid array (BGA), usually at the highest attainable set temperature (around 180° C. to 270° C.) of the processing.
Here, the material of the fine uneven layer 20 is not particularly limited. For example, from the viewpoint of moldability of the fine uneven layer 20, a resin composition that cures by a curing reaction, such as an active energy ray curable resin composition (photo-curable resin composition, electron beam curable resin composition) or thermosetting resin composition, and contains, for example, a polymerizable compound and a polymerization initiator can be used.
As the polymerizable compound, for example, (i) an ester compound obtained by reacting one mole of polyhydric alcohol with two or more moles of (meth)acrylic acid or its derivative, (ii) an ester compound obtained from polyhydric alcohol, polyvalent carboxylic acid or its anhydride, and (meth)acrylic acid or its derivative, or the like can be used.
The above (i) includes 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, tetrahydrofurfuryl acrylate, glycerol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, acryloymonophorine, urethane acrylate, and the like.
The above (ii) includes ester compounds obtained by reacting a polyhydric alcohol such as trimethylol ethane, trimethylol propane, glycerin, or pentaerythritol, a polyvalent carboxylic acid selected from malonic acid, succinic acid, adipic acid, glutaric acid, sebacic acid, fumaric acid, itaconic acid, maleic anhydride, and the like or its anhydride, and (meth)acrylic acid or its derivative, and the like.
One of these polymerizable compounds may be used alone or in combination with two or more.
Furthermore, when the resin composition is photo-curable, the photopolymerization initiator can be, for example, a carbonyl compound such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl, benzophenone, p-methoxybenzophenone, 2,2-diethoxyacetophenone, α,α-dimethoxy-α-phenylacetophenone, methylphenylglyoxylate, ethylphenylglyoxylate, 4,4′-bis(dimethylamino)benzophenone, 1-hydroxy-cyclohexyl-phenyl-ketone, or 2-hydroxy-2-methyl-1-phenylpropan-1-one; a sulfur compound such as tetramethylthiuram monosulfide or tetramethylthiuram disulfide; 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, benzoyl diethoxyphosphine oxide; or the like. One or more types of these can be used.
In the case of being electron beam curable, an electron beam polymerization initiator can be, for example, thioxanthone such as benzophenone, 4,4-bis(diethylamino)benzophenone, 2,4,6-trimethylbenzophenone, methyl orthobenzoylbenzoate, 4-phenylbenzophenone, t-butylanthraquinone, 2-ethylanthraquinone, 2,4-diethylthioxanthone, isopropylthioxanthone, or 2,4-dichlorothioxanthone; acetophenone such as diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyl dimethyl ketal, 1-hydroxycyclohexyl-phenyl ketone, 2-methyl-2-morpholino(4-thiomethylphenyl)propan-1-one, or 2-benzyl-2-dimethyl amino- 1-(4-morpholinophenyl)-butanone; benzoin ether such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, or benzoin isobutyl ether; acylphosphine oxide such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, or bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; methylbenzoylformate, 1,7-bisacridinylheptane, 9-phenylacridine, or the like. One or more types of these can be used.
In the case of thermosetting, a thermal polymerization initiator includes, for example, organic peroxides such as methyl ethyl ketone peroxide, benzoyl peroxide, dicumyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide, t-butyl peroxyoctoate, t-butyl peroxybenzoate, lauroyl peroxide; azo compounds such as azobisisobutyronitrile; redox polymerization initiators combining the organic peroxides with amines such as N,N-dimethylaniline, N,N-dimethyl-p-toluidine, and the like.
These photopolymerization initiator, electron beam polymerization initiator, and thermal polymerization initiator may be used alone or in combination as desired.
The amount of polymerization initiator is preferably 0.01 to 10 parts by mass for 100 parts by mass of polymerizable compound. In such a range, curing progresses sufficiently, the molecular weight of a cured material becomes appropriate and sufficient strength is obtained, and problems such as coloration of the cured material due to residues of the polymerization initiator do not occur.
In addition, the resin composition can contain a non-reactive polymer and an active energy ray sol-gel reactive component as needed, and can also contain various additives such as a thickener, leveling agent, UV absorber, light stabilizer, heat stabilizer, solvent, and inorganic filler.
As illustrated in
Here,
As illustrated in
The optical body 1 according to the present disclosure, in the embodiment illustrated in
As illustrated in
The optical body 1 can also include an easy-adhesion layer and other layers, in addition to the substrate 10 and the fine uneven layer 20 described above, if necessary.
For example, the easy-adhesion layer (not illustrated) can be provided between the substrate 10 and the fine uneven layer 20 for the purpose of enhancing adhesion.
A material of the easy-adhesion layer is not particularly limited, and an optimal material can be selected as appropriate depending on a combination of the resins used for the substrate 10 and the fine uneven layer 20. For example, the material includes coating agents containing common silane coupling agents, UV-curable resins, thermosetting resins, solvents, and the like.
