Patent Application
20140131327
This application is based on Japanese Patent Application No. 2012-248423, the contents of which are incorporated herein by reference.
The present invention relates to an optical system through which laser light passes and to a laser processing apparatus.
With a laser processing apparatus, laser light is transmitted to a processing head from a laser oscillator via an optical fiber, and the laser light is focused by lenses in the processing head to increase the energy density of the laser light, thereby welding or cutting a workpiece. Here, the workpiece is a metal, an alloy, or the like. Examples of the laser oscillator include a CO2 laser oscillator in which CO2 is used as a medium, a YAG laser oscillator in which a crystal having a garnet structure formed of oxides of yttrium and aluminum is used as a medium, a fiber laser oscillator in which an optical fiber itself is used as a medium, and so forth.
Patent Literature 1 discloses an invention related to a laser processing apparatus, which is a technique for increasing the depth of focus of laser light by employing an axicon lens as a focusing means, in order to achieve an increased processing speed. Note that, in the axicon lens described in Patent Literature 1, a flat surface is positioned on the laser-light-source side, that is, the side from which the laser light enters, and a conical surface is positioned on the side from which the laser light is emitted.
PTL 1 Japanese Unexamined Patent Application, Publication No. 2009-82958
PTL 2 Japanese Unexamined Patent Application, Publication No. Hei 9-108879
At a point (processing point) onto which a laser processing apparatus radiates laser light to perform processing of a workpiece, such as welding, cutting, or the like, the energy intensity distribution of the laser light becomes higher in a peripheral region than in a center region thereof, thus making the energy intensity at the processing point higher at the edge of the laser light. As a result, the processing precision can be increased as compared with a case in which the energy distribution at the processing point is higher in the center region than in the peripheral region.
Patent Literature 2 discloses a laser processing apparatus in which, by using an inversion optical system provided with two pairs of cylindrical lenses, an inner area and an outer area of the energy density distribution at a cross-section of a laser beam that follows a Gaussian distribution are inverted with respect to a plane that includes the optical axis of the laser beam. With the laser processing apparatus disclosed in Patent Literature 2, a high-quality laser beam impinges on the workpiece because the inner area and the outer area of the energy density distribution that follows a Gaussian distribution are inverted with respect to the plane that includes the optical axis of the laser beam.
However, because a laser beam is divided into two and the inner area and the outer area thereof are inverted, the cross-section of the laser beam at the position of the workpiece is not circular. Because of this, the workpiece can be processed only in the direction in which the laser beam comes into contact with the workpiece. In other words, with the laser processing apparatus disclosed in Patent Literature 2, the direction in which the workpiece can be processed is limited.
In addition, with the laser processing apparatus disclosed in Patent Literature 2, a laser beam is divided by the two pairs of cylindrical lenses, the inner area and the outer area thereof are inverted, and then, the laser beams are focused on one point on the workpiece by using a focusing lens. Because of this, the configuration of the optical system is very complicated, and the optical-axis adjustment is very difficult because it is necessary to separately adjust the optical axis of the laser beam before the division and the optical axes of the two divided laser beams, and because it is also necessary to make the two divided laser beams converge at the same position on the workpiece.
The present invention has been conceived in light of the above-described circumstances, and an object thereof is to provide an optical system and a laser processing apparatus with which the energy intensity distribution of laser light at a processing point can be made higher in a peripheral region than in a center region in a simple manner.
An optical system according to the present invention is provided with a collimating optical component that emits laser light including parallel rays; an axicon lens that has a circular conical shape and into which the light emitted from the collimating optical component enters; and a focusing optical component that focuses the light emitted from the axicon lens, wherein a conical surface of the axicon lens is positioned on the collimating optical component side, and a flat surface of the axicon lens is positioned on the focusing optical component side.
In this configuration, by passing through the axicon lens, the laser light including the parallel rays that has entered the axicon lens advances so that light in the center region of the entered light is directed outward, and light in the peripheral region of the entering light is directed inward, that is, toward the optical axis. As a result, laser light whose energy intensity is higher in the peripheral region than in the center region is obtained. By applying such laser light to the processing point in a workpiece, the processing precision at the processing point is enhanced because the energy intensity is increased at the edge of the laser light and the energy intensity thereof has a steep distribution tendency.
In addition, the energy intensity distribution can be reversed merely by providing the axicon lens, and thus, the energy intensity distribution can be made higher in the peripheral region than in the center region with a simple configuration. Furthermore, the laser light emitted from the axicon lens has a circular shape in a plane cut perpendicularly to the optical axis. Therefore, a workpiece can be cut with high precision, regardless of the relative directions in which the laser light and the workpiece are moved.
In addition, a laser processing apparatus according to the present invention is provided with the above-described optical system and a laser oscillator that generates laser light and that emits the laser light toward the optical system.
With the present invention, the energy intensity distribution of laser light at a processing point can be made higher in a peripheral region than in a center region in a simple manner.
An embodiment according to the present invention will be described below with reference to the drawings.
A laser processing apparatus 1 according to an embodiment of the present invention will be described below. As shown in
With the laser processing apparatus 1, laser light is transmitted to the processing head 4 from the laser oscillator 2 via the optical fiber 3, and the laser light is focused by lenses in the processing head 4 to increase the energy density of the laser light, thereby cutting a workpiece 20. Here, the workpiece 20 is a metal, an alloy, or the like.
The laser oscillator 2 is, for example, a fiber laser oscillator in which an optical fiber itself is used as a medium. In the case of a fiber laser oscillator, laser light having a wavelength of 1.07 μm to 1.08 μm can be obtained. The laser light generated by the laser oscillator 2 is transmitted to the optical fiber 3. Note that the present invention is not limited to a fiber laser, and it can be applied to a YAG laser, or the like.
