The present disclosure relates to an optical fiber support structure and a semiconductor laser module.
In a semiconductor laser module that couples a spatially multiplexed laser beam to an end portion (input end) of a core wire of an optical fiber, there is conventionally known an optical fiber support structure in which a relaxing portion is provided so as to be in contact with the end portion. (e.g., WO 2017/134911 A)
In this type of optical fiber support structure and a semiconductor laser module including the optical fiber support structure, there is a demand for an optical fiber support structure and a semiconductor laser module having an improved and novel configuration with fewer inconveniences in which, for example, a relaxing portion is less likely to come off, or a relaxing portion is easily attached during assembling the optical fiber support structure.
It is therefore desirable to obtain, for example, an optical fiber support structure and a semiconductor laser module including the optical fiber support structure having an improved and novel configuration with fewer inconveniences.
In some embodiments, an optical fiber support structure includes: a first portion configured to support an optical fiber including a core wire and a covering surrounding the core wire, the core wire including a core and a cladding; a second portion attached to the first portion; and a relaxing portion that is connected to an end portion of the core wire and that is positioned between the first portion and the second portion, the relaxing portion having a light receiving surface configured to receive light input from a space, an area of the light receiving surface being larger than an area of the end portion of the core wire.
In some embodiments, a semiconductor laser module includes: the optical fiber support structure; a semiconductor laser element; and an optical system configured to guide a laser beam output from the semiconductor laser element to the relaxing portion and couple the laser beam to the end portion of the core wire via the relaxing portion.
The above and other objects, features, advantages and technical and industrial significance of this disclosure will be better understood by reading the following detailed description of presently preferred embodiments of the disclosure, when considered in connection with the accompanying drawings.
In the following, exemplary embodiments and modifications are disclosed. The configurations of the embodiments and modifications described below and the actions and results (effects) brought about by the configurations are merely examples. The disclosure can also be realized by configurations other than those disclosed in the following embodiments and modifications. According to the disclosure, it is possible to obtain at least one of various effects (including derivative effects) obtained by the configurations.
The embodiments and modifications described below have similar configurations. Therefore, according to the configuration of each embodiment and modification, similar action and effect based on the similar configuration can be obtained. In the following, the similar configurations are denoted by the same reference numerals, and redundant description may be omitted.
In each of
In the present description, ordinal numbers are given for convenience in order to distinguish parts, materials, portions, and others, and do not indicate priority or order.
As illustrated in
The base 11 has a rectangular parallelepiped shape extending in the X direction, and supports the optical fiber 20 extending in the X direction.
The base 11 has a surface 11a positioned at an end portion on the side opposite in the Z direction and a surface 11b positioned at an end portion in the Z direction.
The surface 11a faces a direction opposite to the Z direction, and intersects and is orthogonal to the Z direction. The surface 11a is a rectangular plane.
The surface 11b faces the Z direction, and intersects and is orthogonal to the Z direction. The surface 11b has three surfaces 11b1, 11b2, and 11b3 that are shifted in the Z direction. The surfaces 11b1, 11b2, and 11b3 all face the Z direction, and intersect and are orthogonal to the Z direction. The surfaces 11b1, 11b2, and 11b3 are all planes. The surface 11b2 is positioned to be shifted from the surface 11b1 in the direction opposite to the Z direction, and the surface 11b3 is positioned to be shifted from the surface 11b2 in the direction opposite to the Z direction. The surfaces 11b1, 11b2, and 11b3 form a step. The surface 11a, the surface 11b1, the surface 11b2, and the surface 11b3 are parallel to each other.
The cover 12 intersects and is orthogonal to the Z direction. The cover 12 has a rectangular shape extending in the X direction.
Both the base 11 and the cover 12 can be made of a material having high thermal conductivity, such as a copper-based material or an aluminum-based material.
