Patent Application
20250112702
This application relates to the field of optical communication, and in particular, to an optical module, a related apparatus, and an assembly method.
With continuous development of communication technologies, a capacity of information transmitted in communication is increasingly large, and an optical communication system can effectively increase the capacity of transmitted information. The optical communication system includes a network device and an optical module connected to the network device. The optical module is further connected to an optical cable. A receiver optical subassembly included in the optical module is configured to perform optical-to-electrical conversion on an optical signal from the optical cable, to send a converted electrical signal to the network device. A transmitter optical subassembly included in the optical module is configured to perform electrical-to-optical conversion on an electrical signal from the network device, to send a converted optical signal to the optical cable.
The optical module includes a printed circuit board assembly (PCBA). The PCBA may include an optical digital signal processor (ODSP) configured to perform electrical signal processing, a driver (DRV), a transimpedance amplifier (TIA), a microcontroller unit (MCU), and the like. The transmitter optical subassembly and the receiver optical subassembly included in the optical module are packaged on the PCBA through chip-on-board (COB) packaging.
However, the transmitter optical subassembly and the receiver optical subassembly are directly packaged on the PCBA, resulting in a fixed structure between the transmitter optical subassembly and the PCBA and between the receiver optical subassembly and the PCBA. In this case, the transmitter optical subassembly and the receiver optical subassembly cannot be flexibly combined with the PCBA, and a structure of the optical module is limited. In addition, with a requirement for an increased quantity of channels supported by the optical module, the transmitter optical subassembly and the receiver optical subassembly cannot match an optical module with an increased quantity of channels.
Embodiments of the present invention provide an optical module, a related apparatus, and an assembly method, to implement flexible combination of structures in an optical module, and effectively ensure that a transmitter optical subassembly and a receiver optical subassembly can match an optical module with an increased quantity of channels.
According to a first aspect of embodiments of the present invention, an optical module is provided. The optical module includes a first circuit board, a second circuit board, and a connection board. The first circuit board includes a transmitter optical subassembly and a receiver optical subassembly. The second circuit board includes a processing unit. The first circuit board further includes a first connection port. The second circuit board further includes a second connection port. The transmitter optical subassembly and the receiver optical subassembly are separately connected to the first connection port. The processing unit is connected to the second connection port. The first circuit board and the second circuit board are fastened to the connection board. The connection board is configured to align the first connection port with the second connection port. The first connection port and the second connection port are connected by using leads.
According to the optical module shown in this aspect, the first connection port is aligned with the second connection port by using the connection board. This ensures a successful connection between the first connection port and the second connection port by using the leads, and reduces a thread length of the lead connected between the first connection port and the second connection port. A reduction in the thread length reduces attenuation of an electrical signal transmitted between the first connection port and the second connection port, improves signal quality of the electrical signal, improves transmission efficiency of the transmitted electrical signal, and effectively ensures that the transmitter optical subassembly and the receiver optical subassembly can match an optical module with an increased quantity of channels.
Based on the first aspect, in an optional implementation, that the connection board is configured to align the first connection port with the second connection port includes: The first connection port includes a first high-speed interface, the second connection port includes a second high-speed interface, the first high-speed interface is any high-speed interface included in the first connection port, the second high-speed interface is a high-speed interface included in the second connection port, and the connection board is configured to align the first high-speed interface with the second high-speed interface; and the first connection port includes a first low-speed interface, the second connection port includes a second low-speed interface, the first low-speed interface is any low-speed interface included in the first connection port, the second low-speed interface is a low-speed interface included in the second connection port, and the connection board is configured to align the first low-speed interface with the second low-speed interface.
According to the optical module shown in this implementation, the first high-speed interface is aligned with the second high-speed interface by using the connection board, and the first low-speed interface is aligned with the second low-speed interface by using the connection board. This ensures a successful connection between the first connection port and the second connection port by using a lead and connection efficiency, reduces a thread of the lead, and improves manufacturing efficiency of the optical module.
Based on the first aspect, in an optional implementation, the leads include a first lead and a second lead, and that the first connection port and the second connection port are connected by using leads includes: The first high-speed interface and the second high-speed interface are connected by using the first lead, and the first low-speed interface and the second low-speed interface are connected by using the second lead.
According to the optical module shown in this implementation, the aligned first high-speed interface and the aligned second high-speed interface are connected by using the first lead, and the aligned first low-speed interface and the aligned second low-speed interface are connected by using the second lead, to reduce threads of the first lead and the second lead.
Based on the first aspect, in an optional implementation, an electrical signal transmission rate supported by the first lead is greater than an electrical signal transmission rate supported by the second lead.
According to the optical module shown in this implementation, the first lead is different from the second lead, and attenuation of an electrical signal in the second lead is greater than attenuation of the electrical signal in the first lead. Therefore, a transmission rate of the electrical signal in the second lead is less than a transmission rate of the electrical signal in the first lead. The second lead is used for an electrical signal with a low transmission rate, and the second lead does not need to support transmission of a high-speed electrical signal at high costs. This effectively reduces costs of the second lead, and further reduces overall costs of the optical module.
Based on the first aspect, in an optional implementation, in the first connection port, the first low-speed interface is located between two adjacent first high-speed interfaces, and in the second connection port, the second low-speed interface is located between two adjacent second high-speed interfaces.
According to the optical module shown in this implementation, a rate of an electrical signal transmitted by the first high-speed interface is greater than a rate of an electrical signal transmitted by the first low-speed interface. Therefore, when the first low-speed interface is located between two adjacent first high-speed interfaces, the first low-speed interface can perform a block function to some extent, to reduce crosstalk between electrical signals respectively transmitted by the two first high-speed interfaces.
Based on the first aspect, in an optional implementation, the first high-speed interface includes a first pin and a second pin, the first pin is connected to the transmitter optical subassembly, and the second pin is grounded; the second high-speed interface includes a third pin and a fourth pin, the third pin is separately connected to the first pin and the processing unit, and the fourth pin is separately connected to the second pin and the processing unit; and the third pin is configured to receive a first electrical signal from the processing unit, and the fourth pin is configured to receive a second electrical signal from the processing unit, where the first electrical signal and the second electrical signal are a pair of differential electrical signals.
According to the optical module shown in this implementation, when the second circuit board outputs a pair of differential electrical signals, the transmitter optical subassembly that supports only single-ended driving can further perform electrical-to-optical conversion on an electrical signal from the processing unit, to emit a service optical signal. There is no need to match a different second circuit board for the transmitter optical subassembly that supports single-ended driving, to ensure flexible matching between the first circuit board and the second circuit board.
