The present invention relates to an optical-element driving device, a camera module, and a camera-mounted device.
In general, a small-sized camera module is mounted in mobile terminals, such as smartphones. An optical-element driving device having an autofocus function of automatically performing focusing during capturing of a subject (hereinafter referred to as “Auto Focus (AF) function”) and a shake-correcting function (hereinafter referred to as “Optical Image Stabilization (OIS) function”) for reducing irregularities of an image by correcting shake (vibration) caused during capturing of an image is applied in such a camera module (see e.g., Patent Literature (hereinafter referred to as “PTL”) 1).
The optical-element driving device having the AF and OIS functions is provided with an autofocus driving unit for moving a lens part in the optical-axis direction (hereinafter, the autofocus driving unit is referred to as “AF driving unit”) and a shake-correcting driving unit for moving the lens part in a plane orthogonal to the optical-axis direction (hereinafter, the shake-correcting driving unit is referred to as “OIS driving unit”). In PTL 1, a voice coil motor (VCM) is employed in the AF driving unit and the OIS driving unit.
In recent years, a camera module including a plurality of optical-element driving devices (typically, two optical-element driving devices) has been put into practical use (so-called dual camera). The dual cameras offer various possibilities according to situations where each of the dual cameras is used, such as a possibility that two images at different focal lengths can be captured at the same time, a possibility that a still image and a video image can be captured simultaneously, and the like.
However, the optical-element driving device utilizing the VCM as in PTL 1 is affected by external magnetism. Thus, there is a possibility that high-precision operation is impaired. In particular, in a dual camera in which optical-element driving devices are placed side by side, it is highly likely that magnetic interference occurs between the optical-element driving devices.
Meanwhile, PTL 2 discloses an optical-element driving device in which an ultrasonic motor is applied to an AF driving unit and an OIS driving unit. The optical-element driving device disclosed in PTL 2 is a magnetless device, and is thus capable of reducing the influence of external magnetism. However, its structure is complicated, and it is difficult to reduce the size and height.
In addition, in the optical-element driving device, a driving sound may be generated when a movable part is moved to perform focusing or shake correction, and thus quietness is required.
An object of the present invention is to provide an optical-element driving device, a camera module, and a camera-mounted device capable of achieving a reduction in size and height and improving driving performance and quietness.
An optical-element driving device according to the present invention includes:
A camera module according to the present invention includes:
A camera-mounted device according to the present invention is an information apparatus or a transporting apparatus, the camera-mounted device including:
According to the present invention, it is possible to reduce the size and height of the optical-element driving device, the camera module, and the camera-mounted device, and to improve the driving performance and quietness.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Smartphone M includes a dual camera consisting of two back side cameras OC1 and OC2. In the present embodiment, camera module A is applied to back side cameras OC1 and OC2.
Camera module A has an AF function and an OIS function, and can capture an image without image blurring by automatically performing focusing at the time of capturing a subject and by optically correcting shake (vibration) caused at the time of capturing the image.
Camera module A is mounted such that the vertical direction (or horizontal direction) is the X-direction, the horizontal direction (or vertical direction) is the Y-direction, and the front-rear direction is the Z-direction, for example, during actually capturing an image with smartphone M. That is, the Z-direction is the optical-axis direction, the upper side (+Z side) in the figures is the light reception side in the optical-axis direction, and the lower side (−Z side) is the image formation side in the optical-axis direction. In addition, the X- and Y-directions orthogonal to the Z-axis are referred to as “optical-axis-orthogonal directions” and the XY plane is referred to as “optical-axis-orthogonal plane.”
As illustrated in
Image capturing part 3 is disposed on the image formation side of optical-element driving device 1 in the optical-axis direction. Image capturing part 3 includes, for example, image sensor board 301, image capturing element 302, and control part 303 mounted on image sensor board 301. Image capturing element 302 is composed of, for example, a Charge-Coupled Device (CCD) image sensor, a Complementary Metal Oxide Semiconductor (CMOS) image sensor, or the like, and captures a subject image imaged by lens part 2. Control part 303 is composed, for example, of a control IC, and performs a drive control of optical-element driving device 1. Optical-element driving device 1 is mounted on image sensor board 301 and is mechanically and electrically connected to the image sensor board. Note that control part 303 may be disposed on image sensor board 301, or may be disposed on a camera-mounted apparatus on which camera module A is mounted (smartphone M in the embodiment).
Optical-element driving device 1 is externally covered by cover 24. Cover 24 as seen in plan view in the optical-axis direction is a capped rectangular cylindrical member. In the embodiment, cover 24 as seen in plan view in the optical-axis direction has a square shape. Cover 24 includes, in its upper surface, substantially circular opening 241. Lens part 2 faces the outside via opening 241 of cover 24 and is configured to protrude from an opening surface of cover 24 on the light reception side, for example, with movement in the optical-axis direction. Cover 24 is fixed, for example, adhesively to base 21 (see
As illustrated in
OIS movable part 10 is a part that moves in the optical-axis-orthogonal plane during shake correction. OIS movable part 10 includes an AF unit, second stage 13, and X-direction reference balls 42A to 42D (see
OIS fixing part 20 is a part to which OIS movable part 10 is connected via OIS supporting part 40. OIS fixing part 20 includes base 21.
OIS movable part 10 is disposed apart from OIS fixing part 20 in the optical-axis direction, and is coupled to OIS fixing part 20 via OIS supporting part 40. Further, OIS movable part 10 and OIS fixing part 20 are biased in a direction approaching each other by OIS biasing members 50. OIS biasing members 50 are disposed at, for example, four corners of optical-element driving device 1 in plan view.
In the present embodiment, for the movement in the Y-direction, entire OIS movable part 10 including the AF unit moves as a movable body. In addition, for the movement in the X-direction, only the AF unit moves as a movable body. That is, for the movement in the X-direction, second stage 13 together with base 21 constitutes OIS fixing part 20, and X-direction reference balls 42A to 42C function as OIS supporting part 40.
