The present application claims priority from Japanese Application JP 2007-188979 filed on Jul. 20, 2007, the content of which is hereby incorporated by reference into this application.
1. Field of the Invention
The present invention relates to a technique for lowering resistance of a common electrode of a top-emission-type active matrix organic EL (Electroluminescent) display device (AM-OLED), and more particularly to an auxiliary electrode used in the display device.
2. Description of Related Art
A common electrode of a conventional active-matrix-type organic EL display device is formed of an opaque metal electrode made of aluminum or the like in a bottom-emission-type (BE-type) organic EL display device, and is formed of a transparent conductive film such as an IZO film or an ITO film in a top-emission-type (TE-type) organic EL display device.
The common electrode of the TE-type organic EL display device is formed of the transparent conductive film as described above and hence, the common electrode exhibits large resistance. Accordingly, a potential of the common electrode is not set to a fixed value in plane and hence, a voltage gradient is generated whereby the brightness irregularities are generated in plane. Accordingly, in the conventional TE-type active-matrix-type organic EL display device, as disclosed in JP-A-2007-73323 (patent document 1), sheet resistance is lowered by forming an auxiliary electrode made of Al on a pixel separation film which is formed around a pixel electrode.
Although the conventional auxiliary electrode made of aluminum exhibits low resistance, a melting point of the conventional auxiliary electrode is extremely high. Accordingly, a vapor deposition mask is deformed due to the thermal expansion and hence, the accuracy of vapor deposition is lowered thus giving rise to a drawback that an organic EL display device having high accuracy and high brightness cannot be realized.
Further, a temperature of an element substrate per se of the organic EL display device is also elevated and hence, an organic EL layer which is already formed is damaged. Accordingly, a lifetime of the organic EL display device is shortened or light emitting efficiency of the organic EL display device is lowered.
It is an object of the present invention to provide an organic EL display device which exhibits high accuracy and a long lifetime.
Although a plurality of means is considered for overcoming the above-mentioned drawbacks, to explain typical examples, they are as follows.
First of all, in a TE-type active-matrix-type organic EL display device, a common electrode is constituted of a transparent conductive film made of metal oxide, an auxiliary electrode which is brought into contact with an upper surface or a lower surface of the common electrode and forms an opening at positions where the auxiliary electrode overlaps with the pixel electrode is provided, and the auxiliary electrode is made of a material which contains Zn or Mg as a main component.
Further, as another constitution of the TE-type active-matrix-type organic EL display device, a common electrode is constituted of a transparent conductive film made of metal oxide, an opaque auxiliary electrode which is brought into contact with an upper surface or a lower surface of the common electrode is provided at positions where the auxiliary electrode overlaps with gaps between pixel electrodes, and the auxiliary electrode is made of a material which contains Zn or Mg as a main component.
Further, reflectivity of Zn or Mg is not high compared to reflectivity of Al which is conventionally used and hence, it is possible to provide an organic EL display device having high display quality. Specifically, color of Zn is black and hence, it is possible to remarkably enhance the contrast.
Further, when Zn is used as a material of the auxiliary electrode, on an edge of the auxiliary electrode in the width direction, a profile (a change of thickness) of a vapor-deposited film thickness becomes extremely small and hence, Zn is easily oxidized by oxygen which constitutes a transparent conductive film so as to form ZnO whereby the auxiliary electrode becomes transparent. As a result, influence attributed to some vapor deposition misalignment of the auxiliary electrode can be restricted to an extent that the influence cannot be recognized with naked eyes.
By lowering sheet resistance which is the combined resistance of the resistance of the common electrode and the resistance of the auxiliary electrode to 10 Ωcm or less, it is possible to eliminate brightness irregularities to an extent that the brightness irregularities cannot be recognized with naked eyes.
Further, the common electrode may preferably be made of oxide containing In, Zn or Sn by taking sheet resistance and transmissivity into consideration.
Further, the auxiliary electrode may preferably be formed by any one of resistance-heating vapor deposition, induction-heating vapor deposition, electronic-beam (EB) vapor deposition, and sputtering.