Based on the first aspect, in an optional implementation, the first high-speed interface includes a fifth pin and a sixth pin, and both the fifth pin and the sixth pin are connected to the transmitter optical subassembly; the second high-speed interface includes a seventh pin and an eighth pin, the seventh pin is separately connected to the fifth pin and the processing unit, and the eighth pin is separately connected to the sixth pin and the processing unit; and the seventh pin is configured to receive a third electrical signal from the processing unit, and the eighth pin is configured to receive a fourth electrical signal from the processing unit, where the third electrical signal and the fourth electrical signal are a pair of differential electrical signals.
According to the optical module shown in this implementation, the transmitter optical subassembly is driven by using a differential electrical signal, and the transmitter optical subassembly can support transmission of an optical signal at a higher rate when a comparison with a manner of driving the transmitter optical subassembly by using a single-ended electrical signal is made.
Based on the first aspect, in an optional implementation, a board material of the first circuit board is different from a board material of the second circuit board, and an electrical signal transmission rate supported by the first circuit board is less than an electrical signal transmission rate supported by the second circuit board.
According to the optical module shown in this implementation, the electrical signal transmission rate supported by the first circuit board is less than the electrical signal transmission rate supported by the second circuit board. A board material that supports high-rate transmission of an electrical signal does not need to be used for the first board material of the first circuit board. This effectively reduces costs of the first circuit board, and further reduces overall manufacturing costs of the optical module.
Based on the first aspect, in an optional implementation, that the first circuit board and the second circuit board are fastened to the connection board includes: Two sides of a same surface of the connection board respectively include a first region and a second region, the first region includes a first positioning member, the first positioning member is configured to fasten the first circuit board to the first region, the second region includes a second positioning member, and the second positioning member is configured to fasten the second circuit board to the second region.
According to the optical module shown in this implementation, precise alignment between the first connection port and the second connection port can be implemented, a thread of the lead that connects the first connection port and the second connection port is effectively reduced, and connection accuracy and efficiency are improved.
Based on the first aspect, in an optional implementation, the first circuit board includes a first daughter board and a second daughter board, the first connection port includes a first connection subport and a second connection subport, the first daughter board includes the transmitter optical subassembly and the first connection subport, the second daughter board includes the receiver optical subassembly and the second connection subport, the transmitter optical subassembly is connected to the first connection subport, and the receiver optical subassembly is connected to the second connection subport; the connection board is configured to align the first connection subport with the second connection port, and the connection board is further configured to align the second connection subport with the second connection port; and the first connection subport is connected to the second connection port by using a lead, and the second connection subport is connected to the second connection port by using a lead.
According to the optical module shown in this implementation, the first daughter board and the second daughter board can be separately processed, to further reduce a manufacturing process of the optical module. In addition, a procedure such as a test can be separately performed on the first daughter board and the second daughter board, to ensure that both the first daughter board and the second daughter board are good products that can work independently and normally. This effectively increases a product yield rate of the optical module.
Based on the first aspect, in an optional implementation, the first circuit board further includes a driver and/or an amplifier, the driver is separately connected to the transmitter optical subassembly and the first connection port, and the amplifier is separately connected to the receiver optical subassembly and the first connection port.
According to the optical module shown in this implementation, when the first circuit board further includes a driver and/or an amplifier, power of an electrical signal transmitted by the first circuit board is high, and signal quality is good. This reduces an area and costs of the second circuit board.
Based on the first aspect, in an optional implementation, the transmitter optical subassembly and the first connection port are separately connected to the driver by using a first electric-conductor, and an electrical signal transmission rate supported by the first electric-conductor is greater than the electrical signal transmission rate supported by the first circuit board; and the receiver optical subassembly and the first connection port are separately connected to the amplifier by using a second electric-conductor, and an electrical signal transmission rate supported by the second electric-conductor is greater than the electrical signal transmission rate supported by the first circuit board.
According to the optical module shown in this implementation, an electrical signal transmitted by the driver or the amplifier is a high-speed electrical signal. To reduce costs of the first circuit board, a transmission path of the service electrical signal transmitted by the driver or the amplifier does not need to pass through a trace of the first circuit board, and an electric-conductor is separately disposed independent of the trace of the first circuit board. Therefore, the optical module may use a first circuit board that supports a low electrical signal transmission rate, to reduce costs of the first circuit board.
According to a second aspect of embodiments of the present invention, an optical-to-electrical conversion module is provided. The optical-to-electrical conversion module includes a first circuit board. The first circuit board includes a transmitter optical subassembly and a receiver optical subassembly. The first circuit board further includes a first connection port. The transmitter optical subassembly and the receiver optical subassembly are separately connected to the first connection port. The first circuit board is configured to be fastened to a connection board. The connection board is further configured to fasten a second circuit board. The first connection port is aligned with a second connection port included in the second circuit board by using the connection board. The first connection port and the second connection port are connected by using leads. For descriptions of beneficial effects of this aspect, refer to the first aspect. Details are not described.
Based on the second aspect, in an optional implementation, the first connection port includes a first high-speed interface, the first high-speed interface is any high-speed interface included in the first connection port, and the first high-speed interface is aligned with a second high-speed interface included in the second connection port by using the connection board; and the first connection port includes a first low-speed interface, the first low-speed interface is any low-speed interface included in the first connection port, and the first low-speed interface is aligned with a second low-speed interface included in the second connection port by using the connection board.
Based on the second aspect, in an optional implementation, the first high-speed interface and the second high-speed interface are connected by using the first lead, and the first low-speed interface and the second low-speed interface are connected by using the second lead.
Based on the second aspect, in an optional implementation, an electrical signal transmission rate supported by the first lead is greater than an electrical signal transmission rate supported by the second lead.
Based on the second aspect, in an optional implementation, in the first connection port, the first low-speed interface is located between two adjacent first high-speed interfaces.
Based on the second aspect, in an optional implementation, the first high-speed interface includes a first pin and a second pin, the first pin is connected to the transmitter optical subassembly, and the second pin is grounded; and the first pin is configured to receive a first electrical signal from the second high-speed interface, and the second pin is configured to receive a second electrical signal from the second high-speed interface, where the first electrical signal and the second electrical signal are a pair of differential electrical signals.
Based on the second aspect, in an optional implementation, the first circuit board includes a first daughter board and a second daughter board, the first connection port includes a first connection subport and a second connection subport, the first daughter board includes the transmitter optical subassembly and the first connection subport, the second daughter board includes the receiver optical subassembly and the second connection subport, the transmitter optical subassembly is connected to the first connection subport, and the receiver optical subassembly is connected to the second connection subport; the first connection subport is aligned with the second connection port by using the connection board, and the second connection subport is aligned with the second connection port by using the connection board; and the first connection subport is connected to the second connection port by using a lead, and the second connection subport is connected to the second connection port by using a lead.