Base 21 is formed of, for example, a molded material made of polyarylate (PAR), a PAR alloy that is a mixture of multiple resin materials containing PAR (e.g., PAR/PC), or a liquid crystal polymer. Base 21 is a rectangular member in plan view, and includes circular opening 211 at the center of base 21.
Base 21 includes first base portion 212 and second base portions 213 forming the main surface of base 21. Second base portions 213 are disposed correspondingly to portions of OIS movable part 10 protruding on the image formation side in the optical-axis direction, i.e., protruding portions 112A to 112D of AF movable part 11 and AF motor fixing portion 125 of first stage 12 (see
In the present embodiment, sensor board 22 is disposed in a region where AF driving unit 14 and OIS driving unit 30 are not disposed, i.e., in a region corresponding to one side (fourth side) of a rectangle that is a planar shape of base 21. Thus, it is possible to integrate power supply lines and signal lines for magnetic sensors 25X, 25Y, and 25Z, so as to simplify the interconnection structure in base 21 (see
Base 21 includes OIS motor fixing portion 215 on which Y-direction driving unit 30Y is disposed. OIS motor fixing portion 215 is disposed, for example, at the corner of base 21, is formed to protrude from first base portion 212 toward the light reception side in the optical-axis direction, and has a shape allowing Y-direction driving unit 30Y to be held.
Terminal metal fixtures 23A to 23C are disposed in base 21, for example, by insert molding. Terminal metal fixture 23A includes a power supply line for AF driving unit 14 and X-direction driving unit 30X. For example, terminal metal fixture 23A is exposed at the four corners of base 21 and is electrically connected to OIS biasing members 50. Power supply to AF driving unit 14 and X-direction driving unit 30X is performed via OIS biasing members 50. Terminal metal fixture 23B includes power supply lines (e.g., four power supply lines) for magnetic sensors 25X, 25Y, and 25Z and signal lines (e.g., six signal lines). Terminal metal fixture 23B is electrically connected to interconnections (not illustrated) formed in sensor board 22. Terminal metal fixture 23C includes a power supply line for Y-direction driving unit 30Y.
Further, base 21 includes Y-direction reference ball holding portions 217A to 217C in which Y-direction reference balls 41A to 41C constituting OIS supporting part 40 are disposed. Y-direction reference ball holding portions 217A to 217C are formed to be recessed in the shape of a rectangle extending in the Y-direction. Y-direction reference ball holding portions 217A to 217C are formed substantially in a V-shape (tapered shape) in a section such that the groove width tapers toward the bottom side.
In the present embodiment, Y-direction reference ball holding portions 217A and 217B are disposed in the side (third side) of base 21 where Y-direction driving unit 30Y is disposed, and Y-direction reference ball holding portion 217C is disposed in the side (fourth side) where sensor board 22 is disposed. OIS movable part 10 (second stage 13) is supported at three points by Y-direction reference balls 41A to 41C disposed in Y-direction reference ball holding portions 217A to 217C.
Sensor board 22 includes the interconnections (not illustrated) including the power supply lines and the signal lines for magnetic sensors 25X, 25Y, and 25Z. Magnetic sensors 25X, 25Y, and 25Z are mounted on sensor board 22. Magnetic sensors 25X, 25Y, and 25Z are, for example, composed of a Hall element, Tunnel Magneto Resistance (TMR) sensor, or the like, and are electrically connected to terminal metal fixture 23B via the interconnections (not illustrated) formed in sensor board 22. Further, opening 221 is formed in a portion of sensor board 22 corresponding to Y-direction reference ball holding portion 217C.
Magnets 16X and 16Y are disposed on first stage 12 of OIS movable part 10 at positions facing magnetic sensors 25X and 25Y (see
Further, magnet 16Z is disposed on AF movable part 11 of OIS movable part 10 at a position facing magnetic sensor 25Z (see
OIS biasing members 50 include, for example, tension coil springs, and couple OIS movable part 10 to OIS fixing part 20. In the present embodiment, one ends of OIS biasing members 50 are connected to terminal metal fixture 23A of base 21, and the other ends are connected to interconnections 17A and 17B of first stage 12. That is, in the present embodiment, OIS biasing members 50 function as power supply lines for AF driving unit 14 and X-direction driving unit 30X.
In addition, OIS biasing members 50 are subjected to a tensile load when OIS movable part 10 is coupled to OIS fixing part 20, and act on OIS movable part 10 and OIS fixing part 20 such that OIS movable part 10 and OIS fixing part 20 approach each other. That is, OIS movable part 10 is held to be movable in the XY plane by OIS biasing members 50 while biased in the optical-axis direction (while pressed against base 21). Thus, it is possible to hold OIS movable part 10 stably without rattling.
Further, as illustrated in
Damper material 71 may be disposed to fill only a gap between spring elements adjacent to each other in the axial direction, or may be filled only in the inside of the coil spring.
When OIS biasing members 50 are formed of a spring material, vibration is likely to be generated when OIS movable part 10 moves in the XY plane. This vibration is transmitted through the air and is recognized as a driving sound. In the present embodiment, since damper material 71 is disposed on and/or in OIS biasing members 50, the vibration of OIS biasing members 50 is efficiently damped in a short time, and the aerial vibration caused by the vibration of OIS biasing members 50 is also suppressed. Therefore, the generation of the driving sound can be suppressed, and the noise reduction performance of optical-element driving device 1 is remarkably improved.
OIS supporting part 40 supports OIS movable part 10 with respect to OIS fixing part 20 in a state where OIS movable part 10 is spaced apart from OIS fixing part 20 in the optical-axis direction. In the present embodiment, OIS supporting part 40 includes three Y-direction reference balls 41A to 41C interposed between OIS movable part 10 (second stage 13) and base 21.
