OPTOELECTRONIC COMPONENT

The invention relates to an optoelectronic device having an active layer with a quantum well structure that comprises nitride compound semiconductor materials, especially InGaN.

This patent application claims the priority of German Patent Application 10 2011 112 706.6, the disclosure content of which is herewith incorporated by reference.

Quantum well structures composed of nitride compound semiconductors which especially comprise InGaN are frequently used as active layer in LEDs or laser diodes which usually emit in the blue spectral range. Depending upon the composition of the semiconductor material, emission in the ultraviolet, green, yellow or red spectral ranges is also possible. Luminescence conversion by means of luminescent materials enables the short-wave radiation to be converted into larger wavelengths. In this way it is possible to generate mixed-coloured light, especially white light. LEDs based on nitride compound semiconductors are therefore of considerable importance for LED lighting systems.

It has been found that the efficiency of LEDs having an InGaN-based quantum well structure declines at high current densities (the so-called droop effect). This effect is described, for example, in the publication E. Kioupakis et al., “Indirect Auger recombination as a cause of efficiency droop in nitride light-emitting diodes”, Applied Physics Letters 98, 161107 (2011). It is assumed that this Auger-like recombination is the dominant loss mechanism in InGaN-based LEDs. This loss mechanism already occurs at current densities appreciably below the customary operating current density and brings about a reduction in the efficiency of the LED. It is assumed that the high Auger-like loss is caused by phonon-assisted Auger recombinations. Such phonon-assisted Auger recombinations occur in particular in InGaN-based semiconductor material. The reason for this is a strong electron/phonon interaction (high Huang-Rhys factor).

The publication J. Ristié et al., “On the mechanisms of spontaneous growth of III-nitride nanocolumns by plasma-assisted molecular beam epitaxy”, Journal of Crystal Growth 310 (2008), 4035-4045, describes the production of GaN-nanostructures. Furthermore, the publication W. Bergbauer et al., “N-face GaN nanorods: Continuous-flux MOVPE growth and morphological properties”, Journal of Crystal Growth 315 (2011), 164-167, describes the production of nanostructures composed of GaN. The content of these publications is incorporated by reference in this regard.

The invention is based on the problem of specifying an optoelectronic device having an active layer that comprises a quantum well structure based on a nitride compound semiconductor material, wherein losses caused by phonon-assisted Auger recombinations are reduced. At the same time the optical and electronic properties of the quantum well structure should otherwise be affected as little as possible.

That problem is solved by an optoelectronic device having the features of patent claim 1. Advantageous arrangements and developments of the invention are the subject matter of the dependent claims.

In accordance with at least one embodiment, the optoelectronic device has an active layer that comprises a multiplicity of structural elements spaced apart from one another laterally. The optoelectronic device is particularly a radiation-emitting optoelectronic device, for example an LED or a semiconductor laser. The structural elements each have a quantum well structure comprising one or more barrier layers composed of In_x1Al_y1Ga_1-x1-y1N wherein 0≦x1≦1, 0≦y1≦1 and x1+y1≦1, and one or more quantum well layers composed of In_x2Al_y2Ga_1-x2-y2N wherein 0≦x2≦1, 0≦y2≦1 and x2+y2≦1. The at least one barrier layer has a larger electronic band gap than the at least one quantum well layer. This can be achieved, for example, by the barrier layer having a smaller indium content than the quantum well layer. Preferably, the following applies in respect of the indium contents: x1<0.7 and x2≦0.7.

Because the active layer has a multiplicity of structural elements spaced apart from one another in the lateral direction, that is to say in a direction parallel to the main plane of extent of the active layer, a reduction in the possible phonon emission modes can be achieved, with the result that phonon-assisted Auger recombinations in the quantum well structure are reduced. The reduction in such non-radiating recombinations advantageously results in an increase in the efficiency of the optoelectronic device in comparison with an optoelectronic device in which the quantum well structure is formed from continuous, that is to say uninterrupted in the lateral direction, barrier layers and quantum well layers.