When there is a difference in refractive index between the materials (resins) used in the substrate 10 and the fine uneven layer 20, one or more refractive index adjustment layers can be laminated to reduce interfacial reflection. As materials for the refractive index adjustment layers, there are layers made of metal oxides, and coatings containing general silane coupling agents, UV curable resins, thermosetting resins, solvents, and the like.
Next, a method for manufacturing the optical body 1 will be described.
As illustrated in
By being subjected to the above steps ((a) to (c) of
In the manufacturing method of the optical body 1 according to the present disclosure, the step of forming the fine uneven structure ((a) and (b) of
As illustrated in (a) of
The manufacturing method according to the present disclosure is characterized in that the modulus of elasticity of the mold 40 is lower than the modulus of elasticity of the substrate 10. Since the modulus of elasticity of the mold 40, when the curable resin is cured with the mold 40 adhering to the curable resin or during processing when the mold is peeled from the cured curable resin (including when heat is applied if necessary), is lower than the modulus of elasticity of the substrate 10, a laminate (optical body 1) of the substrate 10 and the fine uneven layer 20 made of the cured resin can be easily peeled from the mold 40, thereby increasing productivity without any complicated steps. The modulus of elasticity of the mold 40 is a tensile elastic modulus (Young’s modulus), which can be measured by commercially available measuring apparatuses.
An example of a general method for manufacturing the mold 40 will be described here using
First, a master platen 50 with a fine uneven structure 50a is prepared. The master platen 50 can be fabricated mainly by photolithography technology or cutting technology, but the detailed method is not particularly limited. Materials used for the master platen include quartz, Si, Ni-P plated substrates, and the like, but are not particularly limited.
Processing to form a film on a surface of the fabricated master platen 50 by vapor deposition, sputtering, CVD, coating, or other methods may be performed to provide a mold release property.
In
For the step of curing the curable resin 20′, as illustrated in (b) of
Conditions for curing the curable resin 22′, such as ultraviolet light, heat, moisture, and the like can be set as appropriate according to the type of resin. The type of the curable resin is the same as that described for the optical body 1 according to the present disclosure.
The step of peeling the laminate of the substrate 10 and the fine uneven layer 20 made of the cured resin from the mold 40, as illustrated in (c) of
In the manufacturing method according to the present disclosure, after the laminate is peeled from the mold 40, the fine uneven layer 20 can be subjected to UV or electron beam processing and/or heat processing. When uncured components remain inside the fine uneven layer 20 or on a surface of the fine uneven layer 20 during manufacturing, there is a concern that components may segregate or elute during storage or use of the optical body, thereby contaminating surrounding parts or devices and causing defects. In order to reduce such a concern, the UV or electron beam processing and/or heat processing are/is processing to remove the uncured components by promoting cross-linking of the uncured components. It is also conceivable that removal of the uncured components can reduce fluctuations in optical properties after reflow.
The electron beam processing and heat processing should be performed under conditions that enable to promote the cross-linking of the uncured components or remove the uncured components, and there are no particular limitations on detailed conditions and the like.
An optical device according to the present disclosure is characterized by having the optical body described above. By using the optical body according to the present disclosure, which has excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region, optical properties can be improved over the wide wavelength range from the visible light region to the near-infrared region.
The optical device according to the present disclosure is not particularly limited except that the above-described optical body according to the present disclosure is provided as a component, and other components can be provided as appropriate depending on the type of device, required performance, and other factors.
The optical device is not particularly limited. For example, the optical device is a device such as an imaging device or imaging module, or a device such as a sensor or sensor module using infrared rays, and includes smartphones, personal computers, portable game machines, TVs, video cameras, transportation such as automobiles and airplanes, and the like equipped with these devices.
Next, the present disclosure will be specifically described based on examples. However, the present disclosure is not limited to the following examples.
Optical bodies of respective samples were manufactured under various conditions, and optical properties thereof were evaluated as described below.
As each sample of the optical body 1, the fine uneven layer 20 having the fine uneven structure in its surface was formed on the 0.9 mm glass substrate (BK7) 10 made of a UV curable acrylic resin, as illustrated in
The UV curable acrylic resin was composed of a resin composition containing 45 mass% monomer (“Aronix® M305” (Aronix is a registered trademark in Japan, other countries, or both) manufactured by Toagosei Co., Ltd.), 20 mass% oligomer (“UV-1700” by The Nippon Synthetic Chemical Industry Co., Ltd.), 5 mass% reactive diluent (“DMAA®” (DMAA is a registered trademark in Japan, other countries, or both) manufactured by KJ Chemicals Corporation), and 5 mass% photopolymerization initiator (“Irgacure 184” manufactured by IGM Resins B.V.) cured by UV irradiation.
Table 1 lists the uneven height H of the fine uneven structure, the pitch P of the recesses and protrusions, the arrangement of the uneven structure, and the diameter of the protrusions 21 of the obtained optical body samples.