Further, OIS supporting part 40 includes four X-direction reference balls 42A to 42D interposed between first stage 12 and second stage 13 in OIS movable part 10 (see
In the present embodiment, restricting the directions in which Y-direction reference balls 41A to 41C and X-direction reference balls 42A to 42D (total of seven balls) are rollable allows OIS movable part 10 to move in the XY plane accurately. Note that, the number of Y-direction reference balls and X-direction reference balls constituting OIS supporting part 40 can be appropriately changed.
OIS driving unit 30 is an actuator that moves OIS movable part 10 in the X- and Y-directions. Specifically, OIS driving unit 30 is composed of X-direction driving unit 30X for moving OIS movable part 10 (AF unit alone) in the X-direction, and Y-direction driving unit 30Y for moving entire OIS movable part 10 in the Y-direction.
X-direction driving unit 30X is fixed to OIS motor fixing portion 124 extending along the X-direction of first stage 12 (see
The configuration of OIS driving unit 30 is illustrated in
As illustrated in
OIS piezoelectric elements 32 are, for example, plate-shaped elements formed of a ceramic material, and generate a vibration under high-frequency voltage application. Two OIS piezoelectric elements 32 are disposed to sandwich body portion 311 of OIS resonant portion 31.
OIS electrode 33 holds OIS resonant portion 31 and OIS piezoelectric elements 32 in between, and applies a voltage to OIS piezoelectric elements 32. OIS electrode 33 of X-direction driving unit 30X is electrically connected to interconnection 17A of first stage 12, and OIS electrode 33 of Y-direction driving unit 30Y is electrically connected to terminal metal fixture 23C of base 21.
OIS resonant portion 31 is formed of a conductive material and resonates with the vibration of OIS piezoelectric elements 32 to convert the vibrational motion into a linear motion. OIS resonant portion 31 is formed, for example, by laser processing, etching processing, press working, or the like of a metal plate. In the present embodiment, OIS resonant portion 31 includes substantially rectangular body portion 311 sandwiched by OIS piezoelectric elements 32, two arm portions 312 extending in the X- or Y-direction from the upper and lower portions of body portion 311, protruding portion 313 extending in the X- or Y-direction from the central portion of body portion 311, and energization portion 314 extending from the central portion of body portion 311 on the opposite side of protruding portion 313.
Two arm portions 312 have symmetrical shapes whose free end portions make contact with OIS power transmission part 34 and symmetrically deform in resonance with the vibration of OIS piezoelectric elements 32. In the present embodiment, two arm portions 312 are formed such that the contact surfaces making contact with OIS plates 341 of OIS power transmission part 34 face inward and face each other.
Energization portion 314 of X-direction driving unit 30X is electrically connected to interconnection 17A of first stage 12, and energization portion 314 of Y-direction driving unit 30Y is electrically connected to terminal metal fixture 23C of base 21.
OIS piezoelectric elements 32 are bonded to body portion 311 of OIS resonant portion 31 in the thickness direction and are held in between by OIS electrode 33, so that these are electrically connected to one another. For example, one side of a power supply path is connected to OIS electrode 33, and the other side is connected to energization portion 314 of OIS resonant portion 31. A voltage is applied to OIS piezoelectric elements 32, and a vibration is thus generated.
OIS resonant portion 31 has at least two resonant frequencies, and deforms in behaviors different between the resonant frequencies. In other words, the entire shape of OIS resonant portion 31 is set such that OIS resonant portion 31 deforms in behaviors different between the two resonant frequencies. The different behaviors include a behavior causing OIS power transmission part 34 to move forward in the X- or Y-direction, and a behavior causing OIS power transmission part 34 to move backward in the X- or Y-direction.
OIS power transmission part 34 is a chucking guide extending in one direction, whose one end is connected to arm portions 312 of OIS resonant portion 31 and whose other end is connected to second stage 13. OIS power transmission part 34 includes stage connection member 342 connected to first stage 12 or second stage 13, and plate-shaped OIS plates 341 coupling together OIS ultrasonic motor USM1 (OIS resonant portion 31) and stage connection member 342.
Two OIS plates 341 are disposed to make contact respectively with two arm portions 312 of OIS resonant portion 31. Two OIS plates 341 are disposed substantially parallel to each other. The surfaces of OIS plates 341 on the sides where the OIS plates make contact with OIS resonant portion 31 are referred to as “first surfaces,” and the surfaces on the other sides are referred to as “second surfaces.” OIS plates 341 are disposed such that the second surfaces face each other.
One end portions 341b of OIS plates 341 (hereinafter referred to as “OIS motor contact portions 341b”) make sliding contact with the free end portions of arm portions 312 of OIS resonant portion 31. The other end portions of OIS plates 341 are inserted into and fixed to stage connection member 342. Portions of OIS plates 341 extending from OIS motor contact portions 341b toward the other end portions are referred to as “extension portions 341a.”
Stage connection member 342 is fixed to OIS chucking guide fixing portion 135 (see
The width between OIS motor contact portions 341b is set wider than the width between the free end portions of arm portions 312 of OIS resonant portion 31. In the present embodiment, stage connection member 342 includes spacing portion 342a and plate fixing portion 342b at a portion to which OIS plates 341 are connected. Plate fixing portion 342b is formed in a groove-like shape, in which the end portions of OIS plates 341 are inserted. By making the width of spacing portion 342a larger than the width of plate fixing portion 342b, two extension portions 341a are disposed away from each other toward OIS motor contact portions 341b, and also the width between OIS motor contact portions 341b increases. Thus, when OIS power transmission part 34 is attached between arm portions 312 of OIS resonant portion 31, extension portions 341a function as leaf springs, and a biasing force acts on arm portions 312 in the direction of pushing out arm portion 312. This biasing force allows OIS power transmission part 34 to be held between the free end portions of arm portions 312. Accordingly, the driving force from OIS resonant portion 31 is efficiently transmitted to OIS power transmission part 34.
