Optical pickup device and an optical disc drive including the same

Abstract

A second land SLG has a size to pool a sufficient quantity of solder H for allowing the steps of shorting and unshorting a first land SLP and the second land SLG to be repeated plural times. Out of the solder H initially supplied to a short land portion, therefore, a solder portion H bridging a gap between the first and second lands SLP, SLG for shorting may be transferred to and pooled on the second land SLG, whereby the shorted state may be eliminated. When the short land portion is reshorted, the short land portion may be electrically shorted by transferring the solder H on the second land SLG to the first land SLP. This permits the steps of shorting and unshorting the short land portion to be repeated plural times without replenishing fresh solder H. Thus, the solder H may be saved.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an optical disc drive according to one embodiment of the invention showing a state where a tray is moved into the optical disc drive with its top opened;

FIG. 2 is a partially cut-away sectional view of the optical disc drive according to the one embodiment hereof showing a state where the optical disc drive has its tray removed and has its clamper partially cut away;

FIG. 3 is a plan view showing a single body of optical pickup unit of the optical disc drive according to the one embodiment hereof;

FIG. 4 is an enlarged plan view showing a potion enclosed by a dot-dash line in FIG. 3;

FIG. 5 is a group of enlarged schematic diagrams showing a short land portion;

FIG. 6 is a group of enlarged schematic diagrams showing a short land portion in comparison with the short land portion of an optical pickup unit of the embodiment shown in FIG. 5;

FIG. 7 is a flow chart showing the steps of one exemplary procedure of assembling the optical pickup unit in the optical disc drive; and

FIG. 8 is a group of enlarged schematic diagrams showing a conventional short land portion.

Claims

1. An optical pickup device, comprising: a short land portion provided on a circuit board for the purpose of preventing the electrostatic breakdown of a laser diode,wherein said short land portion includes at least one first land and at least one second land for solder pooling, said first and second lands subjected to shorting and unshorting steps by way of a solder, andwherein said second land has a size to pool a sufficient quantity of solder for allowing the steps of shorting and unshorting said lands to be repeated plural times.

2. The optical pickup device according to claim 1, wherein said second land has a greater area than said first land.

3. The optical pickup device according to claim 1, wherein mutually opposing edges of said first land and said second land define parallel straight lines substantially having the same length.

4. The optical pickup device according to claim 2, wherein mutually opposing edges of said first land and said second land define parallel straight lines substantially having the same length.

5. The optical pickup device according to claim 3, wherein said first land has a semicircular shape and said second land has a rectangular shape in which at least a side adjoining said first land has a length substantially equal to a diameter of said first land.

6. The optical pickup device according to claim 4, wherein said first land has a semicircular shape and said second land has a rectangular shape in which at least a side adjoining said first land has a length substantially equal to a diameter of said first land.

7. An optical disc drive comprising the optical pickup device according to any one of claims 1 to 6.