The present application claims priority from Japanese patent application JP2019-227627 filed on Dec. 17, 2019, the contents of which are hereby incorporated by reference into this application.
This relates to an optical module.
A TO-CAN (Transistor Outline Can) Type package, using lead pins held by a dielectric such as glass in through holes of an eyelet, is configured to transmit electrical signals to an optical semiconductor device. The lead pins and electronic components contained in the package are connected by wires, and the lead pins protrude approximately 0.6 mm or more to prevent interference between a wire-bonding tool and the electronic components. The electronic components include a thermoelectric cooler using a Peltier device (JP2011-108939A). There is a bonding portion of the wire, above a heat-absorbing surface of the thermoelectric cooler.
The heat-absorbing surface of the thermoelectric cooler has an unstable potential because it is made of an insulator, and the confinement effect of the electromagnetic field is weak. Therefore, the protruding lead pins become an antenna element, and the high-frequency signal excites the lead pins, resulting in signal transmission loss. In recent years, there has been an increasing demand for modules having high transmission rates. Therefore, stabilization of the ground potential has become important.
This aims at reducing signal transmission loss.
(1) An optical module includes: a conductive block with a first surface and a second surface, the conductive block having some through holes extending therethrough between the first surface and the second surface; some lead pins including a signal lead pin, the lead pins fixed inside the respective through holes and insulated from the conductive block; a thermoelectric cooler with an upper surface and a lower surface, the lower surface fixed to the first surface of the conductive block, the thermoelectric cooler having a Peltier device therein configured to transfer heat between the upper surface and the lower surface; a metal layer laminated on the upper surface of the thermoelectric cooler; a ground wire connecting the first surface of the conductive block and the metal layer; a photoelectric device adapted to convert an optical signal and an electrical signal at least from one to another; a mounting substrate on which the photoelectric device is mounted, the mounting substrate fixed to the upper surface of the thermoelectric cooler with at least the metal layer interposed therebetween, the mounting substrate having a first wiring pattern electrically connected to the photoelectric device; a relay substrate having a second wiring pattern electrically connected to the signal lead pin; and a signal wire configured to connect the first wiring pattern and the second wiring pattern.
This can reduce the signal transmission loss, due to stabilized potential of the metal layer laminated on the upper surface of the thermoelectric cooler because it is connected to the conductive block with the ground wire.
(2) In the optical module according to (1), the mounting substrate may have a mounting surface on which the photoelectric device is mounted, and the upper surface of the thermoelectric cooler and the mounting surface may face in respective directions intersecting with each other.
(3) In the optical module according to (2), the photoelectric device may be arranged such that an optical axis extends in a direction parallel to the mounting surface.
(4) The optical module according to any one of (1) to (3), may further include a support block interposed between the metal layer and the mounting substrate.
(5) In the optical module according to (4), the support block may have a cuboid shape, the cuboid shape having a surface fixed to the metal layer and another surface fixed to the mounting substrate, which are adjacent to each other.
(6) In the optical module according to (4) or (5), the support block may be made of metal.
(7) In the optical module according to (4) or (5), the support block may be made of non-metal.
(8) In the optical module according to any one of (1) to (3), the metal layer may be part of a metal block interposed between the upper surface of the thermoelectric cooler and the mounting substrate, the metal block may have a projection integral with the metal layer, and the mounting substrate may be mounted on the projection.
(9) In the optical module according to any one of (1) to (8), the signal lead pin may be adapted to single-ended driving of the photoelectric device, and the first wiring pattern may have a ground electrode to which a back side of the photoelectric device is bonded.
(10) In the optical module according to any one of (1) to (8), the signal lead pin may be a pair of signal lead pins adapted to drive the photoelectric device by differential signals, the first wiring pattern may include a pair of first differential signal lines, and the second wiring pattern may include a pair of second differential signal lines bonded to the respective pair of signal lead pins.
(11) In the optical module according to any one of (1) to (10), the ground wire may be two or more ground wires.
(12) In the optical module according to any one of (1) to (11), the conductive block may have a pedestal portion integral with the first surface, and the relay board may rest on the pedestal portion.
(13) The optical module according to any one of (1) to (12), may further include a thermistor mounted on the metal layer.