Based on the second aspect, in an optional implementation, the first circuit board further includes a driver and/or an amplifier, the driver is separately connected to the transmitter optical subassembly and the first connection port, and the amplifier is separately connected to the receiver optical subassembly and the first connection port.
Based on the second aspect, in an optional implementation, the transmitter optical subassembly and the first connection port are separately connected to the driver by using a first electric-conductor, and an electrical signal transmission rate supported by the first electric-conductor is greater than an electrical signal transmission rate supported by the first circuit board; and the receiver optical subassembly and the first connection port are separately connected to the amplifier by using a second electric-conductor, and an electrical signal transmission rate supported by the second electric-conductor is greater than the electrical signal transmission rate supported by the first circuit board.
According to a third aspect of embodiments of the present invention, an electrical processing module is provided. The electrical processing module includes a second circuit board. The second circuit board includes a processing unit. The second circuit board further includes a second connection port. The processing unit is connected to the second connection port. The second circuit board is configured to be fastened to a connection board. The connection board is further configured to fasten a first circuit board. The second connection port is aligned with a first connection port included in the first circuit board by using the connection board. The first connection port and the second connection port are connected by using leads. For descriptions of beneficial effects of this aspect, refer to the first aspect. Details are not described.
Based on the third aspect, in an optional implementation, the second connection port includes a second high-speed interface, the second high-speed interface is a high-speed interface included in the second connection port, and the second high-speed interface is aligned with a first high-speed interface included in the first connection port by using the connection board; and the second connection port includes a second low-speed interface, the second low-speed interface is a low-speed interface included in the second connection port, and the second low-speed interface is aligned with a first low-speed interface included in the first connection port by using the connection board.
Based on the third aspect, in an optional implementation, the first high-speed interface and the second high-speed interface are connected by using the first lead, and the first low-speed interface and the second low-speed interface are connected by using the second lead.
Based on the third aspect, in an optional implementation, an electrical signal transmission rate supported by the first lead is greater than an electrical signal transmission rate supported by the second lead.
Based on the third aspect, in an optional implementation, in the second connection port, the second low-speed interface is located between two adjacent second high-speed interfaces.
According to a fourth aspect of embodiments of the present invention, an assembly method is provided. The assembly method is used to assemble an optical module. The optical module includes a first circuit board, a second circuit board, and a connection board. The method includes: fastening the first circuit board to the connection board; fastening the second circuit board to the connection board, where a first connection port of the first circuit board is aligned with a second connection port of the second circuit board by using the connection board; and connecting the first connection port and the second connection port by using leads. For descriptions of beneficial effects of this aspect, refer to the first aspect. Details are not described.
Based on the fourth aspect, in an optional implementation, the connecting the first connection port and the second connection port by using leads includes: connecting a first high-speed interface of the first connection port and a second high-speed interface of the second connection port by using a first lead, where the first high-speed interface is any high-speed interface included in the first connection port, the second high-speed interface is a high-speed interface included in the second connection port, and the first high-speed interface is aligned with the second high-speed interface by using the connection board; and connecting a first low-speed interface of the first connection port and a second low-speed interface of the second connection port by using a second lead, where the first low-speed interface is any low-speed interface included in the first connection port, the second low-speed interface is a low-speed interface included in the second connection port, and the first low-speed interface is aligned with the second low-speed interface by using the connection board.
Based on the fourth aspect, in an optional implementation, two sides of a same surface of the connection board respectively include a first region and a second region, the first region includes a first positioning member, the second region includes a second positioning member, and the fastening the first circuit board to the connection board includes: fastening the first circuit board to the first region by using the first positioning member; and the fastening the second circuit board to the connection board includes: fastening the second circuit board to the second region by using the second positioning member.
According to a fifth aspect of embodiments of the present invention, an optical communication device is provided. The optical communication device includes a communication board. The optical communication device further includes at least one optical module connected to the communication board. The optical module is shown in any one of the first aspect and the implementations of the first aspect.
The following clearly describes the technical solutions in embodiments of the present invention with reference to the accompanying drawings in embodiments of the present invention. It is clear that the described embodiments are merely some rather than all of embodiments of the present invention. All other embodiments obtained by persons skilled in the art based on embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
A structure of an optical communication system to which this application is applied is first described with reference to
The optical communication system 100 shown in this embodiment may be a passive optical network (PON). In this case, the convergence device 101 is an optical line terminal (OLT), and the terminal device 102 is an optical network unit (ONU). The convergence device 101 shown in this embodiment may be directly connected to each terminal device 102, or the convergence device 101 is connected to each terminal device 102 through a point-to-multipoint optical splitting device. Descriptions of a type of the optical communication system 100 in this embodiment are an optional example, and are not limited. For example, the optical communication system 100 may alternatively be an industrial optical network, a data center network, a wavelength division multiplexing network, or an optical transport network (OTN).
A structure of an optical communication device provided in an embodiment of this application is described with reference to
The optical communication device specifically includes a network device 201 and an optical module inserted into and fastened to a panel of the network device 201. The optical module shown in this embodiment may also be referred to as a high-speed pluggable optical module. In this embodiment, for example, two optical modules, namely, an optical module 203 and an optical module 204, are inserted into the panel of the network device 201. It should be noted that a quantity of optical modules inserted into the panel of the network device 201 is not limited in this embodiment. The optical module 203 is connected to a communication board 211 in the network device 201, and the optical module 204 is connected to a communication board 212 in the network device 201. It should be noted that a quantity of communication boards included in the network device 201 is not limited in this embodiment. A quantity of optical modules connected to each communication board included in the network device 201 is not limited in this embodiment.
