Optical semiconductor device and controlling method of the same

Abstract

An optical semiconductor device includes a wavelength-tunable semiconductor laser chip, a mount carrier, a first temperature sensor and a wire. The wavelength-tunable semiconductor laser chip has a first optical waveguide and a second optical waveguide. The second optical waveguide has a heater on a surface thereof and is optically coupled to the first optical waveguide. The mount carrier is for mounting the wavelength-tunable semiconductor laser chip, and has a first area arranged at a surface of the mount carrier of the first optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted. The first temperature sensor is mounted on the first area. The wire couples between the heater and a second area arranged at a surface of the mount carrier of the second optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the present invention will be described in detail with reference to the following drawings, wherein:

FIG. 1A and FIG. 1B illustrate a laser module in accordance with a first embodiment of the present invention;

FIG. 2 illustrates an overall structure of a laser module in accordance with a second embodiment;

FIG. 3 illustrates an overall structure of a laser module in accordance with a third embodiment;

FIG. 4 illustrates an overall structure of a laser module in accordance with a fourth embodiment; and

FIG. 5 illustrates an overall structure of a laser module in accordance with a fifth embodiment.

Claims

1. An optical semiconductor device comprising: a wavelength-tunable semiconductor laser chip that has a first optical waveguide and a second optical waveguide, the second optical waveguide having a heater on a surface thereof and being optically coupled to the first optical waveguide;a mount carrier for mounting the wavelength-tunable semiconductor laser chip, the mount carrier having a first area arranged at a surface of the mount carrier of the first optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted;a first temperature sensor mounted on the first area; anda wire that couples between the heater and a second area arranged at a surface of the mount carrier of the second optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted.

2. The optical semiconductor device as claimed in claim 1, wherein the wire is coupled to a metal pattern provided on the mount carrier except for the first area.

3. The optical semiconductor device as claimed in claim 2, wherein more than three of the wires and more than three of the metal patterns are provided.

4. The optical semiconductor device as claimed in claim 1, wherein the wire extends to an area, the area being on the mount carrier, being arranged diagonally to the first area and being at the second optical waveguide side.

5. The optical semiconductor device as claimed in claim 1 further comprising a second temperature sensor mounted on a second area of the mount carrier, the second area being arranged at a surface of the mount carrier of the second optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted.

6. The optical semiconductor device as claimed in claim 1, wherein the mount carrier is arranged on a temperature control device.

7. The optical semiconductor device as claimed in claim 1, wherein the mount carrier is a surface of a temperature control device.

8. A controlling method of an optical semiconductor device comprising controlling a lasing wavelength of a wavelength-tunable semiconductor laser chip, by controlling a temperature of a temperature control device according to a detection result of a first temperature sensor, the optical semiconductor device having the wavelength-tunable semiconductor laser chip, a mount carrier for mounting the wavelength-tunable semiconductor laser chip, the first temperature sensor and a wire,the wavelength-tunable semiconductor laser chip having a first optical waveguide and a second optical waveguide,the second optical waveguide having the heater on a surface thereof and being optically coupled to the first optical waveguide,the mount carrier having a first area arranged at a surface of the mount carrier of the first optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted,the mount carrier being mounted on the temperature control device,the first temperature sensor being mounted on the first area,the wire coupling between the heater and a second area arranged at a surface of the mount carrier of the first optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted.