Not applicable.
Not applicable.
Passive optical networks (PONs) have been widely deployed by operators to provide broadband services. PONs include fiber-to-the-homes (FTTHs). There are currently more than one hundred million FTTH users worldwide. Each FTTH user requires an optical network unit (ONU) at the customer's premise. Thus, cost reduction is important for large scale PON deployment.
In some embodiments, an optical device includes a laser diode configured to emit an optical signal, wherein the optical signal diffracts into a plurality of emitted optical signals, and a submount comprising a mirror, wherein the mirror is configured to at least partially reflect and redirect the plurality of emitted optical signals to produce a plurality of reflected optical signals, and wherein the mirror is further configured to substantially reshape a vertical far field angle of the optical signal.
In some embodiments, the plurality of reflected optical signals are substantially collimated and focused before being received at an optical fiber. In some embodiments, the mirror is a flat mirror, wherein a plane of the flat mirror is substantially parallel with an active layer of the laser diode. In some embodiments, the laser diode is flip-chip bonded to the submount. In some embodiments, the optical device further includes a lens positioned between the laser diode and the optical fiber, wherein the lens is configured to focus the plurality of emitted optical signals and the plurality of reflected optical signals together. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape, wherein the mirror is configured to reflect light by about 90 degrees. In some embodiments, the mirror is configured to focus the plurality of reflected optical signals toward an acceptance region of an optical fiber, and wherein the acceptance point on the optical fiber is located substantially at an image plane of the mirror.
In some embodiments, an optical device includes a laser diode configured to emit an optical signal, wherein the optical signal diffracts into a plurality of emitted optical signals, and a submount comprising a mirror, wherein the mirror is configured to at least partially reflect and redirect the plurality of emitted optical signals to produce a plurality of reflected optical signals, and wherein the mirror is further configured to substantially reshape a vertical far field angle and a horizontal far field angle of the optical signal.
In some embodiments, the plurality of emitted optical signals and the plurality of reflected optical signals are substantially collimated and focused before being received by the optical fiber. In some embodiments, the laser is flip-chip bonded to the submount. In some embodiments, the optical device further includes a lens positioned between the laser diode and the optical fiber, wherein the lens is configured to focus the plurality of emitted optical signals and the plurality of reflected optical signals together. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape, and wherein the mirror is configured to focus the plurality of reflected optical signals toward an acceptance point of an optical fiber. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape, and wherein the mirror is configured to reflect light by about 90 degrees.
In some embodiments, a method includes generating, via a laser diode disposed on a submount, an optical signal, wherein a mirror is disposed on the submount, wherein the optical signal is emitted from the laser diode as a plurality of emitted optical signals, reshaping a far field angle of the optical signal by reflecting, via the mirror, a portion of the plurality of emitted optical signals to produce a plurality of reflected optical signals, and directing the plurality of emitted optical signals and the plurality of reflected optical signals towards a core of an optical fiber.
In some embodiments, reshaping the far field angle comprises reducing a vertical far field angle relative to the laser diode. In some embodiments, the mirror is a flat mirror, wherein a plane of the flat mirror is substantially parallel with an active layer of the laser diode. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape, and wherein an image plane of the mirror is substantially located on the core of the optical fiber. In some embodiments, the mirror is a substantially doubly concave mirror with a substantially toroidal shape and wherein the mirror is configured to reflect light by about 90 degrees. In some embodiments, the method further includes transmitting, via an output aperture of the laser diode, the optical signal to an optical fiber, wherein a portion of the plurality of emitted optical signals are reflected from the mirror to the optical fiber.
These and other features will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings and claims.
For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts.
It should be understood at the outset that, although illustrative implementations of one or more embodiments are provided below, the disclosed systems and/or methods may be implemented using any number of techniques, whether currently known or in existence. The disclosure should in no way be limited to the illustrative implementations, drawings, and techniques illustrated below, including the exemplary designs and implementations illustrated and described herein, but may be modified within the scope of the appended claims along with their full scope of equivalents.