For example, if the network device 201 is the convergence device shown in
Still refer to
A structure of an optical module provided in this application is described below by using an example with reference to
Specific structures of the optical-to-electrical conversion module 310 and the electrical processing module 320 are described with reference to
The first circuit board 311 includes a transmitter optical subassembly 312 and a receiver optical subassembly 313. The optical module 300 further includes an optical fiber connector 306. The optical fiber connector 306 is configured to connect an external optical cable 307 and an internal optical cable 308. The external optical cable 307 is located outside a housing of the optical module 300, and the internal optical cable 308 is located inside the housing of the optical module. For example, if the optical module 300 is connected to a convergence device, one end of the external optical cable 307 is connected to the optical fiber connector 306, and the other end is connected to a terminal device. For another example, if the optical module 300 is connected to a terminal device, one end of the external optical cable 307 is connected to the optical fiber connector 306, and the other end is connected to a convergence device. The internal optical cable 308 is separately connected to the transmitter optical subassembly 312 and the receiver optical subassembly 313. After receiving a service optical signal from the external optical cable 307, the optical fiber connector 306 sends the service optical signal to the receiver optical subassembly 313 through the internal optical cable 308. The receiver optical subassembly 313 performs optical-to-electrical conversion on the service optical signal, to obtain a service electrical signal. Alternatively, the transmitter optical subassembly 312 performs electrical-to-optical conversion on a service electrical signal from a communication board, to obtain a service optical signal, the internal optical cable 308 receives the service optical signal from the transmitter optical subassembly 312, and the internal optical cable 308 sends the service optical signal to the external optical cable 307 through the optical fiber connector 306. It should be noted that descriptions of a type of the optical fiber connector 306 in this embodiment are an optional example, and are not limited. A specific type of the optical fiber connector 306 shown in this embodiment may be any one of the following:
a multi-fiber push on (MPO) connector, a ferrule connector (FC), a square connector (SC), a lucent connector (LC), a straight tip (ST) connector, a fiber distributed data interface (IFDD) connector, or the like.
The second circuit board 321 of the electrical processing module 320 includes a processing unit 322. The processing unit 322 is separately connected to the transmitter optical subassembly 312 and the receiver optical subassembly 313. A form of the processing unit 322 is not limited in this embodiment. For example, the processing unit 322 may be one or more chips, or one or more integrated circuits. For example, the processing unit 322 may be one or more optical digital signal processors (ODSP), field programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), systems on chips (SoC), central processing units (CPU), network processors (NP), microcontroller units (MCU), programmable logic devices (PLD), other integrated chips, or any combination of the foregoing chips or processors. Details are not described.
The second circuit board 321 further includes an edge connector 323 connected to the processing unit 322. The edge connector 323 is connected to a communication board in an optical communication device, and receiving and sending of an electrical signal between the processing unit 322 and the communication board are implemented based on the edge connector 323.
For example, if the optical communication device is configured to emit a service optical signal, the communication board in the optical communication device sends a service electrical signal to the processing unit 322 through the edge connector 323. The processing unit 322 is connected to the transmitter optical subassembly 312. The processing unit 322 sends a processed service electrical signal to the transmitter optical subassembly 312. The transmitter optical subassembly 312 performs electrical-to-optical conversion on the service electrical signal, to output a service optical signal through the optical fiber connector 306. If the optical communication device is configured to receive a service optical signal, the receiver optical subassembly 313 receives the service optical signal through the optical fiber connector 306, the receiver optical subassembly 313 performs optical-to-electrical conversion on the service optical signal, to obtain a service electrical signal, and the processing unit 322 sends a processed service electrical signal to the communication board in the optical communication device through the edge connector 323. When obtaining the service electrical signal, the processing unit 322 performs signal processing on the service electrical signal, for example, signal amplification, signal retiming, signal shaping, signal regeneration, and signal encoding and decoding.
The following describes a specific manner in which the processing unit 322 shown in this embodiment is separately connected to the transmitter optical subassembly 312 and the receiver optical subassembly 313.
The first circuit board 311 shown in this embodiment includes a first connection port 314, and the second circuit board 321 includes a second connection port 324. The transmitter optical subassembly 312 and the receiver optical subassembly 313 are separately connected to the first connection port 314, and the second connection port 324 is connected to the processing unit 322. The first connection port 314 and the second connection port 324 are connected by using leads. It may be understood that the transmitter optical subassembly 312 is sequentially connected to the processing unit 322 through the first connection port 314 and the second connection port 324. The receiver optical subassembly 313 is sequentially connected to the processing unit 322 through the first connection port 314 and the second connection port 324. Specifically, the first connection port 314 includes a plurality of pins, and the second connection port 324 includes a plurality of pins. Any one of the plurality of pins included in the first connection port 314 is connected to one pin included in the second connection port 324 by using a lead. For example, the first connection port 314 includes pins A1 and A2 to AN, and the second connection port 324 includes pins B1 and B2 to BN, where N is any positive integer. The pin A1 is connected to the pin B1 by using a lead, the pin A2 is connected to the pin B2 by using a lead, and by analogy, the pin AN is connected to the pin BN by using a lead. The lead shown in this embodiment may be made of one or more of electrically conductive metal materials such as gold, aluminum, copper, steel, or nickel. For example, in this embodiment, the pin A1 and the pin B1 are connected through gold wire bonding. Gold wire bonding specifically means that the pin A1 and the pin B1 are directly combined into one by using a gold wire in a manner such as thermo compression bonding, ultrasonic bonding, or thermo compression ultrasonic bonding.
The optical module shown in this embodiment further includes the connection board 330. The first circuit board 311 and the second circuit board 321 are fastened to the connection board 330, and the connection board 330 is configured to align the first connection port 314 with the second connection port 324. Still refer to the foregoing example. Alignment between the first connection port 314 and the second connection port 324 means that a position of the pin A1 is aligned with a position of the pin B1, a position of the pin A2 is aligned with a position of the pin B2, and by analogy, a position of the pin AN is aligned with a position of the pin BN. Alignment between the first connection port 314 and the second connection port 324 is described with reference to
The following describes beneficial effects of aligning the first connection port 314 with the second connection port 324.
In this embodiment, the first connection port 314 is aligned with the second connection port 324 by using the connection board 330, to avoid an offset or an error in relative positions of the first connection port 314 and the second connection port 324, and ensure a successful connection between the first connection port 314 and the second connection port 324 by using the leads. When the first connection port 314 is aligned with the second connection port 324, a thread length of the lead connected between the first connection port 314 and the second connection port 324 can be effectively reduced, and further an insertion loss of an electrical signal transmitted between the first connection port 314 and the second connection port 324 is reduced. The thread length of the lead connected between the first connection port 314 and the second connection port 324 is a length of the lead connected between the first connection port 314 and the second connection port 324. A reduction in the thread length reduces attenuation of the electrical signal transmitted between the first connection port and the second connection port, improves signal quality of the electrical signal, and improves transmission efficiency of the transmitted electrical signal. The first connection port 314 is aligned with the second connection port 324. Therefore, no operational interference is caused to a lead bonding process, efficiency and accuracy of connecting the first connection port 314 and the second connection port 324 by using the leads are improved, and a case in which the first connection port 314 and the second connection port 324 cannot be connected by using the leads is avoided.
The following optionally describes a manner in which the connection board 330 fastens the optical-to-electrical conversion module 310 and the electrical processing module 320.