According to the present invention, it is possible to lower the temperature of the manufacturing processing and hence, the lifetime of the element of the organic EL display device can be prolonged.
Hereinafter, embodiments of the present invention are explained.
An organic EL display device of the present invention includes an EL substrate on which organic EL elements are formed and a sealing substrate which covers the organic EL elements.
A channel of the thin film transistor TFT is formed of a semiconductor layer made of amorphous silicon to which crystallinity is imparted, wherein the reflection film REF is formed of a stacked film made of AlSi/MoW, the pixel electrode AD is made of ITO, the pixel separation film BNK is made of polyimide or SiN, the auxiliary electrode SUP is made of Mg or Zn, and the common electrode CD is made of IZO.
A stacked film made of AlSi/MoW is formed as the reflection film REF on a substrate SUB including the thin film transistors TFT by a sputtering method, and is patterned using a photolithography method. An ITO film is formed on the reflection film REF by a sputtering method, the pixel electrodes AD which are one-size larger than the reflection films are patterned using the photolithography method and, thereafter, the pixel electrodes AD are crystallized. The pixel separation film BNK is formed using polyimide or SiN so as to expose the centers of the pixel electrodes AD and to surround outer peripheries of the pixel electrodes AD. The organic EL layer OLE is formed on the pixel separation film BNK by a vapor deposition method. The auxiliary electrode SUP is formed on the organic EL layer OLE. The auxiliary electrode SUP is formed by an EB vapor deposition method (acceleration voltage: 10 kV), and the auxiliary electrode SUP is made of Mg or Zn. Here, a material of a vapor-deposition-use metal mask may be formed of a film made of 36Ni—Fe and having a thickness of 30 μm, and a gap between the metal mask and the substrate is set to 350 mm. Thereafter, the common electrode CD made of IZO is formed by a sputtering method.
A stacked film made of AlSi/MoW is formed as the reflection film REF on a substrate SUB including the thin film transistors TFT by a sputtering method, and is patterned by a photolithography method. An ITO film is formed on the reflection films REF by a sputtering method, the pixel electrodes AD which are one-size larger than the reflection films are patterned by a photolithography method and, thereafter, the pixel electrodes AD are crystallized. The pixel separation film BNK is formed using polyimide or SiN so as to expose the centers of the pixel electrodes AD and to surround outer peripheries of the pixel electrodes AD. The organic EL layer OLE is formed on the pixel separation film BNK by a vapor deposition method. The common electrode CD is formed on the organic EL layer OLE by forming an IZO film on the whole display region by a sputtering method. Further, the auxiliary electrode SUP is formed on the common electrode CD. The auxiliary electrode SUP is formed by an EB vapor deposition method (acceleration voltage: 10 kV) by way of a metal mask, and the auxiliary electrode SUP is made of Mg or Zn. Here, a material of a vapor-deposition-use metal mask may be formed of a film made of 36Ni—Fe and having a thickness of 30 μm, and a gap between the metal mask and the substrate is set to 350 mm.
To recapitulate the above, as described in the respective embodiments, in the top-emission-type organic EL display device including the organic EL elements each of which is formed by stacking the pixel electrodes, the pixel separation film which surrounds the pixel electrodes, the organic EL layer and the common electrode, and forming a display screen on a common electrode side surface thereof, the auxiliary electrode which is brought into contact with an upper surface or a lower surface of the common electrode and has openings at positions where the auxiliary electrode overlap with the pixel electrodes is made of a material which contains Zn or Mg as a main component. Alternatively, an auxiliary electrode which is brought into contact with an upper surface or a lower surface of the common electrode and is arranged at positions where the auxiliary electrode overlaps with gaps between pixel electrodes is made of a material which contains Zn or Mg as a main component. By adopting either one of the above-mentioned constitutions, the auxiliary electrode can be formed by the low-temperature process. Accordingly, it is possible to reduce damages on the organic EL layer thus prolonging a lifetime of elements of the organic EL display device. The auxiliary electrode can be formed by any one of resistance-heating vapor deposition, induction-heating vapor deposition, EB vapor deposition and sputtering.
Number | Date | Country | Kind |
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2007-188979 | Jul 2007 | JP | national |