The optical fiber 20 is housed in a housing chamber S (see
The cover 12 is fixed to the base 11 by, for example, a fixture 16 such as a screw. The base 11 and the cover 12 are integrated with each other in a state in which a stripped end portion 20a of the optical fiber 20 and a treatment material are housed in the space, whereby a configuration in which the stripped end portion 20a and the treatment material are housed in the space can be realized with a relatively simple configuration. The optical fiber 20 is supported by the base 11 and the cover 12. The base 11 and the cover 12 are examples of a first portion and can also be referred to as a support. Note that the base 11 and the cover 12 may be integrated with each other by a coupling method different from the coupling method using the fixture 16.
The end cap 13 is surrounded by the base 11 and the holder 14 positioned on the side opposite to the base 11 with respect to the end cap 13. The holder 14 is fixed to the base 11 by the fixture 16 such as a screw. The holder 14 is attached to the base 11 in a state in which the end cap 13 is sandwiched between the holder and the base 11. The holder 14 is an example of a second portion. Note that the base 11 and the holder 14 may be integrated with each other by a coupling method different from the coupling method using the fixture 16.
The end cap 13 is, for example, a transparent material having a transmittance of 99% or more with respect to light which is received by the end surface 13a1 and is transmitted through the optical fiber 20 (core wire 21). The end cap 13 can be made of a material having a refractive index substantially equal to that of the core of the optical fiber 20. As an example, the end cap 13 can be made of the same silica-based glass material as the core of the optical fiber 20.
An anti-reflection (AR) coating is applied to the end surface 13a1 of the end cap 13 on the side opposite to the protruding portion 13b. Thus, the reflection of light at the end surface 13a1 is suppressed.
As illustrated in
The holder 14 has two side walls 14b spaced apart from each other in the Y direction and extending in the Z direction, and a top wall 14c extending in the Y direction between end portions of the side walls 14b in the Z direction. These two side walls 14b and the top wall 14c cover the columnar portion 13a of the end cap 13.
Two protrusions 11c are provided on the surface 11b3 of the base 11. The protrusions 11c each are spaced apart from each other in the Y direction, protrude from the surface 11b3 in the Z direction, and extend in the X direction. The protrusions 11c each have inclined surfaces 11c1. The inclined surfaces 11c1 face inward in the radial direction of the central axis (i.e., an optical axis Ax) of the columnar portion 13a of the end cap 13. The inclined surfaces 11c1 are planes extending in the direction (tangential direction) orthogonal to the radial direction of the optical axis Ax and extending in the axial direction of the optical axis Ax, that is, in the Z direction. The outer peripheral surface of the columnar portion 13a is in contact with these inclined surfaces 11c1.
The outer peripheral surface of the columnar portion 13a is also in contact with an inner surface 14c1 of the top wall 14c of the holder 14 on the side opposite to the two protrusions 11c. The inner surface 14c1 is a plane extending in the Y direction and extending in the Z direction. In other words, the inner surface 14c1 is also a plane extending in the direction (tangential direction) orthogonal to the radial direction of the optical axis Ax and extending in the axial direction of the optical axis Ax.
As described above, the outer peripheral surface of the columnar portion 13a is inscribed in the two inclined surfaces 11c1 and the inner surface 14c1, that is, three surfaces. The columnar portion 13a, that is, the end cap 13 is supported by the support 10A by line contact with these three surfaces or surface contact with an elongated surface extending in the X direction with a very small width. In this case, the support 10A can support the end cap 13 without using an adhesive or others.