The optical fiber 3 is connected to the laser oscillator 2 at one end and is connected to the processing head 4 at the other end. The optical fiber 3 transmits the laser light from the laser oscillator 2 to the processing head 4.
As shown in
As shown in
As described above, with the laser processing apparatus 1 of this embodiment, the laser oscillator 2 generates laser light; the generated laser light passes through the optical fiber 3; and the laser light is radiated from the processing head 4 toward the workpiece 20. When cutting the workpiece 20, the processing stage 5 on which the workpiece 20 is placed is moved in the X-Y plane, and thus, the workpiece 20 is cut in a straight line or in a curved line.
Next, the optical system 7 in the processing head 4 of the laser processing apparatus 1 according to this embodiment will be described with reference to
The optical system 7 is provided with, for example, a collimating lens group 8, an axicon lens 9, a focusing lens group 10, and so forth.
The collimating lens group 8 optically adjusts the laser light emitted from the laser entrance portion 6 to form collimated light. The collimated light generated by the collimating lens group 8 is radiated toward the axicon lens 9.
The axicon lens 9 is disposed between the collimating lens group 8 and the focusing lens group 10, allows the laser light radiated from the collimating lens group 8 to pass therethrough, and the light is emitted toward the focusing lens group 10.
The focusing lens group 10 focuses the laser light that has entered it after passing through the axicon lens 9. As a result, laser light whose energy intensity is high along the optical axis is obtained, thus making it possible to cut the workpiece 20.
Next, the axicon lens 9 will be described. The axicon lens 9 is an optical component having a circular conical shape, in which a first surface 9a is a conical surface, and a second surface 9b, a surface opposing the first surface 9a, is a flat surface. The first surface 9a, which is a conical surface, is disposed on the side from which the laser light enters, in other words, it is disposed so as to face the collimating lens group 8, and the second surface 9b, which is a flat surface, is disposed on the side from which the laser light is emitted, in other words, it is disposed so as to face the focusing lens group 10.
The axicon lens 9 is disposed so that the center axis of the circular cone coincides with the optical axis of the laser light, and the flat surface of the second surface 9b is disposed so as to be perpendicular to the optical axis.
Laser light having parallel rays enters the axicon lens 9, and the energy intensity distribution of the entering laser light is higher in a center region, which includes the optical axis, than in a peripheral region, as shown in
By disposing the axicon lens 9 so that the conical surface is positioned on the entrance side and the flat surface thereof is positioned on the exit side, the laser light passing through the axicon lens 9 advances so that the light in the center region thereof is directed outward and, the light in the peripheral region thereof is directed inward, that is, toward the optical axis. As a result, in the laser light exits from the axicon lens 9, the energy intensity distribution is reversed. In other words, the light in the center region whose energy intensity is higher when entering is directed toward an outer circumferential portion, and the light in the peripheral region whose energy intensity is lower when entering is directed toward the optical axis; thus, as shown in
In a plane that includes the processing point and that is cut perpendicularly to the optical axis, a high-energy-intensity region of the laser light emitted from the axicon lens 9 is distributed along the outer circumference of the circular shape, thus forming a ring shape. In a plane that includes the optical axis and that is cut along the optical axis, the energy intensity distribution of the laser light emitted from the axicon lens 9 is caldera-like, being higher in the peripheral region than in the center region.
As a result, the energy intensity is increased at the edge of the laser light and also has a steep distribution tendency. Therefore, in the case in which the laser light that has passed through the optical system 7 of this embodiment is used, the processing precision can be increased as compared with a case in which laser light having an energy distribution that is higher in a center region than in a peripheral region is used. In addition, because it is possible to reliably reverse the energy intensity distribution, it is possible to increase the difference in the energy intensity between the peripheral region where the energy intensity is high and the center region where the energy intensity is low. As a result, it becomes possible to cut a workpiece 20 having a greater thickness, for example, a steel plate having a thickness of 50 mm.
In addition, in a plane that is cut perpendicularly to the optical axis, the laser light emitted from the axicon lens 9 has a circular shape. Therefore, regardless of the relative directions in which the laser light and the workpiece 20 are moved, the workpiece 20 can be cut with high precision, and a thick workpiece can also be cut.
Although it is possible to form a ring-shaped high-energy-intensity region by using spherical aberration of a conventional spherical lens, because laser light tends to spread out when the distance from the focal position is increased, the length in the laser axis direction (depth of focus) has to be relatively small in a portion in which the ring shape is formed. On the other hand, in the case in which the axicon lens 9 is used, as in this embodiment, the tendency of the laser light to spread out is reduced, and thus, it is possible to increase the length in the laser axis direction (to increase the depth of focus) in the portion in which the ring shape is formed.
In the case in which the ring shape is formed by using spherical aberration of the conventional spherical lens, the laser light spreads out when the distance from the processing head 4 is increased, thus increasing the laser light diameter, which decreases the energy intensity. On the other hand, in the case in which the ring shape is formed by using an axicon lens, even when the laser light diameter is increased, the energy intensity distribution in the ring shape is maintained along the laser axis direction. Therefore, because the depth of focus of the portion in which the ring shape is formed is greater in this embodiment, it is possible to cut a relatively thick workpiece.
1 laser processing apparatus
2 laser oscillator
3 optical fiber
4 processing head
5 processing stage
6 laser entrance portion
7 optical system
8 collimating lens group (collimating optical component)
9 axicon lens
9
a first surface
9
b second surface
10 focusing lens group (focusing optical component)
20 workpiece
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-248423 | Nov 2012 | JP | national |