OIS resonant portion 31 and OIS power transmission part 34 are only in contact with each other in a biased state; hence, it is possible to lengthen the movement stroke of OIS movable part 10 only by increasing the contact portions in the X- or Y-direction without enlarging the outer shape of optical-element driving device 1.
X-direction driving unit 30X is fixed to OIS movable part 10 (first stage 12) and is connected to second stage 13 via OIS power transmission part 34, and moves together with OIS movable part 10 during shake correction performed by Y-direction driving unit 30Y in the Y-direction. On the other hand, Y-direction driving unit 30Y is fixed to OIS fixing part 20 (base 21) and is connected to second stage 13 via OIS power transmission part 34, and is not affected by shake correction performed by X-direction driving unit 30X in the X-direction. That is, the movement of OIS movable part 10 by one of OIS driving units 30 is not hindered by the structure of the other one of OIS driving units 30. Therefore, it is possible to prevent rotation of OIS movable part 10 around the Z-axis, so as to allow OIS movable part 10 to move in the XY plane accurately.
Furthermore, damper material 72 is disposed between two extension portions 341a. For example, damper material 72 is disposed after OIS power transmission part 34 is connected between two arm portions 312 of OIS resonant portion 31. Damper material 72 is formed of a gel-like resin material having a viscosity and elasticity that allow the damper material to remain between two extension portions 341a and that do not impair the movement of OIS power transmission part 34. For example, a silicone material, a silicone-based vibration-damping material, or the like can be employed as damper material 72.
Extension portions 341a are plate-shaped portions, and are likely to vibrate with the resonance of OIS resonant portion 31. This vibration is transmitted through the air and is recognized as a driving sound. In the present embodiment, since damper material 72 is disposed between two extension portions 341a, the vibration at two extension portions 341a is efficiently attenuated in a short time, and aerial vibration caused by the vibration transmission from the opposing second surfaces are also suppressed. Therefore, the generation of the driving sound can be suppressed, and the noise reduction performance of optical-element driving device 1 is remarkably improved.
In addition, damper material 72 is disposed only on extension portions 341a of OIS plates 341, and is not disposed on OIS motor contact portions 341b. Thus, the influence of damper material 72 on a contact state (sliding state) of OIS motor contact portions 341b making contact with OIS resonant portion 31 can be suppressed. It is thus possible to obtain stable driving performance as in the case where damper material 72 is not disposed.
In the following, in a rectangle that is a planar shape of optical-element driving device 1, the side where AF driving unit 14 is disposed is referred to as “first side,” the side where X-direction driving unit 30X is disposed is referred to as “second side,” the side where Y-direction driving unit 30Y is disposed is referred to as “third side,” and the remaining one side is referred to as “fourth side.”
As illustrated in
AF movable part 11 is a lens holder for holding lens part 2 (see
AF movable part 11 is formed of, for example, polyarylate (PAR), a PAR alloy that is a mixture of multiple resin materials containing PAR, a liquid crystal polymer, or the like. AF movable part 11 includes cylindrical lens housing 111. Lens part 2 is fixed to the inner peripheral surface of lens housing 111, for example, adhesively.
AF movable part 11 includes, at the outer circumferential surface of lens housing 111, protruding portions 112A to 112D protruding radially outward and extending in the optical-axis direction. Protruding portions 112A to 112D protrude on the image formation side in the optical-axis direction beyond the lower surface of lens housing 111, and make contact with second base portions 213 of base 21, to restrict the movement of AF movable part 11 on the image formation side (lower side) in the optical-axis direction. In the present embodiment, protruding portions 112A to 112D make contact with second base portions 213 of base 21 in a reference state in which AF driving unit 14 is not driven.
Further, magnet housing 114 for housing magnet 16Z for Z position detection is disposed on the outer circumferential surface of lens housing 111. Magnet 16Z is disposed in magnet housing 114. Magnetic sensor 25Z for Z position detection is disposed on sensor board 22 at a position facing magnet 16Z in the optical-axis direction (see
First stage 12 supports AF movable part 11 via AF supporting part 15. Second stage 13 is disposed on the image formation side of first stage 12 in the optical-axis direction via X-direction reference balls 42A to 42D. First stage 12 moves in the X- and Y-directions during shake correction, and second stage 13 moves only in the Y-direction during shake correction.
First stage 12 as seen in plan view in the optical-axis direction is a member having a substantially rectangular shape, and is formed of, for example, a liquid crystal polymer. First stage 12 has substantially circular opening 121 at a portion corresponding to AF movable part 11. Cutout portions 122 corresponding to protruding portions 112A to 112D and magnet housing 114 of AF movable part 11 are formed in opening 121. A portion of first stage 12 corresponding to X-direction driving unit 30X (the outer surface of the sidewall along the second side) is formed to be recessed radially inward such that X-direction driving unit 30X can be disposed without protruding radially outward (OIS motor fixing portion 124). Further, a portion of first stage 12 corresponding to Y-direction driving unit 30Y (the outer surface of the sidewall along the third side) is also similarly formed to be recessed radially inward.
First stage 12 includes, at the lower surface, X-direction reference ball holding portions 123A to 123D for holding X-direction reference balls 42A to 42D. X-direction reference ball holding portions 123A to 123D are formed to be recessed in a rectangular shape extending in the X-direction. X-direction reference ball holding portions 123A to 123D face X-direction reference ball holding portions 133A to 133D of second stage 13 in the Z-direction. X-direction reference ball holding portions 123A and 123B are formed substantially in a V-shape (tapered shape) in a section such that the groove width tapers toward the bottom side, and X-direction reference ball holding portions 123C and 123D are formed substantially in a U-shape.
