The present invention relates to an organic electroluminescent light emitting device.
Generally, an organic electroluminescent light emitting device is composed of a light emitting laminated body which consists of an organic material layer emitting electroluminescence (hereinafter referred to as “EL”) light and an electrode layer, and connecting terminals for supplying the electrode layer of the light emitting laminated body with electric energy.
Specifically, the light emitting laminated body uses a translucent glass plate as a substrate to pick up light emitted there from on the substrate side. On the glass substrate, a transparent anode layer, an organic EL light emitting material layer, and a cathode are laminated in this order. When the electric energy is supplied between the transparent anode layer and cathode layer, holes are injected into the organic EL light emitting material layer from the anode layer and electrons are injected from cathode layer. With recombination of the electrons and the holes in the organic EL light emitting material layer, fluorescence or phosphorescence light is emitted when an exciton loses energy. The light emitting laminated body thus emits the light.
The light emitting laminated body is attracting attention as a display device in the next generation as an alternative to liquid crystal display devices, because of such advantages as excellent visibility of the emitted light, easy to set a color of the emitted light, and low power consumption.
However, the light emitting laminated body is apt to absorb moisture in the air, because organic materials are contained in the organic EL layer. When the laminated body absorbs moisture, a non light emitting portion is formed by peeling off of the electrode layer from the organic EL layer, or by deterioration of the layer itself. Deterioration also takes place in light emitting characteristics with age such as decrease in light emitting luminance etc for example. Therefore, the EL laminated body is often separated from wet air by sealing a periphery of the substrate on which the EL laminated body is formed with a sealing cap or protection plate made of glass or metal.
In order to minimize the moisture intruding through the joint portion formed between the glass substrate on which the EL laminated body is formed and sealing cap made of glass or metal, it is ideal to joint them by welding to provide a non moisture permeable configuration. However, when the sealing cap made of metal or glass is welded to the glass substrate with, the joint portion should be heated to higher than the softening point of glass, for example, around 700° C., which varies depending on the kind of glass. The heating of the glass substrate at such high temperature brings other problems that the light luminance decreases by oxidation or decomposition of the organic material contained in the laminated layer forming the organic EL, or that non light emitting portions are formed.
Generally, a glass substrate and a sealing cap made of metal or glass are joined with an adhesive material in order to prevent heat application to the EL laminated body when sealing. Room temperature setting adhesive or UV cure adhesive composed of acrylic resin or epoxy resin has been used as an adhesive material, because the temperature for curing is low, and the moisture permeability is low after curing.
Also, in the organic electroluminescent light emitting device, the electric power is supplied to the light emitting laminated body through electrode terminals, which is composed of an electrically conductive film and is led out through the boundary area between the glass substrate and sealing cap.
Here, the adhesion between the substrate and the electric conductive film forming the electrode terminal is not sufficient if the electrode terminals are led out from the sealing portion of the light emitting laminated body. Thus, moisture intrudes through the boundary area and results in degradation of the light emitting element composed of the light emitting laminated body. Another cause of the degradation of the light emitting element is that the electrode terminal itself cannot provide perfect air tightness.
As described above, in conventional organic electroluminescent light emitting device, a substrate on which organic EL layer is formed and a sealing cap which is a protective plate made of glass or metal are joined with such adhesive as the UV cure adhesive striding over the electrically conductive film through which electric power is supplied to the EL laminated body from outside. However, with such a structure, it is difficult to effectively block the moisture intrusion through the boundary area between the substrate and electric conductive film or through the electric conductive film itself, and to prevent the variation of light emitting characteristics with time of the organic electroluminescent light emitting device.
It is therefore one of the objects of the present invention to effectively block the intrusion of moisture into the inside of the organic electroluminescent light emitting device from outside, and to provide the organic electroluminescent light emitting device with extremely small variation of light emitting characteristics with time.
The organic electroluminescent light emitting device according to the present invention includes a translucent insulating substrate, a light emitting laminated body provided on the translucent insulating substrate including an organic EL light emitting layer and an electrode layer laminated thereon, a sealing cap joined to the translucent insulating substrate to form a space covering the light emitting laminated body, and electrical connecting terminals which penetrate the sealing cap or the translucent insulating substrate and supply electric power to the electrode layers included in the light emitting laminated body, wherein the electrical connecting terminals are led outside without passing through the joined portion between the translucent insulating substrate and the sealing cap.