In such a configuration, the holder 14 may be made of, for example, an invar material. In the present description, the invar material is a material that shrinks more than a normal temperature at a temperature higher than the normal temperature, and is, as an example, an iron-based alloy containing nickel (nickel alloy). For example, in a case where this type of the support 10A is incorporated in a device including an adhesive as a thermosetting resin, the support 10A may be in a high temperature state after sub-assembly (after assembly). The temperature in the high-temperature state in the thermosetting treatment is, for example, 130 [°C.]. In such a case, if the configuration is such that the thermal expansion of the end cap 13 is hindered by the base 11 and the holder 14, the stress acting on the end cap 13 or the stripped end portion 20a connected to the end cap 13 increases, which may cause deformation or damage of the end cap 13 or the stripped end portion 20a. In this regard, in the case where the holder 14 is made of an invar material, even when the end cap 13 is thermally expanded, the thicknesses t of the top wall 14c of the holder 14 is reduced and the thermal expansion of the end cap 13 is not excessively hindered, so that deformation or damage of the end cap 13 or the stripped end portion 20a can be suppressed.
As illustrated in
The housing chamber S surrounded by the surfaces 11e1 and 11e2 of the recessed groove 11e and the surface 12a of the cover 12 extends in the X direction. The optical fiber 20 extending in the X direction is housed in the housing chamber S.
The surfaces 11e1, 11e2, and 12a suppress positional displacement of the stripped end portion 20a in the direction orthogonal to the X direction. The surfaces 11e1, 11e2, and 12a can also be referred to as positioning portions or positional displacement prevention portions.
A treatment material 15 is housed in a portion except the optical fiber 20 in the housing chamber S. The optical processing mechanism 40 has the treatment material 15. The treatment material 15 is present around the stripped end portion 20a in a state of being in contact with the stripped end portion 20a (core wire 21). The core wire 21 has a core 21a and a cladding 21b. The treatment material 15 transmits or scatters light leaked from the cladding 21b at the stripped end portion 20a. Thus, it is possible to suppress propagation of light from the cladding 21b to a covering 22. The treatment material 15 may convert light energy into heat energy.
The treatment material 15 can be made of, for example, an inorganic adhesive having a property of transmitting or scattering light. The inorganic adhesive is, for example, a silicon-based or alumina-based adhesive. In this case, the inorganic adhesive is applied in an uncured state and then cured, resulting in a ceramic-like film. The inorganic adhesive can transmit or scatter light. Note that, when the inorganic adhesive uses an organic solvent, the organic solvent is volatilized during curing. Since the inorganic adhesive has a high heat resistance, the adhesive is suitable as the treatment material 15.
The treatment material 15 may be made of a resin material having a property of transmitting or scattering light. The resin material is, for example, silicone-based, epoxy-based, or urethane acrylate-based. The resin material may contain, for example, boron nitride, talc, or aluminum nitride (AlN) as a filler. In this case, light is also scattered by the filler. Preferably, the refractive index of the filler is higher than the refractive index of the cladding 21b. Note that the resin material and the filler are not limited to those described above.
As described above, in the present embodiment, the end cap 13 (relaxing portion) is supported by the base 11 and the holder 14 in a state of being sandwiched between the base 11 (first portion) and the holder 14 (second portion). In other words, the end cap 13 is positioned between the base 11 and the holder 14, and is in contact with each of the base 11 and the holder 14.
According to such a configuration, for example, the end cap 13 can be attached to the base 11 more easily or more reliably. For example, as compared with a case where the holder 14 is not provided, it is possible to obtain an effect that the end cap 13 can be suppressed from interfering with a tool or a component during manufacturing or stray light can be suppressed from entering the end cap 13. Note that the end cap 13 may be attached to at least one of the base 11 and the holder 14 via, for example, an adhesive. However, when the adhesive is not used for fixing the end cap 13, it is possible to obtain an advantage such as a reduction in manufacturing cost or suppression of inconvenience caused by the adhesive.
In the present embodiment, the holder 14 is provided with the cutout 14a (opening), and the connecting portion between the protruding portion 13b of the end cap 13 and the tip 20a1 of the core wire 21 of the optical fiber 20 is exposed on the side opposite to the base 11 by the cutout 14a. Such a configuration allows to check a connection state between the protruding portion 13b and the tip 20a1 through the cutout 14a by visual confirmation of an operator or photographing by a camera, for example.
