This invention relates generally to optical interconnects.
Current optical fiber connector and breakout/fanout technologies limit applications because the connectors are heavy, large, and costly. Some of these conventional optical interconnects systems are too susceptible to contamination, as from dirt, dust, and cooling fluids. Still other connector devices are too sensitive to small misalignments or temperature fluctuations.
There is a need for optical connectors that are small and potentially inexpensive. There is also a need for optical connectors that are less susceptible to contamination and for optical connectors that are less sensitive to small misalignments or temperature fluctuations.
In one embodiment, the system of these teachings includes an array of optical fibers, an end portion of the array being arranged such that each optical fiber from the array substantially contacts at least two other optical fibers from the array and an optical subsystem having a first end and a second end, the end portion of the array being operatively connected to the first end of the optical subsystem. Each optical fiber in the end section is capable of emitting electromagnetic radiation and the optical subsystem is capable of receiving the electromagnetic radiation emitted by each fiber and forming an image substantially at infinity (the optical subsystem being hereinafter referred to as an infinite conjugate optical subsystem or as substantially collimating the electromagnetic radiation emission from each optical fiber).
In another embodiment of the system of these teachings, the embodiment includes another (a second) optical subsystem having a first end and a second end, a first end of the second optical subsystem being optically positioned to receive electromagnetic radiation from the second end of the first optical subsystem, and also includes another array of optical fibers, an end portion of the other array being arranged such that each optical fiber from the other array substantially contacts at least two other optical fibers from the other array, the end portion of the other array being operatively connected to the second end of the second optical subsystem. Each optical fiber in the second array of optical fibers is optically disposed such that each optical fiber from the second array of optical fibers is capable of receiving electromagnetic radiation from the second end of the second optical subsystem. The end portion of the first array of optical fibers, the first optical subsystem, the second optical subsystem, and the end portion of the second array of optical fibers are optically disposed such that electromagnetic radiation emanating from one optical fiber from the end portion of the first array is imaged onto another optical fiber from the end portion of the second array.
Other embodiments of the system of these teachings are also disclosed as well as methods for manufacturing the system of these teachings.
For a better understanding of the present teachings, together with other and further objects thereof, reference is made to the accompanying drawings and detailed description and its scope will be pointed out in the appended claims.
Some embodiments of the present teachings are described in
The Ultra-Dense Alignment Tolerant (UDAT) fiber optic connector embodiment is illustrated in
Some of the embodiments of the system of these teachings that are shown herein below are related to the alignment tolerant infinite conjugate imaging system disclosed in U.S. patent application Ser. Nos. 11/385,449, 10/675,873, and 09/425,551 Embodiments are described in
Referring to
In many configurations this imaging is effectively telecentric, which gives rise to very efficient fiber coupling for fibers distributed across the face.
In
Referring to
Each fiber 55 has a core diameter of 100 μm, and an outside cladding/coating diameter of 172 μm. The tolerance of the outside diameter is 2 μm for unsorted fiber, opening the possibility of simple compression alignment of the bundle. An imaged spot can be blurred to a diameter of 244 microns before crosstalk is an issue.
An illustrative embodiment including a hexagonal packing configuration for the fiber array on the face of the rod lens is shown in
The UDAT connector embodiment is further illustrated in
Referring to
The embodiment shown in
Referring to
It is conventionally thought that cylinders naturally pack into dense, hexagonal arrays. In addition to the 96-fiber array shown in
In embodiments of this system of these teachings, when using heat-shrink tubing, uniform pressure is exerted from the shrinking tube and the smaller the diameter of the packing geometry, the lower energy state it will represent. As a result, in some embodiments of systems of these teachings a circular hexagonal packing configuration, such as shown in
One explanation (not desiring to be bound by theory, these teachings are not limited only to any one explanation) for the preference of the hybrid circular-hexagonal packed geometry is illustrated in
Embodiments of this system of these teachings can be used with a broad range of fiber sizes and types. Some illustrative options are shown in
In one instance, the smaller fiber count UDAT connectors embodiments can be utilized for single mode fiber connectorization.
