The present disclosure relates to an optical element driving mechanism.
As technology has developed, it has become more common to include image-capturing and video-recording functions into many types of modern electronic devices, such as smartphones and digital cameras. These electronic devices are used more and more often, and new models have been developed that are convenient, thin, and lightweight, offering more choice to consumers.
Electronic devices that have image-capturing or video-recording functions normally include a driving mechanism to drive an optical element (such as a lens) to move along its optical axis, thereby achieving auto focus (AF) or optical image stabilization (OIS). Light may pass through the optical element and may form an image on an optical sensor. However, the trend in modern mobile devices is to have a smaller size and a higher durability. As a result, how to effectively reduce the size of the optical system and how to increase its durability has become an important issue.
An optical element driving mechanism is provided in some embodiments of the present disclosure, which includes a movable assembly, a fixed portion, a driving assembly, and a circuit assembly. The movable assembly is used for connecting an optical element. The movable assembly is movable relative to the fixed portion. The driving assembly is used for driving the movable assembly to move relative to the fixed portion. The circuit assembly connects the movable assembly and the fixed portion.
In some embodiments, the movably assembly includes a first movable portion and a second movable portion. The first movable portion is movably connected to the second movable portion through the circuit assembly.
In some embodiments, the circuit assembly includes a first circuit element and a second circuit element. The fixed portion includes a case and a bottom arranged along a main axis. The first circuit element is partially disposed between the bottom and the second circuit element in a first axis. The first circuit element is partially disposed between the movably assembly and the case element in the first axis.
In some embodiments, the first circuit element includes a first segment, a second segment, and a first connecting portion. The first circuit element is disposed on the second movable portion through the first connecting portion. The first segment connects to the first connecting portion. The second segment connects to the first connecting portion.
In some embodiments, the first segment and the first connecting portion extend in different directions. The second segment and the first connecting portion extend in different directions.
In some embodiments, the first circuit element further includes a third segment, a fourth segment, a fifth segment, a sixth segment, a seventh segment, an eighth segment, a ninth segment, a tenth segment, a first connecting portion, and a second connecting portion. The third segment connects to the second segment. The fourth segment connects to the third segment. The fifth segment connects to the fourth segment. The sixth segment connects to the fifth segment. The seventh segment connects to the sixth segment. The eighth segment connects to the seventh segment. The ninth segment connects to the eighth segment. The tenth segment connects to the ninth segment. The tenth segment connects to the second connecting portion. The first circuit element is affixed on the first movable portion through the second connecting portion.
In some embodiments, the second segment and the third segment extend in different directions. The third segment and the fourth segment extend in different directions. The fourth segment and the fifth segment extend in different directions. The fifth segment and the sixth segment extend in different directions. The sixth segment and the seventh segment extend in different directions. The seventh segment and the eighth segment extend in different directions. The eighth segment and the ninth segment extend in different directions. The ninth segment and the tenth segment extend in different directions.
In some embodiments, the first segment extends in a third axis. The first connecting portion extends in a second axis. The second axis and the third axis are not parallel.
In some embodiments, the second segment extends in the third axis. The third segment extends in the second axis. The fourth segment extends in the third axis. The fifth segment extends in the second axis. The sixth segment extends in the third axis. The seventh segment extends in the second axis. The eighth segment extends in the third axis. The ninth segment extends in the second axis. The tenth segment extends in the third axis.
In some embodiments, the first circuit element further includes an eleventh segment, a twelfth segment, a thirteenth segment, a fourteenth segment, a fifteenth segment, a sixteenth segment, a third connecting portion, and a substrate. The eleventh segment connects to the second connecting portion. The twelfth segment connects to the eleventh segment. The third connecting portion connects to the twelfth segment. The thirteenth segment connects to the first segment. The fourteenth segment connects to the thirteenth segment. The fifteenth segment connects to the fourteenth segment. The sixteenth segment connects to the fifteenth segment. The substrate connects to the sixteenth segment.
