OPTOELECTRIC PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND OPTOELECTRIC TRANSMISSION METHOD USING THE OPTOELECTRIC PRINTED CIRCUIT BOARD

Abstract

Provided are an optoelectric printed circuit board (PCB) including an optoelectric transmission metal track and a dielectric layer, an optoelectric transmission method using the optoelectric PCB, and a method of manufacturing the optoelectric PCB. The optoelectric transmission method includes injecting light and electricity to the optoelectric PCB including at least one optoelectric transmission metal track and a dielectric layer contacting the optoelectric transmission metal track. The injected light and electricity are transmitted through the optoelectric PCB. The transmitted light and electricity are emitted from the optoelectric PCB.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

FIG. 1 is a perspective view of an optoelectric printed circuit board (PCB) according to an embodiment of the present invention;

FIG. 2 is a perspective view of an optoelectric transmission metal track of the optoelectric PCB of FIG. 1, according to an embodiment of the present invention;

FIGS. 3 and 4 are schematic views for explaining optical transmission;

FIG. 5 is an image showing the near field distribution occurring according to the variation of the thickness of an optoelectric transmission metal track of an optoelectric PCB according to an embodiment of the present invention after optical transmission;

FIG. 6 is a perspective view of an optoelectric PCB according to another embodiment of the present invention;

FIG. 7 is a perspective view illustrating an optical transmission metal track and an electric transmission metal track of the optoelectric PCB of FIG. 6, according to an embodiment of the present invention;

FIG. 8 is a perspective view of an optoelectric PCB according to another embodiment of the present invention; and

FIGS. 9 through 11 are perspective views illustrating optoelectric PCBs not including a substrate according to other embodiments of the present invention.

Claims

1. An optoelectric transmission method comprising: injecting light and electricity to an optoelectric printed circuit board (PCB);transmitting the light and the electricity through the optoelectric PCB; andemitting the light and the electricity from the optoelectric PCB.

2. The optoelectric transmission method of claim 1, wherein, in the transmitting the light and the electricity through the optoelectric PCB, the light and the electricity are transmitted simultaneously.

3. The optoelectric transmission method of claim 1, wherein the optoelectric PCB comprises at least one optoelectric transmission metal track and a dielectric layer contacting the optoelectric transmission metal track.

4. The optoelectric transmission method of claim 1, wherein the optoelectric PCB comprises an optical transmission metal track, an electric transmission metal track which is thicker than the optical transmission metal track, and a dielectric layer contacting the optical transmission metal track.

5. The optoelectric transmission method of claim 3, wherein the dielectric layer comprises a low loss polymer.

6. The optoelectric transmission method of claim 4, wherein the dielectric layer comprises a low loss polymer.

7. The optoelectric transmission method of claim 5, wherein the low loss polymer comprises halogen or heavy hydrogen.

8. The optoelectric transmission method of claim 3, wherein each of the optical transmission metal track and the optical transmission metal track comprises one selected from the group consisting of Group 1 B elements and alloys thereof.

9. The optoelectric transmission method of claim 4, wherein each of the optical transmission metal track and the optical transmission metal track comprises one selected from the group consisting of Group 1 B elements and alloys thereof.

10. The optoelectric transmission method of claim 3, wherein the optoelectric PCB further comprises a substrate formed on the dielectric layer.

11. The optoelectric transmission method of claim 4, wherein the optoelectric PCB further comprises a substrate formed on the dielectric layer.

12. An optoelectric PCB comprising at least one optoelectric transmission metal track and a dielectric layer contacting the optoelectric transmission metal track.

13. The optoelectric PCB of claim 12, wherein the dielectric layer comprises a low loss polymer.

14. The optoelectric PCB of claim 13, wherein the low loss polymer comprises halogen or heavy hydrogen.

15. The optoelectric PCB of claim 12, wherein the optoelectric transmission metal track comprises one selected from the group consisting of Group 1 B elements and alloys thereof.

16. The optoelectric PCB of claim 12, wherein the optoelectric PCB further comprises a substrate formed on the dielectric layer.

17. An optoelectric PCB comprising: an optical transmission metal track transmitting light;an electric transmission metal track which is thicker than the optical transmission metal track and transmits electricity; anda dielectric layer contacting the optical transmission metal track.

18. The optoelectric PCB of claim 17, wherein the optical transmission metal track has a thickness of 5 to 200 nm and a width of 2 to 100 μm.

19. The optoelectric PCB of claim 17, wherein the electric transmission metal track has a thickness and a width of 100 nm to 5 mm both.

20. A method of manufacturing an optoelectric PCB, the method comprising: forming a lower dielectric layer on a substrate;forming at least one optoelectric transmission metal track on the lower dielectric layer; andforming an upper dielectric layer on the optoelectric transmission metal track.

21. The method of claim 20, further comprising removing the substrate.

22. A method of manufacturing an optoelectric PCB, the method comprising: forming a lower dielectric layer on a substrate;forming an optical transmission metal track on the lower dielectric layer;forming an upper dielectric layer on the optoelectric transmission metal track; andforming an electric transmission metal track to be thicker than the optical transmission metal track.

23. The method of claim 22, wherein the electric transmission metal track is formed on the lower dielectric layer.

24. The method of claim 22, wherein the electric transmission metal track is formed on the upper dielectric layer.