Refer to
In this embodiment, the two sides of the first circuit board 311 are inserted into and fastened to the first guide rail, the two sides of the second circuit board 321 are inserted into and fastened to the second guide rail, and the first circuit board 311 and the second circuit board 321 separately abut against the limiting surface, so that the first circuit board 311 and the second circuit board 321 are fastened to the connection board 330, to ensure alignment between the first connection port 314 and the second connection port 324.
To improve stability of a structure in which the first circuit board 311 and the second circuit board 321 are fastened to the connection board 330, there is a bonding layer on the surface 501 of the connection board 330 and/or a surface that is of the first circuit board 311 and that faces the connection board 330. The bonding layer is configured to bond and fasten the first circuit board 311 to the surface 501. For descriptions of fastening the second circuit board 321 to the surface 501 by using a bonding layer, refer to the descriptions of fastening the first circuit board 311 to the surface 501 by using the bonding layer. Details are not described.
Refer to
In this embodiment, when the first positioning pin 613 is inserted into and fastened to the first positioning hole, and the second positioning pin 614 is inserted into and fastened to the second positioning hole, alignment between the first connection port 314 and the second connection port 324 can be effectively ensured.
In this manner, stability of a structure in which the first circuit board 311 and the second circuit board 321 are fastened to the connection board 330 may be further improved by using a bonding layer. For descriptions of the bonding layer, refer to
It should be noted that in this embodiment, descriptions of structures of the first positioning member and the second positioning member that are used to align the first connection port with the second connection port are optional examples, and are not limited. For example, both the first positioning member and the second positioning member may be buckles, the first circuit board is provided with a clamping groove for clamping with and fastening to the buckle, and the second circuit board is also provided with a clamping groove for clamping with and fastening to the buckle. An example in which the first circuit board 311 is first fastened to the connection board, and then the second circuit board 321 is fastened to the connection board is used above. This is not limited. For another example, the second circuit board 321 may be first fastened to the connection board, and then the first circuit board 311 may be fastened to the connection board. For another example, the first circuit board 311 and the second circuit board 321 may be simultaneously fastened to the connection board. For example, the structures of the first positioning member and the second positioning member are the same. In another example, the structures of the first positioning member and the second positioning member may be different. For example, the structure of the first positioning member may be a positioning pin, and the second positioning member is a buckle. The connection board shown in this embodiment may be a part of the housing of the optical module, or the connection board may be located inside the housing of the optical module, and the connection board is fastened inside the housing of the optical module.
A material of the connection board is not limited in this embodiment, and the connection board can securely fasten the first circuit board and the second circuit board. For example, the material of the connection board may be a metal material such as tungsten or copper, or may be a non-metal material such as ceramic. A quantity of connection boards is not limited in this embodiment. For example, there may be one or more connection boards.
After the first circuit board 311 and the second circuit board 321 shown in this embodiment are fastened to the connection board 330, the first connection port 314 of the first circuit board 311 and the second connection port 324 of the second circuit board 321 are connected by using the leads, to effectively avoid a case in which the first circuit board 311 and the second connection board 321 are detached from the connection board 330. Even if an environment in which the optical module is located changes sharply, for example, a collision or fall occurs, because the connection board has a function of fastening the first circuit board 311 and the second circuit board 321, a case in which the first circuit board 311 and the second connection board 321 are detached from the connection board 330 is effectively avoided, a case in which the lead connected between the first connection port and the second connection port is broken is avoided, stability of a connection relationship between the first connection port and the second connection port is improved, transmission of an electrical signal between the first connection port and the second connection port is effectively ensured, and further security and a service life of the optical module are ensured.
According to the optical module shown in this embodiment, the optical-to-electrical conversion module and the electrical processing module are spliced and fastened by using the connection board. Therefore, before the optical module is obtained through splicing, the optical-to-electrical conversion module and the electrical processing module can be separately processed, to reduce a manufacturing process of the optical module. In addition, a procedure such as a test can be separately performed on the optical-to-electrical conversion module and the electrical processing module, to ensure that both the optical-to-electrical conversion module and the electrical processing module are good products that can work independently and normally, and then the optical-to-electrical conversion module and the electrical processing module are spliced and fastened by using the connection board. This effectively increases a product yield rate of the optical module. Further, the optical-to-electrical conversion module and the electrical processing module may be separately designed and arranged, to improve flexibility of structures in the optical module and implement flexible combination of the structures in the optical module.
If the optical-to-electrical conversion module in the optical module is faulty, the optical-to-electrical conversion module may be directly removed from the connection board, the lead connected between the first connection port and the second connection port is removed, and a good optical-to-electrical conversion module is used as a replacement and installed in the optical module. For another example, if the electrical processing module is faulty, the electrical processing module is directly removed from the connection board, the lead connected between the first connection port and the second connection port is removed, and a good electrical processing module is used as a replacement and installed in the optical module. It may be learned that when the optical-to-electrical conversion module or the electrical processing module is faulty, the entire optical module does not need to be replaced, and only the faulty optical-to-electrical conversion module or electrical processing module needs to be replaced. This reduces difficulty in repairing the optical module, a material loss, and costs.
The first connection port of the optical-to-electrical conversion module and the second connection port of the electrical processing module are connected by using the leads, to effectively reduce an electrical connection thread between the first connection port and the second connection port, and effectively reduce attenuation of the electrical signal transmitted between the first connection port and the second connection port. For example, in a scenario in which a quantity of channels of an electrical signal supported by the electrical processing module increases, an optical-to-electrical conversion module that supports high bandwidth may be connected to the electrical processing module to form an optical module. It may be learned that in the scenario in which the quantity of channels of an electrical signal increases, matching between the optical-to-electrical conversion module and the electrical processing module can also be ensured, to ensure normal working of the optical module. For another example, with development of the digital economy, a requirement for traffic in production and life explosively increases, and an optical signal transmission rate supported by the optical module evolves to a high rate, for example, gradually evolves from 25 gigabits per second (Gbps) supported by the optical module to 400 Gbps. As the optical signal transmission rate supported by the optical module exponentially increases, in this scenario, an optical-to-electrical conversion module and an electrical processing module that are obtained after the optical signal transmission rate increases can be connected to form an optical module, to ensure that the optical module can still work normally when the optical signal transmission rate increases.
