Optoelectronic transceiver with multiple flag values for a respective operating condition

Information

  • Patent Grant
  • 8515284
  • Patent Number
    8,515,284
  • Date Filed
    Friday, December 23, 2011
    12 years ago
  • Date Issued
    Tuesday, August 20, 2013
    10 years ago
Abstract
An optoelectronic transceiver includes an optoelectronic transmitter, an optoelectronic receiver, memory, and an interface. The memory is configured to store digital values representative of operating conditions of the optoelectronic transceiver. The interface is configured to receive from a host a request for data associated with a particular memory address, and respond to the host with a specific digital value of the digital values. The specific digital value is associated with the particular memory address received form the host. The optoelectronic transceiver may further include comparison logic configured to compare the digital values with limit values to generate flag values, wherein the flag values are stored as digital values in the memory.
Description
FIELD OF THE INVENTION

The present invention relates generally to the field of fiber optic transceivers and particularly to circuits used to monitor and control these transceivers. More specifically, the present invention is used to identify abnormal and potentially unsafe operating parameters and to report these to a host coupled to the fiber optic transceiver and/or perform laser shutdown, as appropriate.


BACKGROUND OF THE INVENTION

The two most basic electronic circuits within a fiber optic transceiver are the laser driver circuit, which accepts high speed digital data and electrically drives an LED or laser diode to create equivalent optical pulses, and the receiver circuit which takes relatively small signals from an optical detector and amplifies and limits them to create a uniform amplitude digital electronic output. In addition to, and sometimes in conjunction with these basic functions, there are a number of other tasks that must be handled by the transceiver circuitry as well as a number of tasks that may optionally be handled by the transceiver circuit to improve its functionality. These tasks include, but are not necessarily limited to, the following:


Setup functions. These generally relate to the required adjustments made on a part-to-part basis in the factory to allow for variations in component characteristics such as laser diode threshold current.


Identification. This refers to general purpose memory, typically EEPROM (electrically erasable and programmable read only memory) or other nonvolatile memory. The memory is preferably accessible using a serial communication bus in accordance with an industry standard. The memory is used to store various information identifying the transceiver type, capability, serial number, and compatibility with various standards. While not standard, it would be desirable to further store in this memory additional information, such as sub-component revisions and factory test data.


Eye safety and general fault detection. These functions are used to identify abnormal and potentially unsafe operating parameters and to report these to the user and/or perform laser shutdown, as appropriate.


In addition, it would be desirable in many transceivers for the control circuitry to perform some or all of the following additional functions:


Temperature compensation functions. For example, compensating for known temperature variations in key laser characteristics such as slope efficiency.


Monitoring functions. Monitoring various parameters related to the transceiver operating characteristics and environment. Examples of parameters that it would be desirable to monitor include laser bias current, laser output power, received power level, supply voltage and temperature. Ideally, these parameters should be monitored and reported to, or made available to, a host device and thus to the user of the transceiver.


Power on time. It would be desirable for the transceiver's control circuitry to keep track of the total number of hours the transceiver has been in the power on state, and to report or make this time value available to a host device.


Margining. “Margining” is a mechanism that allows the end user to test the transceiver's performance at a known deviation from ideal operating conditions, generally by scaling the control signals used to drive the transceiver's active components.


Other digital signals. It would be desirable to enable a host device to be able to configure the transceiver so as to make it compatible with various requirements for the polarity and output types of digital inputs and outputs. For instance, digital inputs are used for transmitter disable and rate selection functions while digital outputs are used to indicate transmitter fault and loss of signal conditions.


Few if any of these additional functions are implemented in most transceivers, in part because of the cost of doing so. Some of these functions have been implemented using discrete circuitry, for example using a general purpose EEPROM for identification purposes, by inclusion of some functions within the laser driver or receiver circuitry (for example some degree of temperature compensation in a laser driver circuit) or with the use of a commercial micro-controller integrated circuit. However, to date there have not been any transceivers that provide a uniform device architecture that will support all of these functions, as well as additional functions not listed here, in a cost effective manner.


It is the purpose of the present invention to provide a general and flexible integrated circuit that accomplishes all (or any subset) of the above functionality using a straightforward memory mapped architecture and a simple serial communication mechanism.



FIG. 1 shows a schematic representation of the essential features of a typical prior-art fiber optic transceiver. The main circuit 1 contains at a minimum transmit and receiver circuit paths and power supply voltage 19 and ground connections 18. The receiver circuit typically consists of a Receiver Optical Subassembly (ROSA) 2 which contains a mechanical fiber receptacle as well as a photodiode and pre-amplifier (preamp) circuit. The ROSA is in turn connected to a post-amplifier (postamp) integrated circuit 4, the function of which is to generate a fixed output swing digital signal which is connected to outside circuitry via the RX+ and RX− pins 17. The postamp circuit also often provides a digital output signal known as Signal Detect or Loss of Signal indicating the presence or absence of suitably strong optical input. The Signal Detect output is provided as an output on pin 18. The transmit circuit will typically consist of a Transmitter Optical Subassembly (TOSA), 3 and a laser driver integrated circuit 5. The TOSA contains a mechanical fiber receptacle as well as a laser diode or LED. The laser driver circuit will typically provide AC drive and DC bias current to the laser. The signal inputs for the AC driver are obtained from the TX+ and TX− pins 12. Typically, the laser driver circuitry will require individual factory setup of certain parameters such as the bias current (or output power) level and AC modulation drive to the laser. Typically this is accomplished by adjusting variable resistors or placing factory selected resistors 7, 9 (i.e., having factory selected resistance values). Additionally, temperature compensation of the bias current and modulation is often required. This function can be integrated in the laser driver integrated circuit or accomplished through the use of external temperature sensitive elements such as thermistors 6, 8.


In addition to the most basic functions described above, some transceiver platform standards involve additional functionality. Examples of this are the external TX disable 13 and TX fault 14 pins described in the GBIC standard. In the GBIC standard, the external TX disable pin allows the transmitter to be shut off by the host device, while the TX fault pin is an indicator to the host device of some fault condition existing in the laser or associated laser driver circuit. In addition to this basic description, the GBIC standard includes a series of timing diagrams describing how these controls function and interact with each other to implement reset operations and other actions. Some of this functionality is aimed at preventing non-eyesafe emission levels when a fault conditions exists in the laser circuit. These functions may be integrated into the laser driver circuit itself or in an optional additional integrated circuit 11. Finally, the GBIC standard also requires the EEPROM 10 to store standardized serial ID information that can be read out via a serial interface (defined as using the serial interface of the ATMEL AT24C01A family of EEPROM products) consisting of a clock 15 and data 16 line.


Similar principles clearly apply to fiber optic transmitters or receivers that only implement half of the full transceiver functions.


In addition, optical energy emitted from fiber optic transceivers is potentially dangerous to the human eye. Of particular concern are lasers, because they emit monochromatic, coherent, and highly collimated light that concentrates energy into a narrow beam. It is the energy density of this narrow beam that can harm biological tissues, particularly the eye.


The severity of harm to biological tissues depends on the amount of energy, the exposure time, and the wavelength of the light, where the eye is more sensitive to lower wavelengths. Furthermore, seeing that most light used in fiber-optic systems is infrared energy that cannot be seen, a victim might be exposed to such infrared energy without noticing it.


Therefore, to address eye-safety concerns, laser-based products are regulated by standards. In the United States, responsibility for these regulations resides in the Center for Devices and Radiological Health (CDRH) of the Food and Drug Administration. Outside of the United States, the principle regulation is International Electrotechnical Commission (IEC) Publication 825. These regulations cover both the devices themselves and products using them.


The CDRH and IEC regulations define four classes of devices as follows:


Class I: These devices are considered inherently safe. The IEC requires a classification label, but the CDRH does not.


Class II: Class 2 lasers have levels similar to a Class I device for an exposure of 0.25 second. Eye protection is normally provided by what is called a “normal aversion response.” This means that a victim usually responds to an exposure by an involuntary blink of the eye.


Class III: Both the CDRH and IEC define two subclasses: IIIa and IIIb. Class IIIa devices cannot injure a person's eye under normal conditions of bright light. They can, however, injure eyes when viewed through an optical aid such as a microscope or telescope. For Class IIIa, the CDRH concerns only visible light, while the IEC includes all wavelengths. Class IIIb devices can injure the eye if the light is viewed directly.


Class IV: These devices are more powerful than even Class IIIb lasers. They can injure the eye even when viewed indirectly.


The abovementioned regulations use equations to determine acceptable power levels at a given wavelength as well as procedures for making measurements or estimating power levels. Most lasers in fiber optics are either Class I or Class IIIb devices. Class I devices require no special precautions. Class IIIb devices, besides cautionary labels and warnings in the documentation, require that circuits be designed to lessen the likelihood of accidental exposure. For example, a safety interlock is provided so that the laser will not operate if exposure is possible.


One safety system is called open fiber control (OFC), which shuts down the laser if the circuit between the transmitter and receiver is open. A typical OFC system continuously monitors an optical link to ensure that the link is operating correctly by having the receiving circuit provide feedback to the transmitting circuit. If the receiving circuit does not receive data, the transmitting circuit stops operating the laser, under the assumption that a fault has occurred that might allow exposure to dangerous optical levels. This system, however, requires additional sensors and/or circuitry between the transmitter and the receiver. This is both costly and ineffective where the transmitter has not yet been coupled to a receiver.


In light of the above it is highly desirable to provide a system and method for identifying abnormal and potentially unsafe operating parameters of the fiber optic transceiver, to report these to the user, and/or perform laser shutdown, as appropriate.


SUMMARY OF THE INVENTION

The present invention is preferably implemented as a single-chip integrated circuit, sometimes called a controller, for controlling a transceiver having a laser transmitter and a photodiode receiver. The controller includes memory for storing information related to the transceiver, and analog to digital conversion circuitry for receiving a plurality of analog signals from the laser transmitter and photodiode receiver, converting the received analog signals into digital values, and storing the digital values in predefined locations within the memory. Comparison logic compares one or more of these digital values with predetermined setpoints, generates flag values based on the comparisons, and stores the flag values in predefined locations within the memory. Control circuitry in the controller controls the operation of the laser transmitter in accordance with one or more values stored in the memory. In particular, the control circuitry shuts off the laser transmitter in response to comparisons of signals with predetermined setpoints that indicate potential eye safety hazards.


A serial interface is provided to enable a host device to read from and write to locations within the memory. A plurality of the control functions and a plurality of the monitoring functions of the controller are exercised by a host computer by accessing corresponding memory mapped locations within the controller.


In some embodiments the controller further includes a cumulative clock for generating a time value corresponding to cumulative operation time of the transceiver, wherein the generated time value is readable via the serial interface.


In some embodiments the controller further includes a power supply voltage sensor that measures a power supply voltage supplied to the transceiver. In these embodiments the analog to digital conversion circuitry is configured to convert the power level signal into a digital power level value and to store the digital power level value in a predefined power level location within the memory. Further, the comparison logic of the controller may optionally include logic for comparing the digital power supply voltage with a voltage level limit value, generating a flag value based on the comparison of the digital power supply voltage with the power level limit value, and storing a power level flag value in a predefined power level flag location within the memory.


In some embodiments the controller further includes a temperature sensor that generates a temperature signal corresponding to a temperature of the transceiver. In these embodiments the analog to digital conversion circuitry is configured to convert the temperature signal into a digital temperature value and to store the digital temperature value in a predefined temperature location within the memory. Further, the comparison logic of the controller may optionally include logic for comparing the digital temperature value with a temperature limit value, generating a flag value based on the comparison of the digital temperature signal with the temperature limit value, and storing a temperature flag value in a predefined temperature flag location within the memory.


In some embodiments the controller further includes “margining” circuitry for adjusting one or more control signals generated by the control circuitry in accordance with an adjustment value stored in the memory.





BRIEF DESCRIPTION OF THE DRAWINGS

Additional objects and features of the invention will be more readily apparent from the following detailed description and appended claims when taken in conjunction with the drawings, in which:



FIG. 1 is a block diagram of a prior art optoelectronic transceiver;



FIG. 2 is a block diagram of an optoelectronic transceiver in accordance with the present invention;



FIG. 3 is a block diagram of modules within the controller of the optoelectronic transceiver of FIG. 2;



FIG. 4 is a more detailed block diagram of the connections between the controller and the laser driver and post-amplifier;



FIG. 5A is a block diagram of a high-resolution alarm system and a fast trip alarm system, for monitoring and controlling the operation of the fiber optic transceiver to ensure eye safety;



FIG. 5B is a block diagram of logic for disabling the operation of the fiber optic transceiver to ensure eye safety;



FIG. 6 is a flow chart of a method for reducing or preventing potentially unsafe operation of a fiber optic transceiver using the fast trip alarm system of FIG. 5A; and



FIG. 7 is a flow chart of a method for reducing or preventing potentially unsafe operation of a fiber optic transceiver using the high-resolution alarm system of FIG. 5A.





Like reference numerals refer to corresponding parts throughout the several views of the drawings.


DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A transceiver 100 based on the present invention is shown in FIGS. 2 and 3. The transceiver 100 contains a Receiver Optical Subassembly (ROSA) 102 and Transmitter Optical Subassembly (TOSA) 103 along with associated post-amplifier 104 and laser driver 105 integrated circuits that communicate the high speed electrical signals to the outside world. In this case, however, all other control and setup functions are implemented with a third single-chip integrated circuit 110 called the controller IC.


The controller IC 110 handles all low speed communications with the end user. These include the standardized pin functions such as Loss of Signal (LOS) 111, Transmitter Fault Indication (TX FAULT) 14, and the Transmitter Disable Input (TXDIS) 13. The controller IC 110 has a two wire serial interface 121, also called the memory interface, for accessing memory mapped locations in the controller. Memory Map Tables 1, 2, 3 and 4, below, are an exemplary memory map for one embodiment of a transceiver controller, as implemented in one embodiment of the present invention. It is noted that Memory Map Tables 1, 2, 3 and 4, in addition to showing a memory map of values and control features described in this document, also show a number of parameters and control mechanisms that are outside the scope of this document and thus are not part of the present invention.


The interface 121 is coupled to host device interface input/output lines, typically clock (SCL) and data (SDA) lines, 15 and 16. In the preferred embodiment, the serial interface 121 operates in accordance with the two wire serial interface standard that is also used in the GBIC and SFP standards, however other serial interfaces could equally well be used in alternate embodiments. The two wire serial interface 121 is used for all setup and querying of the controller IC 110, and enables access to the optoelectronic transceiver's control circuitry as a memory mapped device. That is, tables and parameters are set up by writing values to predefined memory locations of one or more nonvolatile memory devices 120, 122, 128 (e.g., EEPROM devices) in the controller, whereas diagnostic and other output and status values are output by reading predetermined memory locations of the same nonvolatile memory devices 120, 122, 128. This technique is consistent with currently defined serial ID functionality of many transceivers where a two wire serial interface is used to read out identification and capability data stored in EEPROM.