In the present embodiment, the holder 14 is made of an invar material. According to such a configuration, for example, even when the end cap 13 is thermally expanded, the thermal expansion of the end cap 13 is not excessively hindered by the holder 14, so that deformation or damage of the end cap 13 or the stripped end portion 20a can be suppressed.
In the present embodiment, the end cap 13 is supported by the base 11 at one or more positions and the holder 14 at one or more positions, and is supported by both of the base 11 and the holder 14 at three or more positions in total. According to such a configuration, it is possible to more reliably suppress, for example, the positional displacement of the end cap 13.
According to the present modification, the end cap 13 is supported by the base 11 at two or more positions and the holder 14 at two or more positions, and is supported by both of the base 11 and the holder 14 at four or more positions in total. According to such a configuration, it is possible to much more reliably suppress, for example, the positional displacement of the end cap 13.
In a temperature range in which the support 10D is used, for example, in a range of -20 [°C.] or higher and 120 [°C.] or lower, the support 10D is set such that the gap g is greater than 0.05 [mm], and more preferably, the gap g is greater than or equal to 0.1 [mm]. According to such a configuration, it is possible to suppress the end cap 13 from being compressed between the base 11 and the holder 14D due to thermal expansions or thermal contractions of the respective parts, and thus to suppress the end cap 13 from being deformed or damaged.
Assuming the thermal expansions of the respective parts, the size (g) of the gap g may be set so as to satisfy, for example, the following equation (1). g>ΔT(αh×t+αe×D) (1)
Where ΔT is the maximum temperature difference of the support 10D, αh is the thermal expansion coefficient of the holder 14D, t is the thickness of the top wall 14c of the holder 14D, αe is the thermal expansion coefficient of the end cap 13, and D is the diameter of the end cap 13. Note that Equation (1) is based on the assumption that the length Lt between the end surface of the holder 14D in the Z direction and the end portion of the end cap 13 in the direction opposite to the Z direction is substantially constant.
Further, from the viewpoint of suppressing the entry of a tool such as tweezers or a foreign material into the gap g, the gap g is preferably less than or equal to 0.6 [mm], and more preferably less than or equal to 0.4 [mm].
The elastic modulus of the adhesive 17 in a cured state is preferably smaller than the elastic modulus of the base 11 and the holder 14D. According to such a configuration, the protection of the end cap 13 can be further enhanced by the buffer action of the adhesive 17 which is softer than the base 11 and the holder 14D. From such a viewpoint, the adhesive 17 is preferably an organic adhesive.
Inner surfaces 14b1 and 14c1 of the holder 14D facing the end cap 13 may be provided with a layer of a light absorbing material that absorbs light by, for example, a coated black paint. According to such a configuration, it is possible to suppress stray light (leakage light) reaching the inner surfaces 14b1 and 14c1 from being reflected by the inner surfaces 14b1 and 14c1 and being coupled to the end cap 13. Note that the inner surfaces 14b1 and 14c1 can also be simply referred to as surfaces. The layer of light absorbing material may be provided on a surface of the base 11 facing the end cap 13.
Note that in the present modification, the surface 11b3 of the base 11 and a bottom surface 14b2 of the holder 14D are in contact with each other. The end cap 13 is attached to the base 11 as an example, but is not limited to this example, and the end cap 13 may be attached to the holder 14D and the gap g may be provided between the end cap 13 and the base 11.
Note that the end cap 13 may be attached to the holder 14E at a plurality of positions, and the gap g may be provided between the end cap 13 and the base 11.
As illustrated in
As illustrated in
The optical fiber 20 is an output optical fiber, and is fixed to the base 31 via the support 10 of the first embodiment or the modification thereof.
The support 10 may be configured integrally with the base 31 as a part of the base 31, or the support 10 configured as a separate part from the base 31 may be attached to the base 31 via a fixture such as a screw, for example.
