Claims
- 1. A method for manufacturing an optical device, comprising the steps of:
providing at least two sub-bodies of a base body; providing at each of said at least two sub-bodies a surface so that said surfaces of said at least two sub-bodies are complementary to each other and snugly fit on one another; providing along at least one of said complementary surfaces a first layer system, defining an optical layer system; joining said sub-bodies along said complementary surfaces so as to embed said optical layer system between said sub-bodies and thus forming an assembled sub-body; machining a continuous surface on said assembled sub-body and at a predetermined angle to said complementary surfaces and said embedded layer system where the latter abut at said machined continuous surface; and providing a second layer system along said continuous surface.
- 2. The method of claim 1, comprising the step of joining at least two of said assembled sub-bodies and jointly machining said continuous surface on said at least two joint assemble sub-bodies.
- 3. The process of claim 2, thereby providing said second layer system jointly along said machined continuous surface of said at least two join assembled sub-bodies.
- 4. The process of claim 1, comprising the step of depositing said second layer system on said machined continuous surface.
- 5. The process of claim 1, further comprising the step of providing a further sub-body and machining at said further sub-body a further continuous surface which is complementary to said continuous surface of said assembled sub-body and joining said further sub-body to said assembled sub-body along their continuous surfaces, thereby providing said second layer system at least to one of said continuous surfaces.
- 6. The process of claim 5, further comprising the step of selecting as said further sub-body and said first layer system of said further assembled sub-body are arranged mutually opposed at said second layer system.
- 7. The process of claim 6, wherein said first layer systems of said one assembled sub-body and said first layer system of said further assembled sub-body are arranged mutually opposed at sid second layer system.
- 8. The process of claim 7, further comprising the step machining said continuous surfaces of said two assembled sub-bodies to be plane and providing said first layer systems at said two assembled sub-bodies to abut substantially at a right angle on said second layer system.
- 9. The process of claim 1, further comprising the step of dissecting said one or said second one and further assembled sub-body in such a way that the dissected elements comprise respectively said first and second layer systems.
- 10. The process of claim 5, further comprising the step of dissecting said one or said second one and further assembled sub-body in such a way that the dissected elements comprise respectively said first and second layer systems.
- 11. The process of claim 6, further comprising the step of dissecting said one or said second one and further assembled sub-body in such a way that the dissected elements comprise respectively said first and second layer systems.
- 12. The process of claim 1, wherein machining of said continuous surface comprises at least one of lapping or of polishing.
- 13. The process of claim 5, wherein machining of said continuous surface comprises at least one of lapping or of polishing.
- 14. The process of claim 6, wherein machining of said continuous surface comprises at least one of lapping or of polishing.
- 15. The process of claim 1, further comprising the step of simultaneously machining continuous surfaces on opposite sides of said sub-bodies or of said assembled sub-bodies.
- 16. The process of claim 2, further comprising the step of simultaneously machining continuous surfaces on opposite sides of said sub-bodies or of said assembled sub-bodies.
- 17. The process of claim 6, further comprising the step of simultaneously machining continuous surfaces on opposite sides of said sub-bodies or of said assembled sub-bodies.
- 18. The process of claim 1, further comprising the step of joining at least one of sub-bodies and of assembled sub-bodies by one of cementing and of wringing.
- 19. The process of claim 5, further comprising the step of joining at least one of sub-bodies and of assembled sub-bodies by one of cementing and of wringing.
- 20. The process of claim 6, further comprising the step of joining at least one of sub-bodies and of assembled sub-bodies by one of cementing and of wringing.
- 21. The method of claim 1, wherein at least one of said layer systems is deposited as a dielectric layer system.
- 22. The process of claim 21, wherein said deposition is performed by at least one of a plasma-aided and of an ion-aided coating process.
- 23. The method of claim 21, wherein said deposition is performed by one of sufficiently cold PVD and of a sufficiently cold PECVD process.
- 24. The process of claim 21, wherein said deposition is performed by a cold coating process which establishes a substrate temperature of at most 150° C.
- 25. The process of claim 24, wherein said temperature is 80° C. at most.
- 26. The process of claim 1, further comprising the step of providing at least one of said layer systems with at least one dielectric layer.
- 27. The method of claim 1, further comprising the step of providing at least one of said layer systems as one of a reflection layer system, of a polarization layer system, of a color splitting system and of an antireflection system.
- 28. The method of claim 5, further comprising the step of providing at least one of said layer systems as one of a reflection layer system, of a polarization layer system, of a color splitting system and of an antireflection system.
- 29. The method of claim 6, further comprising the step of providing at least one of said layer systems as one of a reflection layer system, of a polarization layer system, of a color splitting system and of an antireflection system.
- 30. The process of claim 1, further comprising the step of providing said second layer system as a red reflection system.
- 31. The process of claim 5, further comprising the step of providing said second layer system as a red reflection system.
- 32. The process of claim 6, further comprising the step of providing said second layer system as a red reflection system.
- 33. The process of claim 30, further comprising the step of providing said second layer system for S-polarized light at an incidence angle of 45° relative to the layer system.
- 34. The process of claim 5, further comprising the step of bonding at least said assembled sub-body and said further sub-body to get a resulting cuboid body and then sub-dividing the resulting cuboid body into individual cuboid bodies.
- 35. The process of claim 6, further comprising the step of bonding at least said assembled sub-body and said further sub-body to get a resulting cuboid body and then sub-dividing the resulting cuboid body into individual cuboid bodies.
- 36. The method of claim 6, wherein the resulting body being an X-cube.
- 37. The method of claim 35, wherein the resulting body being an X-cube.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2694/96 |
Nov 1996 |
CH |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 08/756,140 filed Nov. 26, 1996 and now U.S. Pat. No. ______, which claims priority on Swiss application number 2694/96 filed Nov. 1, 1996.
Divisions (1)
|
Number |
Date |
Country |
Parent |
08756140 |
Nov 1996 |
US |
Child |
10262701 |
Oct 2002 |
US |