It is noted here that some of the memory locations in the memory devices 120, 122, 128 are dual ported, or even triple ported in some instances. That is, while these memory mapped locations can be read and in some cases written via the serial interface 121, they are also directly accessed by other circuitry in the controller 110. For instance, certain “margining” values stored in memory 120 are read and used directly by logic 134 to adjust (i.e., scale upwards or downwards) drive level signals being sent to the D/A output devices 123. Similarly, there are flags stored in memory 128 that are (A) written by logic circuit 131, and (B) read directly by logic circuit 133. An example of a memory mapped location not in memory devices but that is effectively dual ported is the output or result register of clock 132. In this case the accumulated time value in the register is readable via the serial interface 121, but is written by circuitry in the clock circuit 132.


In addition to the result register of the clock 132, other memory mapped locations in the controller may be implemented as registers at the input or output of respective sub-circuits of the controller. For instance, the margining values used to control the operation of logic 134 may be stored in registers in or near logic 134 instead of being stored within memory device 128. In another example, measurement values generated by the ADC 127 may be stored in registers. The memory interface 121 is configured to enable the memory interface to access each of these registers whenever the memory interface receives a command to access the data stored at the corresponding predefined memory mapped location. In such embodiments, “locations within the memory” include memory mapped registers throughout the controller.


In an alternate embodiment, the time value in the result register of the clock 132, or a value corresponding to that time value, is periodically stored in a memory location with the memory 128 (e.g., this may be done once per minute, or once per hour of device operation). In this alternate embodiment, the time value read by the host device via interface 121 is the last time value stored into the memory 128, as opposed to the current time value in the result register of the clock 132.


As shown in FIGS. 2 and 3, the controller IC 110 has connections to the laser driver 105 and receiver components. These connections serve multiple functions. The controller IC has a multiplicity of D/A converters 123. In the preferred embodiment the D/A converters are implemented as current sources, but in other embodiments the D/A converters may be implemented using voltage sources, and in yet other embodiments the D/A converters may be implemented using digital potentiometers. In the preferred embodiment, the output signals of the D/A converters are used to control key parameters of the laser driver circuit 105. In one embodiment, outputs of the D/A converters 123 are use to directly control the laser bias current as well as to control the level of AC modulation to the laser (constant bias operation). In another embodiment, the outputs of the D/A converters 123 of the controller 110 control the level of average output power of the laser driver 105 in addition to the AC modulation level (constant power operation).


In a preferred embodiment, the controller 110 includes mechanisms to compensate for temperature dependent characteristics of the laser. This is implemented in the controller 110 through the use of temperature lookup tables 122 that are used to assign values to the control outputs as a function of the temperature measured by a temperature sensor 125 within the controller IC 110. In alternate embodiments, the controller 110 may use D/A converters with voltage source outputs or may even replace one or more of the D/A converters 123 with digital potentiometers to control the characteristics of the laser driver 105. It should also be noted that while FIG. 2 refers to a system where the laser driver 105 is specifically designed to accept inputs from the controller 110, it is possible to use the controller IC 110 with many other laser driver ICs to control their output characteristics.


In addition to temperature dependent analog output controls, the controller IC may be equipped with a multiplicity of temperature independent (one memory set value) analog outputs. These temperature independent outputs serve numerous functions, but one particularly interesting application is as a fine adjustment to other settings of the laser driver 105 or postamp 104 in order to compensate for process induced variations in the characteristics of those devices. One example of this might be the output swing of the receiver postamp 104. Normally such a parameter would be fixed at design time to a desired value through the use of a set resistor. It often turns out, however, that normal process variations associated with the fabrication of the postamp integrated circuit 104 induce undesirable variations in the resulting output swing with a fixed set resistor. Using the present invention, an analog output of the controller IC 110, produced by an additional D/A converter 123, is used to adjust or compensate the output swing setting at manufacturing setup time on a part-by-part basis.


In addition to the connection from the controller to the laser driver 105, FIG. 2 shows a number of connections from the laser driver 105 to the controller IC 110, as well as similar connections from the ROSA 106 and Postamp 104 to the controller IC 110. These are analog monitoring connections that the controller IC 110 uses to provide diagnostic feedback to the host device via memory mapped locations in the controller IC. The controller IC 110 in the preferred embodiment has a multiplicity of analog inputs. The analog input signals indicate operating conditions of the transceiver and/or receiver circuitry. These analog signals are scanned by a multiplexer 124 and converted using an analog to digital converter (ADC) 127. The ADC 127 has 12 bit resolution in the preferred embodiment, although ADC's with other resolution levels may be used in other embodiments. The converted values are stored in predefined memory locations, for instance in the diagnostic value and flag storage device 128 shown in FIG. 3, and are accessible to the host device via memory reads. These values are calibrated to standard units (such as millivolts or microwatts) as part of a factory calibration procedure.


The digitized quantities stored in memory mapped locations within the controller IC include, but are not limited to, the laser bias current, transmitted laser power, and received power (as measured by the photodiode detector in the ROSA 102). In the memory map tables (e.g., Table 1), the measured laser bias current is denoted as parameter Bin, the measured transmitted laser power is denoted as Pin, and the measured received power is denoted as Rin. The memory map tables indicate the memory locations where, in an exemplary implementation, these measured values are stored, and also show where the corresponding limit values, flag values, and configuration values (e.g., for indicating the polarity of the flags) are stored.


As shown in FIG. 3, the controller 110 includes a voltage supply sensor 126. An analog voltage level signal generated by this sensor is converted to a digital voltage level signal by the ADC 127, and the digital voltage level signal is stored in memory 128. In a preferred embodiment, the A/D input multiplexer (mux) 124 and ADC 127 are controlled by a clock signal so as to automatically, periodically convert the monitored signals into digital signals, and to store those digital values in memory 128.


Furthermore, as the digital values are generated, the value comparison logic 131 of the controller compares these values to predefined limit values. The limit values are preferably stored in memory 128 at the factory, but the host device may overwrite the originally programmed limit values with new limit values. Each monitored signal is automatically compared with both a lower limit and upper limit value, resulting in the generation of two limit flag values that are then stored in the diagnostic value and flag storage device 128. For any monitored signals where there is no meaningful upper or lower limit, the corresponding limit value can be set to a value that will never cause the corresponding flag to be set.


The limit flags are also sometimes call alarm and warning flags. The host device (or end user) can monitor these flags to determine whether conditions exist that are likely to have caused a transceiver link to fail (alarm flags) or whether conditions exist which predict that a failure is likely to occur soon. Examples of such conditions might be a laser bias current which has fallen to zero, which is indicative of an immediate failure of the transmitter output, or a laser bias current in a constant power mode which exceeds its nominal value by more than 50%, which is an indication of a laser end-of-life condition. Thus, the automatically generated limit flags are useful because they provide a simple pass-fail decision on the transceiver functionality based on internally stored limit values.


In a preferred embodiment, fault control and logic circuit 133 logically OR's the alarm and warning flags, along with the internal LOS (loss of signal) input and Fault Input signals, to produce a binary Transceiver fault (TxFault) signal that is coupled to the host interface, and thus made available to the host device. The host device can be programmed to monitor the TxFault signal, and to respond to an assertion of the TxFault signal by automatically reading all the alarm and warning flags in the transceiver, as well as the corresponding monitored signals, so as to determine the cause of the alarm or warning.


The fault control and logic circuit 133 furthermore conveys a loss of signal (LOS) signal received from the receiver circuit (ROSA, FIG. 2) to the host interface.


Yet another function of the fault control and logic circuit 133 is to determine the polarity of its input and output signals in accordance with a set of configuration flags stored in memory 128. For instance, the Loss of Signal (LOS) output of circuit 133 may be either a logic low or logic high signal, as determined by a corresponding configuration flag stored in memory 128.


Other configuration flags (see Table 4) stored in memory 128 are used to determine the polarity of each of the warning and alarm flags. Yet other configuration values stored in memory 128 are used to determine the scaling applied by the ADC 127 when converting each of the monitored analog signals into digital values.


In an alternate embodiment, another input to the controller 102, at the host interface, is a rate selection signal. In FIG. 3 the rate selection signal is input to logic 133. This host generated signal would typically be a digital signal that specifies the expected data rate of data to be received by the receiver (ROSA 102). For instance, the rate selection signal might have two values, representing high and low data rates (e.g., 2.5 Gb/s and 1.25 Gb/s). The controller responds to the rate selection signal by generating control signals to set the analog receiver circuitry to a bandwidth corresponding to the value specified by the rate selection signal.


Another function of the fault control and logic circuit 133 is to disable the operation of the transmitter (TOSA, FIG. 2) when needed to ensure eye safety. There is a standards defined interaction between the state of the laser driver and an internal Tx Disable output, which is implemented by the fault control and logic circuit 133. When the logic circuit 133 detects a problem that might result in an eye safety hazard, the laser driver is preferably disabled by activating an internal Tx Disable signal output from the controller, as described in further detail below. The host device can reset this condition by sending a command signal on the external Tx Disable line 13 (FIG. 2) into the controller from the host. Further details of this functionality can be found below in relation to FIGS. 4-7.



FIG. 4 is a more detailed block diagram of the connections between the controller 110 (FIG. 2) and the laser driver 105 and post-amplifier 104. Optical signals received by the optical receiver in the ROSA 102 are transmitted along a received power connection 402 to the postamp 104. The postamp 104 generates a fixed output swing digital signal which is connected to the host, and/or controller 110 (FIG. 2), via RX+ and RX− connections 404. The postamp circuit preferably also provides a Loss of Signal (LOS) indicator to the host, and/or controller 110 (FIG. 2), via a LOS connection 406, indicating the presence or absence of suitably strong optical input.


The host transmits signal inputs TX+ and TX− to the laser driver 105 via TX+ and TX− connections 420. In addition, the controller 110 (FIG. 2) transmits power to the laser driver via connection 416, and a transmitter disable signal to the laser driver 105 via an internal TX disable connection 418.


As a laser 410 within the TOSA is not turned on and off, but rather modulated between high and low levels above a threshold current, a modulation current is supplied to the laser 410 via an AC modulation current connection 414. Furthermore, a DC laser bias current is supplied from the laser driver 105 to the laser 410 via a laser bias current connection 412. The level of the laser bias current is adjusted to maintain proper laser output (i.e., to maintain a specified or predefined average level of optical output power by the TOSA 103) and to compensate for variations in temperature and power supply voltage.


In addition, some transceivers include an output power monitor 422 within the TOSA 103 that monitors the energy output from the laser 410. The output power monitor 422 is preferably a photodiode within the laser package that measures light emitted from the back facet of the laser 410. In general, the amount of optical power produced by the back facet of the laser diode, represented by an output power signal, is directly proportional to the optical power output by the front or main facet of the laser 410. The ratio, K, of the back facet optical power to the front facet optical power will vary from one laser diode to another, even among laser diodes of the same type. The output power signal is transmitted from the output power monitor 422 in the TOSA 103 to the controller 110 (FIG. 2) via a transmitter output power connection 408.


In a preferred embodiment, certain of the components within the fiber optic transceiver include monitoring logic that outputs digital fault conditions. For example, the laser driver 105 may output a “out of lock” signal 424 if a control loop monitoring the modulation current is broken. These digital fault condition outputs may then be used to notify the host of fault conditions within the component, or shut down the laser.



FIG. 5A is a block diagram 500 of a high-resolution alarm system 502 and a fast trip alarm system 504, for monitoring and controlling the operation of the fiber optic transceiver to ensure eye safety. The fast trip alarm system 504 is used to quickly generate flag used to shut down the laser 410 (FIG. 4). The fast trip alarm system 504 uses an analog comparator 522 to achieve a quick response. The high resolution alarm system 502 does not generate a flag to shut down the laser as quick as the fast trip alarm system 504. However, the high resolution alarm system 502 is more accurate than the fast trip alarm system 504. To achieve this accuracy, the high resolution alarm system 502 uses digital comparators 512. In use, the high resolution alarm system 502 and the fast trip alarm system 504 operate simultaneously. If the fast trip alarm system 504 does not generate a flag quickly, the high resolution alarm system 502 will identify the fault and generate a flag to shut down the laser.


The high-resolution alarm system 502 and fast trip alarm system 504 are preferably contained within the controller 110 (FIG. 3). Both the high-resolution alarm system 502 and fast trip alarm system 504 are coupled to an input signal 506. In a preferred embodiment this input signal is an analog signal. It should be noted that FIG. 5A shows the high-resolution alarm system 502 and fast trip alarm system 504 for a single input signal 506. However, in a preferred embodiment, identical alarm systems 502 and 504 are provided for each of several signals 506, including several different types of input signals.


The input signals processed by the alarm systems 502 and 504 preferably include: power supply voltage, internal transceiver temperature (hereinafter “temperature”), laser bias current, transmitter output power, and received optical power. The power supply voltage 19 (FIG. 3) is preferably the voltage in millivolts as measured by the Vcc sensor 126 (FIG. 3). The temperature is preferably the temperature in ° C. as measured by the temperature sensor 125 (FIG. 3). The laser bias current is preferably the laser bias current in microamps supplied to the laser 410 (FIG. 4) via the laser bias current connection 412 (FIG. 4). The received optical power is the power in microwatts received at the ROSA 102 (FIG. 4) via the received power connection 402 (FIG. 4). Finally, the optical output power (FIG. 4) is the optical power output in microwatts, from the power monitor 422 (FIG. 4) as received by the controller 110 (FIG. 2) via the output power connection 408 (FIG. 4).


The high-resolution alarm system 502 preferably utilizes all of the above described input signals to trigger warnings and/or shut down at least part of the fiber optic transceiver. In other embodiments the high-resolution alarm system 502 utilizes a subset of the above described input signals to trigger warnings and/or alarms. The high-resolution alarm system 502 includes one or more analog to digital converters 124 (see also FIG. 3) that are configured to receive the analog input signal 506. Each type of analog input signal is preferably converted to a digital input signal using a calibration factor 508 for the particular type of input signal received. For example, a supply voltage in millivolts is converted to a 16 bit digital number by multiplying a supply voltage millivolt value by a supply voltage calibration factor. These calibration factors are predetermined and are preferably stored in the diagnostic value and flag storage 128 (FIG. 3). Alternatively, such calibration factors 508 may be stored in the general purpose EEPROM 120 (FIG. 3).


The analog to digital converter 124 is also coupled to multiple comparators 512. In a preferred embodiment, the comparators 512 form a portion of the value comparison and other logic 131 (FIG. 3) in the controller 110 (FIG. 2). In a preferred embodiment, these comparators 512 are digital comparators.


Also coupled to the comparators 512 are high-resolution setpoints 510(1)-(N). In a preferred embodiment, four predetermined setpoints 510(1)-(4) (for each type of input signal 506) are stored in the diagnostic value and flag storage 128 (FIG. 3). These four predetermined setpoints are: a high alarm setpoint 510(1), a high warning setpoint 510(2), a low warning setpoint 510(3), and a low alarm setpoint 510(4). The comparators 512(1)-(N) are configured to compare the input signal 506 with the predetermined setpoints 510(1)-(4). In a preferred embodiment, the digital equivalent of the input signal 506 is simultaneously compared by the comparators 512(1)-(N), to each of the four digital predetermined setpoints 510(1)-(N) for the particular type of input signal received. Also in a preferred embodiment, the setpoints 510(1)-(N) and the digital equivalents to the input signals 506 are preferably sixteen bit numbers. Of course, in other embodiments there may be more or fewer setpoints 510, and the setpoints 510 and input signal could be digitally represented by more or fewer than sixteen bits.


The comparators subsequently generate high-resolution flags 514(1)-(N), which are input into the general logic and fault control circuit 133 (FIG. 3) to either provide a warning to the host computer, or to shut down at least part of the fiber optic transceiver, such as the laser driver 105 (FIG. 4) and/or laser 410 (FIG. 4). Further details of the method for preventing potentially unsafe operation of the fiber optic transceiver, using the high-resolution alarm system 502, are described below in relation to FIG. 7.


The fast trip alarm system 504 includes multiple temperature dependant setpoints 516. These temperature dependant setpoints 516 are preferably stored in the diagnostic values flag storage 128 (FIG. 3) or the D/A temperature lookup tables 122 (FIG. 3). A multiplexer 518 is configured to supply one of the temperature dependant setpoints 516 to a digital to analog converter 123 (also shown in FIG. 3). The precise temperature dependant setpoint 516 that is supplied depends on the temperature 520 measured by the temperature sensor 125 (FIG. 3). For example, for a first measured temperature, a first setpoint is supplied by the multiplexer 518 to the digital to analog converter 123.


A separate copy or instance of the fast trip alarm system 504 is provided for each input signal 506 for which a temperature based alarm check is performed. Unlike the high-resolution alarm system 502, the fast trip alarm system 504 preferably utilizes only the following input signals 506: laser bias current, transmitter output power, and received optical power input signals, and thus in the preferred embodiment there are three instances of the fast trip alarm system 504. In other embodiment, fewer or more fast trip alarm systems 504 may be employed. The analog input signals processed by the fast trip alarm systems 504 are each fed to a respective comparator 522 that compares the input signal to an analog equivalent of one of the temperature dependant setpoints 516. In a preferred embodiment, the comparators 522 form a portion of the value comparison and other logic 131 (FIG. 3) in the controller 110 (FIG. 2). In a preferred embodiment, the comparators 522 are analog comparators.


In a preferred embodiment at least eight temperature dependant setpoints 516 are provided for the laser bias current input signal, with each setpoint corresponding to a distinct 16° C. temperature range. The size of the operating temperature range for each setpoint may be larger or smaller in other embodiments. These temperature dependant setpoints for the laser bias current are crucial because of the temperature compensation needs of a short wavelength module. In particular, at low temperatures the bias required to produce the required light output is much lower than at higher temperatures. In fact, a typical laser bias current when the fiber optic transceiver is at the high end of its temperature operating range will be two or three times as high as the laser bias current when fiber optic transceiver is at the low end of its temperature operating range, and thus the setpoints vary dramatically based on operating temperature. A typical temperature operating range of a fiber optic transceiver is about −40° C. to about 85° C. The temperature dependant setpoints for the laser bias current are also crucial because of the behavior of the laser bias circuit in a fiber optic transceiver that transmits long wavelength energy.


Also in a preferred embodiment, at least four temperature dependant setpoints 516 are provided for the received optical power and transceiver output power input signals, with each setpoint corresponding to a distinct 32° C. operating temperature range of the fiber optic transceiver. The size of the operating temperature range for each setpoint may be larger or smaller in other embodiments.


In a preferred embodiment, the above mentioned setpoints 516 are 8 bit numbers, which scale directly to the pin (Bin, Pin, Rin) input voltages at (2.5V(max)/256 counts)=0.0098 volts/count.


The comparator 522 is configured to compare an analog equivalent of one of the setpoints 516 to the analog input signal 506. In a preferred embodiment, if the analog input signal 506 is larger than the analog equivalent to one of the setpoints 516, then a fast trip alarm flag 524 is generated. The fast trip alarm flag 524 is input into the general logic and fault control circuit 133 (FIG. 3) to either provide a warning to the host computer or shut down at least part of the fiber optic transceiver, such as the laser driver 105 (FIG. 4) and/or laser 410 (FIG. 4). Further details of the method for preventing potentially unsafe operation of the fiber optic transceiver, using the fast trip alarm system 504, are described below in relation to FIG. 6.



FIG. 5B is a block diagram of logic 530 for disabling the operation of the fiber optic transceiver to ensure eye safety, according to a preferred embodiment of the invention. The high-resolution alarm flags 514(1)-(4), the fast trip alarm system flag 524, and any digital fault condition 532 signals, from FIGS. 4 and 5A, are transmitted to an OR gate 534, which is used to shut down the laser. This is accomplished by sending a signal along the internal Tx disable line 418 (FIG. 4). For example if a digital “out of lock” signal or a fast trip alarm flag is received, the laser will be shut down. It should be appreciated that more or less alarm flags or digital fault condition signals may be supplied to the OR gate 534. For instance, in one preferred embodiment, the inputs to the OR gate 534 include only the high and low alarm flags 514(1), 514(4), the fast trip alarm flag 524 and the digital fault condition(s) signal 532. In other words, in this preferred embodiment, the warning flags 514(2) and 514(3) are not used to generate the internal Tx disable signal 418.



FIG. 6 is a flow chart of a method 600 for reducing or preventing potentially unsafe operation of a fiber optic transceiver using the fast trip alarm system 504 of FIG. 5A. Once the fast trip alarm system 504 (FIG. 5A) has started at step 602, an input signal is acquired, at step 604. In a preferred embodiment, the input signal is preferably an analog signal of: laser bias current in milliamps, received optical power in microwatts, or transceiver output power in microwatts. A temperature of the fiber optic transceiver is obtained at step 606. Step 606 may be performed before, after or at the same time as input signal acquisition step 604.


The multiplexer 518 (FIG. 5A) uses the input signal and the measured temperature to determine, at step 608, which setpoint 516 (FIG. 5A) to use for comparison with the input signal. For example, if the input signal is laser bias current, then the multiplexer looks up a setpoint for laser bias current based on the obtained temperature 520 (FIG. 5A).


In a preferred embodiment, this setpoint is then converted from a digital to analog value, at step 610 by the digital to analog converter 123 (FIG. 5A). Thereafter, the comparator 522 (FIG. 5A) compares the input signal to the setpoint, at step 612, to determine whether there is a conflict, at step 614. In a preferred embodiment, a conflict occurs where the input signal is higher than the setpoint (or an analog equivalent of the setpoint). Alternatively, a conflict may occur where the input signal is lower than the setpoint (or an analog equivalent of the setpoint).


If no conflict exists (614—No), then the method 600 repeats itself However, if a conflict does exist (614—Yes), then a fast trip alarm flag 524 (FIG. 5A) is generated at step 616. In a preferred embodiment the fast trip alarm flag 524 (FIG. 5A) is then used to shut down at least part of the fiber optic transceiver, at step 618, by applying a signal to the internal TxDisable connection 418 (FIG. 4). In a preferred embodiment the fast trip alarm flag 524 (FIG. 5A) is used to disable the laser driver 105 (FIG. 4) and/or laser 410 (FIG. 4), so that no potential eye-damage can occur.


The alarm flag 524 (FIG. 5A) can be used to control the laser driver via the internal Tx Disable Output (Dout) and signal the fault to the host system via the Tx Fault Output (Fout). These outputs can also respond to the Tx Fault Input (Fin), if that signal exists in any given implementation, and the Tx Disable Input (Din) which comes into the fiber optic transceiver from the host.



FIG. 7 is a flow chart of a method 700 for reducing or preventing potentially unsafe operation of a fiber optic transceiver using the high-resolution alarm system 502 of FIG. 5A. Once the high-resolution alarm system 502 (FIG. 5A) has started at step 702, an input signal is acquired, at step 704. In a preferred embodiment, the input signal is preferably an analog signal of: power supply voltage 19 (FIG. 3) in millivolts; the temperature in ° C.; the laser bias current 412 (FIG. 4) in microamps; the received optical power 420 (FIG. 4) in microwatts; and the output power 408 (FIG. 4) in microwatts. In other embodiments, the input signal(s) may be scaled in accordance with other units.


An analog to digital converter 124 (FIGS. 3 and 5) then converts the analog input signal 506 (FIG. 5A) to a digital equivalent, preferably a 16 bit number, at step 706. Conversion of the analog input signal 506 (FIG. 5A) to a digital equivalent performed includes multiplying the input signal 506 (FIG. 5A) by a calibration factor 508 (FIG. 5A), at step 708, for the particular type of input signal received, as described above in relation to FIG. 5A.


The comparators 512 (FIG. 5A) then compare the digital equivalent of the input signal to the setpoints 510(1)-(N) (FIG. 5A), at step 710, to determine whether there is a conflict. In a preferred embodiment, conflicts occur when the digital equivalent of the input signal is: higher than the high alarm setpoint 510(1) to produce a high-alarm flag 514(1) (FIG. 5A); higher than the high warning setpoint 510(2) (FIG. 5A) to produce a high warning flag 514(2) (FIG. 5A); lower than a low warning flag 510(3) (FIG. 5A) to produce a low warning flag 514(3) (FIG. 5A); or lower than a low alarm flag 510(4) (FIG. 5A) to produce a low alarm flag 514(4) (FIG. 5A). It should, however, be appreciated that other types of alarms or warnings may be set.


If no conflict exists (712—No), then the method 700 repeats itself. However, if a conflict does exist (714—Yes), then a high-resolution flag 514(1)-(N) (FIG. 5A) is generated, at step 714. In a preferred embodiment, the high-resolution flags 514(1)-(N) (FIG. 5A) are a high alarm flag 514(1), a high warning flag 514(2), a low warning flag 514(3), and a low alarm flag 514(4), as shown in FIG. 5A. Also in a preferred embodiment, the high alarm flag 514(1) (FIG. 5A) and the low alarm flag 514(4) are used to shut down at least part of the fiber optic transceiver, at step 716, by applying a signal to the internal TxDisable connection 418 (FIG. 4). The part of the fiber optic transceiver shut down preferably includes the laser driver 105 (FIG. 4) and/or the TOSA 103 (FIG. 4). The high and low warning flags 514(2) and 514(3) (FIG. 5A) preferably merely provide a warning to the host and do not shut down the laser driver 105 (FIG. 4) and/or the TOSA 103 (FIG. 4).


The alarm flags 514(1)-(N) (FIG. 5A) can be used to control the laser driver via the internal Tx Disable Output (Dout) and signal the fault to the host system via the Tx Fault Output (Fout). These outputs can also respond to the Tx Fault Input (Fin), if that signal exists in any given implementation, and the Tx Disable Input (Din) which comes into the fiber optic transceiver from the host.


In a preferred embodiment, the high-resolution alarm system 502 (FIG. 5A) updates the high-resolution alarm flags at a rate of approximately once every 0.015 seconds (15 milliseconds), and more generally at least 50 times per second. Thus, the high-resolution alarm flags are set within 0.015 seconds of the detection of an alarm condition. In some embodiments the high-resolution alarm flag update rate is between about 50 times per second and 200 times per second. However, the fast trip alarm system 504 (FIG. 5A) preferably updates the fast trip alarm flags a rate that is faster than once every 10 microseconds. In some embodiments the fast trip alarm system 504 updates the fast trip alarm flags at a rate that is between 50,000 and 200,000 times per second, and more generally at least 50,000 times per second. In a preferred embodiment, the alarm flags of the fast trip alarm system 504 are updated at a rate that is more than a thousand times faster than the update rate of the high-resolution alarm flags. In other embodiments the alarm flags of the fast trip alarm system 504 are updated at a rate that is between 250 and 4000 times faster than the update rate of the high-resolution alarm flags.


To further aid the above explanation, two examples are presented below, where a single point failure causes an eye safety fault condition that is detected, reported to a host coupled to the fiber optic transceiver, and/or a laser shutdown is performed.


Example 1

The power monitor 422 (FIG. 4) in a fiber optic transceiver that includes a power monitor, or its associated circuitry, fails, indicating no or low output power when the laser is in fact operating. The laser bias driver will attempt to increase the transmitter output power by increasing laser bias current. Since the feedback is interrupted, the laser is driven to its maximum capability, perhaps exceeding the eye safety alarm setpoints. The fast trip alarm flag will be generated in less than 10 microseconds after the failure and this fast trip alarm flag can be used to shut down the laser driver via the internal Tx disable (Dout) output. If the fast trip alarm fails or is not selected in the output logic setup, the high-resolution alarm for laser bias current is generated, and the high-resolution low alarm for power would also occur, either of which could be used to shut down the laser driver and/or TOSA.


Example 2

The laser driver (in all types of fiber optic transceiver), or its associated circuitry fails, driving the laser to its maximum output. Depending on the specific failure, the laser bias current may read zero or very high, and in a fiber optic transceiver that includes a power monitor, the power will read very high. The fast trip alarm for laser bias current, and the fast trip alarm for transmitted output power will generate an alarm flag within 10 microseconds. If the laser bias current is reading zero, the high-resolution low alarm for laser bias current will generate an alarm flag. This may be indistinguishable from a failure that causes zero light output, like an open laser wire or shorted laser, but the alarm systems preferably err on the side of safety and command the laser to shut down. In this condition, it may not be possible for the logic to physically turn the laser off, if, for example, the fault was caused by a shorted bias driver transistor. In any case, the link will be lost and the Tx fault output will be asserted to advise the host system of the failure. Depending on the configuration of the bias driver circuit, there are non-error conditions which could set some of these flags during a host-commanded transmit disable state, or during startup conditions. For example, if the host commands a transmitter shutdown, some circuits might read zero transmit power, as one would expect, and some might read very large transmit power as an artifact of the shutdown mechanism. When the laser is re-enabled, it takes a period of time for the control circuitry to stabilize, and during this time there may be erratic occurrences of both low, high and fast trip alarms. Programmable delay timers are preferably used to suppress the fault conditions during this time period.


While the combination of all of the above functions is desired in the preferred embodiment of this transceiver controller, it should be obvious to one skilled in the art that a device which only implements a subset of these functions would also be of great use. Similarly, the present invention is also applicable to transmitters and receivers, and thus is not solely applicable to transceivers. Finally, it should be pointed out that the controller of the present invention is suitable for application in multichannel optical links.









TABLE 1





MEMORY MAP FOR TRANSCEIVER CONTROLLER

















Memory




Location


(Array 0)
Name of Location
Function





00h-5Fh
IEEE Data
This memory block is used to




store required GBIC data


60h
Temperature MSB
This byte contains the MSB of




the 15-bit 2's complement




temperature output from the




temperature sensor.


