Claims
- 1. An optical module for optical transmission comprising:
a substrate with an optical waveguide; and an optical device located opposite to a section of the optical waveguide, wherein said optical device is secured by a solder bump on a solder joint pad, said solder joint pad being formed on non-solder jointing metallization formed on the substrate.
- 2. The optical module as set forth in claim 1, wherein said optical device comprises a solder joint pad for joining the solder bump.
- 3. The optical module as set forth in claim 1, wherein said solder joint pads on the substrate and the optical device are constituted by a plurality of elongated pads including pads parallel to the optical waveguide with their longitudinal side and those perpendicular to the optical waveguide with their longitudinal side, respectively.
- 4. The optical module as set forth in claim 1, wherein the non-solder jointing metallization is formed by WSi.
- 5. The optical module as set forth in claim 1, wherein said solder joint pads contains either one of Au or Pt.
- 6. The optical module as set forth in claim 1, wherein the solder bump is AuSn alloy.
- 7. A process for manufacturing an optical module comprising:
forming non-solder jointing metallization on a substrate; forming an optical waveguide on the substrate after said non-solder jointing metallization is formed; removing a portion of said optical waveguide; forming a solder joint pad on said non-solder jointing metallization; and installing an optical device on said solder joint pad through a solder bump.
- 8. The process for manufacturing an optical module as set forth in claim 7, wherein the step of removing a part of the optical waveguide comprises the step of forming an end surface of the optical waveguide by removing a part of the optical waveguide.
- 9. The process for manufacturing an optical module as set forth in claim 8, wherein the solder joint pad formed on the non-solder jointing metallization is formed at a location opposite to the end surface of the optical waveguide.
- 10. The process for manufacturing an optical module as set forth in claim 7, further comprising the step of forming a solder joint pad on an optical device.
- 11. The process for manufacturing an optical module as set forth in claim 7, wherein the step of installing an optical device on the solder joint pad through a solder bump comprises the steps of jointing a solder piece on the solder joint pad through thermocompression bonding, placing the optical device so that the solder joint pad of the optical device is positioned on said solder piece, and melting said solder bump.
- 12. The process for manufacturing an optical module as set forth in claim 11, wherein, in the thermocompression step, a solder alloy sheet is stamped out by a punch and die, the solder piece being on the solder joint pad of the substrate as it is.
- 13. The process for manufacturing an optical module as set forth in claim 11, wherein melting of the solder bump is performed in one or more gasses selected from nitrogen, hydrogen, and inert gas.
- 14. The process for manufacturing an optical module as set forth in claim 7, further comprising the steps of forming a groove in the substrate, and installing fiber optics in said groove.
- 15. The process for manufacturing an optical module as set forth in claim 14, further comprising the steps of forming an oxide film on the substrate, and removing the oxide film on a region on the substrate where the groove is formed.
Priority Claims (1)
Number |
Date |
Country |
Kind |
128399/1997 |
May 1997 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation of U.S. patent application Ser. No. 09/081,322, filed May 19, 1998 in the name of Junichi Sasaki et al. and entitled “OPTICAL MODULE FOR OPTICAL TRANSMISSION AND MANUFACTURING PROCESS THEREFOR.”
Continuations (1)
|
Number |
Date |
Country |
Parent |
09081322 |
May 1998 |
US |
Child |
09885518 |
Jun 2001 |
US |