The first circuit board of the optical module shown in this embodiment includes the transmitter optical subassembly and the receiver optical subassembly, and the second circuit board of the optical module includes the processing unit. To ensure that the processing unit can process an electrical signal from the receiver optical subassembly or process an electrical signal from the communication board and then send the electrical signal to the transmitter optical subassembly, the second circuit board needs to support a high electrical signal transmission rate. The first circuit board includes a first board material, and the second circuit board includes a second board material. In this embodiment, an example in which the first board material is different from the second board material is used. Attenuation of an electrical signal in the first board material and the second board material that are different is different. Therefore, transmission rates of the electrical signal in the first board material and the second board material that are different are different. In this embodiment, an example in which attenuation of the electrical signal in the first board material is greater than attenuation of the electrical signal in the second board material is used. In this case, a transmission rate of the electrical signal in the first board material is less than a transmission rate of the electrical signal in the second board material. It may be understood that an electrical signal transmission rate supported by the first circuit board is less than an electrical signal transmission rate supported by the second circuit board. When the second circuit board shown in this embodiment supports a high electrical signal transmission rate, normal processing and transmission of the electrical signal by the processing unit can be effectively ensured. When the electrical signal transmission rate supported by the first circuit board is less than the electrical signal transmission rate supported by the second circuit board, a board material that supports high-rate transmission of an electrical signal does not need to be used for the first board material of the first circuit board. This effectively reduces costs of the first circuit board, and further reduces overall manufacturing costs of the optical module.
In addition to the foregoing functions of fastening the first circuit board and the second circuit board and aligning the first connection port with the second connection port, the connection board shown in this embodiment can further implement another function. For example, the connection board further fastens a heat sink configured to dissipate heat for the receiver optical subassembly, the transmitter optical subassembly, and the processing unit. The heat sink can dissipate heat absorbed from the optical module.
In this embodiment, an example in which the first connection port of the first circuit board and the second connection port of the second circuit board are connected by using the leads is used. In another example, the first circuit board further includes a first connector, the first connection port is located in the first connector, the second circuit board further includes a second connector, and the second connection port is located in the second connector. When the first connector is connected to the second connector in a plug-in manner, the first connection port is connected to the second connection port, to ensure transmission of an electrical signal between the optical-to-electrical conversion module and the electrical processing module. For another example, the optical module further includes a flexible printed circuit (FPC), and the FPC is configured to connect the first connection port and the second connection port. The FPC may connect the first connection port and the second connection port in a manner such as a flexible board connector (FPC Connector), a rigid-flex board, or soldering.
In the foregoing embodiment, an example in which the optical-to-electrical conversion module and the electrical processing module are connected to form a planar structure is used. In another example, the optical-to-electrical conversion module and the electrical processing module may be in a stacked structure. For example,
Structures of the first connection port and the second connection port are described in detail with reference to
In this embodiment, the first connection port further includes a first low-speed interface, and the second connection port includes a second low-speed interface. A quantity of first low-speed interfaces and a quantity of second low-speed interfaces are not limited in this embodiment. Still refer to the example shown in
The first connection port is used as an example. A transmission rate of an electrical signal transmitted by the first high-speed interface is greater than a transmission rate of an electrical signal transmitted by the first low-speed interface. For example, the transmission rate of the electrical signal transmitted by the first high-speed interface is greater than or equal to a rate threshold, and the transmission rate of the electrical signal transmitted by the first low-speed interface is less than the rate threshold. In this embodiment, an example in which the rate threshold is 1 Gbps is used. A value of the rate threshold is not specifically limited.
Optionally, in this embodiment, a first lead is different from a second lead. The first lead is configured to connect the first high-speed interface 821 and the second high-speed interface 831, and the second lead is configured to connect the first low-speed interface 823 and the second low-speed interface 833. That a first lead is different from a second lead specifically means that the first lead and the second lead are made of different materials, and/or a structure of the first lead is different from a structure of the second lead. Because the first lead is different from the second lead, attenuation of an electrical signal in the first lead and the second lead that are different is different. Therefore, transmission rates of the electrical signal in the first lead and the second lead that are different are different. In this embodiment, an example in which attenuation of the electrical signal in the second lead is greater than attenuation of the electrical signal in the first lead is used. In this case, a transmission rate of the electrical signal in the second lead is less than a transmission rate of the electrical signal in the first lead. It may be understood that an electrical signal transmission rate supported by the second lead is less than an electrical signal transmission rate supported by the first lead. When the first lead shown in this embodiment supports a high electrical signal transmission rate, it can be effectively ensured that a service electrical signal is successfully transmitted between the processing unit and the transmitter optical subassembly, and it can be ensured that a service electrical signal is successfully transmitted between the processing unit and the receiver optical subassembly. The second lead is used for an instruction electrical signal with a low transmission rate, and the second lead does not need to support transmission of a high-speed electrical signal at high costs. This effectively reduces costs of the second lead, and further reduces overall costs of the optical module.
A structure of a low-speed interface provided in an embodiment of this application is described with reference to
In this embodiment, when both the first circuit board 801 and the second circuit board 802 are fastened to the connection board 800, the VCC pin of the first low-speed interface 823 and a VCC pin of the second low-speed interface 833 are aligned and are connected by using a lead, and by analogy, the SCL pin of the first low-speed interface 823 and an SCL pin of the second low-speed interface 833 are aligned and are connected by using a lead. It may be learned that any pin included in the first low-speed interface 823 is connected to one pin included in the second low-speed interface 833 by using a lead.
When the first circuit board 801 includes a plurality of first high-speed interfaces, the first circuit board 801 includes at least one pair of two adjacent first high-speed interfaces. The two adjacent first high-speed interfaces mean that the two first high-speed interfaces are not separated by any first high-speed interface. For example, if the first high-speed interface 821 and the first high-speed interface 822 shown in
In this embodiment, the rate of the electrical signal transmitted by the first high-speed interface is greater than the rate of the electrical signal transmitted by the first low-speed interface. Therefore, when the first low-speed interface 823 is located between the first high-speed interface 821 and the first high-speed interface 822 that are adjacent to each other, the first low-speed interface 823 can perform a block function to some extent, to reduce crosstalk between a high-speed electrical signal transmitted by the first high-speed interface 821 and a high-speed electrical signal transmitted by the first high-speed interface 822. For descriptions of positions of the second high-speed interface and the second low-speed interface included in the second connection port, refer to the descriptions of the first connection port. Details are not described.