An optical transceiver in an optical line terminal (OLT) or an ONU of a PON typically includes a bi-directional optical assembly (BOSA). The BOSA includes a TOSA and a receiver optical assembly (ROSA). The TOSA comprises components for optical transmissions, such as a laser diode configured to generate an optical signal, such as light or a light beam, and a receptacle configured to receive an optical fiber. For example, the laser diode generates and emits light toward the optical fiber. However, the light emitted from the laser diode diffracts radially or elliptically as the light travels from the laser diode to the optical fiber. The far field angle of the optical signal emitted from the laser diode is the angle at which the light diverges or diffracts from an output of the laser diode after the light has emitted from the laser diode. The acceptance angle of the optical fiber is the angle at which the optical signal can be received by the optical fiber. Typically, the far field angle on a distributed feedback (DFB) laser is about 20° to 30°. In contrast, the typical acceptance angle of a single mode optical fiber is about 4° to about 5°. This large difference between the far field angle of the optical signal emitted from a laser diode, and the acceptance angle of the optical signal accepted by an optical fiber, results in a coupling loss of light in a TOSA. Thus, the BOSAs used in ONUs and OLTs in a PON experience a low coupling efficiency between the laser diodes and optical fibers, even though lenses are usually used to facilitate the coupling between the laser diodes and optical fibers.
Disclosed herein are embodiments of a TOSA that reduce the coupling loss between a laser diode and an optical fiber, and thus improve coupling efficiency and alignment tolerance of an optical signal in between the laser diode and the optical fiber. For example, a TOSA includes a submount comprising a mirror. The mirror is positioned on the submount such that an optical signal emitted from the laser diode is at least partially reflected such that a far field angle of the optical signal emitted from the laser diode is reduced. The disclosed embodiments involve depositing a submount underneath the laser diode and interposing a mirror between the laser diode and the submount. In one embodiment, a laser diode is flip-chip bonded onto the submount comprising a flat mirror. The term flip-chip bonding refers to flipping a component of the TOSA upside down so that a contact point that is typically on the top surface of the component is now flipped to become the bottom surface of the component. The contact point of the component abuts, or is substantially adjacent to, a contact point disposed on the submount. In another embodiment, the laser diode is disposed onto a mirrored submount with a concave mirror. In an embodiment, the concave mirror is a toroidal or spherical mirror. The flat mirror and the concave mirror are positioned on a location of a surface of the submount to reshape the far field angle of the laser diode to match the acceptance angle of the optical fiber. As such, the disclosed embodiments improve coupling efficiency and alignment tolerance, and thus reduce cost. Further, as the coupling loss is reduced, the requirements on the laser diode output power and slope efficiency are reduced. Therefore, the disclosed embodiments may improve laser diode yield and reduce laser diode cost.
The OLT 110 communicates with the ONUs 120 and another network. Specifically, the OLT 110 is an intermediary between the other network and the ONUs 120. For instance, the OLT 110 forwards data received from the other network to the ONUs 120 and forwards data received from the ONUs 120 to the other network. The OLT 110 comprises a transmitter and a receiver. When the other network uses a network protocol that is different from the protocol used in the PON 100, the OLT 110 comprises a converter that converts the network protocol to the PON 100 protocol and vice versa. The OLT 110 is typically located at a central location such as a central office (CO), but it may also be located at other suitable locations.
The ODN 130 is a data distribution system that comprises optical fiber cables, couplers, splitters, distributors, and other suitable components. The components may include passive optical components that do not require power to distribute signals between the OLT 110 and the ONUs 120. The components may also include active components such as optical amplifiers that do require power. The ODN 130 extends from the OLT 110 to the ONUs 120 in a branching configuration as shown, but the ODN 130 may be configured in any other suitable point-to-multipoint (P2MP) configuration.
The ONUs 120 communicate with the OLT 110 and a customer, and act as an intermediary between the OLT 110 and the customer. For instance, the ONUs 120 forward data from the OLT 110 to the customer and forward data from the customer to the OLT 110. The ONUs 120 comprise an optical transmitter that converts electrical signals into optical signals and transmits the optical signals to the OLT 110, and an optical receiver that receives optical signals from the OLT 110 and converts the optical signals into electrical signals. The ONUs 120 further comprise a second transmitter that transmits the electrical signals to the customer and a second receiver that receives electrical signals from the customer. ONUs 120 and optical network terminals (ONTs) are similar, and the terms may be used interchangeably. The ONUs 120 are typically located at distributed locations such as customer premises, but they may also be located at other suitable locations.