In first stage 12, AF motor fixing portion 125 in which AF resonant portion 141, which is an active element of AF driving unit 14, and the like are disposed is formed on one sidewall along the X-direction (sidewall along the first side). AF motor fixing portion 125 includes an upper fixing plate (whose reference numeral is omitted) and lower fixing plate 125a, and AF resonant portion 141 is sandwiched between these plates. AF resonant portion 141 is inserted into, for example, an insertion hole (whose reference numeral is omitted) formed in the upper fixing plate and lower fixing plate 125a, and fixed by adhesion. The upper fixing plate is formed by a part of interconnection 17B, and AF resonant portion 141 is electrically connected to interconnection 17B.
Magnets 16X and 16Y for detecting the XY position are disposed on one of the sidewalls of first stage 12 extending along the Y-direction (the sidewall along the fourth side). For example, magnet 16X is magnetized in the X-direction, and magnet 16Y is magnetized in the Y-direction. Magnetic sensors 25X and 25Y for detecting the XY position are disposed on sensor board 22 at positions facing magnets 16X and 16Y in the optical-axis direction (see
In addition, interconnections 17A and 17B are embedded in first stage 12, for example, by insert molding. Interconnections 17A and 17B are disposed, for example, along the first side and the second side. Interconnections 17A and 17B are exposed at the four corners of first stage 12, and one ends of OIS biasing members 50 are connected to this exposed portions. Power supply to X-direction driving unit 30X is performed via interconnection 17A, and power supply to AF driving unit 14 is performed via interconnection 17B.
Second stage 13 as seen in plan view in the optical-axis direction is a member having a substantially rectangular shape, and is formed of, for example, a liquid crystal polymer. Inner peripheral surface 131 of second stage 13 is formed correspondingly to the external shape of AF movable part 11. Portions of second stage 13 corresponding to X-direction driving unit 30X and Y-direction driving unit 30Y (the outer surfaces of the sidewalls along the second side and the third side) are formed to be recessed radially inward as in first stage 12.
Second stage 13 includes, at the lower surface, Y-direction reference ball holding portions 134A to 134C for housing Y-direction reference balls 41A to 41C. Y-direction reference ball holding portions 134A to 134C are formed to be recessed in the shape of a rectangle extending in the Y-direction. Y-direction reference ball holding portions 134A to 134C face Y-direction reference ball holding portions 217A to 217C of base 21 in the Z-direction. Y-direction reference ball holding portions 134A and 134B are formed substantially in a V-shape (tapered shape) in a section such that the groove width tapers toward the bottom side, and Y-direction reference ball holding portion 134C is formed substantially in a U-shape.
In addition, second stage 13 includes, at the upper surface, X-direction reference ball holding portions 133A to 133D for holding X-direction reference balls 42A to 42D. X-direction reference ball holding portions 133A to 133D are formed to be recessed in a rectangular shape extending in the X-direction. X-direction reference ball holding portions 133A to 133D face X-direction reference ball holding portions 123A to 123D of first stage 12 in the Z-direction. X-direction reference ball holding portions 133A to 133D are formed substantially in a V-shape (tapered shape) in a section such that the groove width tapers toward the bottom side. In the present embodiment, X-direction reference ball holding portions 133A and 133B are disposed in the side (second side) where X-direction driving unit 30X of second stage 13 is disposed, and X-direction reference ball holding portions 133C and 133D are disposed in the side (first side) where AF driving unit 14 is disposed. First stage 12 is supported at four points by X-direction reference balls 42A to 42D.
Y-direction reference balls 41A to 41C constituting OIS supporting part 40 are held at multiple contact points between Y-direction reference ball holding portions 217A to 217C of base 21 and Y-direction reference ball holding portions 134A to 134C of second stage 13. Therefore, Y-direction reference balls 41A to 41C roll stably in the Y-direction.
Further, X-direction reference balls 42A to 42D are held at multiple contact points between X-direction reference ball holding portions 133A to 133D of second stage 13 and X-direction reference ball holding portions 123A to 123D of first stage 12. Therefore, X-direction reference balls 42A to 42D roll stably in the X-direction.
AF supporting part 15 is a portion for supporting AF movable part 11 with respect to first stage 12 (AF fixing part). AF supporting part 15 includes first Z-direction reference balls 15A and second Z-direction reference balls 15B. First Z-direction reference balls 15A and second Z-direction reference balls 15B are rotatably interposed between AF movable part 11 and first stage 12. In the present embodiment, each set of first Z-direction reference balls 15A and second Z-direction reference balls 15B is composed of a plurality of balls (two balls in the present embodiment) disposed side by side in the Z-direction.
AF driving unit 14 is an actuator that move AF movable part 11 in the Z-direction. Like OIS driving units 30, AF driving unit 14 is composed of an ultrasonic motor. AF driving unit 14 is fixed to AF motor fixing portion 125 of first stage 12 such that arm portions 141b extend in the Z-direction. AF driving unit 14 includes AF ultrasonic motor USM2 and AF power transmission part 144.
The configuration of AF driving unit 14 (excluding AF power transmission part 144) is illustrated in
AF ultrasonic motor USM2 includes AF resonant portion 141, AF piezoelectric elements 142, and AF electrode 143. The driving force of AF ultrasonic motor USM2 is transmitted to AF movable part 11 via AF power transmission part 144. That is, in AF driving unit 14, AF resonant portion 141 is an active element, and AF power transmission part 144 is a passive element.
AF piezoelectric elements 142 are, for example, plate-shaped elements formed of a ceramic material, and generate a vibration under high-frequency voltage application. Two AF piezoelectric elements 142 are disposed to sandwich body portion 141a of AF resonant portion 141.
AF electrode 143 holds AF resonant portion 141 and AF piezoelectric elements 142 in between, and applies a voltage to AF piezoelectric elements 142.