In some embodiments, the eleventh segment is arc-shaped. The twelfth segment extends in the second axis. The thirteenth segment extends in the second axis. The fourteenth segment extends in the third axis. The fifteenth segment extends in the second axis. The sixteenth segment extends in the first axis.
In some embodiments, the substrate is between the bottom and the second circuit element. The substrate is affixed on the bottom. The substrate is affixed on the second circuit element.
In some embodiments, the driving assembly includes a magnetic assembly and a circuit assembly. The magnetic assembly is disposed on the second movable portion. The magnetic assembly includes a first magnetic element, a second magnetic element, and a third magnetic element. The circuit assembly includes a first coil, a second coil, a third coil, a fourth coil, and a fifth coil. The first coil and the second coil are disposed on the first movable portion. The third coil, the fourth coil, and the fifth coil are embedded in the second circuit element.
In some embodiments, the first coil corresponds to the first magnetic element. The second coil corresponds to the third magnetic element. The third coil corresponds to the first magnetic element. The fourth coil corresponds to the third magnetic element. The fifth coil corresponds to the second magnetic element.
In some embodiments, the first magnetic element is between the second movable portion and the first coil in the third axis. The third magnetic element is between the second movable portion and the second coil in the third axis. The first magnetic element is between the second movable portion and the third coil in the first axis. The second magnetic element is between the second movable portion and the fourth coil in the first axis. The third magnetic element is between the second movable portion and the fifth coil in the first axis.
In some embodiments, the third connecting portion connects to the first coil or the second coil. The optical element driving mechanism further includes a damping element disposed between the second movable portion and the first circuit element.
In some embodiments, the damping element is disposed between the second movable portion and the thirteenth segment. The damping element is disposed between the second movable portion and the fourteenth segment. The damping element is disposed between the second movable portion and the fifteenth segment. The damping element is disposed between the second movable portion and the sixteenth segment.
In some embodiments, the first circuit elements includes a plurality of conductive circuits, a plurality of protective layers, and an insulating layer. The protective layers cover the conductive circuits. The insulating layer covers the protective layers.
In some embodiments, at least one of the conductive circuits is exposed from the first circuit element at the second connecting portion. At least one of the conductive circuits is exposed from the first circuit element at the third connecting portion.
In some embodiments, the optical element driving mechanism further includes a guiding assembly disposed between the first movable portion and the second movable portion. The guiding assembly includes a first guiding element and a second guiding element. The first guiding element is column-shaped. The first guiding element extends along the first axis. The second guiding element is column-shaped. The second guiding element extends along the first axis. The first guiding element and the second guiding element are arranged along the second axis.
Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, in some embodiments, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are in direct contact, and may further include embodiments in which additional features may be disposed between the first and second features, such that the first and second features may not be in direct contact.
In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Moreover, the formation of a feature on, connected to, and/or coupled to another feature in the present disclosure that follows may include embodiments in which the features are in direct contact, and may further include embodiments in which additional features may be disposed interposing the features, such that the features may not be in direct contact. In addition, spatially relative terms, for example, “vertical,” “above,” “over,” “below,”, “bottom,” etc. as well as derivatives thereof (e.g., “downwardly,” “upwardly,” etc.) are used in the present disclosure for ease of description of one feature's relationship to another feature. The spatially relative terms are intended to cover different orientations of the device, including the features. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It should be appreciated that each term, which is defined in a commonly used dictionary, should be interpreted as having a meaning conforming to the relative skills and the background or the context of the present disclosure, and should not be interpreted in an idealized or overly formal manner unless defined otherwise.
Use of ordinal terms such as “first”, “second”, etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.
In addition, in some embodiments of the present disclosure, terms concerning attachments, coupling and the like, such as “connected” and “interconnected”, refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
Embodiments of the present disclosure disclose an optical element driving mechanism used for driving an optical element to move. For example,
In some embodiments, the fixed portion 1100 may include a fixed portion 1100 and a bottom 1120, which may combined together to form a shell of the optical element driving mechanism 1000. For example, the fixed portion 1100 and the movable assembly 1200 may arrange along the main axis 1900, and other elements may be disposed in the shell to protect these elements. The movable assembly 1200 may include a first movable portion 1210 and a second movable portion 1220 movable relative to the fixed portion 1100. An optical element (not shown) may be disposed in the first movable portion 1210 to allow the optical element being driven by the optical element driving mechanism 1000 to move with the movable assembly 1200, so auto focus (AF) may be achieved.