The structural elements are arranged one next to the other in the plane of the active layer. The structural elements are three-dimensional bodies which can preferably have, at least in certain regions, the shape of a cylinder, a parallelepiped, a prism, a pyramid or a truncated pyramid.

In a preferred embodiment, the structural elements have, at least in certain regions, a shape matched to the hexagonal crystal structure of a nitride compound semiconductor material. In particular, the structural elements can have, at least in certain regions, the shape of a hexagonal pyramid, a truncated hexagonal pyramid or a hexagonal prism.

The structural elements preferably have a width of 20 μm or less. The width of the structural elements is to be understood as being the largest dimension of the structural elements in the lateral direction. By virtue of the small width of the structural elements, the active layer has in the lateral direction a multiplicity of interruptions by means of which phonons in the semiconductor material are suppressed. In an advantageous embodiment, the width of the structural elements is between 5 nm inclusive and 5 μm inclusive. Preferably the width of the structural elements is between 20 nm inclusive and 1 μm inclusive, especially preferably between 25 nm inclusive and 250 nm inclusive.

In an advantageous embodiment, a mask layer is arranged in the optoelectronic device, the structural elements each being arranged in an opening in the mask layer. The mask layer can be, for example, an SiO₂layer or an SiN layer. The structural elements can be produced, for example, by growing the mask layer onto a semiconductor layer of the optoelectronic device and subsequently providing it with a multiplicity of openings. The mask layer can especially be structured photolithographically.

The openings in the mask layer can, however, also be formed by self-organisation, for example by using a thin, not yet closed layer as mask layer. For example, a thin Ni layer can be used as mask.

The structural elements are subsequently grown epitaxially in the openings of the mask layer. In this embodiment the geometric shape of the structural elements and the distances between the structural elements are determined by the openings in the mask layer.

As an alternative to the production of the structural elements with a mask layer it would also be possible to adjust the growth conditions for growth of the active layer in such a way that three-dimensional growth of nanostructures takes place. In this case the nanostructures are advantageously formed by a self-organisation process in which a mask layer is not used. In this embodiment the shape of the structures can be influenced by suitable exploitation of lattice-mismatch-induced strains or by the growth conditions, for example in the case of growth by means of MOVPE by the composition of the process gas.

In an advantageous embodiment, the at least one barrier layer and/or the at least one quantum well layer of the quantum well structure comprise In_xAl_1-xN wherein 0≦x≦0.35. In this embodiment, the barrier layer and/or the quantum well layer are therefore free of gallium, the indium content x in the ternary In_xAl_1-xN semiconductor material being not more than 0.35. In this embodiment, phonons in the semiconductor material are reduced not only by the structuring of the active layer to form a multiplicity of laterally spaced structural elements arranged one next to the other, but also by the choice of the material of the barrier layers and/or quantum well layers. This has the result, in particular, that gallium-containing nitride compound semiconductor layers are interrupted at regular intervals both in the vertical and in the lateral direction, with the result that the propagation of phonons involved in loss processes is reduced in an especially efficient way.

Especially preferably, the following applies in respect of the indium content x in the barrier layer and/or the quantum well layer: 0.09≦x≦0.27. It has been found that it is particularly in this indium content range that the LO phonon modes are greatly reduced.

In a further advantageous embodiment, the quantum well structure comprises a plurality of intermediate layers composed of In_xAl_1-xN wherein 0≦x≦0.6. In this embodiment, the barrier layers can comprise, for example, In_yGa_1-yN wherein 0≦y<1 and the quantum well layers comprise In_zGa_1-zN wherein 0<z≦1 and z>y. In this embodiment the barrier layers and quantum well layers are interrupted in the vertical direction by the intermediate layers.

Preferably, the following applies in respect of the indium content in the intermediate layers: x≦0.35, especially preferably 0.09≦x≦0.27. The phonon spectrum can especially be influenced by a variation in the indium content x of the material Al_1-xIn_xN of the intermediate layer. Preferably the following applies: 0≦x≦0.35.