61h
Temperature LSB
This byte contains the LSB of




the 15-bit 2's complement




temperature output from the




temperature sensor. (LSB




is 0b).


62h-63h
Vcc Value
These bytes contain the MSB




(62h) and the LSB (63h) of




the measured Vcc (15-bit




number, with a 0b LSbit)


64h-65h
Bin Value
These bytes contain the MSB




(64h) and the LSB (65h) of




the measured Bin (15-bit




number, with a 0b LSbit)


66h-67h
Pin Value
These bytes contain the MSB




(66h) and the LSB (67h) of




the measured Pin (15-bit




number, with a 0b LSbit)


68h-69h
Rin Value
These bytes contain the MSB




(68h) and the LSB (69h) of




the measured Rin (15-bit




number, with a 0b LSbit)


6Ah-6Dh
Reserved
Reserved


6Eh
IO States
This byte shows the logical




value of the I/O pins.


6Fh
A/D Updated
Allows the user to verify if




an update from the A/D has




occurred to the 5 values:




temperature, Vcc, Bin,




Pin and Rin. The user




writes the byte to 00h. Once




a conversion is complete for




a give value, its bit will




change to ‘1’.


70h-73h
Alarm Flags
These bits reflect the state




of the alarms as a conversion




updates. High alarm bits are




‘1’ if converted value




is greater than corresponding




high limit. Low alarm bits are




‘1’ if converted value




is less than corresponding




low limit. Otherwise, bits




are 0b.


74h-77h
Warning Flags
These bits reflect the state




of the warnings as a con-




version updates. High warning




bits are ‘1’ if coverted




value is greater than




corresponding high limit.




Low warning bits are ‘1’




if converted value is less




than corresponding low limit.




Otherwise, bits are 0b.


78h-7Ah
Reserved
Reserved


7Bh-7Eh
Password Entry Bytes
The four bytes are used for



PWE Byte 3 (7Bh) MSByte
password entry. The entered



PWE Byte 2 (7Ch)
password will determine the



PWE Byte 1 (7Dh)
user's read/write privileges.



PWE Byte 0 (7Eh) LSByte


7Fh
Array Select
Writing to this byte deter-




mines which of the upper




pages of memory is selected




for reading and writing.




0xh (Array x Selected) Where




x = 1, 2, 3, 4 or 5


80h-F7h

Customer EEPROM


87h
DA % Adj
Scale output of D/A converters




by specified percentage












Memory




Location
Name of Location
Function of Location





(Array 1)


00h-FFh

Data EEPROM


(Array 2)


00h-Ffh

Data EEPROM


(Array 3)


80h-81h
Temperature High
The value written to


88h-89h
Alarm
this location serves as


90h-91h
Vcc High Alarm
the high alarm limit.


98h-99h
Bin High Alarm
Data format is the


A0h-A1h
Pin High Alarm
same as the corresponding



Rin High Alarm
value (temperature,




Vcc, Bin, Pin, Rin).


82h-83h
Temperature Low
The value written to


8Ah-8Bh
Alarm
this location serves as


92h-93h
Vcc Low Alarm
the low alarm limit.


9Ah-9Bh
Bin Low Alarm
Data format is the


A2h-A3h
Pin Low Alarm
same as the corresponding



Rin Low Alarm
value (temperature,




Vcc, Bin, Pin, Rin).


84h-85h
Temp High Warning
The value written to


8Ch-8Dh
Vcc High Warning
this location serves as


94h-95h
Bin High Warning
the high warning limit.


9Ch-9Dh
Pin High Warning
Data format is the same


A4h-A5h
Rin High Warning
as the corresponding




value (temperature,




Vcc, Bin, Pin, Rin).


86h-87h
Temperature Low
The value written to


8Eh-8Fh
Warning
this location serves as


96h-97h
Vcc Low Warning
the low warning limit.


9Eh-9Fh
Bin Low Warning
Data format is the same


A6h-A7h
Pin Low Warning
as the corresponding



Rin Low Warning
value (temperature,




Vcc, Bin, Pin, Rin).


A8h-AFh,
Dout control 0-8
Individual bit locations


C5h
Fout control 0-8
are defined in Table 4.


B0h-B7h, C6h
Lout control 0-8


B8h-BFh, C7h


C0h
Reserved
Reserved


C1h
Prescale
Selects MCLK divisor




for X-delay CLKS.


C2h
Dout Delay
Selects number of


C3h
Fout Delay
prescale clocks


C4h
Lout Delay


C8h-C9h
Vcc - A/D Scale
16 bits of gain


CAh-CBh
Bin - A/D Scale
adjustment for


CCh-CDh
Pin - A/D Scale
corresponding A/D


CEh-CFh
Rin - A/D Scale
conversion values.


D0h
Chip Address
Selects chip address




when external pin




ASEL is low.


D1h
Margin #2
Finisar Selective




Percentage (FSP) for




D/A #2


D2h
Margin #1
Finisar Selective




Percentage (FSP) for




D/A #1


D3h-D6h
PW1 Byte 3 (D3h)
The four bytes are



MSB
used for password 1



PW1 Byte 2 (D4h)
entry. The entered



PW1 Byte 1 (D5h)
password will determine



PW1 Byte 0 (D6h) LSB
the Finisar customer's




read/write privileges.


D7h
D/A Control
This byte determines




if the D/A outputs




source or sink current,




and it allows for the




outputs to be scaled.


D8h-DFh
Bin Fast Trip
These bytes define the




fast trip comparison




over temperature.


E0h-E3h
Pin Fast Trip
These bytes define the




fast trip comparison




over temperature.


E4h-E7h
Rin Fast Trip
These bytes define the




fast trip comparison




over temperature.


E8h
Configuration
Location of the bits



Override Byte
is defined in Table 4


E9h
Reserved
Reserved


EAh-EBh
Internal State Bytes
Location of the bits




is defined in Table 4


ECh
I/O States 1
Location of the bits is




defined in Table 4


EDh-EEh
D/A Out
Magnitude of the




temperature compensated




D/A outputs


EFh
Temperature Index
Address pointer to




the look-up Arrays


F0h-FFh
Reserved
Reserved


(Array 4)


00h-Ffh

D/A Current vs. Temp




#1 (User-Defined




Look-up Array #1)


(Array 5)


00h-Ffh

D/A Current vs. Temp




#2 (User-Defined




Look-up Array #2)
















TABLE 2







DETAIL MEMORY DESCRIPTIONS -


A/D VALUES AND STATUS BITS










Byte
Bit
Name
Description







Converted analog values. Calibrated 16 bit data. (See Notes 1-2)













96
All
Temperature
Signed 2's complement integer temperature


(60h)

MSB
(−40 to +125 C.)





Based on internal temperature measurement


97
All
Temperature
Fractional part of temperature (count/256)




LSB


98
All
Vcc MSB
Internally measured supply voltage in





transceiver. Actual voltage is full 16 bit





value * 100 uVolt.


99
All
Vcc LSB
(Yields range of 0-6.55 V)


100
All
TX Bias
Measured TX Bias Current in mA Bias




MSB
current is full 16 bit value *(1/256) mA.


101
All
TX Bias
(Full range of 0-256 mA possible with 4




LSB
uA resolution)


102
All
TX Power
Measured TX output power in mW. Output




MSB
is full 16 bit value *(1/2048) mW.





(see note 5)


103
All
TX Power
(Full range of 0-32 mW possible with 0.5




LSB
μW resolution, or −33 to +15 dBm)


104
All
RX Power
Measured RX input power in mW RX




MSB
power is full 16 bit value *(1/16384) mW.





(see note 6)


105
All
RX Power
(Full range of 0-4 mW possible with 0.06




LSB
μW resolution, or −42 to +6 dBm)


106
All
Reserved
Reserved for 1st future definition of




MSB
digitized analog input


107
All
Reserved
Reserved for 1st future definition of




LSB
digitized analog input


108
All
Reserved
Reserved for 2nd future definition of




MSB
digitized analog input


109
All
Reserved
Reserved for 2nd future definition of




LSB
digitized analog input


110
7
TX Disable
Digital state of the TX Disable Input Pin


110
6
Reserved


110
5
Reserved


110
4
Rate
Digital state of the SFP Rate Select Input




Select
Pin


110
3
Reserved


110
2
TX Fault
Digital state of the TX Fault Output Pin


110
1
LOS
Digital state of the LOS Output Pin


110
0
Power-On-
Indicates transceiver has achieved power up




Logic
and data valid


111
7
Temp A/D
Indicates A/D value in Bytes 96/97 is




Valid
valid


111
6
Vcc
Indicates A/D value in Bytes 98/99 is




A/D Valid
valid


111
5
TX Bias
Indicates A/D value in Bytes 100/101 is




A/D Valid
valid


111
4
TX Power
Indicates A/D value in Bytes 102/103 is




A/D Valid
valid


111
3
RX Power
Indicates A/D value in Bytes 104/105 is




A/D Valid
valid


111
2
Reserved
Indicates A/D value in Bytes 106/107 is





valid


111
1
Reserved
Indicates A/D value in Bytes 108/109 is





valid


111
0
Reserved
Reserved
















TABLE 3







DETAIL MEMORY DESCRIPTIONS -


ALARM AND WARNING FLAG BITS


Alarm and Warning Flag Bits










Byte
Bit
Name
Description





112
7
Temp High
Set when internal temperature




Alarm
exceeds high alarm level.


112
6
Temp Low
Set when internal temperature




Alarm
is below low alarm level.


112
5
Vcc
Set when internal supply voltage




High Alarm
exceeds high alarm level.


112
4
Vcc
Set when internal supply voltage




Low Alarm
is below low alarm level.


112
3
TX Bias
Set when TX Bias current exceeds




High Alarm
high alarm level.


112
2
TX Bias
Set when TX Bias current is below




Low Alarm
low alarm level.


112
1
TX Power
Set when TX output power exceeds




High Alarm
high alarm level.


112
0
TX Power
Set when TX output power is below




Low Alarm
low alarm level.


113
7
RX Power
Set when Received Power exceeds




High Alarm
high alarm level.


113
6
RX Power
Set when Received Power is below




Low Alarm
low alarm level.


113
5-0
Reserved




Alarm


114
All
Reserved


115
All
Reserved


116
7
Temp High
Set when internal temperature




Warning
exceeds high warning level.


116
6
Temp Low
Set when internal temperature




Warning
is below low warning level.


116
5
Vcc
Set when internal supply voltage




High Warning
exceeds high warning level.


116
4
Vcc
Set when internal supply voltage




Low Warning
is below low warning level.


116
3
TX Bias
Set when TX Bias current exceeds




High Warning
high warning level.


116
2
TX Bias
Set when TX Bias current is below




Low Warning
low warning level.


116
1
TX Power High
Set when TX output power exceeds




Warning
high warning level.


116
0
TX Power Low
Set when TX output power is below




Warning
low warning level.


117
7
RX Power High
Set when Received Power exceeds




Warning
high warning level.


117
6
RX Power Low
Set when Received Power is below




Warning
low warning level.


117
5
Reserved




Warning


117
4
Reserved




Warning


117
3
Reserved




Warning


117
2
Reserved




Warning


117
1
Reserved




Warning


117
0
Reserved




Warning


118
All
Reserved


119
All
Reserved
























TABLE 4







Byte Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0





X-out cntl0
T alrm hi
T alrm lo
V alrm hi
V alrm lo
B alrm hi
B alrm lo
P alrm hi
P alrm lo



set
set
set
set
set
set
set
set


X-out cntl1
R alrm hi
R alrm lo
B ft hi
P ft hi
R ft hi
D-in inv
D-in set
F-in inv



set
set
set
set
set
set

set


X-out cntl2
F-in set
L-in inv
L-in set
Aux inv
Aux set
T alrm hi
T alrm lo
V alrm hi




set

set

hib
hib
hib


X-out cntl3
V alrm lo
B alrm hi
B alrm lo
P alrm hi
P alrm lo
R alrm hi
R alrm lo
B ft hi



hib
hib
hib
hib
hib
hib
hib
hib


X-out cntl4
P ft hi
R ft hi
D-in inv
D-in hib
F-in inv
F-in hib
L-in inv
L-in hib



hib
hib
hib

hib

hib


X-out cntl5
Aux inv
Aux hib
T alrm hi
T alrm lo
V alrm hi
V alrm lo
B alrm hi
B alrm lo



hib

clr
clr
clr
clr
clr
clr


X-out cntl6
P alrm hi
P alrm lo
R alrm hi
R alrm lo
B ft hi
P ft hi
R ft hi
D-in inv



clr
clr
clr
clr
clr
clr
clr
clr


X-out cntl7
D-in clr
F-in inv
F-in clr
L-in inv
L-in clr
Aux inv
Aux clr
EE




clr

clr

clr


X-out cntl8
latch
invert
o-ride
o-ride
S reset
HI enable
LO enable
Pullup



select

data
select
data


enable


Prescale
reserved
reserved
Reserved
reserved
B3
B2
B1
B0


X-out delay
B7
B6
B5
B4
B3
B2
B1
B0


chip address
b7
b6
b5
b4
b3
b2
b1
X


X-ad scale
215
214
213
212
211
210
29
28


MSB


X-ad scale
27
26
25
24
23
22
21
20


LSB















source/

source/




sink
D/A #2 range
sink
D/A #1 range















D/A cntl
1/0
22
21
20
1/0
22
21
20





config/O-
manual
manual
manual
EE Bar
SW-POR
A/D
Manual
reserved


ride
D/A
index
AD alarm


Enable
fast alarm


Internal
D-set
D-inhibit
D-delay
D-clear
F-set
F-inhibit
F-delay
F-clear


State 1


Internal
L-set
L-inhibit
L-delay
L-clear
reserved
reserved
reserved
reserved


State 0


I/O States 1
reserved
F-in
L-in
reserved
D-out
reserved
reserved
reserved


Margin #1
Reserved
Neg_Scale2
Neg_Scale1
Neg_Scale0
Reserved
Pos_Scale2
Pos_Scale1
Pos_Scale0


Margin #2
Reserved
Neg_Scale2
Neg_Scale1
Neg_Scale0
Reserved
Pos_Scale2
Pos_Scale1
Pos_Scale0