In some embodiments, the optical element may be, for example, a lens, a mirror, a prism, a reflective polished surface, an optical coating, a beam splitter, an aperture, a liquid lens, an image sensor, a camera module, or a ranging module. It should be noted that the definition of the optical element is not limited to the element that is related to visible light, and other elements that relate to invisible light (e.g. infrared or ultraviolet) are also included in the present disclosure.
In some embodiments, the circuit assembly 1300 may include a first circuit element 1310 and a second circuit element 1330 to electrically connect to the elements in the optical element driving mechanism 1000 and other external devices, and the circuit assembly 1300 may connect to the fixed portion 1100 and the movable assembly 1200 to allow the first movable portion 1210 movably connecting to the second movable portion 1220 through the circuit assembly 1300. The second circuit element 1330 may affixed on the bottom 1120 through the first circuit element 1310 and may include printed circuit board (PCB), for example. In some embodiments, the driving assembly 1400 may include a coil assembly 1410 and a magnetic assembly 1420 and may be used for driving the movable assembly 1200 to move relative to the fixed portion 1100. In some embodiments, the connecting assembly 1500 may be used for movably connecting the fixed portion 1100 and the movable assembly 1200.
As shown in
In some embodiments, the first coil element 1411 may correspond to the first magnetic element 1421, the second coil element 1412 may correspond to the third magnetic element 1423, the third coil element 1413 may correspond to the first magnetic element 1421, the fourth coil element 1414 may correspond to the third magnetic element 1423, and the fifth coil element 1415 may correspond to the second magnetic element 1422. In some embodiments, along the third axis 1913, the first magnetic element 1421 is between the second movable portion 1220 and the first coil element 1411, and the third magnetic element 1423 is between the second movable portion 1220 and the second coil element 1412. Along the first axis 1911, the first magnetic element 1421 is between the second movable portion 1220 and the third coil element 1413, the second magnetic element 1422 is between the second movable portion 1220 and the fourth coil element 1414, and the third magnetic element 1423 is between the second movable portion 1220 and the fifth coil element 1415.
Therefore, the first movable portion 1210 may be moved relative to the second movable portion 1220 by the first magnetic element 1421, the third magnetic element 1423, the first coil element 1411, and the second coil element 1412. Furthermore, the second movable portion 1220 may be moved relative to the fixed portion 1100 by the first magnetic element 1421, the second magnetic element 1422, the third magnetic element 1423, the third coil element 1413, the fourth coil element 1414, and the fifth coil element 1415. Therefore, functions such as auto focus and optical image stabilization (OIS) may be achieved.
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, the buffering assembly 1520 may be resilient, such as its Young's modulus may be less than that of the case 1110 and the bottom 1120. Furthermore, when the movable assembly 1200 is at a first position (such as the position when no power is provided to the driving assembly 1400), the buffering assembly 1520 (e.g. the first buffering element 1521) may only contact one of the movable assembly 1200 and the fixed portion 1100. Therefore, the movable assembly 1200 may be prevented from being in direct contact with the fixed portion 1100 when the movable assembly 1200 is moving.
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, the first circuit element 1310 may be affixed on the second movable portion 1220 through the first connecting portion 1511, and may be affixed on the first movable portion 1210 through the second connecting portion 1512. The first segment 1311 and the second segment 1312 may connect to the first connecting portion 1511. In some embodiments, the first segment 1311 and the second segment 1312 may extend in the direction that the third axis 1913 extends, and the first connecting portion 1511 may extend in the direction that the second axis 1912 extends. In other words. The first segment 1311 and the second segment 1312 extend in a direction different from the direction that the first connecting portion 1511 extends.