Especially preferably, the indium content x of the intermediate layers is 0.09≦x≦0.27. It has been found that it is particularly in this indium content range that the LO phonon modes are greatly reduced. By embedding the at least one intermediate layer composed of Al_1-xIn_xN wherein 0.09≦x≦0.27, phonon-assisted recombinations in the quantum well structure can therefore be reduced especially effectively. For example, x can be 0.18.

In a preferred embodiment, the intermediate layers have a thickness of less than 1.5 nm. In this way it is advantageously possible to modify the phonon spectrum in the region of the quantum well structure in such a way that non-radiating recombinations are reduced, while on the other hand the optical and electronic properties of the quantum well structure are otherwise modified only negligibly.

In one embodiment, the at least one intermediate layer is arranged between the barrier layer and the quantum well layer. In the case of a multiple quantum well structure, the intermediate layers can, for example, each have been inserted at the interface at which, in the direction of growth, a quantum well layer follows a barrier layer. Alternatively, it is also possible for the intermediate layers each to have been inserted at the interface at which, in the direction of growth, a barrier layer follows a quantum well layer.

The indium content x of the at least one intermediate layer is preferably adjusted in such a way that the electronic band gap of the intermediate layer is the same as the electronic band gap of an adjacent barrier layer. In a further advantageous embodiment, the indium content x of the at least one intermediate layer is adjusted in such a way that the electronic band gap of the intermediate layer is the same as the electronic band gap of an adjacent quantum well layer. Matching the electronic band gap of the intermediate layer to the barrier layer or to the quantum well layer has the advantageous result that the at least one intermediate layer has only a negligible effect on the electrical properties of the quantum well structure.

In an advantageous embodiment, the quantum well structure is a multiple quantum well structure having a plurality of periods each composed of three layers, the three layers being the barrier layer, the intermediate layer and the quantum well layer.

In an alternative embodiment, the quantum well structure is a multiple quantum well structure having a plurality of periods each composed of four layers, the four layers being the intermediate layer, the barrier layer, a further intermediate layer and the quantum well layer. In this embodiment the barrier layer is enclosed on both sides by the intermediate layers. The further intermediate layer has the same properties and advantageous embodiments as the intermediate layer previously described.

In a further embodiment, the quantum well structure is a multiple quantum well structure in which the barrier layer and the quantum well layer are repeated a number of times with a first period length. Advantageously a plurality of intermediate layers are embedded in the quantum well structure. The intermediate layers are advantageously repeated a number of times with a second period length, the first period length not being the same as the second period length. In this case the intermediate layers are therefore not each arranged exactly at an interface between the barrier layer and the quantum well layer, but are distributed in the quantum well structure with a second period length which is not the same as the first period length of the quantum well structure.

In this embodiment, the second period length is preferably smaller than the first period length. It is in this way ensured that at least one intermediate layer is embedded in each layer pair composed of a barrier layer and a quantum well layer. The first period length, that is to say the period length of the quantum well structure, is preferably between 2 nm inclusive and 20 nm inclusive. The second period length with which the intermediate layers are repeated is preferably between 0.7 nm inclusive and 4 nm inclusive.

The intermediate layers need not necessarily be arranged periodically, but can, for example, also be distributed non-periodically in the quantum well structure at intervals preferably in the range between 0.7 nm inclusive and 4 nm inclusive.

The thickness of the at least one barrier layer in the quantum well structure is preferably between 0.7 nm and 3 nm. The at least one quantum well layer in the quantum well structure preferably has a thickness of between 1 nm and 20 nm, especially preferably between 1.5 nm and 12 nm.

In a preferred embodiment, the structural elements each have a layer stack that contains the quantum well structure, the layers of the layer stack being arranged one above the other in such a way that they do not overlap in the lateral direction. In other words, the layers in the structural elements are arranged one above the other in such a way that each layer arranged above an underlying layer covers the top face but not the side faces of the underlying layer. This can be achieved, for example, by growing the layer stacks forming the structural elements in the openings of a mask layer, the mask layer having a greater thickness than the layer stack. In particular, it is possible for the mask layer used for growing the structural elements to remain in the finished optoelectronic device and in that way the structural elements that are spaced apart from one another laterally can be electrically insulated from one another.

In a preferred embodiment, an electrically insulating layer is arranged between the structural elements that are spaced apart from one another laterally. By means of the electrically insulating layer, in particular short-circuits at the side flanks of the quantum well structures are prevented. The electrically insulating layer can especially be a mask layer used for growing the structural elements.

In a different advantageous embodiment, the structural elements each have a layer stack that contains the quantum well structure, the layers of the layer stack being arranged one above the other in such a way that a layer of the layer stack arranged above an underlying layer entirely covers the underlying layer including the side flanks thereof. In other words, in this embodiment the structural elements have a core-shell structure. Since in this embodiment the layers of the quantum well structure that are arranged one above the other each cover one another entirely, it is advantageously unnecessary to arrange an electrically insulating layer between the structural elements in order to prevent short-circuits at the side flanks of the structural elements.

In a further advantageous embodiment, a semiconductor layer and/or a layer composed of a transparent conductive oxide is applied to the active layer, the semiconductor layer and/or the layer composed of the transparent conductive oxide forming a common electrical contact for the multiplicity of structural elements. The multiplicity of structural elements of the active layer are therefore electrically contacted in common. The second electrical contact for the multiplicity of structural elements can be formed, for example, by a semiconductor layer which is arranged below the active layer and which is electrically connected, for example, by way of a rear side of the substrate.

The invention is described in detail below with reference to exemplary embodiments in conjunction with FIGS. 1 to 6, wherein

FIG. 1 is a diagrammatic view of a cross-section through an optoelectronic device in accordance with a first exemplary embodiment,

FIG. 2 is a diagrammatic view of an exemplary embodiment of a structural element in the optoelectronic device in accordance with the first exemplary embodiment,

FIG. 3 is a diagrammatic view of a further exemplary embodiment of a structural element in the optoelectronic device in accordance with the first exemplary embodiment,

FIG. 4 is a diagrammatic view of a further exemplary embodiment of a structural element in the optoelectronic device in accordance with the first exemplary embodiment,

FIG. 5A is a diagrammatic view of a cross-section through an optoelectronic device in accordance with a second exemplary embodiment,

FIG. 5B is a diagrammatic view of an exemplary embodiment of a structural element in the optoelectronic device in accordance with the second exemplary embodiment,

FIG. 6A is a diagrammatic view of a cross-section through an optoelectronic device in accordance with a third exemplary embodiment, and

FIG. 6B is a diagrammatic view of an exemplary embodiment of a structural element in the optoelectronic device in accordance with the third exemplary embodiment.

In the Figures, parts that are identical or have identical action are in each case denoted by identical reference numerals. The parts illustrated and the relative sizes of the parts to one another should not be regarded as to scale.

The exemplary embodiment of an optoelectronic device 11 shown diagrammatically in FIG. 1 is an LED having a radiation-emitting active layer 10. The active layer 10 of the optoelectronic device 11 is intended for emission of radiation, especially in the ultraviolet, blue or green spectral range.

The active layer 10 is arranged between a first cladding layer 8 and a second cladding layer 12. The first cladding layer 8 can be a semiconductor layer or a semiconductor layer sequence which has preferably been grown epitaxially on a substrate 7. The optoelectronic device 11 can have, for example, a substrate 7 composed of GaN, sapphire or Si.

The second cladding layer 12, which is arranged above the active layer 10, preferably comprises a transparent conductive oxide (TCO). In particular, the second cladding layer 12 can be a layer of indium tin oxide (ITO). The surface of the second cladding layer 12 opposite the substrate 7 serves as radiation exit face of the LED. For electrical contacting, for example a first electrical contact 13 is provided on the rear side of the substrate 7 and a second electrical contact 14 is provided on the surface of the second cladding layer 12.