Further, the organic electroluminescent light emitting device according to the present invention includes a translucent insulating substrate on the periphery of which a metal frame is joined, a light emitting laminated body composed of a first electrode layer, an organic EL light emitting layer, and a second electrode layer, which are laminated in this order, a sealing metal cap which is joined to the metal frame to form a space covering the light emitting laminated body, and electrical connecting terminals which penetrate the sealing cap or the translucent insulating substrate and supply electric power to each electrode layer of the light emitting laminated layer, wherein the electrical connecting terminals are led out without passing through the joined portion between the substrate and the sealing cap.
Further, the organic electroluminescent light emitting device according to the present invention includes non moisture permeable translucent substrate, a metal frame joined to the periphery of the translucent substrate, a pair of electrical connecting terminals penetrating the metal frame through an insulating material, a light emitting laminated body provided on one surface of the non moisture permeable translucent substrate, which is composed of an organic light emitting material layer and a pair of electrode layers laminated on both side of the organic light emitting material layer, an interconnection means, which connects each of the pair of electrode layers of the light emitting laminated body with each of the pair of electrically connecting terminals, and a metal sealing cap, which is joined to the metal frame in non moisture permeable manner on the side of the translucent substrate where the light emitting laminated body is provided, so as not to contact with the light emitting laminated body.
Further, the organic electroluminescent light emitting device according to the present invention includes a non moisture permeable translucent substrate on the periphery of which a metal frame is joined, one or plurality of electrical connecting terminals which penetrate the substrate or a joined portion between the substrate and the metal frame, a light emitting laminated body, which is provided on a surface of the substrate and is composed of an organic light emitting material layer and a pair of electrode layers laminated on both sides of the organic light emitting material layer, and a metal sealing cap which is joined to the metal frame in non moisture permeable manner on the surface of the substrate where the light emitting laminated body is provided, so as not to contact with the light emitting laminated body, wherein a chassis is formed with the substrate at its bottom and with a wall with the metal frame around the substrate, and wherein each of the pair of electrode layers forming the light emitting laminated body are respectively connected with the electrical connecting terminals.
Further, the organic electroluminescent light emitting device according to the present invention includes a non moisture permeable translucent substrate on the periphery of which a metal frame is joined, one or plurality of electrical connecting terminals which penetrate the substrate, a light emitting laminated body, which is provided on a surface of the substrate and is composed of an organic light emitting material layer and a pair of electrode layers laminated on both sides of the organic light emitting material layer those are, and a metal sealing cap which is joined to the metal frame with in non moisture permeable manner construction on the surface of the substrate where the light emitting laminated body is provided, so as not to contact with the light emitting laminated body, wherein a chassis is formed with the substrate at its bottom and with a wall with the metal frame around the substrate, and wherein one of the pair of electrode layers forming the light emitting laminated body is connected with the electrical connecting terminals, while the other electrode layers is connected with the metal frame.
Further, the organic electroluminescent light emitting device according to the present invention includes a metal substrate, one or a plurality of electrical connecting terminals which penetrate the metal substrate through an insulating material, an light emitting laminated body composed of an organic light emitting material layer and laminated electrode layers laminated thereon, and a non moisture permeable translucent plate, which is provided on a surface of the metal substrate where the light emitting laminated body is formed and to the periphery of which a metal frame is joined with non moisture permeable construction so as not to contact with the light emitting laminated body, wherein the electrode layer laminated on the organic light emitting material layer is connected to the electrical connecting terminal.
Further, the organic electroluminescent light emitting device according to the present invention includes a first and a second non moisture permeable translucent substrate with metal frame joined on the periphery, one or plurality of electrical connecting terminals penetrate the substrates through an insulating material, a light emitting laminated body composed of a pair of electrode layers and an organic light emitting material layer laminated between the pair of electrode layers, which are formed on one surface of the first and the second non moisture permeable substrates, and a metal sealing cap which joins the first and the second non moisture permeable substrates, so as to make surfaces of the first and the second non moisture permeable translucent substrate where the light emitting laminated body face with each other, wherein the electrode layers forming the light emitting laminated body are connected to each of the electrical connecting terminals respectively.