In some embodiments, the third segment 1313 connects to the second segment 1312, the fourth segment 1314 connects to the third segment 1313, the fifth segment 1315 connects to the fourth segment 1314, the sixth segment 1316 connects to the fifth segment 1315, the seventh segment 1317 connects to the sixth segment 1316, the eighth segment 1318 connects to the seventh segment 1317, the ninth segment 1319 connects to the eighth segment 1318, the tenth segment 1320 connects to the ninth segment 1319 and the second connecting portion 1512, the eleventh segment 1321 connects to the second connecting portion 1512, the twelfth segment 1322 connects to the first buffering element 1521, the thirteenth segment 1323 connects to the first segment 1311, the fourteenth segment 1324 connects to the thirteenth segment 1323, the fifteenth segment 1325 connects to the fourteenth segment 1324, the sixteenth segment 1326 connects to the fifteenth segment 1325, and the substrate 1327 connects to the sixteenth segment 1326 and may be affixed on the bottom 1120.
In some embodiments, the first circuit element 1310 may be bent to allow the first circuit element 1310 moving relative to the second movable portion 1220 and allow the second movable portion 1220 moving relative to the fixed portion 1100. In some embodiments, the second segment 1312 and the third segment 1313 extend in different directions, the third segment 1313 and the fourth segment 1314 extend in different directions, the fourth segment 1314 and the fifth segment 1315 extend in different directions, the fifth segment 1315 and the sixth segment 1316 extend in different directions, the sixth segment 1316 and the seventh segment 1317 extend in different directions, the seventh segment 1317 and the eighth segment 1318 extend in different directions, the eighth segment 1318 and the ninth segment 1319 extend in different directions, and the ninth segment 1319 and the tenth segment 1320 extend in different directions. For example, the third segment 1313, the fifth segment 1315, the seventh segment 1317, and the ninth segment 1319 may extend in the second axis 1912, and the fourth segment 1314, the sixth segment 1316, the eighth segment 1318, and the tenth segment 1320 may extend in the third axis 1913. Therefore, the first circuit element 1310 may be bent to increase the flexibility of the first circuit element 1310.
In some embodiments, the eleventh segment 1321 is arc-shaped, the twelfth segment 1322 extends in the second axis 1912, the thirteenth segment 1323 extends in the first height 1921, the fourteenth segment 1324 extends in the third axis 1913, the fifteenth segment 1325 extends in the second axis 1912, the sixteenth segment 1326 extends in the first axis 1911, and a substrate 1927 is between the bottom 1120 and the circuit assembly 1300 and affixed on the bottom 1120 and the second circuit element 1330. In other words, along the first axis 1911, the first circuit element 1310 may be partially disposed between the bottom 1120 and the second circuit element 1330 (such as the substrate 1327) and partially disposed between the movable assembly 1200 and the case 1110 (such as the thirteenth segment 1323, the fourteenth segment 1324, the fifteenth segment 1325, and the sixteenth segment 1326).
In some embodiments, an additional damping element 1630 may be disposed between the first circuit element 1310 and the second movable portion 1220 to movably connect a portion of the first circuit element 1310 and the second movable portion 1220. In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, the first recessed portion 1122 may connect to the bottom surface 1128 and may be trapezoidal. For example, the first recessed portion 1122 has a first width 1931 at a side connected to the bottom surface 1128 and a second width 1932 at a side connected to the connecting portion 1124, and the first width 1931 and the second width 1932 are different. For example, the first width 1931 may be greater than the second width 1932 in order to make it easier to demold when manufacturing the bottom 1120.
In some embodiments, the connecting portion 1124 may include a third width 1933, and the third width 1933 may be different from the first width 1931 and the second width 1932. For example, the first width 1931 may be greater than the third width 1933, and the second width 1932 may be less than the third width 1933. In some embodiments, circuit may be embedded in the bottom 1120, and a circuit terminal 1125 of the circuit may be exposed from the bottom 1120, such as exposed from the bottom 1120 at the connecting portion 1124. In some embodiments, a plurality of circuit terminals 1125 may be exposed at an identical connecting portion 1124.
