BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the present invention will be described in detail with reference to the following drawings, wherein:
FIG. 1 illustrates a perspective view of a laser chip in accordance with a first embodiment of the present invention;
FIG. 2A and FIG. 2B illustrate a top view and a cross sectional view of a laser chip in accordance with a first embodiment of the present invention;
FIG. 3A and FIG. 3B illustrate a top view and a cross sectional view of a SG-DR region in accordance with a first embodiment;
FIG. 4 illustrates an enlarged top view of a SG-DR region in accordance with a second embodiment;
FIG. 5 illustrates an enlarged top view of a SG-DR region in accordance with a third embodiment;
FIG. 6 illustrates an enlarged top view of a SG-DR region in accordance with a fourth embodiment;
FIG. 7A through FIG. 7C illustrate a top view and a cross sectional view of a SG-DR region in accordance with a fifth embodiment; and
FIG. 8 illustrates an overall view of a laser module in accordance with a sixth embodiment.