AF resonant portion 141 is formed of a conductive material and resonates with the vibration of AF piezoelectric elements 142 to convert the vibrational motion into a linear motion. AF resonant portion 141 is formed, for example, by laser processing, etching processing, press working, or the like of a metal plate. In the present embodiment, AF resonant portion 141 includes substantially rectangular body portion 141a sandwiched between AF piezoelectric elements 142, two arm portions 141b extending in the Z-direction from body portion 141a, energization portion 141d extending in the Z-direction from the central portion of body portion 141a and electrically connected to the power supply path (interconnections 17B (upper fixing plate) of first stage 12), and stage fixing portion 141c extending from the central portion of body portion 141a toward the opposite side of energization portion 141d.
Two arm portions 141b have symmetrical shapes whose free end portions make contact with AF power transmission part 144, and symmetrically deform in resonance with the vibration of AF piezoelectric elements 142. In the present embodiment, two arm portions 141b are formed such that the surfaces of the arm portions making contact with AF plates 61 of AF power transmission part 144 face outward, and the free end portions are disposed to be sandwiched between AF plates 61.
AF piezoelectric elements 142 are bonded to body portion 141a of AF resonant portion 141 in the thickness direction and are held in between by AF electrode 143, so that these are electrically connected to one another. When energization portion 141d of AF resonant portion 141 and AF electrode 143 are connected to interconnection 17B of first stage 12, a voltage is applied to AF piezoelectric elements 142 and a vibration is thus generated.
Like OIS resonant portion 31, AF resonant portion 141 has at least two resonant frequencies, and deforms in behaviors different between the resonant frequencies. In other words, the entire shape of AF resonant portion 141 is set such that AF resonant portion 141 deforms in behaviors different between the two resonant frequencies.
As illustrated in
Protruding portions 112A and 112B, together with first stage 12, hold Z-direction reference balls 15A and 15B being AF supporting part 15. First Z-direction reference ball holding portion 113a for accommodating first Z-direction reference balls 15A is formed in protruding portion 112A of protruding portions 112A and 112B. Second Z-direction reference ball holding portion 113b for accommodating second Z-direction reference balls 15B is formed in protruding portion 112B of protruding portions 112A and 112B. First Z-direction reference ball holding portion 113a and second Z-direction reference ball holding portion 113b are formed substantially in a V-shape (tapered shape) in a section such that the groove widths decrease toward the groove bottoms.
In AF movable part 11, a space formed by protruding portions 112A and 112B serves as driving-unit housing 115 in which AF driving unit 14 is disposed. Protruding portions 112A and 112B include plate housings 115c respectively on surfaces opposite first and second Z-direction reference ball holding portions 113a and 113b. AF power transmission part 144 and biasing member 62, which are passive elements of AF driving unit 14, are disposed in plate housings 115c.
AF power transmission part 144 is a chucking guide having a predetermined length in the Z-direction. In the present embodiment, AF power transmission part 144 includes two AF plates 61. Specifically, AF plates 61 are interposed between AF resonant portion 141 of AF driving unit 14 and biasing member 62. The power of AF resonant portion 141 is transmitted to AF movable part 11 via AF plates 61.
AF plates 61 are, for example, a hard plate-like member made of a metal material such as titanium copper, nickel copper, or stainless steel. AF plates 61 are disposed in AF movable part 11 along the moving direction such that first surfaces of the plates make contact with arm portions 141b of AF resonant portion 141, and are movable integrally with AF movable part 11. AF plates 61 are disposed in plate housings 115c of AF movable part 11 and are physically locked. Specifically, AF plates 61 are fixed to AF movable part 11, with guide insertion portions 611 being loosely fitted in guide grooves 115a formed in AF movable part 11 and fixation pieces 612 being disposed between the bottom surfaces of plate housings 115c and locking pieces 115b.
AF plates 61 only need to be fixed to AF movable part 11 to be capable of following the attachment state (individual difference in attachment position) of AF resonant portion 141. The plates do not have to be bonded, or may be bonded with an elastically deformable soft adhesive (for example, silicone rubber).
Further, damper material 73 is disposed between the second surfaces (the surfaces opposite the first surfaces) of AF plates 61 and opposing surfaces. Specifically, plate housings 115c in which AF plates 61 are disposed are filled with damper material 73 so as to be embedded in the damper material. Damper material 73 is formed, for example, in a state in which AF driving unit 14 is assembled. Damper material 73 is formed of a gel-like resin material having a viscosity and elasticity that allow the damper material to remain in plate housings 115c and that do not impair the biasing force of biasing member 62. For example, a silicone material, a silicone-based vibration-damping material, or the like can be employed as damper material 73.
AF plates 61 are plate-shaped portions, and are likely to vibrate with the resonance of AF resonant portion 141. This vibration is transmitted through the air and is recognized as a driving sound. In the present embodiment, since damper material 73 is disposed in plate housings 115c where AF plates 61 are disposed, the vibration of AF plates 61 is efficiently damped in a short time and the aerial vibration caused by the vibration transmission from the second surfaces is also suppressed. Therefore, the generation of the driving sound can be suppressed, and the noise reduction performance of optical-element driving device 1 is remarkably improved.
Biasing member 62 is a member for biasing AF plates 61 toward arm portions 141b of AF resonant portion 141, and includes two spring portions 621. Spring portions 621 are configured to press AF plates 61 against arm portions 141b with the same biasing forces. The biasing forces of spring portions 621 are not impaired by damper material 73.
Biasing member 62 is formed by, for example, sheet metal processing, and spring portions 621 are formed from leaf springs extending from coupling portion 622. Specifically, the leaf springs of spring portions 621 are formed to extend from a lower portion of coupling portion 622 toward the − side in the Z-direction, to be folded back outward in a hairpin shape, and to be inclined inward with respect to the Z-direction.