In an embodiment, each of the ONUs 120 and/or the OLT 110 comprises a TOSA and a ROSA. In various embodiments, the TOSA and the ROSA may be both housed within one transistor outline (TO)-can or the TOSA and the ROSA may be housed within separate TO-cans. The TOSA and the ROSA share components of the BOSA, such as a TO-cap surrounding the TOSA and BOSA, a lens positioned on or formed as part of the TO-cap, and a TO-header upon which the components of the TOSA and ROSA are positioned. The TOSA comprises components for optical transmission, and the ROSA comprises components for optical reception. For example, the TOSA comprises a laser diode, and the ROSA comprises a photodiode. The TOSA may also comprise a receptacle configured to receive and secure an optical fiber. In a TOSA, there may be a gap, or a distance, between the laser diode and the optical fiber. The lens is disposed between the laser diode and the optical fiber.
When an optical signal is emitted from the laser diode, the optical signal typically diverges, or diffracts, in the gap between the laser diode and the optical fiber. While the lens focuses and directs the optical signal emitted from the laser to the optical fiber during operation, the lens does not reduce the far field angle of the laser diode enough to match the acceptance angle of the optical fiber to reduce coupling loss. Typical schemes of reducing coupling loss to increase coupling efficiency and alignment tolerance involve making changes to the structure of the laser diode and/or the optical fiber. However, these changes to the structure of the laser diode and/or the optical fiber are often times intricate and too costly to implement across the millions of ONUs and OLTs in PONs.
Disclosed herein are embodiments of a TOSA that reduce coupling loss between a laser diode and an optical fiber. The embodiments disclosed herein do not involve making complex changes to the structure of the laser diode or the optical fiber. Instead, the embodiments disclosed herein involve interposing a submount comprising a mirror below the laser diode. In an embodiment, the light that is emitted from the laser diode and impinged onto the mirror is at least partially reflected and redirected. In an embodiment, the reflected light reshapes the far field angle of the laser diode.
In an embodiment, the laser diode is flip-chip bonded to the submount such that an active layer of the laser diode is adjacent to the submount. The output of the laser diode is relatively close to the submount when the laser diode is flip-chip bonded to the submount. In this embodiment, a mirror may be formed on a surface of the submount proximate to the laser diode such that the mirror is extended past the output of the laser diode. In this embodiment, when an optical signal is emitted from the output of the laser diode, the diverged beams of the optical signal in the vertical direction will be partially reflected by the mirror on the submount.
In another embodiment, the laser diode may not need to be flip-chip bonded to the submount. In this embodiment, the submount comprises a plateau that extends from an edge of the laser diode comprising the output. The plateau of the submount comprises the mirror. In this embodiment, the mirror is relatively proximate to the output of the laser diode without having to flip-chip bond the laser diode to the submount.
In another embodiment, the submount comprises a concave surface that is bent or curved by about 90° at a predefined distance from the output of the laser diode and the optical fiber. In an embodiment, a concave mirror is formed on the concave surface of the submount. In an embodiment, the concave mirror is a toroidal mirror or a spherical mirror that is radially or elliptically concave. The optical signals impinge on the concave mirror, and the concave mirror reflects the optical signals at substantially 90° and focuses the optical signals toward a point or an area. In an embodiment, the concave surface supports the concave mirror.
As shown in
As shown in
However, the mode field of an SSMF that is to accept the emitted light is circular, due to the cross-sectional shape of the fiber. The acceptance angle of the SSMF (i.e., the maximum angle of impinging light as it strikes the end face of the fiber) is about 5°. The angular mismatch between the mode field of the laser diode 203 and the acceptance angle of the optical fiber 206 may result in significant coupling loss between the two components.