For example, but not limited to, a 7-fiber UDAT connector can be utilized with single mode fiber. The primary misalignment will likely be due to the variation in fiber core/cladding diameters. However, for the 7-fiber UDAT connector, the edge fiber positions will only be subject to a single fiber-pair cascade in diameter variations. Consider typical single mode fiber cases such as the conventional F-SMF-28 optical fiber. The conventional F-SMF-28 optical fiber has a mode field of 9.3+/−0.5 microns, with a cladding diameter of 125+/−1.0 microns. A simple pre-selection process may refuse this variation by half or more. Acceptable coupling efficiencies may be obtained with UDAT connector embodiments coupling single mode fibers in embodiments of UDAT fiber arrays.
One embodiment of the method of these teachings for high-fiber-number UDAT connector fabrication is to first manufacture ultra-stable and repeatable subarrays of fibers, such as with the 7 and 19 fiber UDAT arrays, and then to arrange these subarrays themselves in stable “superarray” formations. This embodiment is illustrated in
Similarly, in another embodiment, 19 of these 7-fiber subarrays can form a stable, oriented 133-fiber UDAT array. The same overall fiber number can be obtained by 7 subarrays, each containing 19 fibers (See
Another method of these teachings for improving the performance of the UDAT connectors of these teachings includes the formation of UDAT fiber arrays with stripped coatings. This technique produces arrays of fibers pressed cladding-to-cladding (with no coatings), and several distinct benefits are obtained. First, still higher densities can be obtained since wasted coating space is eliminated. Further, higher coupling efficiencies are expected since positional errors should decrease—this is due to the fact that the variations in coating thickness will no longer add to the positional errors of each fiber center from its ideal lattice point.
Another embodiment of the system of these teachings includes UDAT fiber connector, as shown in
A further use on the FABI embodiment is in direct fiber-to-circuit board connectors. The UDAT embodiment can be used to bring the optical signals directly from fiber cables to circuit board interfaces, or alternatively, from dense UDAT connectors in the chassis box to FABI connectors on the circuit boards. These embodiments of the FABI Connectors of these teachings contain an integrated high-density surface optoelectronic module that converts the 96 or more signals from a single UDAT connector to on-board signals, all with the tiny footprint of a few millimeters across.
In this embodiment, the UDAT connector (right) is inserted into the Enclosure through a port in the wall. Each of the fibers creates a plane wave at differing angles, and these are all imaged onto a dense hexagonally packed detector array in the BB-ODP module (left). Here signals from a hundred fibers are converted to electrical signals on the circuit board through solder bumps in a footprint of only a few millimeters square. The standard off-the-shelf alignment tolerances for boards in a card cage are more than sufficient for the interconnection shown (displacements on the order of millimeters are readily tolerated).
By combining the UDAT connector technology for footprint reduction on the outside of an enclosure, coupled with the FABI technology linking the UDAT to the circuit board with another gain in footprint reduction is obtained
In another embodiment, of the UDAT connector of these teachings is utilized in a variety of fanout and breakout configurations. For example, the UDAT embodiment can be utilized in signal breakout and fanout configurations as illustrated in
A series of raytrace analyses of the UDAT connector concept was performed using the ZEMAX optical design software. One such real ray trace is shown in
In the UDAT connector of these teachings the gap region between the two lenses will be small, providing an essentially telecentric imaging condition for the connector. This will minimize coupling efficiency degradation toward the edges of the optical fiber arrays.
If the fiber arrays are located on a surface of the infinite conjugate gradient index rod lens, the array will be telecentric for very small lens separations. Offsetting the fiber arrays from the end surface slightly can accommodate larger lens separations. The telecentric condition is useful for maintaining large coupling efficiency at the edges of the fiber array, since the bundle of rays will be centered on the acceptance angle of the fiber.
Real rays are drawn for fiber locations on axis and at heights of 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, and 0.9 mm. The telecentricity is important for maintaining a large coupling efficiency.
The spot sizes were optimized at a partial field height in order to increase the area over which the spot sizes remain small. The largest excursion radius of any ray in this set is 18.9 microns at an object height of 0.9 mm.
Heat shrink polymer tubes (it should be noted that other his shrinkable materials are within the scope of this teachings) used in embodiments of the system of these teachings are commercially available and described in available commercial literature. The term heat-shrinkable jacket or tubing is intended to include tubing, jackets, tapes, wraps or coatings comprising heat-shrinkable materials that may be wrapped around the desired portion of the optical fiber cable. The first step in making a heat shrink polymer tube is to start with a thermoplastic material that is extruded into tubes. Crystalline bonds that are readily broken down by heating hold the thermoplastic tubes together.
The second step is to add a cross-linked superstructure throughout the polymer tube material. This cross-linked superstructure transforms the tube into a thermoset material, and the tubes will no longer melt when heated.