In some embodiments, the trench 1126 may further include a plurality of trenches 1126 recessed from the external surface 1127 and extending along the first axis 1911. Therefore, the surface area of the bottom 1120 may be increased to increase the adhesion strength between the case 1110 and the bottom 1120 when bonded by an adhesive element 1111. For example, the adhesive element 1111 may be disposed between the case 1110 and the bottom 1120 and in the trenches 1126. In some embodiments, the recess 1121 may be located between the plurality of trenches 1126.
In some embodiments, as shown in
In some embodiments, the first connecting element 1501, the second connecting element 1502, the third connecting element 1503, and the fourth connecting element 1504 may be disposed on the second movable portion 1220, and the fifth connecting element 1505, the sixth connecting element 1506, and the seventh connecting element 1507 may be disposed on the bottom 1120. In some embodiments, the first connecting portion 1511, the second connecting portion 1512, and the third connecting portion 1513 may connect to each other through the fourth strengthen element 1514 and may be disposed between the bottom 1120 and the second movable portion 1220. In some embodiments, the first connecting element 1501 and the fifth connecting element 1505 may be disposed on opposite sides of the first connecting portion 1511, the second connecting element 1502 and the sixth connecting element 1506 may be disposed on opposite sides of the second connecting portion 1512, and the third connecting element 1503 and the seventh connecting element 1507 may be disposed on opposite sides of the third connecting portion 1513. The fourth connecting element 1504 may be disposed in an accommodating space 1950 between the bottom 1120 and the second movable portion 1220.
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, the fourth connecting element 1504 is not located on the first virtual plane 1941 and the second virtual plane 1942, such as the fourth connecting element 1504 may be located between the first virtual plane 1941 and the second virtual plane 1942, and the first virtual plane 1941 and the second virtual plane 1942 do not pass through the fourth connecting element 1504. For example, the first virtual plane 1941 and the second virtual plane 1942 may have distances greater than zero to the fourth connecting element 1504. In some embodiments, in the first axis 1911, the fourth connecting element 1504 may have a first height 1921, the accommodating space 1950 may have a second height 1922, and the first height 1921 is less than the second height 1922. In other words, the fourth connecting element 1504 may not be used for supporting the second movable portion 1220 and the bottom 1120 in common situations, but the fourth connecting element 1504 may be a stopper when the second movable portion 1220 is tilted to prevent the second movable portion 1220 from being damaged.
In some embodiments, the first connecting element 1501, the second connecting element 1502, the third connecting element 1503, the fourth connecting element 1504, the fifth connecting element 1505, the sixth connecting element 1506, and the seventh connecting element 1507 may be spherical, and their material may include, for example, ceramic. Therefore, they may roll when the second movable portion 1220 moves relative to the bottom 1120 to reduce the friction between the second movable portion 1220 and the bottom 1120, so the second movable portion 1220 is easier to be moved. It should be noted that since a plane can be defined by three points, the first virtual plane 1941 is defined by the first connecting element 1501, the second connecting element 1502, and the third connecting element 1503, and the second virtual plane 1942 is defined by the fifth connecting element 1505, the sixth connecting element 1506, and the seventh connecting element 1507. As a result, the main axis 1900 of the optical element driving mechanism 1000 may be prevented from being tilted during operation to increase its optical performance.
In some embodiments, as shown in
In some embodiments, the sensing magnetic element 1610 may include a Hall sensor, a magnetoresistance effect sensor (MR sensor), a giant magnetoresistance effect sensor (GMR sensor), a tunneling magnetoresistance effect sensor (TMR sensor), or a fluxgate sensor. Therefore, positions of the first movable portion 1210 and the second movable portion 1220 during moving may be detected to precisely control the first movable portion 1210 and the second movable portion 1220.
Moreover, the fourth strengthen element 1514 may include a first end 1561 and a second end 1562, wherein the first end 1561 may be disposed on the first connecting portion 1511 and at least partially exposed from the first connecting portion 1511, and the second end 1562 may be disposed on the third connecting portion 1513 and at least partially exposed from the third connecting portion 1513. In some embodiments, the first end 1561 and the second end 1562 may extend in an identical direction, such as a direction parallel to the second axis 1912.
