An anti-fogging system 1 for an optical component X of the first embodiment will be described in the following with reference to
The anti-fogging system 1 for an optical component X of this embodiment is an anti-fogging system 1 for an optical component X that reflects or transmits light, such as, for example, a tip lens or cover glass directed into an oral cavity of an oral cavity internal observation device. As shown in
The transparent conductive film 2 is formed on the surface of the optical component X, for example. The transparent conductive film 2 has a predetermined electrical temperature characteristic (for example, at an early stage, at a temperature of 20° C., a resistance value of 70Ω, and a resistance temperature coefficient of 600 ppm/° C.). Here, resistance temperature coefficient means a rate of variation in resistance value for temperature variation. Electrodes 2a and 2b are provided on the transparent conductive film 2, and the transparent conductive film 2 is heated by current flowing due to application of a voltage across the electrodes 2a and 2b.
Also, the transparent conductive electrode 2 has a resistance value that varies in accordance with temperature variation. For example, in the case of a temperature variation from 20° C. to 21° C., the resistance value is increased by a resistance value variation amount of 70Ω600×10−6=0.042Ω/° C., and when temperature is 21 C resistance value becomes 70.042Ω. Here, the resistance temperature coefficient of the transparent conductive film 2 (for example 600 ppm/° C.) does not vary over time, and a resistance value can always be calculated using the same value. On the other hand, the resistance value with respect to temperature of the transparent conductive film 2 does vary over time. It is therefore necessary to carry out calibration, which will be described later.
It is preferable to use a material that exhibits a good resistance value variation for temperature variation as the transparent conductive film 2. Specifically, such materials may include a compound containing indium oxide and tin oxide, tin oxide, titanium oxide or zinc oxide.
As shown in
Also, a characteristic calibration section 8 for calibrating the temperature characteristics stored in the characteristic storage section 4 as required or periodically, is provided in the temperature control section 3. As shown in
The thermal equilibrium state determination section 9 determines a state of thermal equilibrium from the temperature detected by the temperature sensor 10 becoming a static state.
Operation of an anti-fogging system 1 for an optical component X of this embodiment constructed as described above will be described in the following.
In attempting to prevent misting up of the surface of an optical component X using the anti-fogging system 1 of this embodiment, as shown in
The set target temperature is sent to the voltage control section 7, and the target temperature is converted to a target resistance value using operation of the voltage control section 7 (Step 2). Conversion of the target temperature to target resistance value first involves calculating a difference between the target temperature set in the target temperature setting section 6 and the temperature stored in the characteristic storage section 4. This difference is then multiplied by the resistance value temperature coefficient per 1° C. temperature variation similarly stored in the characteristic storage section 4. Further, conversion to a target resistance value for the target temperature is carried out by adding the stored resistance value to the resistance value variation amount obtained through multiplication.
Next, the resistance value of the transparent conductive film 2 is detected by operation of the resistance value detection section 5 in the temperature control unit 3 (Step 3). Detection of the resistance value can be carried out by applying a predetermined voltage to the transparent conductive film 2 by means of the voltage control section 7, and detecting current flowing. In the drawing, reference numeral 12 is a current detection section for detecting current flowing in the transparent conductive film 2. Alternatively, it is possible to apply a predetermined current to the transparent conductive film 2 and detect the voltage across the two ends of the transparent conductive film 2 using a voltage detection section (not shown).
If the resistance value of the transparent conductive film 2 is detected, the converted target resistance value and the detected resistance value are compared (step S4). In the event that the result of comparison is that the target resistance value is larger than the current resistance value, the voltage control section 7, supplies a predetermined voltage to the transparent conductive film 2, and heats the transparent conductive film 2 (step S5).
Also, in the event that the result of comparison described above is that the target resistance value is smaller than the current resistance value, the voltage control section 7 stops supply of the predetermined voltage to the transparent conductive film 2 (step S6), and stops the heating of the transparent conductive film 2. By repeating this, the voltage control section 7 controls the voltage applied to the transparent conductive film 2 so that the resistance value of the transparent conductive film 2 approaches the target resistance value, and it is possible to achieve the target temperature.
In this way, the voltage control section 7 controls the transparent conductive film 2 to the target temperature by supplying or not supplying the predetermined voltage. On the other hand, the voltage control section 7, carries out detection of the resistance value during temperature control for the transparent conductive film 2 at a predetermined cycle, as shown in
Also, in this embodiment, the voltage control section 7 sets the voltage to be supplied to the transparent conductive film 2 at the time of temperature control to 5V, for example, and sets the voltage supplied at the time of resistance value detection to 0.5 V, for example. In this way, it is possible to control heating of the transparent conductive film 2 at the time of resistance value detection, and to make heating control simple. Also, since the voltage is made 0.5 V at the time of resistance value detection, and the duty ratio of the resistance value detection time is 1:1000, it is possible to reduce power consumption.
The transparent conductive film 2 is arranged so as to cover the entire surface of the optical component X. It is therefore possible to detect average temperature of the entire surface of the optical component X by detecting resistance value of the transparent conductive film 2. It is then possible to keep the optical component X from misting up by setting a temperature a few degrees higher than the dew-point temperature as the target temperature. It is then determined whether or not an off signal has been input to a power supply (not shown) for components provided in the anti-fogging system 1 (step S7), and if the off signal has not been input processing returns to step S3 where repeated temperature control is carried out.