The third step in making the heat-shrink polymer material is to heat and expand the tube. In this process the crystalline bonds are broken and the cross-linked superstructure is stretched, like a wire-mesh cage, to two or three times the former tube diameter.
The fourth step is to rapidly cool the stretched cross-linked tube. This allows the crystalline bonds to re-form, locking the stretched tube into its expanded form with the potential contractile energy stored in the “frozen” tube system.
Finally, to complete the heat-shrink polymer tube cycle, the polymer tube is placed over the items to enclose and it is heated again. This final heating melts the crystalline bonds that are temporarily holding the stretched tube in its expanded condition, and the tube now relaxes and tries to recover its original diameter. This compresses the encapsulated material, and relaxes stresses stored in the polymer. Upon cooling, the crosslinked structure is further strengthened by re-formed crystalline bonds.
This type of material process is utilized for the UDAT Connector dense fiber array assembly and manufacture.
The types of polymers readily used in this process include many materials such as polyolefin, neoprene, Teflon, and Kynar.
In order to further illustrate the system of these teachings, exemplary results from sample embodiments are shown herein below. The first set of results presented relate to fiber coupling efficiency relative to a standard FC-FC connector as a function of fiber position in a UDAT fiber array of these teachings. In this measurement, first the two FC fiber connectors were coupled with a standard FC-FC (butt-) coupler, and the power transmitted through both fibers and the standard coupler was referenced as the 0 dB level. Then the input fiber was aligned on the rear edge of the first (right) rod lens, and coupled via the infinite conjugate imaging system to the receive fiber located near the front edge of the second (left) rod lens. The power transmitted through the two fibers and UDAT connector feasibility prototype was then read relative to the reference (See
This procedure was repeated over a second scan across the face of the rod lens, with a slight displacement from the first scan. Both curves are shown together in
The above figures indicate that a large coupling efficiency is obtained with the fibers in the center of the rod lenses and that efficiency was maintained across nearly half of the width of the lens face. This implies that UDAT fiber arrays spanning half of the width of the rod lens face should all exhibit relatively high coupling efficiencies. As described earlier, this result corresponds to high overall UDAT fiber connector densities.
A second set of measurements using the UDAT prototype alignment testbed provides understanding of expected misalignment sensitivities in the UDAT connector. In this measurement, the receive fiber position was held fixed, and the position of the transmit fiber was swept while monitoring coupled power. The power coupled through the UDAT connector is graphed in
Referring to
The receive fiber displacements represent the tolerance for effects of varying fiber diameters in the UDAT fiber array. Since not all fibers have exactly identical diameters, the positions of the fibers in the UDAT fiber arrays vary slightly from the ideal.
This data of
A still further series of measurements, using a UDAT prototype alignment testbed, of expected crosstalk levels in the UDAT connector were performed. In the measurements shown in
Referring to
An embodiment UDAT Connector of these teachings applied to the enclosure applications as illustrated in
Referring to
Referring to
This fanout capability was discussed in hereinabove, and is illustrated in
The UDAT connector technology is readily expandable to more complicated breakout and fanout geometries as shown in
Although the invention has been described with respect to various embodiments, it should be realized this invention is also capable of a wide variety of further and other embodiments within the within the spirit and scope of the appended claims.
This application is a divisional of co-pending U.S. patent application Ser. No. 11/777,170 filed Jul. 12, 2007 and entitled OPTICAL INTERCONNECT AND CONNECTOR DEVICES, which in turn claims priority of U.S. Provisional Application Ser. No. 60/830,294 entitled OPTICAL INTERCONNECT AND CONNECTOR DEVICES filed Jul. 12, 2006, both of which are incorporated by reference herein in their entirety for all purposes.
This invention was made with U.S. Government support from the United States Air force under Contract FA8650-04-C-3414. The U.S. Government has certain rights in the invention.