In an embodiment, laser diode 203 is flip-chip bonded to the submount 406, where the upper surface 307 is coupled to the submount 406. In this way, laser diode 203 is flipped upside down so that contact points that are typically on the upper surface 307 are now adjacent to the submount 406. In an embodiment, the contact points on the upper surface 307 are solder bumps that are bonded to contact points on the submount 406 and/or the mirror 409. By positioning the active layer 306 of the laser diode 203 adjacent to the submount 406, heat dissipation in TOSA 400 is improved because the heat radiated from the active layer 306 is dissipated into the submount 406. Thus, flip-chip bonding the laser diode 203 to the submount 406 improves the performance of the laser diode 203 when operating in high temperatures.
As shown in
As shown in
As shown in
Even though the TOSA 400 may only reduce the vertical far field angle 323 of the laser diode 203 in a vertical direction, the TOSA 400 produces an output beam with a more circular shape, thereby substantially matching (or more closely approximating) the circular mode field 318 of the optical fiber 206. For example, the vertical far field angle 323 of the output beam or the light emitted from the laser diode 203 in the embodiment of the TOSA 400 shown in
In the TOSA 400, the lens 209 focuses and directs the emitted optical signals 310 and 421 emitted from the laser diode 203 and the reflected optical signals 416 and 419 to the acceptance region 450 of an optical fiber 206. The phases of the emitted optical signal 310 and the reflected optical signals 416 and 419 comprise substantially the same phase at the image plane of the lens 209, thus no optical interference occurs when the optical signals 310, 416, 419, and 421 reach the acceptance region 450 of the optical fiber 206.
In an embodiment, the mirror 409 may be disposed on the submount 406 such that the mirror 409 extends from an edge of the laser diode 203 at a length sufficient enough to reflect a portion of the optical signals that are downwardly vertically emitted from the laser diode 203. For example, as shown in
In an embodiment, the mirror 409 may be formed by polishing the surface of the submount 406. In this embodiment, the submount 406 has a reflective enough surface for reflecting the optical signals emitted from the laser diode 203. In another embodiment, a metal layer with reflective properties, such Ti and/or Au, is deposited on the surface of the submount 406 to comprise the mirror 409.
In an embodiment, the laser diode 203 is flip-chip bonded to the submount 406. As shown in
In an embodiment, the laser diode 203 is coupled to the submount 406 and/or the mirror 409 via electrical contacts 506 and 503. Electrical contacts 506 and 503 may be formed by soldering together metal contact points on the laser diode 203 to the metal contact points on the submount 406. As the active layer 306 comprises a waveguide and grating responsible for generating the light, the active layer 306 emits more heat than the substrate 303. Since the active layer 306 is substantially adjacent to the submount 406, the submount 406 is configured to dissipate some of the heat from the active layer 306. In this way, TOSA 400 provides more heat dissipation than a traditional TOSA.
The light emitted from the output aperture 350 of the laser diode 203 includes emitted optical signals 310 and 421 and reflected optical signals 416, 419, and 521. The reflected optical signals 416, 419, and 521 are emitted from the output aperture 350 and reflected from the mirror 409 upwards and to the right. It should be noted that the emitted optical signals 310 and 421 are not reflected from the mirror 409, but may still be captured by the lens 209, which focuses the optical signals 310, 419, 416, 521, and 421 and directs the focused optical signals 310, 419, 416, 521, and 421 toward the optical fiber.
The submount 606 is similar to the submount 406 in that the submount 606 may be disposed on either the TO-header 403 or a substrate on the TO-header 403. The mirror 409 is disposed on the plateau 609. The plateau 609 is a block comprising the same material as the submount 606, and includes a substantially planar surface that is substantially parallel to the active layer 306 of the laser diode 203. In the embodiment shown in
As shown in
Graph 700 illustrates the optical field along the vertical direction (y-axis 706) relative to the distance from the laser diode 203 (x-axis 703). Horizontal line 708 represents the height of the mirror 409. Portion 709 represents the optical field of the emitted optical signals and the reflected optical signals below the mirror 409, and portion 710 represents the optical field of the emitted optical signals and the reflected optical signals that are above the mirror 409. Curve 712 represents the optical field of the emitted optical signals, and curve 715 represents the optical field of the reflected optical signals that are reflected off mirror 409. Curve 718 represents the total optical power of the combined optical fields represented by curve 712 and curve 715. Note that the optical field vanishes beneath the mirror, so only the portions of the curves above the mirror represent the optical field.