The base 31 is made of a material having high thermal conductivity, such as a copper-based material or an aluminum-based material, for example. The base 31 is covered with a cover (not illustrated). The optical fiber 20, the light emitting unit 32, the light combining unit 33, and the support 10 are housed and sealed in a housing chamber formed between the base 31 and the cover.
The light emitting unit 32 is, as an example, a chip-on sub-mount. The light emitting units 32 each include a sub-mount 32a and a light emitting element 32b mounted on the sub-mount 32a. The light emitting element 32b is, for example, a semiconductor laser chip. A plurality of the light emitting elements 32b outputs, for example, light of the same wavelength (single wavelength).
As illustrated in
The collimator lens 33a collimates light in the Z direction (fast axis direction), and the collimator lens 33b collimates light in the X2 direction (slow axis direction). The collimator lens 33a is, for example, attached to the sub-mount 32a and integrated with the light emitting unit 32. The collimator lens 33b is placed on the stepped surface 31c on which the corresponding light emitting unit 32 is mounted.
The mirror 33c directs the light from the collimator lens 33b toward the combiner 33e. The mirror 33c is placed on the stepped surface 31c on which the corresponding light emitting unit 32 and collimator lens 33b are mounted. In other words, the light emitting unit 32, the collimator lens 33b through which light from the light emitting element 32b of the light emitting unit 32 passes, and the mirror 33c that reflects light from the collimator lens 33b are mounted on the same stepped surface 31c. In other words, in each of the arrays A1 and A2, the light emitting unit 32, the collimator lens 33b, and the mirror 33c which are aligned in the Y direction are mounted on the same stepped surface 31c. Note that the position of the stepped surface 31c in the Z direction and the size of the mirror 33c in the Z direction are set so as not to interfere with light from another mirror 33c. The light emitting unit 32, the collimator lens 33b, and the mirror 33c which are mounted on the stepped surface 31c may be simply hereinafter referred to as mounted components. The light emitting unit 32, the collimator lens 33b, and the mirror 33c may not be mounted on the same stepped surface (plane).
The combiner 33e combines the light from the two arrays A1 and A2 and outputs the combined light toward the condenser lens 33f. The light from the array A1 is input to the combiner 33e via the mirror 33d and a half-wave plate 33e1, and the light from the array A2 is directly input to the combiner 33e. The half-wave plate 33e1 rotates the polarization plane of the light from the array A1. The combiner 33e can also be referred to as a polarization combining element.
The condenser lens 33f condenses light in the Z direction (fast axis direction). The condenser lens 33g condenses the light from the condenser lens 33f in the Y direction (slow axis direction) and optically couples the light to the end portion of the optical fiber 20. Note that the condenser lens 33g may be provided on the support 10 or may be provided on the base 31. The condenser lens 33f may be provided on the support 10.
The effect of the above first embodiment is also obtained in the light emitting device 30A of the present embodiment.
While the embodiments of the disclosure have been exemplified above, the embodiments described above have been presented by way of example only, and are not intended to limit the scope of the inventions. The embodiments described above may be practiced in a variety of other forms, and various omissions, substitutions, combinations, and changes may be made to an extent without departing from the spirit of the inventions. The specifications (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, and others) of each configuration, shape, and others may be appropriately changed.
The disclosure can be used in an optical fiber support structure and a semiconductor laser module.
According to the disclosure, it is possible to obtain an optical fiber support structure and a semiconductor laser module having an improved and novel configuration with fewer inconveniences.
Although the disclosure has been described with respect to specific embodiments for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth.
Number | Date | Country | Kind |
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2020-139502 | Aug 2020 | JP | national |
This application is a continuation of International Application No. PCT/JP2021/030444, filed on Aug. 19, 2021 which claims the benefit of priority of the prior Japanese Patent Application No. 2020-139502, filed on Aug. 20, 2020, the entire contents of which are incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP2021/030444 | Aug 2021 | WO |
Child | 18166691 | US |