Optically Pumped Semiconductor Device

Abstract

A semiconductor device comprising an optically pumped vertical emitter having an active vertical emitter layer (3), and a pump radiation source, which is used to generate a pump radiation field which propagates in the lateral direction and optically pumps the vertical emitter layer (3) in a pump region, the wavelength of the pump radiation field being smaller than the wavelength of the radiation field (12) generated by the vertical emitter. The pump radiation source has an active pump layer (2), which is arranged downstream of the vertical emitter layer (3) in the vertical direction and which at least partly overlaps the vertical emitter layer as seen in the vertical direction, the active pump layer (2) being arranged in such a way that the pump radiation field generated during operation has a higher power than a parasitic laterally propagating radiation field generated by the vertical emitter layer (3) or that the generation of a parasitic laterally propagating radiation field by the vertical emitter layer (3) is suppressed.

Description

IN THE FIGURES

FIG. 1 shows a schematic sectional illustration of a first exemplary embodiment of a semiconductor device according to the invention,

FIG. 2 shows a schematic sectional illustration of a second exemplary embodiment of a semiconductor device according to the invention,

FIG. 3 shows a schematic sectional illustration of a third exemplary embodiment of a semiconductor device according to the invention,

FIG. 4 shows a schematic sectional illustration of a fourth exemplary embodiment of a semiconductor device according to the invention,

FIG. 5 shows a schematic sectional illustration of a fifth exemplary embodiment of a semiconductor device according to the invention,

FIG. 6 shows a schematic sectional illustration of a sixth exemplary embodiment of a semiconductor device according to the invention,

FIG. 7 shows a graphical illustration of the field profile of the pump radiation field outside the pump region, and

FIG. 8 shows a graphical illustration of the field profile of the pump radiation field within the pump region.

Identical or identically acting elements are provided with the same reference symbols in the Figures.

The exemplary embodiment of an optically pumped semiconductor device according to the invention as illustrated in FIG. 1 has a semiconductor body 1 comprising an active pump layer 2 and also an active vertical emitter layer 3, which is arranged downstream of the active pump layer 2 in the vertical direction, the pump layer 2 and the vertical emitter layer 3 being arranged parallel to one another.

The pump layer 2 and the vertical emitter layer 3 are furthermore formed within a waveguide 10 adjoined by a first cladding layer 8 and a second cladding layer 9 disposed opposite the two.

Arranged downstream of the waveguide in the vertical direction are a Bragg mirror 4 and a substrate 5, which is provided with a contact metalization 6 on the side remote from the semiconductor layers. Corresponding thereto, on the opposite side of the semiconductor body, a contact layer 17 and a second contact metalization 7, which has a cutout within the pump region 11, are applied on the first cladding layer 8. In said region, the radiation 12 that is generated by the vertical emitter layer and emitted in the vertical direction is coupled out.

Moreover, a charge-carrier-selective barrier layer 13 is arranged between the pump layer 2 and the vertical emitter layer 3.

The exemplary embodiment shown may be realized for example on the basis of the AlInGaAl material system ((Al_xIn_1-x)_yGa_1-yAs, where 0≦x≦1, 0≦y≦1) or the AlInGaP material system ((Al_xIn_1-x)_yGa_1-yP, where 0≦x≦1, 0≦y≦1), in the last-mentioned case for instance with a pump wavelength of 630 nm and an emission wavelength of the vertical emitter of approximately 650 nm. In this case, a current blocking layer, for example an Al_0.5In_0.5P layer in an (Al_0.5Ga_0.5)_0.5In_0.5P waveguide, may be provided as the barrier layer 13.

For an AlInGaAs-based structure corresponding to FIG. 1, the layer material and thickness and also the doping are specified by way of example in the table below. In the case of this structure, the Bragg mirror 4 comprises 30 layer pairs each comprising an Al_1.0Ga_0.0As layer and an Al_0.2Ga_0.8As layer and, on the side remote from the substrate, a terminating Al_1.0Ga_0.0As layer. In the case of an oxidized Bragg mirror, that is to say in which the Al_1.0Ga_0.0As layers are oxidized to form Al₂O₃ layers, approximately six layer pairs are sufficient.

Thickness	Material	Doping	Element
200 nm	GaAs	p	C, 1 × 1020 cm−3	Contact layer
				17
1500 nm	Al0.6Ga0.4As	p	C, 1 × 1018 cm−3	Cladding
				layer 8
120 nm	Al0.2Ga0.8As	—	—	Waveguide 10
10 nm	In0.13Ga0.87As	—	—	Active pump
				layer 2
120 nm	Al0.2Ga0.8As	—	—	Waveguide 10
120 nm	Al0.6Ga0.4As	n	Te, 1 × 1017 cm−3	Barrier layer 13
225 nm	Al0.2Ga0.8As	n	Te, 1 × 1017 cm−3	Waveguide 10
10 nm	In0.16Ga0.84As	n	Te, 1 × 1017 cm−3	Active
				vertical emitter
				layer 3
375 nm	Al0.2Ga0.8As	n	Te, 1 × 1017 cm−3	Waveguide 10
375 nm	Al0.6Ga0.4As	n	Te, 1 × 1017 cm−3	Cladding
				layer 9
75 nm	Al1.0Ga0.0As	n	Te, 1 × 1017 cm−3	Bragg Mirror 4
75 nm	Al0.2Ga0.8As	n	Te, 1 × 1017 cm−3
(30x)
75 nm	Al1.0Ga0.0As	n	Te, 1 × 1017 cm−3
(30x)
	GaAs	n	Te, 1 × 1017 cm−3	Substrate 5

It goes without saying that the invention is not restricted to this material system, but rather can also be realized, depending on wavelength and other requirements, on the basis of other semiconductor material systems such as, for example, ((Al_xIn_1-x)_yGa_1-yAs₂P_1-2 where 0≦x≦1, 0≦y≦1, 0≦z≦1 or (Al_xIn_1-x)_yGa_1-yN where 0≦x≦1, 0≦y≦1.

In the exemplary embodiment shown, the pump radiation source is preferably embodied as an edge emitting pump laser, the laser-active medium of which constitutes the pump layer 2. The laser resonator is formed by the lateral areas 16 that laterally delimit the pump layer 2, so that the vertical emitter layer 3 and, in particular, the pump region 11 of the vertical emitter are arranged within the pump laser resonator.

During operation, charge carriers for generating the pump radiation are injected into the semiconductor body via the contact metalizations 6 and 7. In this case, holes are injected as first charge carrier type from the coupling-out side or the contact metalization 7, and electrons are injected as second charge carrier type via the opposite contact metalization 6.

On account of the different mobilities of the two charge carrier types, holes have a higher net trapping rate than electrons in the exemplary embodiment shown. Therefore, the pump layer 2 is arranged closer to the contact metalization 7 than the vertical emitter layer, so that the holes which are coupled in by means of the contact metalization 7 are preferably available for radiative recombination in the pump layer 2 and generate the pump radiation field there.

Moreover, the charge-carrier-selective barrier layer 13 serves to prevent holes from diffusing into the underlying vertical emitter layer 3, with the result that the probability of the injected charge carriers recombining in the pump layer 2 is increased further.

In the case of the exemplary embodiment illustrated in FIG. 1, moreover, the substrate 5, the Bragg mirror 4, the cladding layer 9, the subsequent region of the waveguide 10, the vertical emitter layer 3, the subsequent region of the waveguide 10 and the barrier layer 13 are doped with a first conductivity type. The subsequent region of the waveguide, the pump layer 2 and the succeeding region of the waveguide are undoped, and the first cladding layer 8 on the top side is doped with the second conductivity type. By way of example, the first conductivity type corresponds to an n-type doping and the second conductivity type corresponds to a p-type doping.

On account of this doping, a space charge zone forms in the region of the pump layer 2, the vertical emitter layer 3 being arranged outside said space charge zone.

As already described, in the case of the invention the pump layer 2 is embodied in such a way that the pump radiation generated has a shorter wavelength than the radiation 12 that is generated by the vertical emitter layer 3 within the pump region 11 and is emitted in the vertical direction. If the pump layer 2 and the vertical emitter layer 3 exhibited equality in this case, then on account of the wavelength difference, in the event of simultaneous electric excitation, a laterally propagating radiation field would initially be excited by the vertical emitter layer 3. This is undesirable for the reasons mentioned and is intended largely to be avoided.

