The present invention relates to an optoelectronic module.
Cameras having optical sensors and which are permanently attached to a vehicle are increasingly used in the automobile industry for optically detecting the vehicle's surroundings. The high demands on the alignment of optical imaging elements with regard to a light-sensitive sensor result as a rule in the use of what is known as imager modules in which the optical imaging elements are directly mounted on the light-sensitive sensor. However, this limits the processing temperature of the imager module, rendering known inexpensive soldering techniques for attaching such imager modules, e.g., on a supporting element carrying electronic and optical components, unusable.
Based on the optoelectronic module, it is possible to assemble an optical module including an imaging lens system and a light-sensitive sensor, which meets all optical requirements, without unacceptably high thermal stress due to soldering processes or the like. Due to the fact that the imaging optical element is situated in a housing and that the light-sensitive optical element is separately connected to a supporting element, it is possible to optimally pre-assemble both optical elements. In the subsequent assembly of supporting element and housing, a simple and reliable alignment of the optical axes of the optical elements is facilitated by the fact that the optical element connected to the supporting element comes to rest on a supporting surface on the housing while the supporting element, for adjustment purposes, still remains rotatable and displaceable in an x-, y-plane. Due to the fact that the optical element, connected to the supporting element, rests only loosely on the supporting surface and is not fixedly attached to the housing, an excessive mechanical stress of the soldered joints of the optical element, which is preferably soldered to the supporting element, may be prevented. This is, however, advantageous for a long service life of the optoelectronic module. Despite the stable and durable construction, the optoelectronic module may be manufactured in a cost-effective manner, which in turn benefits high-volume applications. Since the imaging optical element is assembled mechanically separated from the light-sensitive optical element, it may also be easily replaced in the event of damage. This makes the optoelectronic module repair-friendly.
The present invention relates to an optoelectronic module having a housing and a supporting element for optical and electronic components situated in the housing. At least one optical component is situated in the housing as well as on the supporting element. The supporting element is attached to the housing via fastening means. Subsequently to the assembly of the supporting element, the fastening means are upset in such a way that the material of the fastening means fills recesses situated in the supporting element, thereby fixing the supporting element.
In a further design variant of the present invention, threaded studs are provided as the fastening means. Subsequently to sliding supporting element 3 onto the studs and aligning optical elements 3.1, 5 to each other, supporting element 3 is screwed together with the studs using washers and nuts. In a further embodiment of the present invention, fastening means 4.1, 4.2 are glued to the supporting element after the alignment of optical elements 3.1, 5 has taken place.
Number | Date | Country | Kind |
---|---|---|---|
10 2004 018 222 | Apr 2004 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/EP2005/050989 | 3/4/2005 | WO | 00 | 6/8/2007 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2005/101813 | 10/27/2005 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4734778 | Kobayashi et al. | Mar 1988 | A |
5212595 | Dennison et al. | May 1993 | A |
5789709 | Luers et al. | Aug 1998 | A |
6359740 | Tsuchiya | Mar 2002 | B1 |
6809884 | Nomura et al. | Oct 2004 | B2 |
7199359 | Webster | Apr 2007 | B2 |
7242433 | Tanaka et al. | Jul 2007 | B2 |
20030066638 | Qu et al. | Apr 2003 | A1 |
Number | Date | Country |
---|---|---|
6-242678 | Sep 1994 | JP |
03 005455 | Jan 2003 | WO |
2005 015897 | Feb 2005 | WO |
Number | Date | Country | |
---|---|---|---|
20070279770 A1 | Dec 2007 | US |