Alternatively, it is also possible for the second cladding layer 12 to be a semiconductor layer. In that case the cladding layers 8, 12 advantageously have different types of conductivity. For example, the first cladding layer 8 can be n-doped and the second cladding layer 12 p-doped. The first cladding layer 8 and the second cladding layer 12 can each be composed of a plurality of sub-layers which, for the sake of clarity, are not shown individually in the drawing.

The optoelectronic device 11 need not necessarily have the structure shown by way of example. For example, the optoelectronic device 11 can alternatively be a so-called thin-film LED in which the growth substrate 7 used to grow the semiconductor layer sequence has been detached from the semiconductor layer sequence and the semiconductor layer sequence has been joined to a carrier on a side opposite the original growth substrate. In such a thin-film LED a first cladding layer facing the carrier is usually p-doped and a second cladding layer facing the radiation exit face n-doped.

The semiconductor layer sequence of the optoelectronic device 11 is based on a nitride compound semiconductor. “Based on a nitride compound semiconductor” means in this context that the semiconductor layer sequence or at least one layer thereof comprises a III nitride compound semiconductor material, preferably In_xAl_yGa_1-x-yN, where 0≦x≦1, 0≦y≦1 and x+y≦1. Such a material need not necessarily have a mathematically exact composition in accordance with the above formula, but rather it may comprise one or more dopants and additional constituents that do not significantly alter the characteristic physical properties of the In_xAl_yGa_1-x-yN material. For the sake of simplicity, however, the above formula contains only the main constituents of the crystal lattice (In, Al, Ga, N), although some of those constituents can be replaced by small amounts of further substances.

The active layer 10 of the optoelectronic device 11 advantageously comprises a multiplicity of structural elements 6 that are spaced apart from one another laterally, each of which has a quantum well structure 5. The structural elements 6 each have a quantum well structure 5 comprising at least one barrier layer 2 composed of In_xAl_yGa_1-x-yN wherein 0≦x1≦1, 0≦y1≦1 and x1+y1≦1, and at least one quantum well layer 1 composed of In_x2Al_y2Ga_1-x2-y2N wherein 0≦x2≦1, 0≦y2≦1 and x2+y2≦1. The at least one barrier layer 2 has, for example as a result of a smaller indium content, a larger electronic band gap than the at least one quantum well layer 1. Preferably, the following applies in respect of the indium contents: x1<0.7 and x2≦0.7.

The structural elements 6 of the active layer 10 that are spaced apart from one another laterally are, for example, in the shape of cylinders. Alternatively, the structural elements 6 can be, for example, in the shape of a cuboid, a prism, a pyramid or a truncated pyramid. Each of the structural elements 6 has a layer stack which contains the quantum well structure 5, the layers of the layer stack being arranged one above the other in such a way that they do not overlap in the lateral direction. That is to say, that layers in each case cover the top face but not the side faces of the underlying layer.

The structural elements 6 can be produced, for example, by alternately growing quantum well layers 1 and barrier layers 2, which form the quantum well structure 5, in the openings of a mask layer 9. For example, prior to the growth of the quantum well structure 5 the mask layer 9 is grown onto the first cladding layer 8 arranged below the active layer 10 and is provided with a multiplicity of openings. The openings in the mask layer 9 can be made, for example, by means of photolithography. The mask layer 9 is preferably an electrically insulating layer, especially a layer composed of a silicon oxide or a silicon nitride.

It has been found that by structuring the active layer 10 to form a multiplicity of structural elements 6 that are spaced apart from one another laterally it is possible to achieve an improvement in the efficiency of the optoelectronic device 11. In particular, the structuring of the active layer 10 brings about a reduction in the phonon density of states in the semiconductor material, with the result that non-radiating phonon-assisted Auger recombinations are reduced.