For this purpose, three measures are provided in the case of the exemplary embodiment shown in FIG. 1, namely the small distance between the pump layer and that side from which the charge carriers having the higher net trapping rate are injected, the arrangement of a barrier layer 13 between the pump layer 2 and the vertical emitter layer 3, and the formation of a space charge zone, so that the pump layer 2 lies within the space charge zone and the vertical emitter layer 3 lies outside the space charge zone. These three measures cancel an equality of the pump layer 2 and the vertical emitter layer 3 in respect of simultaneous electrical excitation, so that a laterally propagating pump radiation field is primarily generated by the pump layer 2.

Depending on the intensity of the electrical excitation, the generation of a parasitic laterally propagating radiation field by the vertical emitter layer 3 is suppressed completely or at least to such a great extent that the power of the pump radiation field is greater than the power of the parasitic radiation field. It should be noted that, in the context of the invention, just one of the measures mentioned may suffice for avoiding a parasitic radiation field. On the other hand, particularly in the event of intense excitation, even further measures may be required to prevent the vertical emitter layer from building up a laterally propagating radiation field.

The exemplary embodiment illustrated in FIG. 2 has a construction corresponding to FIG. 1 in respect of the pump layer 2, the vertical emitter layer 3, the intervening barrier layer 11, the waveguide 10, the adjoining cladding layers 8 and 9 and also the Bragg mirror 4.

In contrast to the exemplary embodiment illustrated in FIG. 1, however, radiation is coupled out through the substrate 5, the contact metallization 6 applied on the substrate having a cutout within the pump region for coupling out the radiation 12 emitted in the vertical direction. By contrast, the opposite contact metalization 7 arranged on the Bragg mirror 4 is formed in a continuous manner and without a cutout.

The exemplary embodiment illustrated in FIG. 2 requires the substrate 5 to be sufficiently radiation-transmissive in respect of the vertically emitted radiation 12 generated. Since electrically conductive substrates sometimes have a restricted transparency, it may be expedient for the substrate to be partly or else completely removed within the pump region (not illustrated).

Like the exemplary embodiment illustrated in FIG. 1, too, the exemplary embodiment shown in FIG. 2 has the abovementioned three measures for suppressing a parasitic radiation field in the vertical emitter layer, it also being the case, if appropriate, that one or two of said measures may be sufficient, or further measures are necessary for suppressing a parasitic radiation field. In particular, the position of the pump layer 2 and the vertical emitter layer 3 may be interchanged in the two exemplary embodiments.

FIG. 3 illustrates a third exemplary embodiment of the invention. In a manner similar to that in the previous exemplary embodiments, the semiconductor body 1 has a substrate 5, to which a Bragg mirror 4, a waveguide 10 and a cladding layer 8 are successively applied. Within the waveguide, the active pump layer 2 is formed and the vertical emitter layer 3 is formed parallel to and in a manner arranged downstream of the pump layer 2 in the vertical direction. The substrate 5 is provided with a contact metalization 6 and, disposed opposite thereto, the cladding layer 8 is provided with a contact metalization 7.

A pump mode 14 is defined by the waveguide 10. The overlap between said pump mode and one of the active layers is referred to as the filling factor. The greater said filling factor, the greater the coupling of the respective active layer to the pump radiation field. In the context of the invention it is provided that the pump layer is intended to have a highest possible filling factor Γ_p outside the pump region 11. For this purpose, in the exemplary embodiment shown, the pump layer is arranged at an intensity maximum of the pump mode 14 and the vertical emitter layer 3 is spaced apart therefrom in such a way that the filling factor of the pump layer Γ_p is greater than the filling factor of the vertical emitter layer Γ_v.

On account of the larger filling factor Γ_p, the pump layer 2 couples to a radiation field propagating laterally in the waveguide more intensely than the vertical emitter layer 3, so that, on the one hand, pump radiation is generated primarily in the waveguide, and, on the other hand, the vertical emitter layer 3 scarcely impairs the lateral propagation of the pump radiation field outside the pump region 11.

It should be noted that, in the context of the invention, there are also other possibilities for reducing an absorption of the pump radiation outside the pump region in the vertical emitter layer 3. By way of example, the vertical emitter layer could be excited so intensely outside the pump region that it bleaches and its transmission is thus increased. On account of the intense excitation, however, the risk of vertically propagating parasitic modes forming increases in this case, so that the above-mentioned possibilities are to be regarded as more advantageous.