As each sample of the optical body 1, the fine uneven layer 20 having the fine uneven structure in its surface was formed on both surfaces of the 0.9 mm glass substrate (BK7) 10 made of a UV curable acrylic resin, as illustrated in
The UV curable acrylic resin was composed of a resin composition containing 45 mass% monomer (“Aronix® M305” manufactured by Toagosei Co., Ltd.), 20 mass% oligomer (“UV-1700” by The Nippon Synthetic Chemical Industry Co., Ltd.), 5 mass% reactive diluent (“DMAA®” manufactured by KJ Chemicals Corporation), and 5 mass% photopolymerization initiator (“Irgacure 184” manufactured by IGM Resins B.V.) cured by UV irradiation.
Table 1 lists the uneven height H of the fine uneven structure, the pitch P of the recesses and protrusions, the arrangement of the uneven structure, and the diameter of the protrusions 21 of the obtained optical body samples.
As a sample of the optical body 1, the fine uneven layer 20 having the fine uneven structure was formed on a front surface of the 0.9 mm glass substrate (BK7) 10 made of a UV curable acrylic resin, and SiO2: 95 nm, Al2O3: 85 nm, ZrO2: 135 nm, and MgF2: 100 nm (multilayer AR1) were deposited by vacuum deposition on a rear surface of the glass substrate 10, as illustrated in
The UV curable acrylic resin was composed of a resin composition containing 45 mass% monomer (“Aronix® M305” manufactured by Toagosei Co., Ltd.), 20 mass% oligomer (“UV-1700” by The Nippon Synthetic Chemical Industry Co., Ltd.), 5 mass% reactive diluent (“DMAA®” manufactured by KJ Chemicals Corporation), and 5 mass% photopolymerization initiator (“Irgacure 184” manufactured by IGM Resins B.V.) cured by UV irradiation.
Table 1 lists the uneven height H of the fine uneven structure, the pitch P of the recesses and protrusions, the arrangement of the uneven structure, and the diameter of the protrusions 21 of the obtained optical body samples.
As a sample of the optical body 1, a glass substrate (BK7) with a thickness of 0.9 mm was used.
For Comparison Example 2, as a sample of the optical body 1, SiO2: 95 nm, Al2O3: 85 nm, ZrO2: 135 nm, and MgF2: 100 nm (multilayer AR1) were formed by vacuum deposition on the 0.9 mm glass substrate (BK7) 10.
For Comparative Example 4, as a sample of the optical body 1, Al2O3: 15 nm, SiO2: 30 nm, Al2O3: 140 nm, SiO2: 40 nm, Al2O3: 20 nm, SiO2: 145 nm, Al2O3: 95 nm, ZrO2: 135 nm, and MgF2: 120 nm (multilayer AR2) were deposited by vacuum deposition on the 0.9 mm glass substrate (BK7) 10.
For Comparative Example 3, as a sample of the optical body 1, SiO2: 95 nm, Al2O3: 85 nm, ZrO2: 135 nm, and MgF2: 100 nm (multilayer AR1) were formed by vacuum deposition on the 0.9 mm glass substrate (BK7) 10.
For Comparative Example 5, as a sample of the optical body 1, Al2O3: 15 nm, SiO2: 30 nm, Al2O3: 140 nm, SiO2: 40 nm, Al2O3: 20 nm, SiO2: 145 nm, Al2O3: 95 nm, ZrO2: 135 nm, and MgF2: 120 nm (multilayer AR2) were deposited by vacuum deposition on both surfaces of the 0.9 mm glass substrate (BK7) 10.
The following evaluations were performed on each sample of a laminate obtained in each of the examples and comparative examples. Table 1 lists evaluation results.
Table 1 lists wavelengths at which the samples of the optical body provide a maximum value (Ra) and a local minimum value (Rb) of reflectance for light from 400 nm to 950 nm on front and rear surfaces.
The reflectance at each wavelength was measured by a spectrophotometer (V-770 manufactured by JASCO). When the reflectance was measured, the rear surface was blackened to measure the reflectance of only the front surface.
For the samples of the optical body as Example 1, Comparative Example 2, and Comparative Example 4, graphs of reflectance versus wavelength were prepared and are illustrated in
The sum of a regular reflectance (RH (λ)) on a higher reflective surface of the front or rear surface of each sample of the optical body for light of 400 nm to 950 nm and a maximum value (Tr) of transmittance for light of 400 nm to 950 nm was calculated and listed in Table 1.
The regular reflectance of the higher reflective surface was measured by a spectrophotometer (V-770 manufactured by JASCO).
The total light transmittance of each sample of the optical body was measured by HM-150 manufactured by Murakami Color Research Laboratory.
8
It is apparent from Table 1 and
On the other hand, it is apparent from Table 1 and
According to the present disclosure, it is possible to provide the optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region, the method for manufacturing the optical body having excellent antireflection performance over a wide wavelength range from the visible light region to the near-infrared region at low cost without any complicated steps, and the optical device with excellent visibility over a wide wavelength range from the visible light region to the near-infrared region.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2020-064433 | Mar 2020 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2021/010930 | 3/17/2021 | WO |