In the exemplary embodiment, the mask layer 9 advantageously is of greater height than the quantum well structures 5 grown in the openings in the mask layer 9. Regions of the electrically insulating mask layer 9 are therefore arranged between the structural elements 6 that are spaced apart from one another in the lateral direction. This has the advantage that a common electrical contact for the multiplicity of structural elements 6 can be provided by the second cladding layer 12 which is applied over the entire surface of the structured active layer 10. Because, in particular, the side flanks of the structural elements 6 are covered by the electrically insulating mask layer 9, the second cladding layer 12 in each case adjoins only the uppermost semiconductor layer of the quantum well structures 5. On the opposite side, the quantum well structures 5 are contacted by the first cladding layer 8.

The structural elements 6 preferably have a width b of 20 μm or less. In particular, the structural elements can have a width of between 5 nm inclusive and 5 μm inclusive. The width b is preferably between 20 nm inclusive and 1 μm inclusive, especially preferably between 25 nm inclusive and 250 nm inclusive.

A structural element 6 of the active layer 10 is shown on an enlarged scale in FIG. 2. The structural element 6 contains a quantum well structure 5, which has alternating quantum well layers 1 and barrier layers 2. In the exemplary embodiment, the quantum well structure 5 is a multiple quantum well structure containing four periods 4 each composed of the quantum well layer 1 and the barrier layer 2. The quantum well structure 5 can alternatively also have a different number of periods, for example between one and one hundred. In particular, it is possible for the quantum well structure 5 to be a single quantum well structure having only one period. Preferably the number of periods 4 is between four inclusive and seven inclusive. Each period 4 of the quantum well structure 5 has, for example, a thickness between 4 nm inclusive and 10 nm inclusive.

It has advantageously been found that the phonon density of states in the semiconductor material that has already been reduced by the structuring of the active layer 10 can be reduced even further if the barrier layers 2 and/or the quantum well layers 1 comprise In_xAl_1-xN wherein 0≦x≦0.35. In this advantageous embodiment, the barrier layers 2 and/or the quantum well layers 1 are therefore in particular free of gallium. Especially preferably the following applies: 0.09≦x≦0.27.

An alternative embodiment of a structural element 6 of the active layer 10 is shown in FIG. 3. In this embodiment, intermediate layers 3 composed of In_xAl_1-xN wherein 0≦x≦0.35 are present between the barrier layers 2 and the quantum well layers 1. The intermediate layers 3 preferably have a thickness of less than 1.5 nm, especially preferably less than 1 nm. In the exemplary embodiment, the intermediate layers 3 are arranged at all interfaces between the barrier layers 2 and quantum well layers 1. Each period 4 of the quantum well structure therefore consists of 4 layers.

Alternatively, however, it would also be possible to arrange the intermediate layers only at those interfaces at which, in the direction of growth, a barrier layer 2 follows a quantum well layer 1. Furthermore, it would also be possible to arrange the intermediate layers 3 only at those interfaces at which, in the direction of growth, a quantum well layer 1 follows a barrier layer 2. In such embodiments, a period 4 of the quantum well structure 5 in each case consists of 3 layers.

The intermediate layers 3 which are arranged in the quantum well structure 5 between the quantum well layers 1 and the barrier layers 2 advantageously bring about an increase in the efficiency of radiation generation. This results, in particular, from the fact that non-radiating recombinations of charge carriers in the quantum well structure 5, which are phonon-assisted Auger recombinations, are reduced. In particular, it has been found that the insertion of the intermediate layers 3 composed of In_xAl_1-xN brings about a reduction in the LO phonon density of states in the quantum well structure 5. This advantageous effect is especially marked if the indium content x of the intermediate layers 3 is between 0.09 inclusive and 0.27 inclusive. For example, the intermediate layers can comprise In_0.18Al_0.82N.

In particular, the insertion of the intermediate layers 3 increases the quantum efficiency of the quantum well structure 5 when the optoelectronic device 11 is driven at high current strengths. Furthermore, it has been found that the insertion of the intermediate layers 3 is able to reduce strains in the semiconductor material. This results in an improvement in crystal quality, which brings about an increase in the quantum efficiency, especially in the case of comparatively small current strengths.