Biasing member 62 is fixed to AF movable part 11 by placing coupling portion 622 of biasing member 62 on spring placement portions 115d disposed on driving-unit housing 115 and disposing spring portions 621 in plate housings 115c. AF plates 61 are positioned at hairpin portions of biasing member 62, and are biased toward the inside (toward the arm portion 141b side) by spring portions 621. Biasing member 62 is not bonded to AF movable part 11 so as to be capable of following the attachment position of AF driving unit 14. That is, biasing member 62 is movable along an attachment surface of driving-unit housing 115, and is held at a position where the biasing loads of two spring portions 621 are uniform when the biasing member sandwiches AF driving unit 14 (AF resonant portion 141 and AF plates 61). Note that the configuration of biasing member 62 is one example and can be changed as appropriate. For example, an elastic body such as a coil spring or a hard rubber may be used.
In first stage 12, AF motor fixing portion 125 is formed by cutting out portions corresponding to protruding portions 112A and 112B of AF movable part 11 and corresponding to the space sandwiched between the protruding portions. Further, first Z-direction reference ball holding portion 127a and second Z-direction reference ball holding portion 127b are formed continuously to both sides of AF motor fixing portion 125.
First Z-direction reference ball holding portion 127a is formed along tangential direction D1 of lens housing 111 (see
Second Z-direction reference ball holding portion 127b is formed to be inclined with respect to tangential direction D1 of lens housing 111 (see
Second Z-direction reference balls 15B are biased obliquely with respect to tangential direction D1 of lens housing 111 (see
Here, angle θ formed by tangential direction D1 and biasing direction D2 is, for example, 0° to 45° (excluding 0°). Biasing direction D2 is set in balance with pressure F, for example, such that the rotation of AF movable part 11 about the optical axis is restricted. For example, when angle θ formed between biasing direction D2 and tangential direction D1 is increased, the pressing force in the Y-direction is increased. Accordingly, pressure F by leaf spring 181 can be reduced. However, increased angle θ causes disadvantages in terms of space, such as a need to increase the protrusion length of protruding portions 112A and 112B. On the contrary, it is advantageous in terms of space when angle θ formed between biasing direction D2 and tangential direction D1 is small. However, the pressing force in the Y-direction is reduced, and it is thus necessary to increase the pressure by leaf spring 181.
First Z-direction reference balls 15A are held between first Z-direction reference ball holding portions 113a and 127a of AF movable part 11 and first stage 12 in a rollable manner. Further, second Z-direction reference balls 15B are held between spacer 182 disposed in second Z-direction reference ball holding portion 127b of first stage 12 and second Z-direction reference ball holding portion 113b of AF movable part 11 in a rollable manner. AF movable part 11 is supported and held in a stable attitude by first stage 12 while biased via first Z-direction reference balls 15A and second Z-direction reference balls 15B.
First Z-direction reference balls 15A are sandwiched between AF movable part 11 and first stage 12, and are restricted from moving in the optical-axis-orthogonal direction orthogonal to the optical axis (the rotation of AF movable part 11). As a result, AF movable part 11 can be moved in a stable manner in the optical-axis direction.
Meanwhile, second Z-direction reference balls 15B are sandwiched between AF movable part 11 and first stage 12 via leaf spring 181 and spacer 182, and are allowed to move in the optical-axis-orthogonal direction orthogonal to the optical axis. With this configuration, it is possible to absorb the dimensional tolerances of AF movable part 11 and first stage 12, and the stability during movement of AF movable part 11 is improved.
Further, a portion of AF movable part 11 where AF driving unit 14 is disposed is sandwiched between first Z-direction reference balls 15A and second Z-direction reference balls 15B, and the pressure is applied to second Z-direction reference balls 15B, that is, AF movable part 11 is supported at one place with respect to first stage 12. Thus, it is easier to reduce the distance between, on one hand, the force point at which the driving force of AF driving unit 14 is applied, and, on the other hand, the rotational axis, and it is possible to reduce the moment to reduce the pressure. Further, by causing second Z-direction reference balls 15B to function as pressurization balls, it is possible to reduce the rolling resistance. Therefore, the driving efficiency of AF driving unit 14 is improved, and also becomes suitable for a lens driving device for a large diameter lens. In addition, in the condition of the same pressure, the tilt resistance is higher.
In addition, both first Z-direction reference balls 15A and second Z-direction reference balls 15B include two balls. In this case, the rolling resistances of first Z-direction reference balls 15A and second Z-direction reference balls 15B are smaller than in a case where each of the first and the second Z-direction reference balls includes three or more balls.
In optical-element driving device 1, when a voltage is applied to AF driving unit 14, AF piezoelectric elements 142 vibrate, and AF resonant portion 141 deforms in a behavior corresponding to the frequency. The driving force of AF driving unit 14 causes sliding of AF power transmission part 144 in the Z-direction. Accordingly, AF movable part 11 moves in the Z-direction, and focusing is performed. Since AF supporting part 15 is composed of balls, AF movable part 11 can move smoothly in the Z-direction. Moreover, AF driving unit 14 and AF power transmission part 144 are only in contact with each other in a biased state; hence, it is possible to lengthen the movement stroke of AF movable part 11 easily only by increasing a contact portion in the Z-direction without preventing height reduction for optical-element driving device 1.
In optical-element driving device 1, when a voltage is applied to OIS driving unit 30, OIS piezoelectric elements 32 vibrate, and OIS resonant portion 31 deforms in a behavior corresponding to the frequency. The driving force of OIS driving unit 30 causes sliding of OIS power transmission part 34 in the X- or Y-direction. Accordingly, OIS movable part 10 moves in the X- or Y-direction, and shake correction is performed. Since OIS supporting part 40 is composed of balls, OIS movable part 10 can move smoothly in the X- or Y-direction.