In some embodiments, as shown in
In some embodiments, in the direction that the first axis 1911 extends, the first recessed portion 1515 and the fifth recessed portion 1541 may at least partially overlap each other, the second recessed portion 1516 and the sixth recessed portion 1542 may at least partially overlap each other, and the third recessed portion 1517 and the seventh recessed portion 1543 may at least partially overlap each other. In other words, in the direction that the first axis 1911 extends, the first connecting element 1501 and the fifth connecting element 1505 may at least partially overlap each other, the second connecting element 1502 and the sixth connecting element 1506 may at least partially overlap each other, and the third connecting element 1503 and the seventh connecting element 1507 may at least partially overlap each other to reduce sizes in other directions to achieve miniaturization.
In some embodiments, the first recessed portion 1515 include a first recessed surface 1551, the second recessed portion 1516 include a second recessed surface 1552, the third recessed portion 1517 include a third recessed surface 1553, the fourth recessed portion 1518 include a fourth recessed surface 1554, the fifth recessed portion 1541 include a fifth recessed surface 1555, the sixth recessed portion 1542 include a sixth recessed surface 1556, and the seventh recessed portion 1543 include a seventh recessed surface 1557, The first recessed surface 1551, the second recessed surface 1552, the third recessed surface 1553, and the fourth recessed surface 1554 may face an identical direction, and the first recessed surface 1551, the second recessed surface 1552, the third recessed surface 1553, and the fourth recessed surface 1554 may face a direction opposite from a direction that the fifth recessed surface 1555, the sixth recessed surface 1556, and the seventh recessed surface 1557. For example, the first recessed surface 1551, the second recessed surface 1552, the third recessed surface 1553, and the fourth recessed surface 1554 may face away from the bottom 1120, the fifth recessed surface 1555, the sixth recessed surface 1556, and the seventh recessed surface 1557 may face the bottom 1120, and their normal vectors may be parallel to the first axis 1911.
In some embodiments, as shown in
In some embodiments, a lubricant 1620 (such as lubricant) may be disposed on the first recessed portion 1515, the second recessed portion 1516, the third recessed portion 1517, the fourth recessed portion 1518, the fifth recessed portion 1541, the sixth recessed portion 1542, and the seventh recessed portion 1543 to further decrease the frictions between the connecting assembly 1500, the second movable portion 1220, and the bottom 1120.
In some embodiments, additional strengthen element may be added in the second movable portion 1220 to increase the mechanical strength of the second movable portion 1220, and the strengthen element may be magnetic permeable. For example, as shown in
In some embodiments, as shown in
In summary, an optical element driving mechanism is provided, which includes a movable assembly, a fixed portion, and a driving assembly. The movable assembly is used for connecting an optical element. The movable assembly is movable relative to the fixed portion. The driving assembly is used for driving the movable assembly to move relative to the fixed portion. Therefore, the moving direction of the movable portion relative to the fixed portion can be further stabilized to achieve better filming performance.
The relative positions and size relationship of the elements in the present disclosure may allow the driving mechanism achieving miniaturization in specific directions or for the entire mechanism. Moreover, different optical modules may be combined with the driving mechanism to further enhance optical quality, such as the quality of photographing or accuracy of depth detection. Therefore, the optical modules may be further utilized to achieve multiple anti-vibration systems, so image stabilization may be significantly improved.
Although embodiments of the present disclosure and their advantages already have been described in detail, it should be understood that various changes, substitutions and alterations may be made herein without departing from the spirit and the scope of the disclosure as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are also intended to include within their scope of such processes, machines, manufacture, and compositions of matter, means, methods, or steps. In addition, each claim herein constitutes a separate embodiment, and the combination of various claims and embodiments are also within the scope of the disclosure.
This application claims priority of U.S. Provisional Patent Application No. 63/517,770 filed on Aug. 4, 2023, the entirety of which is incorporated by reference herein.
Number | Date | Country | |
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63517770 | Aug 2023 | US |