In an embodiment, the optical signal 220 emitted from the laser diode 203 may be approximated by an elliptical Gaussian beam. The propagation and diffraction of the optical signal 220 may be analyzed by considering two-dimensional propagations in vertical direction (denoted as x) and the direction toward the optical fiber 206 (denoted as z) without including the horizontal direction since the mirror 409 does not modify the beam propagation in the horizontal direction. The laser diode 203 is positioned at a distance, denoted as h, above the mirror 409, which is slightly above an optical axis of the optical fiber 206. The electrical field of a two-dimensional Gaussian beam from emitted optical signal 220 is as follows:
where k is the wave number of the laser diode 203, or DFB laser, output, and w0 is the waist size of the beam.
The mirror 409 on the submount 406 and 606 essentially folds the electrical field for x<0, and the electrical field of the reflected optical signals 416 and 419 may be expressed as:
For simplicity, the lens 209 may be assumed as a thin lens, the ABCD matrix of the lens 209 is as follows:
The transformation of a Gaussian beam by a thin lens 209 is as follows:
where j represents the imaginary component, w1 and w2 are the spot sizes of the Gaussian beam before and after the thin lens 209, respectively, and f is the focal length of the thin lens 209. Therefore,
For the thin lens 209, w1 is about the same as w2. Equating the real and imaginary components of both sides of equation (5) results in the following:
For the incident beam, both E(x, z) and Er(x, z), the distance of the object, for example, the laser diode 203 front facet, to the lens 209 is distance 430 (do). Then the radius of curvature at the z=do is as follows:
The spot-size is as follows:
w
1
=w(do)=w0√{square root over (1+(do/zR)2)}≈w0do/zR for zR<<do (8)
Therefore, the curvature of the Gaussian beam after passing the lens 209 is as follows:
For R2 <0, the lens 209 can focus the diverged Gaussian beam to a narrower beam waist. The phase of the light at the lens 209 for both E(x, z) and Er(x, z) fields are as follows:
Therefore, on the z=do plane, the phase of φEr(x, do) is different from E(x, z). In some embodiments, there may be an interference pattern at the lens 209. Even though the radius of curvature for E(x, z) and Er(x, z) fields is the same before or after the lens 209, the small displacement between these two fields creates the interference pattern.
For Gaussian beam propagation in free space, the ABCD matrix is as follows:
where di, is the propagation distance. Then, after a distance of di, the Gaussian beam is transformed to a beam with radius of curvature
when 1+diR2 =0, where distance 433 (di) may be expressed as
the radius of curvature is infinity. This happens at
where R2<0 for both E(x, z) and Er(x, z) fields. When the radius of curvature is infinite, the phase is constant on the z=di plane, as both fields go through the same transformation. The field at di=−1/R2 plane as follows:
where w32(di)=w02(1−di/f)2+w02(di/zr)2
However, the centers of the transformed Gaussian fields Er (x,d0) and E(x, z) have a small displacement, hi=hdi/do. This displacement is required to be smaller than the diameter of the optical fiber 206. Thus, the distance between the mirror 409 and the laser diode 203 front facet may be small, which is achieved by flip-chip bonding the laser diode 203 to the submount 406. In addition, the half Gaussian beam for the field E(x, z) is tilted slightly downward by an angle of θ=−h/do, while the half Gaussian beam for the field Er(x, z) is tilted slightly upward by an angle of θ=−h/do. If h is significantly less than do, where h is about 1 μm to about 2 μm and do>1 millimeter (mm), this tilt may be neglected.
The laser diode 203 may or may not be flip-chip bonded to the submount 806. The surface proximate to the substrate of the laser diode 203 is coupled to submount 806. The submount 806 is similar to the submount 406 in that submount 806 also comprises a dielectric, such as AIN or another suitable material. Submount 806 may also be disposed on either the TO-header 403 or a substrate. However, unlike submount 406, submount 806 is substantially L-shaped.