Claims
  • 1. An optoelectronic transceiver comprising: an optoelectronic transmitter;an optoelectronic receiver;comparison logic to compare sensor values representative of operating conditions of the optoelectronic transceiver with corresponding limit values to generate flag values;memory to store the flag values, the flag values comprising a first flag value and a second flag value associated with a respective operating condition, wherein the first flag value and a second flag value are associated with a shared memory address; anda module configured to: receive, from a host external to the optoelectronic transceiver, a request for information associated with the respective operating condition, wherein the request includes the shared memory address; andrespond to the host by sending flag values associated with the shared memory address, wherein the flag values sent to the host include at least the first flag value and the second flag value.
  • 2. The optoelectronic transceiver of claim 1, wherein the comparison logic is a module in an integrated circuit.
  • 3. The optoelectronic transceiver of claim 1, wherein the module is an interface module in an integrated circuit.
  • 4. The optoelectronic transceiver of claim 3, wherein the interface module is a module in an integrated circuit comprising a plurality of modules comprising circuitry.
  • 5. The optoelectronic transceiver of claim 3, wherein the interface module is configured to facilitate communications between the host and other modules within the optoelectronic transceiver.
  • 6. The optoelectronic transceiver of claim 5, wherein the other modules within the optoelectronic transceiver include one or more logic modules and one or more memory modules.
  • 7. The optoelectronic transceiver of claim 1, wherein the module enables the host to specify read and write operations to read from and write to locations in the memory, wherein the read and write operations are associated with respective host specified memory addresses.
  • 8. The optoelectronic transceiver of claim 1, wherein the module enables the host to perform control functions by accessing locations associated with respective host specified memory addresses.
  • 9. The optoelectronic transceiver of claim 8, further comprising control logic to control operations of the optoelectronic transmitter in accordance with one or more of the flag values generated based on corresponding limit values, wherein, one or more of the limit values are provided by the host.
  • 10. The optoelectronic transceiver of claim 8, further comprising control logic to control operations of the optoelectronic transmitter in accordance with one or more values stored in memory.
  • 11. The optoelectronic transceiver of claim 10, wherein the control logic comprises circuitry.
  • 12. The optoelectronic transceiver of claim 10, wherein the control logic is configured to conditionally disable the operation of the optoelectronic transmitter.
  • 13. The optoelectronic transceiver of claim 9, further comprising: control adjustment logic for adjusting a control signal generated by the control logic in accordance with an adjustment value stored in memory.
  • 14. The optoelectronic transceiver of claim 13, wherein the control adjustment logic comprises circuitry.
  • 15. The optoelectronic transceiver of claim 1, wherein the shared memory address is a byte-level memory address.
  • 16. The optoelectronic transceiver of claim 1, wherein the shared memory address is a logical location in memory.
  • 17. The optoelectronic transceiver of claim 16, wherein the shared memory address is used to locate data in memory.
  • 18. The optoelectronic transceiver of claim 1, further comprising: analog to digital conversion circuitry configured to: receive a plurality of analog signals from one or more components of the optoelectronic transceiver, the analog signals corresponding to operating conditions of the optoelectronic transceiver; andconvert the analog signals into digital signals comprising the sensor values that are used by the comparison logic to generate the flag values.
  • 19. The optoelectronic transceiver of claim 1, wherein: the shared memory address corresponds to a memory mapped location in a predefined memory map; andthe memory map includes memory mapped locations corresponding to a plurality of different physical storage elements in the optoelectronic device.
  • 20. The optoelectronic transceiver of claim 19, wherein the plurality of different physical storage elements include at least one memory device and at least one register.
  • 21. The optoelectronic transceiver of claim 1, wherein: the first flag value is indicative of a comparison between a respective sensor value for the respective operating condition and a first limit value for the respective operating condition; andthe second flag value is indicative of a comparison between the respective sensor value for the respective operating condition and a second limit value for the respective operating condition, the second limit value being different from the first limit value.
  • 22. The optoelectronic transceiver of claim 1, wherein the request includes a request for multiple pairs of flag values, each pair associated with a distinct operating condition.
  • 23. The optoelectronic transceiver of claim 22, wherein each pair of flag values includes, for a particular operating condition: a flag value indicative of a comparison between a respective sensor value for the particular operating condition and a low limit value for the particular operating condition; anda flag value indicative of a comparison between the respective sensor value for the particular operating condition and a high limit value for the particular operating condition.
  • 24. The optoelectronic transceiver of claim 22, wherein the multiple pairs of flag values for the request include at least two pairs of flag values selected from the set consisting of: a high temperature alarm flag and a low temperature alarm flag,a high internal supply voltage alarm flag and a low internal supply voltage alarm flag,a high transmitter bias current alarm flag and a low transmitter bias current alarm flag,a high transmitter output power alarm flag and a low transmitter output power alarm flag, anda high received optical power alarm flag and a low received optical power alarm flag.
  • 25. The optoelectronic transceiver of claim 22, wherein the multiple pairs of flag values for the request include at least three pairs of flag values selected from the set consisting of: a high temperature alarm flag and a low temperature alarm flag,a high internal supply voltage alarm flag and a low internal supply voltage alarm flag,a high transmitter bias current alarm flag and a low transmitter bias current alarm flag,a high transmitter output power alarm flag and a low transmitter output power alarm flag, anda high received optical power alarm flag and a low received optical power alarm flag.
  • 26. The optoelectronic transceiver of claim 1, wherein: the flag values include a third flag value and a fourth flag value associated with the respective operating condition, wherein the third flag value and the fourth flag value are associated with an additional shared memory address; andthe module is configured to: receive, from a host external to the optoelectronic transceiver, an additional request for information associated with the respective operating condition, wherein the additional request includes the additional shared memory address; andrespond to the host by sending flag values associated with the additional shared memory address, wherein the flag values sent to the host include at least the third flag value and the fourth flag value.
  • 27. The optoelectronic transceiver of claim 26, wherein: the first flag value and the second flag value are alarm flag values generated by the comparison logic in accordance with high and low alarm limit values for the respective operating condition; andthe third flag value and the fourth flag value are warning flag values generated by the comparison logic in accordance with high and low warning limit values for the respective operating condition.
RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 12/400,752, filed Mar. 9, 2009, now U.S. Pat. No. 8,086,100, which is a continuation of U.S. application Ser. No. 11/679,800, filed Feb. 27, 2007, now U.S. Pat. No. 7,502,564, which is a continuation of U.S. application Ser. No. 10/657,554, filed Sep. 4, 2003, now U.S. Pat. No. 7,184,668, which is a continuation of U.S. application Ser. No. 10/266,869, filed Oct. 8, 2002, now U.S. Pat. No. 7,058,310, which is a continuation-in-part of prior application Ser. No. 09/777,917, filed Feb. 5, 2001, now U.S. Pat. No. 7,079,775, all of which are hereby incorporated by reference in their entireties.