Hereinafter, with reference to drawings, the embodiment of the present invention is described specifically and in detail. In all the drawings, the same members are denoted by the same reference numerals and have the same or equivalent functions, and a repetitive description thereof will be omitted. The size of the figure does not necessarily coincide with the magnification.
The optical module 100 has some lead pins L (including a signal lead pin LS). The lead pins L are fixed inside the respective through holes 16 and insulated from the conductive block 10. The lead pins L protrude from the first surface 12. The lead pins L also protrude from the second surface 14 and are connected to the flexible printed circuit board 102 (
The optical module 100 includes a thermoelectric cooler 20. The thermoelectric cooler 20 has an upper surface 22 and a lower surface 24. The upper surface 22 and the lower surface 24 are made of an insulator such as ceramic. The lower surface 24 is fixed to the first surface 12 of the conductive block 10. A thermally conductive adhesive may be used for fixing. The thermoelectric cooler 20 has a Peltier device 26 therein for transferring heat between the top surface 22 and the lower surface 24. For example, the upper surface 22 is the heat-absorbing surface and the lower surface 24 is the heat-radiating surface, or vice versa by switching. An electrode 28 of thermoelectric cooler 20 is connected to the lead pin L with a wire W.
A metal layer 30 is laminated on the upper surface 22 of the thermoelectric cooler 20. The metal layer 30 serves as a reference potential plane (e.g., ground plane). Two or more ground wires WG connect the first surface 12 of the conductive block 10 and the metal layer 30. Thus, the potential of the metal layer 30 becomes the same as the conductive block 10 and stabilizes. A thermistor 31 rests on and is electrically connected to the metal layer 30 for measuring the temperature. The thermistor 31 is connected to a lead pin L with a wire W for applying a voltage thereto.
The optical module 100 has a photoelectric device 32 for converting an optical signal and an electrical signal at least from one to another. The photoelectric device 32 is fixed to the upper surface 22 of the thermoelectric cooler 20 at least through the metal layer 30. Since the ground potential of the metal layer 30 is stabilized, the signal transmission loss is reduced. The photoelectric device 32 is adapted to be single-ended driven.
The photoelectric device 32 is mounted on a mounting substrate 34. The mounting substrate 34 has a mounting surface on which the photoelectric device 32 is mounted. The photoelectric device 32 is arranged such that an optical axis OX extends in a direction parallel to the mounting surface 36. The upper surface 22 of the thermoelectric cooler 20 and the mounting surface 36 face in respective directions crossing each other (e.g., orthogonal). The mounting substrate 34 has a first wiring pattern 38 on the mounting surface 36.
As shown in
A bypass capacitor 48 is mounted on the support block 46. The back side (electrode) of the bypass capacitor 48 is conducted to the support block 46 and is connected to the reference potential (e.g., ground). The other electrode of the bypass capacitor 48, via a wire W, is connected to a lead pin L, so that a voltage is applied. The voltage, via another wire W, is also connected to the photoelectric device 32 for the power supply voltage to be supplied.
A relay board 50 is mounted on the pedestal portion 18 of the conductive block 10. The relay substrate 50 has a second wiring pattern 52. The second wiring pattern 52 is electrically connected to the signal lead pin LS. Specifically, between an end of the signal lead pin LS (protruding portion from the first surface 12) and a terminal of the second wiring pattern 52, a filler metal 54 (solder, brazing material) is interposed to electrically connect them. The second wiring pattern 52, via a signal wire WS, is connected to the first wiring pattern 38.
The second wiring pattern 452 of the relay substrate 450 includes a pair of second differential signal lines 462. Each of the pair of second differential signal lines 462, with the wire W, is connected to a corresponding one of the pair of first differential signal lines 460. The pair of second differential signal lines 462 are bonded to a respective pair of signal lead pins LS. Thus, the pair of signal lead pins LS are electrically connected to the photoelectric device 432. Incidentally, the support block 446 is made of a non-metal such as ceramic (insulator). Therefore, the metal layer 430 and the mounting substrate 434 are electrically insulated. The contents described in the first embodiment are applicable to this embodiment.