The lattice constant of the intermediate layers 3 can be varied by modifying the indium content x so that a lattice match with an adjacent quantum well layer 1 or the neighbouring barrier layer 2 can be achieved. By suitably adjusting the indium content x of the intermediate layers 3 it is advantageously possible, alternatively or in addition, for the electronic band gap of the intermediate layer 3 to be matched to an adjacent barrier layer 2 or quantum well layer 1.

FIG. 4 shows a further exemplary embodiment of a structural element 6 of the active layer. A plurality of intermediate layers 3 composed of Al_1-xIn_xN wherein 0≦x≦0.6 are embedded in the multiple quantum well structure 5. Unlike the exemplary embodiment of FIG. 3, the intermediate layers 3 are embedded in the quantum well structure 5 in a periodic sequence, the period length d₂of the arrangement of the intermediate layers 3 not corresponding to the period length d₁of the quantum well structure 5. In other words, the sequence of quantum well layers 1 and barrier layers 2 has a first period length d₁and the sequence of the intermediate layers 3 has a second period length d₂, where d₁≠d₂.

This has the result that the intermediate layers 3 are not necessarily each arranged at an interface between a quantum well layer 1 and a barrier layer 2, but rather the intermediate layers 3 can also be embedded in a quantum well layer 1 or a barrier layer 2. In that case the intermediate layer 3 is therefore enclosed by a first sub-layer and a second sub-layer of the quantum well layer 1 or barrier layer 2 in question. For example, the first quantum well layer 1 of the lowermost period 4 in the direction of growth has a first sub-layer la and a second sub-layer 1b, with an intermediate layer 3 being arranged between the first sub-layer 1a and the second sub-layer 1b. Furthermore, one or even two intermediate layers are embedded in some of the further quantum well layers 1 and barrier layers 2. The uppermost period 4 of the quantum well structure 5 in the direction of growth has, for example, a barrier layer 2 which has a first sub-layer 2a and a second sub-layer 2b, with an intermediate layer 3 being arranged between the first sub-layer 2a and the second sub-layer 2b.

Furthermore, in this embodiment it can also be the case that at least some of the intermediate layers 3 are arranged at an interface between a quantum well layer 1 and a barrier layer 2. For example, the barrier layer 2 of the lowermost period 4 in the direction of growth adjoins an intermediate layer 3 on both sides.

In this exemplary embodiment the intermediate layers 3 are advantageously comparatively thin. Preferably the thickness of the intermediate layers 3 is less than 1 nm, especially preferably less than 0.5 nm.

The period length d₂of the intermediate layers 3 is preferably between 2 nm and 4 nm. Preferably the period length d₂of the intermediate layers 3 is smaller than the period length d₁of the multiple quantum well structure 5. In that way it is ensured that at least one intermediate layer 3 is embedded in each period 4 of the quantum well structure 5. The period of the quantum well structure 5 can be, for example, between 4 nm and 10 nm.

In an especially preferred embodiment, the indium content x of the intermediate layers 3 is in each case adjusted in such a way that the electronic band gap of the intermediate layer 3 is matched to the material of the quantum well layer 1 or the barrier layer 2 in which the intermediate layer 3 in question is embedded. In the case of an intermediate layer 3 arranged at an interface between a quantum well layer 1 and a barrier layer 2, the indium content x of the intermediate layer 3 is preferably adjusted in such a way that the electronic band gap of the intermediate layer 3 corresponds either to the adjacent quantum well layer 1 or to the adjacent barrier layer 2. In this way the electronic properties of the quantum well structure 5 are advantageously not significantly affected by the embedding of the intermediate layers 3. In this way, therefore, undesired phonons in the semiconductor material, which could reduce the efficiency of the optoelectronic device 11 by non-radiating recombinations, are advantageously reduced, but at the same time the other electronic and optical properties of the optoelectronic device 11 are only insignificantly modified.