US Referenced Citations (272)
Number Name Date Kind
3646329 Yoshino et al. Feb 1972 A
4162531 Rode et al. Jul 1979 A
4192005 Kurtz Mar 1980 A
4273413 Bendiksen et al. Jun 1981 A
4315210 Michel et al. Feb 1982 A
4329600 Stewart May 1982 A
4414480 Zasio Nov 1983 A
4509130 Menzies et al. Apr 1985 A
4523089 Maeda et al. Jun 1985 A
4545078 Wiedeburg Oct 1985 A
4547039 Caron et al. Oct 1985 A
4549124 Beier Oct 1985 A
4559616 Bruder Dec 1985 A
4580044 Hongo et al. Apr 1986 A
4592057 Comerford May 1986 A
4597631 Flores Jul 1986 A
4612670 Henderson Sep 1986 A
4612671 Giles Sep 1986 A
4627080 Debus, Jr. Dec 1986 A
4647148 Katagiri Mar 1987 A
4663760 Shimada et al. May 1987 A
4680487 Kobayashi Jul 1987 A
4685097 van der Put Aug 1987 A
4687924 Galvin et al. Aug 1987 A
4691127 Huizer Sep 1987 A
4707067 Haberland et al. Nov 1987 A
4707620 Sullivan et al. Nov 1987 A
4715003 Keller et al. Dec 1987 A
4719369 Asano et al. Jan 1988 A
4728881 Evans et al. Mar 1988 A
4734914 Yoshikawa Mar 1988 A
4747091 Doi May 1988 A
4765188 Krechmery et al. Aug 1988 A
4779013 Tanaka Oct 1988 A
4809286 Kollanyi et al. Feb 1989 A
4859877 Cooperman et al. Aug 1989 A
4860198 Takenaka Aug 1989 A
4872080 Hentschel et al. Oct 1989 A
4878225 Aiba et al. Oct 1989 A
4890288 Inuyama et al. Dec 1989 A
4894562 Cavaliere et al. Jan 1990 A
4903273 Bathe Feb 1990 A
4912521 Almquist et al. Mar 1990 A
4916707 Rosenkranz Apr 1990 A
4918681 Ikeda Apr 1990 A
4932038 Windus Jun 1990 A
4939389 Cox et al. Jul 1990 A
4958520 Trommler et al. Sep 1990 A
4967105 Akamatsu et al. Oct 1990 A
4977333 Suzuki et al. Dec 1990 A
4992724 Hisanaga et al. Feb 1991 A
5005939 Arvanitakis et al. Apr 1991 A
5019769 Levinson May 1991 A
5023488 Gunning Jun 1991 A
5024101 Tanaka et al. Jun 1991 A
5029272 Fourcroy et al. Jul 1991 A
5039194 Block et al. Aug 1991 A
5045730 Cooperman et al. Sep 1991 A
5045832 Tam Sep 1991 A
5046138 Grubb, III Sep 1991 A
5047835 Chang Sep 1991 A
5055715 Inaba Oct 1991 A
5057932 Lang Oct 1991 A
5069522 Block et al. Dec 1991 A
5073838 Ames Dec 1991 A
5075569 Branson Dec 1991 A
5081379 Korteling Jan 1992 A
5097148 Gabara Mar 1992 A
5107230 King Apr 1992 A
5117130 Shoji May 1992 A
5117476 Yingst et al. May 1992 A
5118971 Schenck Jun 1992 A
5121064 Eller Jun 1992 A
5122893 Tolbert Jun 1992 A
5134311 Biber et al. Jul 1992 A
5136410 Heiling et al. Aug 1992 A
5165046 Hesson Nov 1992 A
5185538 Kondoh et al. Feb 1993 A
5194765 Dunlop et al. Mar 1993 A
5195154 Uchida Mar 1993 A
5199884 Kaufman et al. Apr 1993 A
5202943 Carden et al. Apr 1993 A
5206546 Usami Apr 1993 A
5224866 Nakamura et al. Jul 1993 A
5228064 Viviano Jul 1993 A
5230638 DiVesti Jul 1993 A
5237214 Usami Aug 1993 A
5243678 Schaffer et al. Sep 1993 A
5254883 Horowitz et al. Oct 1993 A
5268949 Watanabe et al. Dec 1993 A
5278404 Yeates Jan 1994 A
5296756 Patel et al. Mar 1994 A
5334826 Sato et al. Aug 1994 A
5383208 Queniat et al. Jan 1995 A
5387824 Michelsen Feb 1995 A
5392273 Masaki et al. Feb 1995 A
5396059 Yeates Mar 1995 A
5448629 Bosch et al. Sep 1995 A
5457407 Shu et al. Oct 1995 A
5477541 White et al. Dec 1995 A
5479288 Ishizuka et al. Dec 1995 A
5506922 Grois et al. Apr 1996 A
5510924 Terui et al. Apr 1996 A
5515361 Li et al. May 1996 A
5515468 DeAndrea et al. May 1996 A
5517505 Buchholz et al. May 1996 A
5526160 Watanabe et al. Jun 1996 A
5526164 Link et al. Jun 1996 A
5546042 Tedrow et al. Aug 1996 A
5553237 Eisenberg et al. Sep 1996 A
5557437 Sakai et al. Sep 1996 A
5568068 Ota et al. Oct 1996 A
5574435 Mochizuki Nov 1996 A
5576877 Aulet et al. Nov 1996 A
5578960 Matsumara et al. Nov 1996 A
5594748 Jabr Jan 1997 A
5596285 Marbot et al. Jan 1997 A
5596663 Ishibashi et al. Jan 1997 A
5604757 Liang et al. Feb 1997 A
5604758 AuYeung et al. Feb 1997 A
5619430 Nolan et al. Apr 1997 A
5623355 Olsen Apr 1997 A
5659459 Wakabayashi et al. Aug 1997 A
5668468 Cargill Sep 1997 A
5673282 Wurst Sep 1997 A
5684421 Chapman et al. Nov 1997 A
5717533 Poplawski et al. Feb 1998 A
5734558 Poplawski et al. Mar 1998 A
5734672 McMinn et al. Mar 1998 A
5745409 Wong et al. Apr 1998 A
5748672 Smith et al. May 1998 A
5761216 Sotome et al. Jun 1998 A
5801866 Chan et al. Sep 1998 A
5812572 King et al. Sep 1998 A
5822099 Takamatsu Oct 1998 A
5831929 Manning Nov 1998 A
5838177 Keeth Nov 1998 A
5844928 Shastri et al. Dec 1998 A
5852378 Keeth Dec 1998 A
5854704 Grandpierre Dec 1998 A
5860080 James et al. Jan 1999 A
5862094 Kawabata et al. Jan 1999 A
5870347 Keeth et al. Feb 1999 A
5872736 Keeth Feb 1999 A
5887254 Halonen Mar 1999 A
5892981 Wiggers Apr 1999 A
5910920 Keeth Jun 1999 A
5920518 Harrison et al. Jul 1999 A
5926034 Seyyedy Jul 1999 A
5926303 Giebel et al. Jul 1999 A
5935263 Keeth et al. Aug 1999 A
5940608 Manning Aug 1999 A
5940609 Harrison Aug 1999 A
5943152 Mizrahi et al. Aug 1999 A
5945819 Ursino et al. Aug 1999 A
5946244 Manning Aug 1999 A
5946260 Manning Aug 1999 A
5949254 Keeth Sep 1999 A
5953690 Lemon et al. Sep 1999 A
5956168 Levinson et al. Sep 1999 A
5959481 Donnelly et al. Sep 1999 A
5959929 Cowles et al. Sep 1999 A
5963502 Watanabe et al. Oct 1999 A
5977797 Gasparik Nov 1999 A
5986955 Siek et al. Nov 1999 A
5987628 Von Bokern et al. Nov 1999 A
5996043 Manning Nov 1999 A
5999549 Freitag et al. Dec 1999 A
6000022 Manning Dec 1999 A
6010538 Sun et al. Jan 2000 A
6011732 Harrison et al. Jan 2000 A
6014241 Winter et al. Jan 2000 A
6014759 Manning Jan 2000 A
6016282 Keeth Jan 2000 A
6020593 Chow et al. Feb 2000 A
6021947 Swartz Feb 2000 A
6023147 Cargin, Jr. et al. Feb 2000 A
6026050 Baker et al. Feb 2000 A
6026051 Keeth et al. Feb 2000 A
6028451 Ruff Feb 2000 A
6029250 Keeth Feb 2000 A
6029252 Manning Feb 2000 A
6031787 Jeddeloh Feb 2000 A
6032220 Martin et al. Feb 2000 A
6032274 Manning Feb 2000 A
6034878 Osaka et al. Mar 2000 A
6047346 Lau et al. Apr 2000 A
6049413 Taylor et al. Apr 2000 A
6064501 Roberts et al. May 2000 A
6072747 Yoon Jun 2000 A
6087893 Oowaki et al. Jul 2000 A
6094075 Garrett, Jr. et al. Jul 2000 A
6097746 Noda et al. Aug 2000 A
6108114 Gilliland et al. Aug 2000 A
6115113 Flockencier Sep 2000 A
H1881 Davis et al. Oct 2000 H
RE36886 Ishibashi et al. Oct 2000 E
6160647 Gilliland et al. Dec 2000 A
6175434 Feng Jan 2001 B1
6205505 Jau et al. Mar 2001 B1
6222660 Traa Apr 2001 B1
6256127 Taylor Jul 2001 B1
6294934 Garrett, Jr. et al. Sep 2001 B1
6317804 Levy et al. Nov 2001 B1
6321282 Horowitz et al. Nov 2001 B1
6359938 Keevill et al. Mar 2002 B1
6423963 Wu Jul 2002 B1
6442644 Gustavson et al. Aug 2002 B1
6462591 Garrett, Jr. et al. Oct 2002 B2
6463392 Nygaard et al. Oct 2002 B1
6473224 Dugan et al. Oct 2002 B2
6512617 Tanji et al. Jan 2003 B1
6516365 Horowitz et al. Feb 2003 B2
6526076 Cham et al. Feb 2003 B2
6539036 Lehr et al. Mar 2003 B2
6556052 Garrett, Jr. et al. Apr 2003 B2
6608507 Garrett, Jr. et al. Aug 2003 B2
6631146 Pontis et al. Oct 2003 B2
6661836 Dalal et al. Dec 2003 B1
6684263 Horowitz et al. Jan 2004 B2
6694462 Reiss et al. Feb 2004 B1
6711189 Gilliland et al. Mar 2004 B1
6748181 Miki et al. Jun 2004 B2
6802654 Roberts et al. Oct 2004 B1
6850398 Ciancio Feb 2005 B2
6862302 Chieng et al. Mar 2005 B2
6937949 Fishman et al. Aug 2005 B1
6941077 Aronson et al. Sep 2005 B2
6952531 Aronson et al. Oct 2005 B2
6957021 Aronson et al. Oct 2005 B2
7050720 Aronson et al. May 2006 B2
7058310 Aronson et al. Jun 2006 B2
7079775 Aronson et al. Jul 2006 B2
7162160 Aronson et al. Jan 2007 B2
7184668 Aronson et al. Feb 2007 B2
7233027 Neumeuer et al. Jun 2007 B2
RE40150 Ishibashi et al. Mar 2008 E
RE40154 Ishibashi et al. Mar 2008 E
7474630 Huang et al. Jan 2009 B2
7574540 Robillard et al. Aug 2009 B2
7574630 Ranaweera et al. Aug 2009 B1
7653840 Taylor et al. Jan 2010 B1
8159956 Ray Noble et al. Apr 2012 B2
20020021468 Kato et al. Feb 2002 A1
20020027688 Stephenson Mar 2002 A1
20020060824 Liou et al. May 2002 A1
20020097468 Mecherle et al. Jul 2002 A1
20020101641 Kurchuk Aug 2002 A1
20020105982 Chin et al. Aug 2002 A1
20020149821 Aronson et al. Oct 2002 A1
20020181519 Vilhelmsson et al. Dec 2002 A1
20020181894 Gilliland et al. Dec 2002 A1
20030053170 Levinson et al. Mar 2003 A1
20030113118 Bartur Jun 2003 A1
20030210917 Stewart et al. Nov 2003 A1
20040076113 Aronson et al. Apr 2004 A1
20040120720 Chang et al. Jun 2004 A1
20040122607 Fishman et al. Jun 2004 A1
20040153913 Fishman et al. Aug 2004 A1
20040202210 Thornton Oct 2004 A1
20040240886 Aronson et al. Dec 2004 A1
20040253003 Farmer et al. Dec 2004 A1
20050058455 Aronson et al. Mar 2005 A1
20050246568 Davies Nov 2005 A1
20060251087 Ng et al. Nov 2006 A1
20070189174 Hibbert Aug 2007 A1
20070189175 Vedanabhatla et al. Aug 2007 A1
20070189176 Milne et al. Aug 2007 A1
20080187033 Smith Aug 2008 A1
20080189641 Kotturu et al. Aug 2008 A1
20080253293 Beyers Oct 2008 A1
20110161728 Kano et al. Jun 2011 A1
Foreign Referenced Citations (21)
Number Date Country
0061034 Aug 1985 EP
0482392 Apr 1992 EP
1168687 Jan 2002 EP
1471671 Oct 2004 EP
58-140175 Aug 1983 JP
62-124576 Jun 1987 JP
62-235975 Oct 1987 JP
62-281485 Dec 1987 JP
2-102589 Apr 1990 JP
4-023373 Jan 1992 JP
1994-097548 Apr 1994 JP
6-504405 May 1994 JP
6-209209 Jul 1994 JP
9-162811 Jun 1997 JP
2002-191821 Jul 2002 JP
WO 9321706 Oct 1993 WO
WO 9800893 Jan 1998 WO
WO 9800943 Jan 1998 WO
WO 02063800 Aug 2002 WO
WO 2004013991 Feb 2004 WO
WO 2004098100 Nov 2004 WO
Non-Patent Literature Citations (259)
Entry
Bellcore, Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria GR-253-CORE, Issue 2, Dec. 1995, Revision 2, Jan. 1999, 786 pgs.
Dallas Semiconductor Maxim, DS1847 Dual Temperature-Controlled NV Variable Resistor, Jan. 18, 2006, 1-17 pgs.
Dallas Semiconductor Maxim, DS1848, Dual Temperature-Controlled NV Variable Resistor & Memory Jan. 18, 2006, 1-17 pgs.
Finisar Corp., App Note AN-2025: Using the Finisar GBIC I2C Test Diagnostics Port, 1998, 16 pgs.
Finisar Corporation, Office Action, European Patent Application 05737559.4, Oct. 17, 2011,6 pgs.
Noble, Office Action, U.S. Appl. No. 13/449,226, filed Aug. 17, 2012, 12 pgs.
SFF Committee, SFF-8053 Specification for GBIC (Gigabit Interface Converter), Rev 5.5, Sep. 27, 2000, i-xviii and 1-66 pgs.
Acarlar, A High Speed Surface Mount Optical Data Link for Military Applications, IEEE Xplore, 1990, pp. 297-302.
ADC Fiber Optic Transceiver Evaluation Kit Advertisement, International Fiber Optics and Communications, Sep. 1986, 1 pg.
AMP, One-Piece Printed Circuit Board Connectors, Interconnection Systems Selection Guide 82750, Jul. 1995, 3 pgs.
Andary, The Development Test Flight of the Flight Telerobotic Servicer: Design Description and Lessons Learned, IEEE Transactions on Robotics and Automation, vol. 9, No. 5, Oct. 1993, pp. 664-674.
Annex 48B (Jitter Test Methods) Analog Target Specification, IEEE, May 2001, pp. 6-14.
Aronson, Digital Diagnostic Monitoring Interface for Optical Transceivers, Draft Rev. 9.0, Mar. 28, 2002, 31 pgs.
Atmel, IR Receiver ASSP T2525, Product Information, Rev. 4657C-AUTO, Oct. 2003, 10 pgs.
Avella, AN/ARC-144 UHF Multimode Transceiver, Sep. 1971, pp. 14-15.
Baldwin, Fiber Optic Module Interface Attachment, Research Disclosure, No. 330, Kenneth Mason Publications Ltd, England, Oct. 1991, 1 pg.
Baumgartner, An Integrated 1.25 Gbit/s Laser Driver/ Post Amplifer IC, IEEE Customer Integrated Circuits Conference, IBM-AS/400 Division, 1997, pp. 17-20.
Cai, Jitter Testing for Gigabit Serial Communication Transceivers, Design & Test of Computers, IEEE, vol. 19, Issue 1, Jan.-Feb. 2002, pp. 66-74.
CFR 1040.10, Code of Federal Regulations, Title 21, vol. 8, Apr. 1, 2009, 23 pgs.
Chown, Integrated Transceiver for FDDI, IEEE Xplore, May 1989, pp. 378-383.
Clark, The PCB Connector as a Surface Mounted Device, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-8, No. 4, Dec. 1985, pp. 530-534.
Coombs, Printed Circuits Handbook, Fourth Edition, 1996, 4 pgs.
Course Schedule, Fibre Channel Group, Nov. 23, 1998, 4 pgs.
Definition of “Interface”, Microsoft Press Computer Dictionary, Second Edition, 1994, 8 pgs.
Definition of “Interface”, Newton's Telecom Dictionary, Eleventh Edition, 1996, 3 pgs.
Definition of “Interface”, Webster's Desk Dictionary, 1995, 3 pgs.
Definition of “Location”, McGraw-Hill Electronics Dictionary, Fifth Edition, 1994, 3 pgs.
Definition of “Motherboard”, Fiber Optics Standard Dictionary, Third Edition, 1997, 5 pgs.
Definition of “Motherboard”, IEEE 100, The Authoritative Dictionary of IEEE Standards Terms, Seventh Edition, 2000, 6 pgs.