An intensified coupling of the vertical emitter layer 3 to the pump radiation field is provided within the pump region 11, by contrast, since the vertical emitter is optically pumped by the pump radiation field in said region. For this purpose, the wave-guiding properties of the waveguide are modified within the pump region 11 in such a way that the filling factor of the vertical emitter layer Γ_v is increased, or the ratio of the filling factors Γ_p/Γ_v is reduced compared with laterally adjoining regions outside the pump region 11.

In the case of the exemplary embodiment shown, this is achieved by trapezoidally removing the cladding layer 8 and parts of the waveguide 11 within the pump region 11, which leads to a reduction of the waveguide width. The shallowly obliquely running sidewalls of the cutout bring about a continuous transition in the wave-guiding properties toward the pump region, as a result of which undesirable reflections and scattering losses are avoided.

The intensity maximum of the pump mode 15 is thus shifted in the direction of the vertical emitter layer 3, so that the filling factor Γ_v thereof is increased and the filling factor Γ_p of the pump layer 2 is reduced. The shift in the intensity maximum is illustrated schematically on the basis of the pump mode 15 within the pump region. Furthermore, FIG. 3 schematically shows the intensity distribution of the vertically emitted radiation field 12 within the semiconductor body. The illustration likewise shows the lateral extent of the vertically emitted radiation field 12, for instance the 1/e radius of the radiation field, which increases due to diffraction in the emission direction.

FIG. 4 shows a fourth exemplary embodiment of the present invention. The semiconductor device largely corresponds to the exemplary embodiment illustrated in FIG. 3. In contrast thereto, the waveguide 10 has no removal in the pump region 11, and the Bragg mirror 4 is oxidized within the pump region 11. The number of mirror periods (number of layer pairs) can advantageously be reduced in the case of an oxidized Bragg mirror compared with a non-oxidized Bragg mirror. Thus, by way of example, approximately 5 to 10 mirror periods suffice for an oxidized Bragg mirror, whereas 25 to 50 mirror periods are typically provided in the case of a non-oxidized Bragg mirror. A smaller number of mirror periods reduces both the production outlay and the thermal resistance of the Bragg mirror.

A Bragg mirror based on the GaAS/AlGaAs material system, preferably layers having a high proportion of aluminum, is suitable, in particular for an oxidized Bragg mirror. Such layers can be oxidized for example in moist thermal fashion, for instance in a water vapor atmosphere at an elevated temperature of 400° C. As a result of the oxidation of the aluminum-containing layers, the refractive index thereof is critically altered and the desired modification of the wave-guiding properties is consequently realized as a result.

In this exemplary embodiment, the waveguide 10 is dimensioned in such a way that the pump mode has a zero crossing, that is to say a node. In this case, as in the previous exemplary embodiment, the pump layer is arranged at an intensity maximum of the pump mode 14, whereas the vertical emitter layer is arranged at the zero crossing of the pump mode 14. A maximum filling factor Γ_p of the pump layer 2 in conjunction with a minimum filling factor Γ_v of the vertical emitter layer 3 is thereby realized.

The wave-guiding properties of the waveguide 10 are once again modified within the pump region 11 in such a way that the ratio of the filling factors Γ_p/Γ_v decreases, that is to say that the coupling of the active layers is shifted from the pump layer 2 to the vertical emitter layer 3. In the exemplary embodiment shown, this is achieved by the partial oxidation of the Bragg mirror 4 adjoining the waveguide 10.

The oxidation of the Bragg mirror leads to an alteration of the jump in refractive index between waveguide 10 and Bragg mirror 4, so that outside the pump region 11, the pump mode 14 penetrates more deeply into the Bragg mirror, as illustrated. Within the pump region 11, by contrast, the Bragg mirror 4 is oxidized, so that the jump in refractive index is significantly higher than in the laterally adjoining regions, and the zero crossing of the pump mode 15 is shifted in the direction of the pump layer 2 and thus away from the vertical emitter layer 3. As a result, the filling factor Γ_v of the vertical emitter layer increases and, consequently, so does the coupling or the absorption of the pump radiation field in the vertical emitter layer.