Number | Name | Date | Kind |
---|---|---|---|
3937557 | Milton | Feb 1976 | A |
4148550 | MacAnally | Apr 1979 | A |
4168882 | Hopkins | Sep 1979 | A |
4213677 | Sugimoto et al. | Jul 1980 | A |
4456329 | Henderson et al. | Jun 1984 | A |
4498730 | Tanaka et al. | Feb 1985 | A |
4612670 | Henderson | Sep 1986 | A |
4730891 | Poorman | Mar 1988 | A |
5016963 | Pan | May 1991 | A |
5050954 | Gardner et al. | Sep 1991 | A |
5071216 | Sullivan | Dec 1991 | A |
5093879 | Bregman et al. | Mar 1992 | A |
5117473 | Pan | May 1992 | A |
5245680 | Sauter | Sep 1993 | A |
5266794 | Olbright et al. | Nov 1993 | A |
5291324 | Hinterlong | Mar 1994 | A |
5384874 | Hirai et al. | Jan 1995 | A |
5612824 | Si et al. | Mar 1997 | A |
5666448 | Schoenwald et al. | Sep 1997 | A |
6044187 | Duck et al. | Mar 2000 | A |
6122042 | Wunderman et al. | Sep 2000 | A |
6222970 | Wach et al. | Apr 2001 | B1 |
6236787 | Laughlin | May 2001 | B1 |
6253004 | Lee et al. | Jun 2001 | B1 |
6253007 | Laughlin | Jun 2001 | B1 |
6546169 | Lin et al. | Apr 2003 | B1 |
6704147 | Fukuzawa et al. | Mar 2004 | B2 |
7015454 | Stone | Mar 2006 | B2 |
7224864 | Burkhard et al. | May 2007 | B2 |
7228033 | Bhagavatula et al. | Jun 2007 | B2 |
7236671 | Rasmussen | Jun 2007 | B2 |
7492998 | Miller et al. | Feb 2009 | B2 |
7660502 | Stone | Feb 2010 | B1 |
20020076163 | Murali et al. | Jun 2002 | A1 |
20020118908 | Conde et al. | Aug 2002 | A1 |
20030081906 | Filhaber et al. | May 2003 | A1 |
20030103725 | Li | Jun 2003 | A1 |
20040208443 | Burkhard et al. | Oct 2004 | A1 |
20060045444 | Miller et al. | Mar 2006 | A1 |
20060067614 | Wang | Mar 2006 | A1 |
20130302032 | Shimakawa | Nov 2013 | A1 |
Entry |
---|
Kenjiro Hamanaka “Optical Bus Interconnection System Using Selfoc Lenses”, Optics Letters vol. 16, No. 16; 1222-1224, Aug. 15, 1991. |
Hugo Thienpont, et al. “Free Space Optical Interconnect and Processing Demonstrators With Arrays of Light-Emitting Thyristors”, Proceedings of the SPIE, vol. 3002, 156-167, Conference date Feb. 13-14, 1997 [probably published several months later]. |
Andrew Kirk, et al. “Compact Optical Imaging System for Arrays of Optical Thyristors”, Applied Optics 36, No. 14, 3070-3078, May 10, 1997. |
V. Baukens, et al. “An Optical Interconnection System for Arrays of MicroEmitters and Detectors: Combining Printed Microlenses and Large Diameter GRINs”, Proceedings of the SPIE, vol. 3490, 155-158, Conference date (Belgium) Jun. 17-20, 1998. |
Tomasz Maj, et al. “Interconnection of a Two-Dimensional Array of Vertical-Cavity Surface-Emitting Lasers to a Receiver Array by Means of a Fiber Image Guide”, Applied Optics vol. 39, No. 5, 683-689, Feb. 10, 2000. |
Donald M. Chiarulli, et al. “Demonstration of a Multichannel Optical Interconnection by Use of Imaging Fiber Bundles Butt Coupled to Optoelectronic Circuits”, Applied Optics vol. 39, No. 5, 698-703, Feb. 10, 2000. |
Donald M. Chiarulli, et al. “Optoelectronic Multi-Chip Modules Based on Imaging Fiber Bundle Structures”, Proceedings of the SPIE, vol. 4089, 80-85, Conference date Jun. 18-23, 2000. |
Valerie Baukens, et al. “Free Space Optical Interconnection Modules for 2-D Photonic-VLSI Circuitry Based on Microlenses and GRINs”, Proceedings of the SPIE, vol. 4114, 169-181, Conference date Aug. 2-3, 2000. |
Mohammad R. Taghizadeh, et al. “Microoptical Elements and Optoelectronic Devices for Optical Interconnect Applications”, Proceedings of the SPIE, vol. 4455, 119-130, Conference date Jul. 29-31, 2001. |
Number | Date | Country | |
---|---|---|---|
60830294 | Jul 2006 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11777170 | Jul 2007 | US |
Child | 12701653 | US |