Specifically, when X-direction driving unit 30X is driven and OIS power transmission part 34 moves in the X-direction, power is transmitted to second stage 13 from first stage 12 in which X-direction driving unit 30X is disposed. At this time, balls 41 sandwiched between second stage 13 and base 21 are incapable of rolling in the X-direction, and the position of second stage 13 with respect to base 21 in the X-direction is maintained. On the other hand, balls 42 sandwiched between first stage 12 and second stage 13 are capable of rolling in the X-direction, first stage 12 moves with respect to second stage 13 in the X-direction. That is, second stage 13 serves as a component of OIS fixing part 20, and first stage 12 serves as components of OIS movable part 10.
Further, when Y-direction driving unit 30Y is driven and OIS power transmission part 34 moves in the Y-direction, power is transmitted to second stage 13 from base 21 where Y-direction driving unit 30Y is disposed. At this time, balls 42 sandwiched between first stage 12 and second stage 13 are incapable of rolling in the Y-direction, and the position of first stage 12 with respect to the second stage in the Y-direction is maintained. On the other hand, balls 41 sandwiched between second stage 13 and base 21 are capable of rolling in the Y-direction, second stage 13 moves with respect to base 21 in the Y-direction. First stage 12 also moves in the Y-direction following second stage 13. That is, base 21 serves as a component of OIS fixing part 20, and the AF unit including first stage 12 and second stage 13 serves as a component of OIS movable part 10.
As described above, OIS movable part 10 moves in the XY plane, and shake correction is performed. Specifically, an energization voltage to OIS driving units 30X and 30Y is controlled based on a detection signal indicative of an angular shake from a shake detection part (for example, a gyro sensor (not illustrated)) such that the angular shake of camera module A is canceled. In this case, it is possible to accurately control the translational movement of OIS movable part 10 by feeding back the detection result of the XY position detecting part composed of magnets 16X and 16Y and magnetic sensors 25X and 25Y.
A difference between
Optical-element driving device 1 according to the present embodiment includes OIS fixing part 20 (fixing part), OIS movable part 10 disposed apart from OIS fixing part 20 in the optical-axis direction, OIS supporting part 40 configured to support OIS movable part 10 with respect to OIS fixing part 20, OIS driving unit 30 configured to move OIS movable part 10 with respect to OIS fixing part 20 in an optical-axis-orthogonal plane orthogonal to the optical-axis direction, and OIS biasing members 50 (tension coil springs) disposed to couple together OIS fixing part 20 and OIS movable part 10 and configured to bias OIS fixing part 20 and OIS movable part 10 such that OIS fixing part 20 and OIS movable part 10 approach each other, in which damper material 71 is disposed on and/or in OIS biasing members 50.
According to optical-element driving device 1, the vibration of OIS biasing members 50 is efficiently damped by damper material 71, and the aerial vibration caused by the vibration transmission from OIS biasing members 50 is suppressed. Accordingly, the noise reduction performance is remarkably improved.
Further, in optical-element driving device 1, damper material 71 is disposed between the spring elements constituting each of the tension coil springs that are OIS biasing members 50, and/or in the inner hollow portion.
Accordingly, OIS movable part 10 and OIS fixing part 20 can be coupled to each other without impairing the movement of movable part 10. Since the tension coil springs are likely to be vibrated and the driving sound is easily generated, the noise reduction effect by damper material 71 is exhibited remarkably.
In addition, in optical-element driving device 1, OIS driving unit 30 includes OIS ultrasonic motor USM1 that converts a vibrational motion into a linear motion.
It is thus possible to reduce the influence of external magnetism, and to reduce the size and height. Even when camera modules A having optical-element driving device 1 are disposed close to each other as in smartphone M, no magnetic influence is caused. Thus, the optical-element driving device is extremely suitable for use in a dual camera.
Further, OIS supporting part 40 is balls interposed between OIS fixing part 20 and OIS movable part 10.
Accordingly, OIS movable part 10 moves smoothly with respect to OIS fixing part 20 in a stable attitude. It is thus possible to suppress the vibration itself that can be a cause of the driving noise, and it is thus possible to improve the noise reduction performance.
While the invention made by the present inventors has been specifically described based on the preferred embodiment, it is not intended to limit the present invention to the above-mentioned preferred embodiment, but the present invention may be further modified within the scope and spirit of the invention defined by the appended claims.
For example, while smartphone M serving as a camera-equipped mobile terminal has been described in the embodiment as one example of the camera-mounted device including camera module A, the present invention is applicable to a camera-mounted device including a camera module and an image processing part that processes image information obtained by the camera module. The camera-mounted device encompasses an information apparatus and a transporting apparatus. Examples of the information apparatus include a camera-mounted mobile phone, a note-type personal computer, a tablet terminal, a mobile game machine, a web camera, and a camera-mounted in-vehicle device (for example, a rear-view monitor device or a drive recorder device). In addition, examples of the transporting apparatus include an automobile.
The present invention is not limited to the case where the driving source is composed of an ultrasonic motor as in OIS driving unit 30, but can also be applied to an optical-element driving device including a driving source (e.g., voice coil motor (VCM)) other than an ultrasonic motor.
In addition, although the embodiment has been described in relation to optical-element driving device 1 that drives lens part 2 as an optical element, the optical element to be driven may be an optical element other than a lens, such as a mirror or a prism.
The embodiment disclosed herein is merely an exemplification in every respect and should not be considered as limitative. The scope of the present invention is specified by the claims, not by the above-mentioned description. The scope of the present invention is intended to include all modifications in so far as they are within the scope of the appended claims or the equivalents thereof.
The disclosure of U.S. provisional Patent Application No. 63/109,390, filed on Nov. 4, 2020, including the specification, drawings and abstract is incorporated herein by reference in its entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2021/035646 | 9/28/2021 | WO |
Number | Date | Country | |
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63109390 | Nov 2020 | US |