FIG. 5 illustrates a fifth exemplary embodiment of the invention. This exemplary embodiment combines features of the two exemplary embodiments illustrated in FIG. 3 and FIG. 4. The semiconductor body is largely like the semiconductor body illustrated in FIG. 3 and has, in particular, a cutout in the cladding layer 8 or in the waveguide 10 within the pump region 11. By contrast, a mode having a zero crossing is provided as pump mode 14 as in the case of the exemplary embodiment illustrated in FIG. 4, the pump layer 2 once again being arranged at an intensity maximum of the pump mode 14 and the vertical emitter layer 3 being arranged at the zero crossing of the pump mode 14. As in the case of the exemplary embodiment illustrated in FIG. 3, the wave-guiding properties of the waveguide are modified by the cutout in the cladding layer 8 or the waveguide 10 within the pump region in such a way that the intensity maximum is shifted from the pump layer in the direction of the vertical emitter layer 3.

FIG. 6 shows a sixth exemplary embodiment of the present invention. The semiconductor body once again essentially corresponds to the semiconductor body illustrated in FIG. 3 with the difference that the cutout within the pump region is embodied deeper and extends from the cladding layer via the waveguide 10 to beyond the pump layer, that is to say that the pump layer is also removed within the pump region. This is advantageous since essentially no electrical excitation effected on account of the arrangement of the contacts 6 and 7 within the pump region 11. Accordingly, in said region, the pump layer 2 does not contribute to the generation of the pump radiation field, but can disadvantageously absorb the pump radiation field. The layer sequence is preferably etched away to a desired depth within the pump region and subsequently covered with a passivation layer, for example with a dielectric such as silicon nitride.

The wave-guiding properties of the waveguide 10 are modified on account of the cutout within the pump region 11, in a manner similar to that in the case of the exemplary embodiments illustrated in FIG. 3 and in FIG. 5. As in the case of the exemplary embodiment illustrated in FIG. 5, a higher transversal mode having a zero crossing is provided as pump mode 14, it being the case that outside the pump region the pump layer 2 is arranged at an intensity maximum of the pump mode and the vertical emitter layer 3 is arranged at the zero crossing of the pump mode.

FIG. 7 schematically illustrates the vertical intensity profile of the pump mode along the line A-A outside the pump region. Said intensity profile was determined for a corresponding semiconductor device by means of simulation calculations. The simulation calculations were based on an AlInGaP layer system having a pump wavelength of 630 nm and an emission wavelength of the vertical emitter of 650 nm.

The intensity of the pump field along the vertical direction z and also the associated refractive index of the semiconductor layer sequence are plotted.

By contrast, FIG. 8 illustrates a corresponding profile of the intensity of the pump radiation field within the pump region 11 along the line B-B in extracts. An SiN layer serves as passivation layer 18.

The compression of the pump mode on account of the reduced width of the waveguide, on the one hand, and a shift in the pump mode in the direction of the vertical emitter layer, on the other hand, are clearly discernible. It should be noted that the maximum of the pump mode has deliberately not been shifted into the vertical emitter layer 3, since this can lead to an excessively high absorption of the pump mode within the pump region with the consequence that the pump radiation field is greatly reduced at the edge of the pump region, and an inhomogeneous pump profile can arise in this way.

The invention is preferably embodied as a semiconductor disk laser, for example as a VCSEL or a VECSEL. In particular, the vertical emitter is provided for forming a vertically emitting laser with an external resonator (VECSEL), the resonator being formed by the Bragg mirror and an external mirror.

In one preferred development of this embodiment, an element for frequency conversion, for example for frequency doubling, is provided within the external resonator. By way of example, nonlinear optical elements, in particular nonlinear crystals, are suitable for this purpose.

It goes without saying that the explanation of the invention on the basis of the exemplary embodiments is not to be understood as a restriction of the invention thereto. Rather, the invention also encompasses the combination of all features mentioned in the exemplary embodiments and the rest of the description, even if this combination is not the subject matter of a patent claim.

Claims

1. A semiconductor device comprising: an optically pumped vertical emitter having an active vertical emitter layer, and a pump radiation source, which is used to generate a pump radiation field which propagates in the lateral direction and optically pumps the vertical emitter layer in a pump region, the wavelength of the pump radiation field being smaller than the wavelength of the radiation field generated by the vertical emitter, whereinthe pump radiation source has an active pump layer, which is arranged above or below the vertical emitter layer in the vertical direction and which at least partly overlaps the vertical emitter layer as seen in the vertical direction, the active pump layer being arranged in such a way that the pump radiation field generated during operation has a higher power than a parasitic laterally propagating radiation field generated by the vertical emitter layer or that the generation of a parasitic laterally propagating radiation field by the vertical emitter layer is suppressed.

2. The semiconductor device as claimed in claim 1, wherein the pump radiation source is electrically excited by charge carrier injection for generation of the pump radiation.