While there have been described what are at present considered to be certain embodiments, it will be understood that various modifications may be made thereto, and it is intended that the appended claims cover all such modifications as fall within the true spirit and scope of the invention.
Number | Date | Country | Kind |
---|---|---|---|
JP2019-227627 | Dec 2019 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
4768070 | Takizawa | Aug 1988 | A |
5068866 | Wada | Nov 1991 | A |
5089861 | Tanaka | Feb 1992 | A |
5550675 | Komatsu | Aug 1996 | A |
5557116 | Masui | Sep 1996 | A |
6562693 | Ichikawa | May 2003 | B2 |
6567439 | Auracher | May 2003 | B1 |
6807207 | Shiomoto | Oct 2004 | B2 |
6868104 | Stewart | Mar 2005 | B2 |
6876685 | Umemoto | Apr 2005 | B2 |
D505664 | Takagi | May 2005 | S |
6920161 | Riaziat | Jul 2005 | B2 |
6920162 | Harding | Jul 2005 | B2 |
7037001 | Oomori | May 2006 | B2 |
7046707 | Koizumi | May 2006 | B2 |
7061949 | Zhou | Jun 2006 | B1 |
7154126 | Aruga | Dec 2006 | B2 |
7263112 | Oomori | Aug 2007 | B2 |
7358542 | Radkov | Apr 2008 | B2 |
7366215 | Aruga | Apr 2008 | B2 |
7463659 | Go | Dec 2008 | B2 |
7837398 | Sato | Nov 2010 | B2 |
7856038 | Oomori | Dec 2010 | B2 |
7991029 | Aruga | Aug 2011 | B2 |
8509575 | Okada | Aug 2013 | B2 |
8743564 | Kuwahara | Jun 2014 | B2 |
8908728 | Huikai | Dec 2014 | B1 |
9059569 | Yamanaka | Jun 2015 | B2 |
9209903 | Lee | Dec 2015 | B2 |
9372315 | Miao | Jun 2016 | B2 |
9541714 | Lim | Jan 2017 | B2 |
9625671 | Vorndran | Apr 2017 | B2 |
9628184 | Pfnuer | Apr 2017 | B2 |
9859680 | Serbicki | Jan 2018 | B2 |
9980379 | Noguchi | May 2018 | B2 |
10168493 | Shirasaki | Jan 2019 | B2 |
10211599 | Vorndran | Feb 2019 | B2 |
10334717 | Noguchi | Jun 2019 | B2 |
10431955 | Serbicki | Oct 2019 | B2 |
10763638 | Jungwirth | Sep 2020 | B2 |
10771155 | McLaurin | Sep 2020 | B2 |
10819084 | Zhang | Oct 2020 | B2 |
10852493 | Noguchi | Dec 2020 | B2 |
11153962 | Kimura | Oct 2021 | B2 |
11206087 | Otani | Dec 2021 | B2 |
11256048 | Hettler | Feb 2022 | B2 |
11385422 | Saeki | Jul 2022 | B2 |
20010006235 | Ozawa | Jul 2001 | A1 |
20030043868 | Stewart | Mar 2003 | A1 |
20030086243 | Harding | May 2003 | A1 |
20030183921 | Komobuchi | Oct 2003 | A1 |
20030214860 | Greenlaw | Nov 2003 | A1 |
20030218923 | Giaretta | Nov 2003 | A1 |
20040074661 | Schiaffino | Apr 2004 | A1 |
20040081410 | Aronson | Apr 2004 | A1 |
20040126066 | Keh | Jul 2004 | A1 |
20040129441 | Giaretta | Jul 2004 | A1 |
20040151505 | Aronson | Aug 2004 | A1 |
20040163836 | Kumar | Aug 2004 | A1 |
20040240497 | Oomori | Dec 2004 | A1 |
20040247004 | Keh | Dec 2004 | A1 |
20040247259 | Blom | Dec 2004 | A1 |
20050008049 | Oomori | Jan 2005 | A1 |
20050013561 | Kuhara | Jan 2005 | A1 |
20050047460 | Go | Mar 2005 | A1 |
20050047731 | Hu | Mar 2005 | A1 |