The second exemplary embodiment of an optoelectronic device 11 shown in FIG. 5A differs from the first exemplary embodiment in the configuration of the structural elements 6 of the active layer 10. As in the first exemplary embodiment, the active layer 10 has a multiplicity of structural elements 6 arranged one next to the other, the structural elements 6 each having a quantum well structure 5.

A single structural element 6 of the active layer 10 is shown on an enlarged scale in FIG. 5B. The quantum well structure 5 has a multiplicity of alternating quantum well layers 1 and barrier layers 2. Unlike the first exemplary embodiment, the layers 1, 2 in the layer stack forming the quantum well structure are arranged in such a way that a layer of the layer stack that is arranged above an underlying layer in each case entirely covers the underlying layer including the side flanks thereof. In other words, the structural element 6 has a core-shell structure. In the exemplary embodiment a core layer 16, which forms the core of the structural element 16, has the shape of a truncated pyramid. Alternatively, the core layer 16 could, however, also have some other shape. The core layer 16 can comprise, for example, GaN. In particular, the core layer 16 can be formed from the material of the barrier layers 2 of the quantum well structure.

The subsequent quantum well layer 1 entirely covers the core layer 16 including the side flanks thereof. In the same way, the subsequent alternating quantum well layers 1 and barrier layers 2 each entirely cover the underlying layer including the side flanks thereof

In this embodiment it is in particular unnecessary for the mask layer 9 to have a greater height than the quantum well structures 5. In this embodiment, the second cladding layer 12, especially a transparent conductive oxide, such as, for example, ITO, can be applied over the entire surface of the multiplicity of structural elements 6 without there being any risk of a short-circuit at the side flanks of the quantum well structures 5. This is because the uppermost layer of the quantum well structure 5 entirely covers the underlying layers. The second cladding layer 12 is therefore in electrical contact only with the uppermost layer of the quantum well structure 5, even when there is no electrical insulating layer arranged between the structural elements 6.

In the second exemplary embodiment, as in the first exemplary embodiment, the quantum well structure 5 can be configured with intermediate layers between the barrier layers 2 and quantum well layers 1 or, for example, with intermediate layers distributed periodically in the quantum well structure 5 (not shown). Further advantageous embodiments of the second exemplary embodiment of the optoelectronic device 11 correspond to the first exemplary embodiment described above.

FIG. 6A shows a third exemplary embodiment of the optoelectronic device 11 which differs from the previous exemplary embodiments in the configuration of the structural elements 6 of the active layer 10. A single structural element 6 is shown on an enlarged scale in FIG. 6B.

The structural elements 6 each have a core layer 16 which has, for example, substantially the shape of a cylinder or a hexagonal prism. A substantially hexagonal shape can especially be determined by the hexagonal crystal structure of the nitride compound semiconductor material. The quantum well structure 5 of the structural elements 6 formed from alternating quantum well layers 1 and barrier layers 2 is in each case grown on the side faces of the core layer 16. In this embodiment, the main planes of the quantum well layers 1 and barrier layers 2 are arranged substantially perpendicular to the substrate 7.

A top face of the structural elements 6 is covered by an electrically insulating layer 15. By means of the electrically insulating layer 15, in particular the side faces of the quantum well layers 1 and barrier layers 2 running in the horizontal direction are electrically insulated from the second cladding layer 12. The structural elements 6 are electrically contacted by the second cladding layer 12, which comprises, for example, a transparent conductive oxide, on their outer face but not on their top face.

Further advantageous developments of the third exemplary embodiment of the optoelectronic device 11 will be found in the description of the exemplary embodiments described above.

The description of the invention with reference to the exemplary embodiments does not limit the invention thereto, but rather the invention encompasses any novel feature and any combination of features, including in particular any combination of features in the patent claims, even if those features or those combinations are not themselves explicitly defined in the patent claims or exemplary embodiments.

OPTOELECTRONIC COMPONENT

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