3. The semiconductor device as claimed in claim 2, wherein charge carriers of a first charge carrier type and charge carriers of a second charge carrier type are injected into the semiconductor device.

4. The semiconductor device as claimed in claim 3, wherein the charge carriers of the first charge carrier type have a higher net trapping rate than the charge carriers of the second charge carrier type and are injected into the semiconductor device from a side, the pump layer being at a smaller distance from said side than the vertical emitter layer.

5. The semiconductor device as claimed in claim 3, wherein a barrier having a selectivity with regard to the charge carrier type is formed between the vertical emitter layer and the pump layer.

6. The semiconductor device as claimed in claim 3, wherein the semiconductor device is doped partly with a first conductivity type and partly with the second conductivity type and has a space charge zone, the pump layer being arranged within the space charge zone and the vertical emitter layer being arranged outside the space charge zone.

7. The semiconductor device as claimed in claim 1, wherein the pump layer and the vertical emitter layer are arranged within a waveguide

8. The semiconductor device as claimed in claim 7, wherein a pump mode having a filling factor Γp of the pump layer and a filling factor Γv of the vertical emitter layer is assigned to the waveguide outside the pump region, the filling factor of the pump layer Γp being greater than the filling factor of the vertical emitter layer Γv.

9. The semiconductor device as claimed in claim 7, wherein an intensity maximum is assigned to the pump mode, and the pump layer is arranged closer to the intensity maximum than the vertical emitter layer.

10. The semiconductor device as claimed in claim 7, wherein the pump mode has a zero crossing, and the vertical emitter layer is arranged closer to the zero crossing than the pump layer.

11. The semiconductor device as claimed in claim 1, wherein within the pump region, the absorption of the pump radiation in the vertical emitter layer is increased compared with regions of the vertical emitter layer which laterally adjoin the pump region.

12. The semiconductor device as claimed in claim 11, wherein the pump radiation field has a filling factor Γp with regard to the pump layer and a filling factor Γv with regard to the vertical emitter layer, the ratio Γp/Γv being decreased within the pump region compared with regions of the vertical emitter layer which laterally adjoin the pump region.

13. The semiconductor device as claimed in claim 11, wherein the pump layer and the vertical emitter layer are arranged within a waveguide whose wave-guiding properties are modified within the pump region compared with regions which laterally adjoin the pump region.

14. The semiconductor device as claimed in claim 13, wherein the waveguide or layers adjoining the latter are at least partly removed within the pump region.

15. The semiconductor device as claimed in claim 11, wherein the waveguide or layers adjoining the latter are at least partly oxidized within the pump region.

16. The semiconductor device as claimed in claim 1, wherein the pump layer is at least partly removed within the pump region.

17. The semiconductor device as claimed in claim 1, wherein means for suppressing vertically propagating parasitic radiation fields are provided outside the pump region.

18. The semiconductor device as claimed in claim 17, wherein a material whose reflectivity is low enough to suppress the oscillation build-up of vertically propagating modes of parasitic radiation fields is chosen for contact metalizations.

19. The semiconductor device as claimed in claim 17, wherein an absorber layer for suppressing vertically propagating parasitic radiation fields is provided outside the pump region.

20. The semiconductor device as claimed in claim 1, wherein a mirror layer is arranged above or below the pump layer and the vertical emitter layer in the vertical direction.

21. The semiconductor device as claimed in claim 20, wherein the mirror layer is oxidized within the pump region.

22. The semiconductor device as claimed in claim 20, wherein the mirror layer is arranged between the vertical emitter layer and a substrate, and the radiation generated by the vertical emitter layer is coupled out on the opposite side to the substrate.

23. The semiconductor device as claimed in claim 20, wherein the vertical emitter layer is arranged between the mirror layer and a substrate, and the radiation generated by the vertical emitter layer is coupled out through the substrate.

24. The semiconductor device as claimed in claim 1, wherein an external resonator is assigned to the vertical emitter.

25. The semiconductor device as claimed in claim 20, wherein an external resonator is assigned to the vertical emitter, and the external resonator is formed by the mirror layer and an external mirror.

26. The semiconductor device as claimed in claim 24, wherein an element for frequency conversion is arranged within the external resonator.

27. The semiconductor device as claimed in claim 1, wherein the semiconductor device is formed in monolithically integrated fashion.