20050067698 | Aruga | Mar 2005 | A1 |
20050105911 | Keh | May 2005 | A1 |
20050121684 | Aruga | Jun 2005 | A1 |
20050130342 | Zheng | Jun 2005 | A1 |
20050141825 | Lee | Jun 2005 | A1 |
20050175299 | Hargis | Aug 2005 | A1 |
20050185882 | Zack | Aug 2005 | A1 |
20050196112 | Takagi | Sep 2005 | A1 |
20050201433 | Riaziat | Sep 2005 | A1 |
20050207458 | Zheng | Sep 2005 | A1 |
20050207459 | Yu | Sep 2005 | A1 |
20060007516 | Kagaya | Jan 2006 | A1 |
20060072883 | Kilian | Apr 2006 | A1 |
20060176918 | Aruga | Aug 2006 | A1 |
20070120134 | Oshima | May 2007 | A1 |
20070159773 | Deng | Jul 2007 | A1 |
20070201881 | Douma | Aug 2007 | A1 |
20070237196 | Oomori | Oct 2007 | A1 |
20090135864 | Aruga | May 2009 | A1 |
20090269067 | Kihara | Oct 2009 | A1 |
20100008093 | Lin | Jan 2010 | A1 |
20100213471 | Fukasawa | Aug 2010 | A1 |
20100290488 | Ko | Nov 2010 | A1 |
20110085767 | Miao | Apr 2011 | A1 |
20120045161 | Okada | Feb 2012 | A1 |
20140037293 | Lee | Feb 2014 | A1 |
20140112363 | Feitisch | Apr 2014 | A1 |
20150008552 | Matsusue | Jan 2015 | A1 |
20150043166 | Heo | Feb 2015 | A1 |
20150104199 | Ye | Apr 2015 | A1 |
20150116809 | Uto | Apr 2015 | A1 |
20150125162 | Pfnuer | May 2015 | A1 |
20150155944 | Lee | Jun 2015 | A1 |
20150200730 | Kim | Jul 2015 | A1 |
20150241636 | Ohata | Aug 2015 | A1 |
20160036192 | Serbicki | Feb 2016 | A1 |
20160112776 | Kim | Apr 2016 | A1 |
20160126382 | Yang | May 2016 | A1 |
20160276802 | Gao | Sep 2016 | A1 |
20160327365 | Collin | Nov 2016 | A1 |
20170051884 | Raring | Feb 2017 | A1 |
20170063464 | Ho | Mar 2017 | A1 |
20170064831 | Noguchi | Mar 2017 | A1 |
20170085970 | Zhang | Mar 2017 | A1 |
20170133821 | Kimura | May 2017 | A1 |
20180003908 | Jung | Jan 2018 | A1 |
20180310397 | Noguchi | Oct 2018 | A1 |
20190074658 | Jungwirth | Mar 2019 | A1 |
20200064572 | Hettler | Feb 2020 | A1 |
20200192038 | Noguchi | Jun 2020 | A1 |
20200203922 | Zhang | Jun 2020 | A1 |
20200220322 | Takagi | Jul 2020 | A1 |
20200337147 | Kimura | Oct 2020 | A1 |
20210076500 | Noguchi | Mar 2021 | A1 |
20210132305 | Noguchi | May 2021 | A1 |
20210165177 | Chang | Jun 2021 | A1 |
20210184056 | Noguchi | Jun 2021 | A1 |
20210218473 | Otani | Jul 2021 | A1 |
20210271038 | Noguchi | Sep 2021 | A1 |
20210281042 | Krause | Sep 2021 | A1 |
20210333496 | Chang | Oct 2021 | A1 |
20210336701 | Noguchi | Oct 2021 | A1 |
20210351563 | Noguchi | Nov 2021 | A1 |
20220069540 | Wai Li | Mar 2022 | A1 |
20220069543 | Wai Li | Mar 2022 | A1 |
20220069544 | Wai Li | Mar 2022 | A1 |
20220103262 | Noguchi | Mar 2022 | A1 |
20220173571 | Noguchi | Jun 2022 | A1 |
20220201863 | Noguchi | Jun 2022 | A1 |
Number | Date | Country |
---|---|---|
2011-108939 | Jun 2011 | JP |
Number | Date | Country | |
---|---|---|---|
20210184056 A1 | Jun 2021 | US |