Definition of “Mount”, The American Heritage Dictionary of the English Language, Third Edition, 1996, 3 pgs.
Definition of “Surface Mount Technology”, McGraw-Hill Electronics Dictionary, Fifth Edition, 1994, 9 pgs.
DLX2000 Transceiver, Fiber Optic Data Link, BT&D Technologies, May 1989, 5 pgs.
Einwaechter, Shortwave Transmitter & Receiver System FuG 101 for Telegraphy and Telephony, Siemens Review LIII, 1976, pp. 526-529.
Fairchild Semiconductor, CMOS, the Ideal Logic Family, Application Note 77, Jan. 1983, 10 pgs.
Fairhurst, Manchester Encoding, Jan. 9, 2001, 2 pgs.
Fiber Optics Standard Dictionary, Third Edition, 1997, two cover pages and p. 540.
Finisar Corporation v. Source Photonics, Civil Case No. CV 10-00032 WHA, Defendant and Counterclaimant Source Photonics Inc.'s Preliminary Invalidity Contentions Pursuant to Patent L.R.3-3, 39 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032-WHA [Proposed] Claim Construction Order of Finisar Corporation, Document 70, Aug. 25, 2010, 3 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032 WHA, Declaration of Dr. Joseph M. Kahn in Support of Finisar's Opening Claim Construction Brief, Document 68, Aug. 25, 2010, 9 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032 WHA, Declaration of Paul K. Wright in Support of Source Photonics, Inc.'s Responsive Claim Construction Brief, Document 73, Sep. 8, 2010, 8 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032 WHA, Defendant and Counterclaimant's Responsive Claim Construction Brief, Document 72, Sep. 8, 2010, 29 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032 WHA, Finisar's Opening Claim Construction Brief Pursuant to Patent L.R. 4-5, Document 67, Aug. 25, 2010, 30 pgs.
Finisar Corporation v. Source Photonics, Inc. Case No. CV-10-00032 WHA Joint Claim Construction and Prehearing Statement Pursuant to Patent L.R. 4-3, Document 65, Aug. 13, 2010, 57 pgs.
Finisar Corporation, European Search Report, EP Application 02704344.7, Oct. 5, 2004, 4 pgs.
Finisar Corporation, European Search Report, EP Application 04777655.4, Jan. 24, 2008, 5 pgs.
Finisar Corporation, International Search Report, PCT/US00/28596, Feb. 15, 2001.
Finisar Corporation, International Search Report, PCT/US02/03226, May 9, 2002, 3 pgs.
Finisar Corporation, International Search Report, PCT/US04/11130, Oct. 12, 2004, 3 pgs.
Finisar Corporation, Office Action, JP Patent Application 2002-563630, Jul. 13, 2005, 10 pgs.
Finisar, Analyzers, Fibre Channel, GLA-2000 Gigabit Link Analyzer, Feb. 5, 1998, 1 pg.
Finisar, Application Note AN-2010: Using the Built-in Test/Diagnostics Port on FTR-XX10 Transceivers, FTM-XX10 Transmitters and FRM-XX10 Receivers, May 19, 1997, 14 pgs.
Finisar, Fibre Channel Gigabit Traffic (GT) System Provides Performance and Protocol Analysis, Data Generation and Ber Testing in Portable or Desktop Configurations, Jan. 21, 1998, 4 pgs.
Finisar, Finisar Introduces Smart GBICs, Jul. 8, 1998, 3 pgs.
Finisar, GBIC Transceivers, Fibre Channel, Gigabit Ethernet, Up to 1.25 Gb/s, Sep. 11, 1999, 3 pgs.
Finisar, Gigabit Transceivers Simplify LAN Connection; Give Network Hardware Designers Choice of Coax, Multi-Mode and Single-Mode Fiber Optic Transmission, Aug. 15, 1995, 3 pgs.
Finisar, Handheld Link Status and Performance Monitor for Fibre Channel or Gigabit Ethernet From Finisar Corporation, Jul. 13, 1998, 3 pgs.
Finisar, Link Extenders, FLX-2000, Powerful Built-In Diagnostics, Feb. 5, 1998, 1 pg.
Finisar, Link Extenders, FLX-2000, Versatile Monitoring Capabilities, Feb. 5, 1998, 1 pg.
Finisar, Low-Cost Analyzer Tests Several High-Speed Gigabit Links; Provides “Parallel Bit Error Rate” and Multifunction Testing, Jul. 15, 1993, 3 pgs.
Finisar, Optic Modules, Application Note AN-2010, Communication During Open Fiber Control Protocol Sequence, Feb. 5, 1998, 2 pgs.
Finisar, Optic Modules, Application Note AN-2010, Introduction, Feb. 5, 1998, 2 pgs.
Finisar, Optic Modules, Application Note AN-2010, Network Communication with Multiple Modules, Feb. 5, 1998, 4 pgs.
Finisar, Optic Modules, Application Note AN-2010, Simplex Link Operation, Feb. 5, 1998, 1 pg.
Finisar, Optic Modules, Application Note AN-2010, Table I: FTR-XX10/FTM-XX10 Data Request Command List, Feb. 5, 1998, 2 pgs.
Finisar, Optic Modules, Application Note AN-2010, Table II: FTR-XX10/FTM-XX10 System Command List, Feb. 5, 1998, 1 pg.
Finisar, Optic Modules, FTM-8510 Transmitter/FRM-8510 Receiver, FTM/FRM-8510 Low Cost, Gigabit Fiber Optic Transmitter/Receiver, Feb. 5, 1998, 1 pg.
Finisar, Optic Modules, FTR-8510 Transceiver, FTR-8510 Low Cost, Gigabit Fiber Optic Transceiver, Feb. 5, 1998, 1 pg.
Finisar, Optical Link Extender from Finisar Corporation Lengthens Fibre Channel Connections More Than Fifteen Fold, Apr. 2, 1996, 2 pgs.
Franklin, A Hard Look at SANs, Finisar's SAN QoS reveals Fibre Channel secrets, Sep. 17, 2001, 3 pgs.
Hanson, Wiring with Plastic: A Growing Interest in High-Speed, Short Distance Communications Links is Opening a Huge Market for Plastic Optical Fibers, IEEE LTS, Feb. 1992, pp. 34-39.
Hartman, Optical Interconnection Technology in the Telecommunications Network, IEEE, 1986, pp. 464-478.
Hausdorf, Mobile Transceiver Measurements with Radiocommunication Service Monitor CMS, 1989, pp. 4-7.
Heuler, Thesis: Design, Implementation and Test of an RS-232 Compatible Bi-Directional, Full Duplex, Fiber-Optic Interface with Provision for Hardware Handshaking on a Minimum of Fiber-Optic Lines, Naval Postgraduate School, Monterey, California, Jun. 1989, 123 pgs.
Hewlett Packard HFBR-5203/-5203T, 800 nm 300 m HFBR 5204/-5204T 1300 nm 500 m HFBR-5205/-5205T 1300 nm 2 km, “ATM Multimode Fiber Transceivers for Sonet OC-3/SDH STM-1 in Low Cost 1×9 Package Style,” Oct. 1993, pp. 107-125.
Hewlett Packard HFBR-5301-HFBR-5302, “Fibre Channel 133 MBd and 266 MBd Transceivers in Low Cost 1×9 Package Style,” Mar. 1995, pp. 215-226.
Hewlett Packard, ATM Multimode Fiber Transceivers for Sonet OC-3/SDH STM-1 in Low Cost 1×9 Package Style, May 1997, 19 pgs.
Hewlett Packard, FDDI, 100 Mbps ATM, and Fast Ethernet Transceivers in Low Cost 1×9 Package Style, May 1997, 22 pgs.
Hewlett Parckard HFBR-5103/-5103T, 1300 nm 200 m HFBR 5104/-5104T 800 nm 500 m HFBR-5105/-5105T 1300 nm 500 km, “FDDI, 100 Mbps ATM and Fast Ethernet Transceivers in Low Cost 1×9 Package Style,” Oct. 1993, pp. 126-147.
I2C, Webopedia.com, www.webopedia.com/TERM/I/I2C.html, Mar. 12, 2002, 1 pg.
IEEE 100, The Authoritative Dictionary of IEEE Standards Terms, 2000, two cover pages and pp. 684-685.
ILX Lightwave Corporation, LDC3722 Laser Diode Controller, Instruction Manual, Chapters 1, 2, 3 & 4, May 25, 1990, 234 pgs.
ILX Litghtwave Corporation, LDC3722 Laser Diode Controller, Instruction Manual, Chapter 2 & 5, May 25, 1990.
Infineon Technologies, OptiPort™ SFF BIDI®-Transceiver 100 Mbit/s, 1310 nm Tx/1550 nm Rx, V23870-A 1133-Kx01, Data Sheet, Jun. 22, 2004, 1 pg.
Intel LXT16706/16707 SerDes Chipset, Product Information, 2002, 2 pgs.
Intel LXT35401XAUI-to-Quad 3.2G Transceiver, Product Information, Apr. 4, 2002, 2 pgs.
Jackson, Low-Cost Compact, Gigabit Transceivers for Data Communications, IEEE Electronic Components and Technology Conference, 1997, pp. 1-6.
Johnson, Single Chip Transceivers Help Facilitate Fibre-Channel Implementation, Computer Technology Review vol. XIX, No. 5, May 1999, 2 pgs.
MAC address, Webopedia.com, Aug. 8, 2002, 2 pg., http://www.webopedia.com/TERM/M/MAC—address.html (no date).
Maxim Engineering Journal, Optical/Electrical Conversion in SDH/SONET Fiber Optic Systems, Special Fiber Optic Edition, 1999, 15 pgs.
Maxim Integrated Products, 622Mbps LAN/WAN Laser Driver with Automatic Power Control and Safety Shutdown, MAX3766, 1997, pp. 1-19.
Maxim, High-Efficiency, Current-Mode, Inverting PWM Controller, MAX 1846/MAX1847, Aug. 2001, 20 pgs.
Mendez, A Circuit to Provide Protection from Surge Voltages (for CB Transceiver), May 1984, 5 pgs.
Microsoft Press Computer Dictionary, Second Edition, 1994, two cover pages and p. 261.
Nagahori, 150 Mbits -1 ch -1 12-channel Optical Parallel Interface Using an LED and a PD Array, Optical and Quantum Electronics 24, 1992, pp. S479-S490.
National Semiconductor, DS92LV16 Design Guide, Feb. 2002, 20 pgs.
National Semiconductor, LM75 Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface, Apr. 2000, 17 pgs.
National Semiconductor's Temperature Sensor Handbook, Jan. 1, 1998, 40 pgs.
National Semiconductors, LM75 Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface, 1997, 5 pgs.
National Semiconductors, LM78 Microprocessor System Hardware Monitor, Feb. 2000, pp. 1-31.
Newton's Telecom Dictionary, Eleventh Edition, 1996, two cover pages and pp. 388 and 575.
OCP 1×9 Duplex SC Package with EMI Shield Package Outline, Jul. 27, 2000, 3 pgs.
OCP 1×9 Package with ST & FC connector, Package Outline, May 15, 2000, 1 pg.
Ocp DTC-01, OC-1 Single Mode Transceiver with Clock Recovery, Sep. 10, 1999, 5 pgs.
OCP DTC-03, OC-3/STM-1 Single Mode Transceiver with Clock Recovery, Aug. 30, 1999, 5 pgs.
OCP DTC-03-3.3, 3.3 volt OC-3/STM-1 Single Mode Transceiver with Clock Recovery, Mar. 30, 1999, 5 pgs.
OCP DTC-03-3.3-A-L0-LR1-N, OC-03/STM-1 Single Mode Transceiver, Mar. 15, 2002, 1 pg.
OCP DTC-03-3.3-S, 3.3 volt OC-3/STM-1 Single Mode Transceiver with Clock Recovery, Mar. 15, 1999, 5 pgs.
OCP DTC-03-A-L0-LR1-N, OC-03/STM-1 Single Mode Transceiver, Mar. 15, 2002, 1 pg.
OCP DTC-03-H, OC-3/STM-1 Single Mode Transceiver with Clock Recovery with PECL Signal Dectect Output, Mar. 25, 1999, 5 pgs.
OCP DTC-03-MM, OC-3/STM-1 Multimode Transceivver with Clock Recovery & TTL Signal Detect Output, Oct. 26, 1998, 5 pgs.
OCP DTC-03-MM-H, OC-3/STM-1 Multimode Transceiver with Clock Recovery & PECL Signal Detect Output, Mar. 1, 1999, 5 pgs.
OCP DTC-12 GF2, OC-12/STM-4 “GF2” Single Mode Transceiver with Clock Recovery, Dec. 17, 1999, 4 pgs.
OCP DTC-12, OC-12/STM-4 Single Mode Transceiver with Clock Recovery, Nov. 30, 1998, 5 pgs.
OCP DTC-12-3.3, 3.3 volt OC-12/STM-4 Single Mode Transceiver with Clock Recovery, Sep. 16, 2002, 5 pgs.
OCP DTC-12-3.3, 3.3 volt OC-12/STM-4 Single Mode Transceiver with Clock Recovery, Mar. 22, 1999, 5 pgs.
OCP DTC-12-3.3-S, 3.3 volt OC-12/STM-4 Single Mode Transceiver with Clock Recovery, Oct. 15, 1999, 5 pgs.
OCP DTC-12-H, OC-12/STM-4 Single Mode Transceiver with Clock Recovery, Nov. 30, 1998, 5 pgs.
OCP DTC-12-MM, OC-12/STM-4 Multimode Transceiver with Clock Recovery, Dec. 15, 1998, 5 pgs.
OCP DTC-12-MM-T-GF2 (T is A or B temperature option), OC-12/STM-4 “GF2” Multimode Transceiver with Clock Recovery, May 26, 1999, 4 pgs.
OCP DTC-12-S, OC-12/STM-4 Single Mode Transceiver with Clock Recovery & Differential Facet Monitors, Apr. 20, 1998, 5 pgs.
OCP DTC-48, OC-48/STM-16 Single Mode Transceiver with Clock Recovery, Apr. 30, 1999, 5 pgs.
OCP DTC-48-H, OC-48/STM-16 Single Mode Transceiver with Clock Recovery, Oct. 11, 2000, 5 pgs.
OCP DTL-125 & DTL-200, Hermetically Sealed Data Link Modules, Feb. 5, 2002, 5 pgs.
OCP DTL-125 & DTL-200W, Wide Temperature Range Hermetic Data Link Modules, Oct. 15, 2001, 5 pgs.
OCP DTL-1300-F & DTL-1300-S, High Performance Hermetically Sealed Data Link Modules, Feb. 5, 2002, 5 pgs.
OCP DTL-200-RX-SW-100, Short Wavelength Hermetic Receiver, 2 pgs, Dec. 10, 1997, 2 pgs.
OCP DTL-270, Hermetically Sealed Data Link Modules at 270 Mb/s, Feb. 5, 2002, 5 pgs.
OCP DTR Multimode Transceivers, for ATM/SONET/SDH, Fibre Channel, FDDI & Fast Ethernet, Sep. 28, 1999, 9 pgs.
OCP DTR-1062-3.3-MM, 3.3 V 1×9 1.062 Gbaud Fibre Channel Shortwave Transceivers, Nov. 6, 1998, 5 pgs.
OCP DTR-1062-MM, 1×9 1.062 Gbaud Fibre Channel Shortwave Transceivers, Nov. 5, 1998, 5 pgs.
OCP DTR-1062-MM-GB & DTR-1062-3.3-MM-GB, GBIC Interface Fibre Channel 850 nm VCSEL Transceivers, Oct. 19, 1998, 5 pgs.
OCP DTR-1062-SM, 1.062 Gbaud Fibre Channel Longwave Transceiver, Sep. 15, 1998, 5 pgs.
OCP DTR-1062-SM-GB, GBIC Interface Fibre Channel Long wave Laser Transceivers, Jan. 25, 1999, 5 pgs.
OCP DTR 1250-3.3-MM-T, 3.3 V 1×9 Gigabit Ethernet 850 nm VCSEL Transceivers with TTL Signal Detect output, Sep. 4, 2002, 8 pgs.
OCP DTR-1250-3.3-SM, 3.3 V 1×9 Gigabit Ethernet 1300 & 1550 nm Laser Transceivers, Dec. 20, 2001, 5 pgs.
OCP DTR-1250-MM, 1×9 Gigabit Ethernet 850 nm VCSEL Transceivers, Sep. 23, 1998, 5 pgs.
OCP DTR-1250-MM-GB & DTR-1250-3.3-MM-GB, GBIC Interface Gigabit Ethernet 850 nm VCSEL Transceivers, Oct. 19, 1998, 5 pgs.