The mirror 809 is a curved or substantially doubly concave mirror that is disposed on at least the interior surface of the submount 806. The mirror 809 is a semi-spherical or toroidal mirror that has a reflective surface, which curves downward to create a curved trough-like shape, curving substantially ninety degrees away from the laser diode 203 in the embodiment shown. Alternatively, other amounts of curvature can be employed. For example, the mirror 809 is a semi-tubularly concave surface including a curving, which is a substantially 90° bend. In an embodiment, the curving is around a vertex of the mirror 809. In an embodiment, a vertex of the mirror 809 is disposed at a distance 880 from the acceptance region 450 of the optical fiber 206. The vertex of the mirror 809 may be the center point of the mirror 809 in some embodiments. The distance 880 is based on the optical field of the light emitted from the laser diode 203 and an angle of incidence of light with respect to the mirror 809.
As shown in
In an embodiment, the substantially doubly concave shape of the mirror 809 receives the emitted optical signals 812, 815, 818, and 822, and redirects the reflected optical signals 825, 828, 831, and 834 at a substantially 90° angle toward a focal point located at an image plane. The focal point is a point in space at an image plane at which optical signals incident toward the mirror and reflected off the mirror 809 will meet after reflection. In an embodiment, TOSA 800 can be structured so that the focal point of the mirror 809 is substantially on or around the acceptance region 450 on the optical fiber 206. This way, the reflected optical signals 825, 828, 831, and 834 automatically converge toward the core of the optical fiber, thereby reducing the far field angle 230 of the laser diode 203. In this embodiment, there may be little to no coupling loss between the laser diode 203 and the optical fiber 206.
In some embodiments, a lens 209 may be positioned in between the submount 806 and the optical fiber 206. However, since the lens 209 is typically used to focus reflected optical signals, such a lens 209 is not needed in this embodiment. This is because the reflected optical signals 825, 828, 831, and 834 are substantially focused to a focal point due to the substantially doubly concave shape of mirror 809. Therefore, the TOSA 800 eliminates the need for a lens 209 in an ONU 120 or OLT 110. Instead, a less costly glass window can be disposed in place of the lens 209.
As shown in
In an embodiment, the mirror 809 can extend along the submount 806 so long as the mirror 809 reflects the light emitted from the laser diode 203. The mirror 809 comprises a vertex 910. The vertex 910 is the geometric center of the concave structure of the mirror 809, and the mirror 809 curves radially around the vertex 910. The mirror 809 is a semi-spherical or toroidal mirror that has a reflective surface, which bulges inward (away from the light emitted from the laser diode 203). For example, the mirror 809 is also a semi-tubularly concave surface including a curving region, which is a substantially 90° bend around the vertex 910 of the mirror 809 in the embodiment shown.
The light emitted from the output aperture 350 of the laser diode 203 includes emitted optical signals 812 and 815 and reflected optical signals 825 and 828. The emitted optical signals 812 and 815 may be optical signals in a horizontal direction or a vertical direction that are emitted from the output aperture 350. The emitted optical signals 812 and 815 impinge on a surface of the mirror 809. The emitted optical signals 812 and 815 are reflected from the surface of the mirror 809 based on a reflection angle 930 of the mirror 809. The reflection angle 930 is the angle by which emitted optical signals 812 and 815 are reflected to produce the reflected optical signals 825 and 828. In an embodiment, the emitted optical signals 812 and 815 are reflected by the mirror 809 at a reflection angle 930 of substantially 90° to form the reflected optical signals 825 and 828. The reflected optical signals 825 and 828 may be optical signals in a horizontal direction or a vertical direction that are reflected by the mirror 809. The concave shape of the mirror 809 focuses the reflected optical signals 825 and 828 to a focal point. In an embodiment, the concave shape of the mirror 809 reshapes and reduces the far field angle 230 of the laser diode 203. Therefore, the portion 900 can be structured such that the image of reflected optical signals 825 and 828 is set to be the acceptance region 450 at a core of the optical fiber 206.
The concave surface 1010 comprises a vertex 910. The vertex 910 is a point or an area at the center of the concave surface 1010. In an embodiment, the mirror 809 or the concave surface 1010 curves around the vertex 910. The deflection angle 930 of the mirror 809 is about 90°. However, as should be appreciated, the deflection angle 930 of the mirror 809 can be any angle such that laser diode 203 emits optical signals that are reflected off of the concave surface 1010 onto a focus point, which is at an acceptance point of the optical fiber 206. In an embodiment, the deflection angle 930 can be based on the focal distance 920, the distance 880 from the mirror 809 to the acceptance region 450 of the optical, and/or the optical field of the optical signals emitted from the laser diode 203.
