Claims
- 1. A low profile optical wavelength division multiplexer and/or demultiplexer device wherein n channels are transmitted on n different wavelengths, and said device is carried in a pluggable module, and adapted for detachable connection to a host device, comprising:
a pluggable module having first and second ends, a three strata, low profile optical subassembly having a substrate forming a first stratum, a molded plastic coupling module forming a second stratum, and an optical block forming a third stratum, said molded plastic coupling module carrying a fiber optic cable receptacle, said substrate carrying either a plurality of n lasers or n photodetectors, said molded coupling module connected to said substrate and carrying a plurality of n lenses for either receiving light from said n lasers or focusing light on said n photodetectors, said optical block connected to or integrally formed with said molded coupling module, said optical block having a reflective coating, a plurality of n filters whereby said n channels are reflected between said reflective coating on said optical block and said plurality of n filters, and wherein each of n channels passes through one of said filters and through one of said n lens surfaces, said three strata adapted to be connected together such that the optical elements are passively aligned with said fiber optic cable receptacle and no postassembly alignment is required, means for mounting said optical subassembly in said pluggable module so that said fiber optic cable receptacle is positioned at said first end of said housing.
- 2. The apparatus of claim 1 wherein said second stratum and said third stratum are integrally molded together with said plurality of on filters embedded in the integrally molded piece.
- 3. The apparatus of claim 1 wherein each of said three strata is separately formed.
- 4. The apparatus of claim 1 wherein said pluggable module has a metallic cover, and wherein said substrate is thermally connected to said metallic cover to facilitate heat transfer from said substrate to said metallic cover.
- 5. The apparatus of claim 1 wherein said optical subassembly is adapted to be assembled and tested before being mounted in said pluggable module.
- 6. The apparatus of claim 1 further comprising means for horizontally plugging said pluggable module into said host device to achieve an electrical interface between said module and said host device.
- 7. The apparatus of claim 1 further comprising means for vertically plugging said pluggable module into said host device to achieve an electrical interface between said module and said host device.
- 8. A low profile optical wavelength division multiplexer and/or demultiplexer device wherein n channels are transmitted on n different wavelengths, and said device is carried in a Giga-bit Interface Converter (GBIC) compatible housing, and adapted for detachable connection to a host device, comprising:
a GBIC compatible housing having first and second ends, a three layered, low profile optical subassembly having a substrate forming a first layer, a molded plastic coupling module forming a second layer, and an optical block forming a third layer, said molded plastic coupling module carrying a fiber optic cable receptacle, said substrate carrying either a plurality of n lasers or n photodetectors, said molded coupling module connected to said substrate and carrying a plurality of n lenses for either receiving light from said n lasers or focusing light on said n photodetectors, said optical block connected to said molded coupling module, said optical block having a reflective coating, a plurality of n filters mounted between said molded coupling module and said optical block, whereby said n channels are reflected between said reflective coating on said optical block and said plurality of n filters, and wherein each of n channels passes through one of said filters and through one of said n lens surfaces, said three layers adapted to be connected together such that the optical elements are passively aligned with said fiber optic cable receptacle and no postassembly alignment is required, means for mounting said optical subassembly in said GBIC compatible housing so that said fiber optic cable receptacle is positioned at said first end of said housing, and means for interfacing said optical subassembly to said host device at said second end of said housing.
- 9. The apparatus of claim 8 wherein said GBIC compatible housing has a metallic cover, and wherein said substrate is thermally connected to said metallic cover to facilitate heat transfer from said substrate to said metallic cover.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This is a continuation-in-part of U.S. patent application Ser. No. 09/347,490 filed Jul. 2, 1999.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09347490 |
Jul 1999 |
US |
Child |
09805514 |
Mar 2001 |
US |