Structures of the first high-speed interface and the second high-speed interface are described with reference to
Optional structures of the first high-speed interface and the second high-speed interface are further described with reference to
For example, in
In the embodiment shown in
In the foregoing embodiment, an example in which the first circuit board is one circuit board is used. A first circuit board provided in an embodiment shown in
The first circuit board shown in this embodiment includes two daughter boards, namely, a first daughter board 1311 and a second daughter board 1321. The first daughter board 1311 includes a transmitter optical subassembly 1312 and a transmitter optical subassembly driving unit 1313 configured to drive the transmitter optical subassembly 1312. The first daughter board 1311 further includes a first connection subport 1314. A first high-speed interface included in the first connection subport 1314 is connected to the transmitter optical subassembly 1312, a first low-speed interface included in the first connection subport 1314 is connected to the transmitter optical subassembly driving unit 1313, and the first connection subport 1314 is connected to the second connection port 1304. For descriptions of the first high-speed interface and the first low-speed interface included in the first connection subport 1314, refer to
The first daughter circuit board 1311 and the second circuit board 1301 that are fastened to the connection board 1300 in this embodiment can implement alignment between the first connection subport 1314 and the second connection port 1304. The second daughter circuit board 1321 and the second circuit board 1301 that are fastened to the connection board 1300 can implement alignment between the second connection subport 1324 and the second connection port 1304. It may be understood that the connection board 1300 shown in this embodiment can avoid an offset or an error in relative positions of the first connection subport 1314 and the second connection port 1304, and ensure a successful connection between the first connection subport 1314 and the second connection port 1304 by using a lead. In addition, when the first connection subport 1314 is aligned with the second connection port 1304, a thread length of a lead connected between the first connection subport 1314 and the second connection port 1304 can be effectively reduced, and an insertion loss of an electrical signal transmitted between the first connection subport 1314 and the second connection port 1304 is effectively reduced. Furthermore, the first connection subport 1314 is aligned with the second connection port 1304. Therefore, no operational interference is caused to a lead bonding process, efficiency and accuracy of connecting the first connection subport 1314 and the second connection port 1304 by using the lead are improved, and a case in which the first connection subport 1314 and the second connection port 1304 cannot be connected by using the lead is avoided. For descriptions of beneficial effects of aligning the second connection subport 1324 with the second connection port 1304 by using the connection board 1300, refer to the descriptions of the beneficial effects of aligning the first connection subport 1314 with the second connection port 1304 by using the connection board 1300.
According to the optical module shown in this embodiment, the first daughter board and the second daughter board can be separately processed, to further reduce a manufacturing process of the optical module. In addition, a procedure such as a test can be separately performed on the first daughter board and the second daughter board, to ensure that both the first daughter board and the second daughter board are good products that can work independently and normally. This effectively increases a product yield rate of the optical module. The first daughter board and the second daughter board are separately designed and arranged, to improve flexibility of structures in the optical module. When the first daughter board 1311 included in the optical-to-electrical conversion module is faulty, only the first daughter board 1311 needs to be replaced, and the entire optical-to-electrical conversion module does not need to be replaced. This reduces difficulty in repairing the optical module, a material loss, and costs.
The following describes, by using an example, a structure of an optical-to-electrical conversion module provided in this application.
The first connection port 1430 receives four service electrical signals from an electrical processing module. For descriptions of receiving the service electrical signals by the first connection port 1430, refer to
In this embodiment, an example in which the four drivers are located on a first circuit board included in the optical-to-electrical conversion module is used. The driver 1406 is used as an example. A transmission rate of an electrical signal transmitted by the driver 1406 is high. When the driver 1406 is located on the first circuit board, a distance between the driver 1406 and the laser 1402 is less than a distance that is between the driver 1406 and the laser 1402 and that exists when the driver 1406 is located on a second circuit board. A shorter distance between the driver 1406 and the laser 1402 indicates higher power of the service electrical signal sent by the driver 1406 to the laser 1402 and better signal quality. Therefore, when the driver 1406 is located on the first circuit board, efficiency of performing electrical-to-optical conversion by the laser 1402 can be effectively improved. The driver 1406 is arranged on the first circuit board. This reduces an area and costs of the second circuit board.
In this embodiment, the electrical signal transmitted by the driver 1406 is a high-speed electrical signal. To reduce costs of the first circuit board, a transmission path of the service electrical signal transmitted by the driver 1406 does not need to pass through a trace of the first circuit board, and a first electric-conductor is separately disposed independent of the trace of the first circuit board. An electrical signal transmission rate supported by the first electric-conductor is greater than an electrical signal transmission rate supported by the trace of the first circuit board. The laser 1402 and the first connection port 1430 are separately connected to the driver 1406 by using the first electric-conductor. It may be learned that in this embodiment, a first circuit board that supports a low electrical signal transmission rate may be used, which can also ensure that each driver amplifies an electrical signal sent to the transmitter optical subassembly, to reduce costs of the first circuit board. The driver 1406 shown in this embodiment may alternatively be disposed on the second circuit board, or the driver 1406 is integrated with a processing unit on the second circuit board.
In this embodiment, an example in which the receiver optical subassembly 1420 supports four channels is used. A quantity of channels supported by the receiver optical subassembly 1420 is not limited in this embodiment. The receiver optical subassembly 1420 includes a demultiplexer 1421 and four photodetectors (PD), namely, a PD 1422, a PD 1423, a PD 1424, and a PD 1425, connected to the demultiplexer 1421. The optical-to-electrical conversion module further includes four TIAs, namely, a TIA 1426 connected to the PD 1422, a TIA 1427 connected to the PD 1423, a TIA 1428 connected to the PD 1424, and a TIA 1429 connected to the PD 1425, respectively connected to the four PDs. The four TIAs are separately connected to the first connection port 1430. The demultiplexer 1421 receives the multiplexed service optical signal, and demultiplexes the service optical signal to obtain four service optical signals. The demultiplexer 1421 is configured to respectively send the four service optical signals to the four PDs. The PD 1422 is used as an example. The PD 1422 performs optical-to-electrical conversion on a received service optical signal to send a service electrical signal to the TIA 1426. The TIA 1426 amplifies the received service electrical signal to send an amplified service electrical signal to the first connection port 1430.
In this embodiment, an example in which the four TIAs are located on the first circuit board included in the optical-to-electrical conversion module is used. A transmission rate of an electrical signal transmitted by the TIA 1426 is high. When the TIA is located on the first circuit board, a distance between the TIA 1426 and the PD 1422 is less than a distance that is between the TIA 1426 and the PD 1422 and that exists when the TIA 1426 is located on the second circuit board. Therefore, when the TIA 1426 is located on the first circuit board, higher power of the service electrical signal received by the TIA 1426 and the service electrical signal sent by the TIA 1426 to the first connection port 1430 indicates better signal quality. This improves efficiency and accuracy of a service carried in the service electrical signal obtained by the electrical processing module. In addition, the TIA 1426 is arranged on the first circuit board. This reduces an area and costs of the second circuit board.