OCP DTR-1250-MM-LC-MR & DTR-1250-MM-LS-MR, 3.3V LC connector SFF Multi-Rate Gigabit Ethernet 850 nm VCSEL Transceivers, May 28, 2002, 6 pgs.
OCP DTR-1250-MM-LS-C-AC-M-S1-ALC, 3.3V LC connector SF Gigabit Ethernet 850 nm Laser Transceivers, Sep. 27, 2002, 1 pg.
OCP DTR-1250-MM-MR, 1×9 Gigabit Ethernet 850 nm VCSEL Multirate Transceivers, May 14, 2002, 5 pgs.
OCP DTR-1250-SM, 1×9 Gigabit Ethernet 1300 nm & 1550 nm Laser Transceivers, Dec. 1, 1998, 5 pgs.
OCP DTR-1250-SM-CWDM, 1×9 Gigabit Ethernet CWDM Laser Transceivers, Jan. 18, 2002, 5 pgs.
OCP DTR-1250-SM-GB, GBIC Interface Gigabit Ethernet 1300 & 1550 nm Laser Transceivers, May 14, 1999, 5 pgs.
OCP DTR-1250-SM-GB-CWDM, GBIC Interface Gigabit Ethernet CWDM Laser Transceivers, Jan. 9, 2002, 5 pgs.
OCP DTR-1250-SM-LC/LS-CWDM, 3.3V LC connector SFF Gigabit Ethernet CWDM Laser Transceivers, Jan. 28, 2002, 5 pgs.
OCP DTR-1250-SM-LC/LS-MR, 3.3V LC connector SFF Gigabit Ethernet 1300 nm & 1550 nm Multirate Laser Transceivers, May 16, 2002, 6 pgs.
OCP DTR-1250-SM-LS-A-H3-AC-M-S1-ALC, 3.3V LC connector SFF Gigabit Ethernet 1310 nm Laser Transceivers, Sep. 27, 2002, 1 pg.
OCP DTR-1250-SM-LS-A-H7-AC-M-S1-ALC, 3.3V LC connector SFF Gigabit Ethernet 1550 nm Laser Transceivers, Sep. 27, 2002, 2 pgs.
OCP DTR-156-3.3-SM2-A-L0-LR1-N, 3.3V 2×9 Sc connector OC-03/STM-1 Single Mode Transceiver, Nov. 2, 2001, 1 pg.
OCP DTR-156-3.3-SM2-B-HP-1510, 5.0 Volt 2×9 OC-3 1510nm DFB Single Mode Transceivers, Jul. 4, 2001, 1 pg.
OCP DTR-156-3.3-SM-A-L0-LR1-N, 3.3V 1×9 SC Connector OC-3/STM-1 Single Mode Transceiver, Feb. 1, 2002, 1 pg.
OCP DTR-156-3.3-SM-A-LR2-W, 3.3 Volt Single Mode Transceivers (1×9 pin-out), Jan. 17, 2001, 1 pg.
OCP DTR156-LS-A-ME-ALS, 2×5 Small Form Factor Multimode OC-3 LED Transceivers, May 17, 2002, 7 pgs.
OCP DTR-156-SM2-XX-A-L3-IR2, Mar. 25, 1999, 1 pg.
OCP DTR-156-SM2-XX-C-L0-LR1, Mar. 25, 1999, 1 pg.
OCP DTR-156-SM-A-L0-LR1N, OC-03/STM-1 Single Mode Transceiver, Aug. 30, 2001, 1 pg.
OCP DTR-156-SM-L1-CS, Single Mode Transceivers (1×9 pin-out), Aug. 15, 2000, 4 pgs.
OCP DTR-156-SM-LS-A-L0-LR1-N-MSE-ALS, 2×5 Small Form Factor OC-3 Laser Transceivers, May 29, 2002, 7 pgs.
OCP DTR-156-SM-LS-A-L0-LR2-MSE-ALS, 2×5 Small Form Factor OC-3 Laser Transceivers, May 29, 2002, 7 pgs.
OCP DTR-156-SM-LS-A-L3-IR-MSE-ALS, 2×5 Small Form Factor OC-3 Laser Transceivers, May 15, 2002, 7 pgs.
OCP DTR-2488-3.3-SM, 3.3 volt OC-48/STM-16 1×9 Single Mode Transceiver, May 15, 2000, 5 pgs.
OCP DTR-2488-SM, 5 volt OC-48/STM-16 1×9 Single Mode Transceiver, May 15, 2000, 5 pgs.
OCP DTR-2488-SM2, OC-48/STM-16 Single Mode Transceiver, May 4, 1999, 5 pgs.
OCP DTR-2488-SM2-LC & DTR-2488-SM2-LS (ALC), 3.3 volt 2×10 LC connector OC-48 Single Mode Transceiver, Apr. 13, 2001, 5 pgs.
OCP DTR-2488-SM2-LC & DTR-2488-SM2-LS, 3.3 volt 2×10 LC connector OC-48 Single Mode Transceiver, Mar. 23, 2001, 5 pgs.
OCP DTR-2488-SM-LC & DTR-2488-SM-LS, 3.3 volt 2×5 LC connector OC-48 Single Mode Transceiver, Feb. 2, 2001, 5 pgs.
OCP DTR-2488-SM-LC-L1-SR-M-CM, 2×5 Short Reach OC-48 LC Single Mode Transceiver with CML Data interface, Jul. 15, 2000, 3 pgs.
OCP DTR-622-3.3-CS, OC-12 Multimode Transceiver, Dec. 9, 2000, 1 pg.
OCP DTR-622-3.3-SM-L3-IR-CS, 3.3 Volt OC-12/STM-4 Single Mode Transceivers (1x9 pin-out), Dec. 7, 2001, 1 pg.
OCP DTR-622-SD & DTR-622-A-SD, OC-12/STM-4 “SD” 1×9 Multimode Transceiver, Jun. 10, 1999, 3 pgs.
OCP DTR-622-SM “SD” OC-12/STM-4 “SD” 1×9 Single Mode Transceiver, Nov. 8, 1999 , 4 pgs.
OCP DTR-622-SM “SE”, OC-12/STM-4 “SE” 1×9 Single Mode Transceiver, Dec. 11, 2000, 4 pgs.
OCP DTR-622-SM2-LC-PM & DTR-622-SM2-LS-PM, 3.3 Volt 2×10 LC connector OC-12 Single Mode Transceivers with Receiver Power Monitor, Nov. 9, 2000, 6 pgs.
OCP DTR-622-SM-A-HP-LR2-SL, OC-12/STM-4 “SL” Single Mode Transceivers (1×9 pin-out), Jan. 11, 2001, 4 pgs.
OCP DTR-xxx-3.3 (3.3 Volt Multimode Transceivers) for ATM/SONET/SDH, Fibre Channel FDDI & Fast Ethernet, Sep. 28, 1999, 9 pgs.
OCP DTR-xxx-3.3-SM, 3.3 Volt Single Mode Transceivers (1×9 pin-out), Mar. 1, 1999, 9 pgs.
OCP DTR-xxx-3.3-SM2, 3.3 Volt OC-1 to OC-12 Single Mode Transceivers (2×9 pin-out), Mar. 30, 1999, 8 pgs.
OCP DTR-xxx-3.3-SM-T, 3.3 Volt Single Mode Transceivers (1×9 pin-out), May 10, 2002, 6 pgs.
OCP DTR-xxx-SM, Single Mode Transceivers (1×9 pin-out), Mar. 1, 1999, 9 pgs.
OCP DTR-xxx-SM2 Single Mode Transceivers (2×9 pin-out), Mar. 10, 1999, 9 pgs.
OCP DTR-xxx-SM2-CWDM, CWDM Single Mode Transceivers (2×9 pin-out) Jan. 18, 2002, 6 pgs.
OCP DTR-xxx-SM2-LC & DTR xxx-SM2-LS, 3.3 Volt 2×10 LC connector OC-3 & OC-12 Single Mode Transceivers, Jul. 4, 2001, 7 pgs.
OCP DTR-xxx-SM-CWDM CWDM Single Mode Transceivers (1×9 pin-out), Jan. 29, 2002, 6 pgs.
OCP DTX-xxx-SM-LC & DTR-xxx-SM-LS, 3.3 Volt 2×5 LC connector OC-3 & OC-12 Single Mode Transceivers, Sep. 4, 2000, 7 pgs.
OCP DWTX-48, OC-48/STM-16 ITU-grid DWDM Transmitters, Oct. 23, 2001, 5 pgs.
OCP Interface Circuits for DTC (2×9 Transceivers with Clock), Oct. 16, 1998, 2 pgs.
OCP Interface Circuits for DTR-SM2 (2×9 Transceivers), Jan. 16, 1998, 2 pgs.
OCP PTC-48, 2.5 Gbits/s Transponder with 16-Channel 155Mbits/s Multiplexer/Demultiplexer with Clock Recovery, Sep. 5, 2001, 11 pgs.
OCP PTC-48SL, Compact size & Low Current consumption, 2.5 Gbits/s Transponder with 16-Channel 155Mbits/s Multiplexer/ Demultiplexer with Clock Recovery, Sep. 5, 2001, 11 pgs.
OCP PTC-48SP, Compact size & Low Current consumption, 2.5 Gbits/s Transponder with 16-Channel 155Mbits/s Multiplexer/ Demultiplexer with Clock Recovery, May 9, 2002, 11 pgs.
OCP SRC-03, OC-3/STM-1 Receiver with Clock Recovery, Feb. 8, 1999, 5 pgs.
OCP SRC-03-S, OC-3/STM-1 Receiver with Clock Recovery in 24-pin package, Jul. 7, 1997, 5 pgs.
OCP SRC-12, OC-12/STM-4 Receiver with Clock Recovery, May 3, 1999, 5 pgs.
OCP SRC-12-APD, High Sensitivity OC-12/STM-4 APD Receiver with Clock Recovery, Feb. 7, 2001, 3 pgs.
OCP SRC-12-APD-PSC-A-ALC, High Sensitivity OC-12/STM-4 APD Receiver with Clock Recovery, Mar. 26, 2001, 3 pgs.
OCP SRC-12-H, OC-12/STM-4 Receiver with Clock Recovery, Sep. 29, 1999, 5 pgs.
OCP SRC-12-S, OC-12/STM-4 Receiver with Clock Recovery in 24-pin package, Dec. 7, 1998, 5 pgs.
OCP SRC-48, OC48/STM-16 Receiver with Clock Recovery, Sep. 16, 2002, 5 pgs.
OCP SRX-03-APD, High Sensitivity OC-3/STM-1 APD Receiver, Apr. 28, 2002, 4 pgs.
OCP SRX-12-APD, High Sensitivity OC-12/STM-4 APD Receiver, Mar. 16, 1998, 4 pgs.
OCP SRX-12-L, OC-12/STM-4 Receiver (TTL Signal Detect), May 3, 1999, 5 pgs.
OCP SRX-48 ALC, OC-48/STM-16 Receiver without Clock Recovery, Mar. 8, 2001, 3 pgs.
OCP SRX-48, OC-48/STM-16 Receiver without Clock Recovery, Sep. 16, 2002, 5 pgs.
OCP SRX-48-PSC-B-LR-ALC, Oc-48/STM-16 Receiver without Clock Recovery, Oct. 19, 2001, 1 pg.
OCP STX/SRX SONET/SDH Transmitters & Receivers, Feb. 7, 2002, 9 pgs.
OCP STX-01-PLC-B-L1-0510-ALC, SONET OC-1 CWDM 1510nm Transmitter, Feb. 7, 2002, 1 pg.
OCP STX-03/SRX-03, OC-3 SONET/SDH Transmitters & Receivers, Sep. 28, 1999, 5 pgs.
OCP STX-03-xxx-L3-IR-D5, OC-3 SONET/SDH Transmitters, May 7, 1999, 3 pgs.
OCP STX-12-PSC-A-L3-IR-ALC, SONET/SDH Transmitter, Aug. 15, 2000, 3 pgs.
OCP STX-200-LED-SW-100, Short Wavelength Transmitter, Dec. 10, 1997, 2 pgs.
OCP STX-48 ALC, OC-48/STM-16 Transmitter, Mar. 6, 2001, 5 pgs.
OCP STX-48, OC-48/STM-16 Transmitter, Sep. 16, 2002, 5 pgs.
OCP STX-48-MS, OC-48/STM-16 Transmitter, Jul. 23, 2001, 4 pgs.
OCP STX-xx-3.3 / SRX-xx-3.3, 3.3 Volt SONET/SDH Transmitters & Receivers, Mar. 8, 1999, 9 pgs.
OCP TRP-48 Single Mode, OC-48/STM-16 LC Small Form-factor Pluggable (SFP) Single Mode Transceivers, Jul. 25, 2002, 5 pgs.
OCP TRP-F2 Single Mode, 3.3V Double Speed Single Mode Fibre Channel LC conncetor Small Form-factor Pluggable (SFP) Transceivers, Jul. 3, 2002, 5 pgs.
OCP TRP-FE (Multimode), Fast Ethernet (100-FX) LC Small Form-factor Pluggable (SFP) Multimode Transceivers, Jun. 28, 2002, 5 pgs.
OCP TRP-G1 Multi-Mode, 3.3V Gigabit Ethernet 850 nm VCSEL Small Form-factor Pluggable (SFP) Transceivers, Jun. 27, 2002, 5 pgs.
OCP, Optical Communication Products, Inc., Optical Communication Products Announces the Appointment of John Lemasters as its New Chairman, May 9, 2002, 1 pg.
PCO FDDI Transceiver, “FTR-1300-S1N and FTR-1300-S1C FDDI Data-Only Transceivers Preliminary Sheets” Oct. 1993, 8 pgs.
PCO FDDI Transceiver, FTR-1300-S1 FDDI Data-Only Transceiver, Oct. 1993, 8 pgs.
Petition to Make Special Under 37 C.F.R. §1.102, U.S. Appl. No. 09/777,917, filed Dec. 11, 2002, 12 pgs.
Petition to Make Special Under 37 C.F.R. §1.102, U.S. Appl. No. 10/266,869, filed Oct. 27, 2003, 9 pgs.
Philips Semiconductors, NE1619 HECETA4 Temperature and Voltage Monitor, Aug. 29, 2001, 18 pgs.
Phillip Semiconductors, NE1617 Temperature Monitor for Microprocessor System, Mar. 19, 1999, 16 pgs.
Phillip Semiconductors, NE1619 HECETA4 Temperature and Voltage Monitor, Jul. 13, 2000, 18 pgs.
Piven, 3COM's Got Wireless in the Palm of Its Hand-So Far, Technology Review, May 1999, 3 pgs.
Public-Key Encryption, www.webopedia.com/term/p/public—key—cryptography.html, Oct. 9, 2003, 1 pg.
Purdy Electronics Corporation, OPTO-3001A Transceiver OPTO-3001 Transceiver, Digital Digital Data Links (660 & 800 nm), Interoptics, Jun. 5, 2000, 1 pg.
Response to Final Office Action, U.S. Appl. No. 10/657,554, Sep. 16, 2005, 12 pgs.
Response to Office Action, U.S. Appl. No. 10/266,869, Jan. 31, 2005, 22 pgs.
Response to Office Action, U.S. Appl. No. 10/657,554, Mar. 13, 2006, 15 pgs.
Response to Office Action, U.S. Appl. No. 10/657,554, Jan. 31, 2005, 9 pgs.
Response to Office Action, U.S. Appl. No. 10/713,685, Nov. 23, 2004, 17 pgs.
Response to Office Action, U.S. Appl. No. 10/713,752, Nov. 19, 2004, 10 pgs.
Response to Office Action, U.S. Appl. No. 10/766,488, Feb. 27, 2007, 51 pgs.
Response to Office Action, U.S. Appl. No. 11/077,280, May 22, 2006, 8 pgs.
Second Preliminary Amendment, U.S. Appl. No. 10/266,869, Oct. 27, 2003, 12 pgs.
Shomiti has built itself . . . , www.networknews.co.uk, Aug. 29, 2001, 2 pgs.
Soderstrom, CD Laser Optical Data Links for Workstations and Midrange Computers, IEEE Xplore, 1993, pp. 505-509.
Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria GR-253-CORE, Issue 2, Dec. 1995, Revision Jan. 2, 1999, 786 pgs.
Texas Instruments, TLK1501 Serdes EVM Kit Setup and Usage, User's Guide, SLLU008, Jun. 2000, 53 pgs.
Texas Instruments, TLK2201 Serdes EVM Kit Setup and Usage, User's Guide, SLLU011, Jun. 2000, 26 pgs.
The 7 Layers of the OSI Model, webopedia.internet.corn/quick—ref/OSI-Layers.asp, Aug. 8, 2002, 3 pgs.
THMC10 Remote/Local Temperature Monitor with SMBus Interface, Texas Instruments, Dec. 1999, 22 pgs.
Toshiba, Fiber Optic Transceiver Module TODX280, Fiber Optic Transceiving Module for Duplex Digital Signal Communication, Oct. 1993, 9 pgs.
Toshiba, Fiber Optic Transceiver Module TODX294, Fiber Optic Transceiving Module for Duplex Digital Signal Communication, Oct. 1993, 9 pgs.
TRV5366 OC-1 Transceiver, Oct. 1993, 2 pgs.
TRV5466 OC-3 Transceiver, Oct. 1993, 2 pgs.
UDA, Fiber Optic Transciever for FDDI Application, FOC/LAN 1988, pp. 160-164.
Underwriters Laboratories, Optical Communications Products, ISO 9001:1994, Jan. 23, 2002, 1 pg.
Vaishali Semiconductor, Fibre Channel Transceiver VN16117, preliminary Product Information, MDSN-0002-02, Aug. 9, 2001, 15 pgs.
Wright, 21st Century Manufacturing, First Edition, 2001, p. 234.
Xicor, Hot Pluggable X9520, Fiber Channel / Gigabit Ethernet Laser Diode Control for Fiber Optic Modules, 2000, 33 pgs.
Xicor, Hot Pluggable X9520, Fiber Channel / Gigabit Ethernet Laser Diode Control for Fiber Optic Modules, Oct. 4, 2002, 34 pgs.
Yamashita, Compact-Same-Size 52-and 156Mb/s SDH Optical Transceiver Modules, Journal of Lightwave Technology, vol. 12, No. 9, Sep. 1994, pp. 1607-1615.
Finisar Corporation, Office Action, Chinese Patent Application No. 200610149558.1, Sep. 9, 2010, 9 pgs.
Finisar Corporation, Office Action, Chinese Patent Application No. 200610149558.1, Apr. 19, 2010, 6 pgs.
Finisar Corporation, Office Action, Chinese Patent Application No. 200610149558.1, Jun. 26, 2009, 5 pgs.
Related Publications (1)
Number Date Country
20120093504 A1 Apr 2012 US
Continuations (4)
Number Date Country
Parent 12400752 Mar 2009 US
Child 13336963 US
Parent 11679800 Feb 2007 US
Child 12400752 US
Parent 10657554 Sep 2003 US
Child 11679800 US
Parent 10266869 Oct 2002 US
Child 10657554 US
Continuation in Parts (1)
Number Date Country
Parent 09777917 Feb 2001 US
Child 10266869 US