Patent Grant
12259110
The subject matter relates to optical packaging, and more particularly, to an optical packaging structure and a backlight module having the optical packaging structure.
A backlight may include a chip scale package (CSP) or a near chip scale package (NCSP) structure. Such package structure may have a number of LEDs for emitting light.
However, the light emission angle of the package structure may not meet the requirements, resulting in a poor light output effect, and a size of the package structure may be large.
Therefore, there is room for improvement in the art.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different FIG.s to indicate corresponding or analogous components. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
Referring to
The light-emitting chip 2 is a LED chip. The light-emitting chip 2 may be, but is not limited to, a flip-chip structure. The light-emitting chip 2 with the flip-chip structure can be soldered on the circuit board of a backlight module through eutectic soldering technology. Thus, the installation of the optical packaging structure 100 in the backlight module is easily and simply. The production costs can be reduced. Furthermore, the size of the optical packaging structure 100 can be reduced, which can provide greater power with a same packaging size.
In a direction perpendicular to the light emitting surface 21, an orthogonal projection of the lens structure 5 on the light emitting surface 21 covers the light emitting surface 21. Thus, the light emitted by the light-emitting chip 2 from the light emitting surface 21 can almost be completely transmitted into the lens structure 5. Thus, the light emitted by the light-emitting chip 2 in a vertical direction (defined as “a”) is fully reflected to reduce a light intensity in the vertical direction. Furthermore, the light emitted in the vertical direction is reflected to a side of the optical packaging structure 100 to enlarge the light emission angle.
In an embodiment, a projection of the curved surface 6 along the direction perpendicular to the light emitting surface 21 covers the light emitting surface 21. Thus, the reflecting layer 7 can entirely cover the curved surface 6.
In an embodiment, the lens structure 5 further includes a bottom surface 51 opposite to the third top surface 52. The first surface 51 is close to the light-emitting chip 2. The first surface 51 is a plane, that is, the second top surface 41 of the fluorescent layer 4 in contact with the lens structure 5 is a plane. The third top surface 52 is recessed towards the bottom surface 51 to form the curved surface 6. The bottom surface 51 of the lens structure 5 is a plane. In other words, the bottom surface 51 is a place with no curvatures. The bottom surface 51 can fully refract the light emitted from the light-emitting chip 2 and conduct the light to the lens structure 5 with a curved surface 6. Thus, the light in the vertical direction of the light-emitting chip 2 can be reflected to the sidewalls of the optical packaging structure 100 sufficiently, thereby reducing the light intensity in the vertical direction.
In an embodiment, the optical packaging structure 100 is substantially a cubic structure. The packaging layer 3 and the fluorescent layer 4 are also cubic structures. The lens structure 5 is located on the top of the fluorescent layer 4. A third side surface 42 of the fluorescent layer 4 can be a vertical surface or a curved surface with a small curvature, which is beneficial for further reducing the size of the optical packaging structure 100 and improving a packaging density of the optical packaging structure 100 in the backlight module.
Referring to
In an embodiment, the curved surface 6 is a concave surface that is concave towards the third top surface 52, which is conducive to enlarge the light emission angle of the light reflected by the reflecting layer 7.
In an embodiment, a curvature of the curved surface 6 gradually decreases from a periphery of the curved surface 6 to a middle of the curved surface 6, which is beneficial for evenly reflecting the light in the middle and periphery of the light-emitting chip 2 at a large angle.
In an embodiment, the curved surface 6 may be, but not limited to, a spherical surface, a quasi-spherical surface, an ellipsoidal surface, a quasi-ellipsoidal surface, or an irregular concave surface.
In another embodiment, referring to
In an embodiment, a distance (defined as “h”) between a lowest point of the curved surface 6 is spaced from and the bottom surface 51, the distance “h” is greater than zero. Thus, the curved surface 6 does not directly reflect the light emitted by the fluorescent layer 4. That is, all light emitted from the fluorescent layer 4 first enters the lens structure 5 and is subjected to a certain degree of refraction, and then the light is reflected by the reflecting layer 7 on the curved surface 6. Thus, the light in the vertical direction can travel to the sidewalls of optical packaging structure 100, thereby preventing a portion of the light from travelling along its original path, which is beneficial for further enlarging the angle of reflected light.
In an embodiment, the projection of the lens structure 5 along the direction perpendicular to the light emitting surface 21 covers the light emitting surface 21, which can fully refract the light emitted from the light emitting surface 21. Thus, the light efficiency of the optical packaging structure 100 is further improved.
In an embodiment, a plurality of light-emitting chips 2 are arranged in the packaging layer 3. The projection of the curved surface 6 along the direction perpendicular to the light-emitting surface 21 covers the light-emitting surface 21 of each of the light-emitting chips 2. By encapsulating the plurality of light-emitting chips 2 together in the packaging layer 3, the density of the light-emitting chips 2 can be increased, the optical effect can be improved, and the number of optical packaging structures 100 in the backlight module can be reduced.
Referring to
The light-emitting chip 2 is a flip-chip structure. The flip-chip light-emitting chip 2 can be soldered on the substrate 1 through eutectic soldering technology. Compared to CSP packaging structure, the optical packaging structure 200 with the substrate 1 is a NCSP structure, which facilitates the packaging of the light-emitting chip 2 and the miniaturization of the optical packaging structure 200.
With the above configuration, in the optical packaging structure 100 (200), the lens structure 5 with the curved surface 6 is disposed on the top of the fluorescent layer 4, and the reflecting layer 7 is disposed on the curved surface 6. The light is refracted by the lens structure 5 and reflected by the reflecting layer 7 on the curved surface 6, which can enlarge the light emission angle to direct the light in the vertical direction to the sidewalls of the optical packaging structure 100 (200). Thus, the optical effect of the optical packaging structure 100 is improved. Furthermore, the lens structure 5 is only disposed on the top of the fluorescent layer 4, thereby reducing the volume of the optical packaging structure 100 (200).
Referring to
The optical packaging structure 100 (200) is beneficial to improving the light-emitting effect of the backlight module 1000, while also reducing the number of optical packaging structures 100 (200) on the backlight module 1000.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present exemplary embodiments, to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202420468338.9 | Mar 2024 | CN | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 12191428 | Park | Jan 2025 | B2 |
