Optical Sensor Using a Laser Mounted on Top of a Semiconductor Die

Abstract

A semiconductor device comprising an integrated circuit die and an electronic component mounted to the integrated circuit dies wherein the electronic component comprises a light emitting active area arranged to emit light.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present inventions will become apparent from and will be elucidated with respect to the embodiments described hereinafter with reference to the accompanying drawings. The drawings illustrate the embodiments of the invention and together with the description, serve to explain the principles of the invention. In the drawings:

FIG. 1 illustrates a schematic representation of a semiconductor device;

FIG. 2 illustrates another schematic representation of a semiconductor device; and

FIG. 3 shows a schematic representation of a system comprising the semiconductor device.

Claims

1. A semiconductor device, comprising: an integrated circuit die; andan electronic component mounted to the integrated circuit die, the electronic component comprising a light emitting active region.

2. The semiconductor device of claim 1, wherein the electronic component is a vertical-cavity surface-emitting laser (VCSEL).

3. The semiconductor device of claim 1, wherein the electronic component comprises an anode and a cathode.

4. The semiconductor device of claim 3, wherein the anode and the cathode are electrically coupled to an anode connector and a cathode connector respectively on the integrated circuit die via wire bonds.

5. The semiconductor device of claim 4, wherein the anode is electrically coupled to the anode connector on the integrated circuit die via a wire bond, and the cathode is mounted on at least a part of the integrated circuit die and electrically coupled to the electronic component via a conductive bonding agent.

6. The semiconductor device of claim 3, wherein the integrated circuit die, the electronic component, the anode, the cathode and the wire bonds are encapsulated with a mold of a clear material.

7. The semiconductor device of claim 1, wherein the integrated circuit die and the electronic component are coated with a layer of a material.

8. A system, comprising: an integrated circuit die; andan electronic component mounted to the integrated circuit die, the electronic component comprising a light emitting active region

9. The system of claim 8, wherein the electronic component comprises a laser diode.

10. The system of claim 8, comprising a means for emitting light from the light emitting active region of the electronic component.

11. The system of claim 8, further comprising a means for detecting a reflection of light reflected from a surface.

12. A method of assembling a semiconductor device, the method comprising: mounting an electronic component onto an integrated circuit die, wherein the electronic component comprises a light emitting active region;coupling an anode and a cathode to a respective anode connector and a cathode connector via wire bonds, wherein both the anode connector and cathode connector are located on the integrated circuit die; andencapsulating the integrated circuit die and the electronic component with a mold of a transparent material.

13. The method of claim 12, further comprising mounting the cathode on the integrated circuit die.

14. The method claim 12, further comprising encapsulating the integrated circuit die and the electronic component with a layer of a compliant material.

15. A method of mounting a device on a base, the method comprising: placing an electronic component onto an integrated circuit die, wherein the electronic component comprises a light emitting active region; andbonding a cathode and an anode to the integrated circuit die.

16. The method of claim 15, wherein the cathode and the anode are both pads on a top layer of the electronic component.

17. The method of claim 15, wherein the electronic component is a vertical-cavity surface-emitting laser (VCSEL).

18. The method of claim 15, wherein both the cathode pad and the anode pad are wire bonded to the integrated circuit die.

19. The method of claim 15 wherein the electronic component is glued to both the cathode pad and the anode pad.

20. The method of claim 15, further comprising: placing a vertical-cavity surface-emitting laser (VCSEL) onto the silicon die, wherein the VCSEL component comprises a light emitting active region;gluing a cathode to a top layer metal on the silicon die, wherein the cathode is present on the base of the VCSEL and the anode is a pad on the VCSEL.

21. The method of claim 20, wherein the cathode is glued to the top layer metal on the silicon die by a conductive die attach material