In this embodiment, the electrical signal transmitted by the TIA 1426 is a high-speed electrical signal. To reduce costs of the first circuit board, a transmission path of the service electrical signal transmitted by the TIA 1426 does not need to pass through a trace of the first circuit board, and a second electric-conductor is separately disposed independent of the trace of the first circuit board. An electrical signal transmission rate supported by the second electric-conductor is greater than an electrical signal transmission rate supported by the trace of the first circuit board. The PD 1422 and the first connection port 1430 are separately connected to the TIA 1426 by using the second electric-conductor. It may be learned that in this embodiment, a first circuit board that supports a low electrical signal transmission rate may be used, which can also ensure that each TIA amplifies an electrical signal from the receiver optical subassembly, to reduce costs of the first circuit board. The TIA 1426 shown in this embodiment may alternatively be disposed on the second circuit board, or the TIA 1426 is integrated with the processing unit on the second circuit board.
The first connection port 1504 receives four service electrical signals from an electrical processing module. The driver 1515 is used as an example. The driver 1515 amplifies power of the service electrical signal from the first connection port 1504, to send a service electrical signal obtained after power amplification to the modulator 1511. The modulator 1511 modulates the service electrical signal onto an optical signal from the light source 1505 to output one service optical signal. The multiplexer 1503 receives four service optical signals from the four modulators, and performs multiplexing to emit a multiplexed service optical signal.
The four drivers shown in this embodiment are located on the first circuit board. For descriptions of specific beneficial effects, refer to the descriptions corresponding to
The first connection port 1604 receives four service electrical signals from an electrical processing module. The driver 1615 is used as an example. The driver 1615 amplifies power of the service electrical signal from the first connection port 1604, to send a service electrical signal obtained after power amplification to the ICT. The ICT 1611 modulates the service electrical signal onto an optical signal from the light source 1605 to output one service coherent optical signal. The multiplexer 1603 receives four service coherent optical signals from the four ICTs, and performs multiplexing to emit a multiplexed service coherent optical signal. The four drivers shown in this embodiment are located on the first circuit board. For descriptions of specific beneficial effects, refer to the descriptions corresponding to
The silicon photonic chip 1602 shown in this embodiment further includes the receiver optical subassembly. In this embodiment, an example in which the receiver optical subassembly supports four channels is used. A quantity of channels supported by the receiver optical subassembly is not limited in this embodiment. The receiver optical subassembly includes a demultiplexer 1607 and four integrated coherent receivers (ICR), namely, an ICR 1621, an ICR 1622, an ICR 1623, and an ICR 1624, connected to the demultiplexer 1607. The first circuit board further includes four TIAs, namely, a TIA 1625 connected to the ICR 1621, a TIA 1626 connected to the ICR 1622, a TIA 1627 connected to the ICR 1623, and a TIA 1628 connected to the ICR 1624, respectively connected to the four ICRs. The four TIAs are separately connected to the first connection port 1604. The demultiplexer 1607 receives the multiplexed service coherent optical signal, and demultiplexes the multiplexed service coherent optical signal to obtain four service coherent optical signals. The demultiplexer 1607 is configured to respectively send the four service coherent optical signals to the four ICRs. The ICR 1621 is used as an example. The ICR 1621 performs coherent coupling on the received service coherent optical signal and a local-frequency optical signal from the light source 1605, performs optical-to-electrical conversion to output a service electrical signal, and sends the service electrical signal to the TIA 1625. The TIA 1625 amplifies the received service electrical signal, to send an amplified service electrical signal to the first connection port 1604. In this embodiment, an example in which the ICT and the ICR share the light source 1605 is used, to reduce costs of the optical-to-electrical conversion module. In another example, the ICT and the ICR may respectively use different light sources.
In this embodiment, an example in which the four TIAs are located on the first circuit board included in an the optical-to-electrical conversion module is used. For descriptions of specific beneficial effects, refer to the descriptions in the embodiment corresponding to
An embodiment further provides an assembly method used to assemble an optical module.
Step 1701: Fasten a first circuit board to a connection board.
In this embodiment, the first circuit board may be fastened to the connection board by using an assembly device. For example, the first circuit board is fastened to the connection board by using a mechanical arm. Specifically, the first circuit board is fastened to a first region by using a first positioning member in the first region of the connection board. For descriptions of a specific fastening manner, refer to the descriptions in
Step 1702: Fasten a second circuit board to the connection board.
A time sequence of performing step 1701 and step 1702 is not limited in this embodiment. For example, step 1701 may be performed before step 1702. For another example, step 1702 is performed before step 1701. For another example, step 1701 and step 1702 are simultaneously performed. For description of an execution body for performing step 1702, refer to the descriptions in step 1701. Details are not described.
Specifically, the second circuit board is fastened to a second region by using a second positioning member in the second region of the connection board. For descriptions of a process of fastening the second circuit board to the connection board in this embodiment, refer to the descriptions in
Step 1703: Connect a first high-speed interface of the first connection port and a second high-speed interface of the second connection port by using a first lead.
For detailed descriptions of this step, refer to the descriptions corresponding to
Step 1704: Connect a first low-speed interface of the first connection port and a second low-speed interface of the second connection port by using a second lead.
A time sequence of performing step 1703 and step 1704 shown in this embodiment is not limited. For example, step 1703 may be performed before step 1704. For another example, step 1704 is performed before step 1703. For another example, step 1703 and step 1704 are simultaneously performed.
For detailed descriptions of this step, refer to the descriptions corresponding to
In this embodiment, when both the first circuit board and the second circuit board are fastened to the connection board, a test may be directly performed. If a normal result is obtained by performing a test, the connection board to which the first circuit board and the second circuit board are fastened is packaged into a housing of an optical module. Then, the packaged optical module may be tested again to ensure normal use of the packaged optical module. A test manner is not limited in this embodiment, provided that it is ensured that the optical module that passes the test can be used normally. For example, the test may include a test on optical power of the optical module, a test performed by using an optical spectrometer, a test performed by using an eye pattern meter, or a test performed by using a bit error rate tester.
The foregoing embodiments are merely intended for describing the technical solutions of the present invention, but not for limiting the present invention. Although the present invention is described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art should understand that they may still make modifications to the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features thereof, without departing from the scope of the technical solutions of embodiments of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210675108.5 | Jun 2022 | CN | national |
This application is a continuation of International Application No. PCT/CN2023/097406, filed on May 31, 2023, which claims priority to Chinese Patent Application No. 202210675108.5, filed on Jun. 15, 2022. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2023/097406 | May 2023 | WO |
| Child | 18978449 | US |
