TREA

Optoelectronic IC package

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Information

  • Patent Grant
  • D510915
  • Patent Number
    D510,915
  • Date Filed
    Friday, October 10, 2003
    21 years ago
  • Date Issued
    Tuesday, October 25, 2005
    19 years ago
Information
Abstract
Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;


FIG. 2 is a first side view thereof;


FIG. 3 is a second side view thereof;


FIG. 4 is a third side view thereof;


FIG. 5 is a top view thereof; and,


FIG. 6 is a fourth side view thereof.


The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.


Claims
  • The ornamental design for an optoelectronic IC package, as shown and described.
Priority Claims (1)
Number Date Country Kind
2003-019763 Jul 2003 JP national
US Referenced Citations (11)
Number Name Date Kind
5218223 Spaeth et al. Jun 1993 A
5679976 Nishikawa et al. Oct 1997 A
D432097 Song et al. Oct 2000 S
6328483 Havasi et al. Dec 2001 B1
6355946 Ishinaga Mar 2002 B1
6571190 Hou et al. May 2003 B2
D476961 Horiuchi et al. Jul 2003 S
6642449 Gotoh et al. Nov 2003 B2
6707069 Song et al. Mar 2004 B2
20010040300 Huang et al. Nov 2001 A1
20040201987 Omata Oct 2004 A1
Foreign Referenced Citations (3)
Number Date Country
D1144892 Jun 2002 JP
D1144893 Jun 2002 JP
D1145109 Jun 2002 JP