Semiconductor opto-electronic devices including semiconductor optical waveguides and methods of manufacture thereof are disclosed.
There is a wide-ranging demand for increased communications capabilities, including more channels and greater bandwidth per channel. The needs range from long distance applications such as telecommunications between two cities to extremely short range applications such as the data-communications between two functional blocks (fubs) in a semiconductor circuit with spacing on the order of a hundred microns.
Optical fibers can carry information encoded as optical pulses over long distances. The advantages of optical media include vastly increased data rates, lower transmission losses, lower basic cost of materials, smaller cable sizes, and almost complete immunity from stray electrical fields. Other applications for optical fibers include guiding light to awkward places (e.g., surgical applications), image guiding for remote viewing, and various sensing applications.
Optical fibers or waveguides provide an economical and higher bandwidth alternative to electrical conductors for communications. A typical optical fiber includes a silica core, a silica cladding, and a protective coating. The index of refraction of the core is higher than the index of refraction of the cladding to promote internal reflection of light propagating down the silica core.
Waveguides have been developed comprising a mixture of silica (SiO2) and silicon nitride (Si3N4), often referred to as SiON. The indexes of refraction of the core and cladding can be controlled by controlling the nitrogen content. That is, the nitrogen content of the core will be higher than that of the cladding to give the core a suitably higher index of refraction than the cladding.
However, the differences in the index of refraction of the core and cladding also result in birefringence, or the separation of the light pulse or ray into two unequally refracted pulses or rays. As a result, part of the light transmission is lost. For fiber optic communication systems where long range fiber optic communication is utilized, there is a need for optical and electro-optic devices that are substantially free from birefringence.
In general, birefringence is the difference between a refractive index nTM for the TM mode having a field component perpendicular to the substrate and a refractive index nTE for the TE mode having a field component parallel to the substrate, or, the birefringence equals nTM-nTE.
The majority of fiber optic telecommunications systems use standard single-mode silica fiber that does not preserve the polarization of the transmitted light. For such systems, the polarization state of the light signal in the optical fiber at any point and at any time is unknown and subject to variation over time and distance as a result of environmental and other changes that occur along the transmission path of the signal. If devices placed at any point in the fiber transmission path or at its end have response characteristics that depend on the polarization state of the light (i.e., polarization dependence), the signal may be degraded or lost altogether.
As integrated optical and electro-optical devices are employed in fiber optic systems for which the polarization state of the light signal is unknown, a need arises to circumvent or minimize the consequences of the polarization dependence and birefringence of these devices.
The most popular approach for reducing the effects of birefringence has been to introduce additional components to control the state of polarization of the light signal before its introduction to the polarization-sensitive device.
A more satisfactory approach would be to provide a waveguide device with a small polarization dependence and birefringence thereby causing only negligible transmission degradation.
To provide an optical waveguide and other opto-electronic devices with reduced birefringence and reduced polarization dependence, waveguide and devices are made from binary systems of silica and silicon nitride. Using a plasma enhanced chemical vapor deposition (PECVD) process, a waveguide 10 having the structure illustrated in
To fabricate the waveguide 10 of
The entire structure is then annealed to provide the interlayer diffusion illustrated in FIG. 3. The temperature of the anneal process will typically range from about 1000° C. to about 1300° C., more preferably at the lower end of this range, from about 1000° C. to about 1100° C. It will be noted that only small differences in the nitrogen content (or the oxygen content) the cladding 12 and core layers 13 are required in order to generate a sufficient index of a refraction. Specifically, the relatively steep slope of the refractive index illustrated in
Turning to
In contrast, when strong intermixing and interdiffusion does not occur, there will be a natural surface tension forming between two crystallized materials. Therefore, the simultaneous flow will induce a straightening of the interface between the two materials thereby reducing sidewall roughness. By maintaining the process temperature constant during the deposition of the cladding 12 and core layers 13, surface tension between the two materials is reduced thereby reducing the stress-induced birefringence.
Further, as illustrated in
The differences in nitrogen content and oxygen content of the cladding 12 and core layers 13 will depend upon the surface area of the structure. Using the fraction x for SiO2 content in the cladding and y for Si3N4 content in the cladding where x+y=1, when the surface area of the cladding 12 is about 1×1 μm, the Si3N4 content of the core layers 13 should exceed the Si3N4 content of the cladding 12 by 0.1 to about 0.2. In contrast, when the surface area of the cladding is about 3×3 μm, the Si3N4 content of the core layers 13 should exceed the Si3N4 content of the cladding 12 by 0.03 to 0.05. When the surface area of the cladding 12 is about 6×6 μm, the Si3N4 content of the layers 13 of the core 14 should exceed the Si3N4 content of the cladding 12 by about 0.01 to about 0.03. In other words, the larger the surface area of the cladding 12, a lower difference in Si3N4 content between the cladding 12 and core layers 13 is required. The same is also true for SiO2 content.
In the foregoing detailed description, the disclosed structures and methods have been described with reference exemplary embodiments. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of this disclosure. The above specification and figures are to be regarded as illustrative, rather than restrictive. Particular materials selected herein can easily be substituted for other materials that will be apparent to those skilled in the art and would nevertheless remain equivalent embodiments of the disclosed structures and methods.
This is a divisional of application Ser. No. 10/136,729 filed on May 1, 2002, now U.S. Pat. No. 6,670,210.
Number | Name | Date | Kind |
---|---|---|---|
4420873 | Leonberger et al. | Dec 1983 | A |
4518219 | Leonberger et al. | May 1985 | A |
4614873 | Umeji | Sep 1986 | A |
5436991 | Sunagawa et al. | Jul 1995 | A |
5465860 | Fujimoto et al. | Nov 1995 | A |
5540346 | Fujimoto et al. | Jul 1996 | A |
5604835 | Nakamura et al. | Feb 1997 | A |
5732179 | Caneau et al. | Mar 1998 | A |
5734703 | Hiyoshi | Mar 1998 | A |
5825047 | Ajisawa et al. | Oct 1998 | A |
5917980 | Yoshimura et al. | Jun 1999 | A |
5943465 | Kawaguchi et al. | Aug 1999 | A |
5961924 | Reichert et al. | Oct 1999 | A |
6075908 | Paniccia et al. | Jun 2000 | A |
6083843 | Ohja et al. | Jul 2000 | A |
6147366 | Drottar et al. | Nov 2000 | A |
6166846 | Maloney | Dec 2000 | A |
6178281 | Sautter et al. | Jan 2001 | B1 |
6195478 | Fouquet | Feb 2001 | B1 |
6215577 | Koehl et al. | Apr 2001 | B1 |
6268953 | Maloney | Jul 2001 | B1 |
6269199 | Maloney | Jul 2001 | B1 |
6304706 | Sugita et al. | Oct 2001 | B1 |
6501895 | Bloechl et al. | Dec 2002 | B1 |
6518200 | Lin | Feb 2003 | B2 |
20020132386 | Bazylenko | Sep 2002 | A1 |
Number | Date | Country | |
---|---|---|---|
20030207485 A1 | Nov 2003 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10136729 | May 2002 | US |
Child | 10443332 | US |