Also, in the anti-fogging system 1 of this embodiment, the temperature characteristic of the transparent conductive film 2 stored in the characteristic storage section 4 is calibrated by operating the characteristic calibration section 8 as required or periodically.
As shown in
If the characteristic calibration section 8 is activated, then as shown in
When it has been determined by the thermal equilibrium determination section 9 that the transparent conductive film 2 is not in a state of thermal equilibrium, temperature detection by the temperature sensor S10 (step S9) and determination (step S10) are repeated. On the other hand, when it is determined by the thermal equilibrium state determination section 9 that the transparent conductive film 2 is in a state of thermal equilibrium, the characteristic calibration section 8 is activated and the resistance value of the transparent conductive film 2 is detected by the resistance value detection section 5. The characteristic calibration section 8 updates the temperature characteristics in the characteristic storage section 4 by updating the resistance value detected by the resistance value detection section 5, and the temperature detected by the temperature sensor 10 at the point in time when a thermal equilibrium state is determined, as new temperature characteristics.
It is also possible to automatically switch the component power supply off after determining that the transparent conductive film 2 is in a state of thermal equilibrium and updating the temperature characteristics in the characteristic storage section 4. It is also possible to turn the component power supply off when the off signal is input to the component power supply, and after that, carry out determination of thermal equilibrium state of the transparent conductive film 2 and update of the temperature characteristics of the transparent conductive film 2 in the characteristic storage section 4 using an internal battery (not shown).
In this way, the next time power is input for the components included in the anti-fogging system 1 of this embodiment, the anti-fogging effect will be reliably exhibited based on the latest temperature characteristic for the transparent conductive film 2.
In this way, according to the anti-fogging system 1 of this embodiment, since the temperature characteristics of the transparent conductive film 2 are calibrated by operating the characteristic calibration section 8, it is possible to always store the latest accurately calibrated temperature characteristics even if the resistance value of the transparent conductive film 2 varies over time due to contact with components in the air. As a result, a target temperature is accurately achieved, and it can be expected to more reliably prevent misting up of the optical component X.
In this case, in the anti-fogging system 1 of this embodiment, periodic calibration of the temperature characteristics is carried out automatically with activation of the thermal equilibrium state determination section 9. Accordingly, it is possible to always prevent the optical component X misting up without the user carrying out a temperature characteristic calibration operation.
Also, when carrying out calibration of the temperature characteristics of the transparent conductive film 2, the temperature sensor 10 detects temperature in a state of thermal equilibrium. For this reason, as a temperature sensor 10 used for calibration, it is not necessary to detect average temperature over a wide range of the optical component X such as the transparent conductive film 2, and if suffices to measure the temperature at a single point of the optical component X or a single point close to the optical component X. It is therefore possible to adopt as the temperature sensor 10 a high accuracy temperature sensor 10 that does not vary over time like the transparent conductive film 2, and it is possible to carry out calibration of the temperature characteristic with good accuracy.
Also, in this embodiment, the transparent conductive film 2 is arranged so as to directly cover the whole of the optical component X. Therefore, it is possible to quickly and accurately control a target temperature for the optical component X compared to a case where a temperature measurement structure for the optical element X is provided separately and the temperature of the optical component X is controlled based on temperature measured by that temperature measurement structure.
Further, in the case of using a material such as a compound containing indium oxide and tin oxide, tin oxide, titanium oxide or zinc oxide as the material of the transparent conductive film 2, since the transparent conductive film 2 displays good resistance value variation with respect to temperature variation even when the transparent conductive film 2 is formed on glass, it is possible to adjust temperature with good accuracy. As a result, it is possible to reliably prevent misting up of the optical component X.
In this embodiment, using the voltage control section 7 of the temperature control unit 3, the voltage supplied to the transparent conductive film 2 is fixed at a predetermined voltage value, and temperature control is carried out by turning that voltage on and off. However, with the present invention it is also possible to adopt another control method instead. Also, when detecting resistance value of the transparent conductive film 2, a voltage that is sufficiently lower than the voltage supplied to the transparent conductive film 2 at the time of voltage control is supplied to the transparent conductive film 2 by the voltage control section 7. However, instead of this, it is also possible to supply the same voltage as the voltage supplied at the time of temperature control to the transparent conductive film 2.
Also, in this embodiment, a predetermined temperature, and the resistance value and resistance temperature coefficient at that time, are stored in the characteristic storage section 4. In this way, there is the advantage that fewer numerical values are required to be rewritten at the time of calibration of the temperature characteristic. Instead of this, it is also possible to store a coefficient or map relating to temperature and resistance value.
Also with this embodiment, a determination method for a state of thermal equilibrium is based on temperature detected by the temperature sensor 10. Instead of this, however, it is also possible to determine a thermal equilibrium state according to whether or not the resistance value of the transparent conductive film 2 detected by the resistance value detection section 5 is static.
As a method of determining the thermal equilibrium state, it is also possible to provide a timer (not shown), and determine a state of thermal equilibrium as a result of the timer clocking a predetermined time. For example, it is possible to determine the thermal equilibrium state after two minutes elapses from cessation of voltage supply to the transparent conductive film 2.
Also, in this embodiment, the thermal equilibrium state represents a state where equilibrium temperature is a temperature within about ±0.5° C. For example, as shown in
Number | Date | Country | Kind |
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2006-260390 | Sep 2006 | JP | national |