As shown in
In an embodiment where the mirror is the flat mirror 409, a lens 209 may be used to further direct the emitted optical signals and the reflected optical signals to the optical fiber 206, and the vertical far field angle 323 is reduced. In an embodiment where the mirror is a substantially doubly concave mirror 809, a lens is not required, and both the vertical far field angle 323 and the horizontal far field angle 326 are reduced. At step 1130, the reflected optical signals are directed towards a core of an optical fiber. For example, the reflected optical signals are directed to an acceptance region 450 of the optical fiber 206. For example, the acceptance region 450 may be located at a core of the optical fiber 206. In an embodiment, the optical transceiver is structured such that at the focus point, the reflected optical signals are substantially collimated together at the acceptance region 450 of the optical fiber 206.
The processor 1230 is implemented by any suitable combination of hardware, middleware, firmware, and software. The processor 1230 may be implemented as one or more CPU chips, cores (e.g., as a multi-core processor), field-programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), or digital signal processors (DSPs). The processor 1230 is in communication with the ingress ports 1210, Rx 1220, Tx 1240, egress ports 1250, and memory 1260. In an embodiment, the processor 1230 comprises an optical module 1270. In an embodiment, the optical module 1270 may be configured to control the laser diode 203.
The memory 1260 comprises one or more disks, tape drives, or solid-state drives and may be used as an over-flow data storage device, to store programs when such programs are selected for execution, and/or to store instructions and data that are read during program execution. The memory 1260 may be volatile and/or non-volatile and may be read-only memory (ROM), random-access memory (RAM), ternary content-addressable memory (TCAM), or static random-access memory (SRAM).
In an embodiment, the disclosure includes a means for emitting an optical signal, wherein the optical signal diffracts into a plurality of emitted optical signals, and a means for at least partially reflecting and redirecting the emitted optical signals to produce a plurality of reflected optical signals, and wherein the mirror is further configured to reshape a far field angle of the optical signal.
In an embodiment, the disclosure includes a means for emitting an optical signal, wherein the optical signal diffracts into a plurality of emitted optical signals, at least partially reflecting and redirecting the plurality of emitted optical signals to produce a plurality of reflected optical signals, and wherein the mirror is further configured to reshape a far field angle of the optical signal, and receiving the plurality of emitted optical signals and the plurality of reflected optical signals.
In an embodiment, the disclosure includes a means for generating an optical signal, wherein a mirror is disposed on the submount, wherein the optical signal is emitted from the laser diode as a plurality of emitted optical signals, a means for reshaping a far field angle of the optical signal by reflecting a portion of the plurality of emitted optical signals to produce a plurality of reflected optical signals, and directing the plurality of emitted optical signals and the plurality of reflected optical signals towards a core of an optical fiber.
While several embodiments have been provided in the present disclosure, it may be understood that the disclosed systems and methods might be embodied in many other specific forms without departing from the spirit or scope of the present disclosure. The present examples are to be considered as illustrative and not restrictive, and the intention is not to be limited to the details given herein. For example, the various elements or components may be combined or integrated in another system or certain features may be omitted, or not implemented.
In addition, techniques, systems, subsystems, and methods described and illustrated in the various embodiments as discrete or separate may be combined or integrated with other systems, modules, techniques, or methods without departing from the scope of the present disclosure. Other items shown or discussed as coupled or directly coupled or communicating with each other may be indirectly coupled or communicating through some interface, device, or intermediate component whether electrically, mechanically, or otherwise. Other examples of changes, substitutions, and alterations are ascertainable by one skilled in the art and may be made without departing from the spirit and scope disclosed herein.
The present application claims benefit of U.S. Provisional Patent Application No. 62/353,777 filed Jun. 23, 2016 by Ning Cheng, et. al. and entitled “Optical Transceiver With a Mirrored Submount and a Distributed Feedback (DFB) Laser for Laser-to-Fiber Coupling,” which is incorporated herein by reference as if reproduced in its entirety.
Number | Date | Country | |
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62353777 | Jun 2016 | US |