A method for manufacturing the organic electroluminescent light emitting device according to an embodiment of the present invention includes steps of joining a metal frame on a periphery of a non moisture permeable translucent substrate, fixing a plurality of electrically connecting terminals to the metal frame or the translucent substrate in a state electrically insulated there from, making the plurality of electrically connecting terminals penetrate through the metal frame or the translucent substrate, forming a light emitting laminated body on a surface of the substrate having an organic light emitting material layer and a plurality of electrode layers, connecting the plurality of electrode layers with the electrical connecting terminals or the metal frame, and joining a metal sealing cap or a metal protection plate to the surface of the translucent substrate with non moisture permeable construction on which the light emitting laminated body is formed so that the metal caps or the protection plate may not contact with the light emitting laminated body.
Further, a method for manufacturing the organic electroluminescent light emitting device according to another embodiment of the present invention includes steps of preparing a non moisture permeable translucent substrate having a metal frame joined on a peripheral portion, preparing a metal plate having one or a plurality of electrical connecting terminals which penetrate the metal plate through an insulating material, forming an light emitting laminated body composed of an organic light emitting material layer and electrode layers laminated thereon on one surface directly or through an insulating layer, connecting the electrode layers forming the light emitting laminated body with the electrical connecting terminals, and joining the metal frame joined to the non moisture permeable translucent substrate to a peripheral portion of the metal plate so as not to contact with the light emitting laminated body.
An organic electroluminescent light emitting device and the manufacturing method according to an embodiment of the present invention is explained using the accompanying figures.
The organic electroluminescent light emitting device shown in
In order to bring light emitted from the light emitting laminated body 13 out of the light emitting device, the electrode layer 15 and 17 are made translucent. The electrode layers 15 and 17 of the light emitting laminated body 13 contact with the connecting terminals 23 respectively for electrical connection.
Because the light emitting element substrate 31 is made before the light emitting laminated body 13 is formed, the substrate 11 and the connecting terminals 23 can be joined at high temperature in non moisture permeable manner. In the case of the organic electroluminescent light emitting device shown in
Next, light emitting laminated body 13 is formed on one surface of the substrate 11 by laminating a translucent electrode layer 15, an organic EL light emitting material layer 16, and electrode layer 17 in this order. Each of the translucent electrode layers 15 and 17 are formed so as to contact with each connecting terminals 23 for electrical connection.
As shown in
The organic electroluminescent light emitting device manufactured in this way has the following advantages.
(1) The translucent electrode layers 15 and 17 forming the light emitting laminated body 13 are connected electrically with each of the connecting terminals 23 penetrating the substrate 11, without passing through a joint portion between substrate 11 and sealing cap 14. That is, because the substrate 11 and the sealing cap 14 are joined directly without any electrically conducting thin film formed, intervening there between, on the substrate 11 by evaporation or sputtering, the mutual adhesion becomes stronger. Therefore, the moisture and oxygen intruding through the joint portion between the substrate 11 and the sealing cap 14 or through the electric conductive layer itself of the thin film can be minimized.
With this effect, variation of the light emitting characteristics of the organic electroluminescent light emitting device with time decreases, and thus the life of the light emitting device can be made longer.
(2) Further, because the translucent electrode layers 15 and 17 are not led out through the joint portion between the substrate 11 and the sealing cap 14, the heat generated for joining the substrate 11 and the sealing cap 14 is not conducted to light emitting laminated body 13 through the translucent electrode layers 15 and 17. Therefore, the light emitting laminated body 13 is not affected by a violent heat stress. As a result, the organic electroluminescent light emitting device thus manufactured according to the present invention has also good initial light emitting characteristics.
Various modifications are applicable about the embodiment of the organic electroluminescent light emitting device mentioned above. For example, as a substrate 11, it is not limited to a glass plate, but a resin plate etc. coated with a thin film of non moisture permeable nature. That is, if it is a translucent plate having non moisture permeability and insulating property, the material is not limited to the materials mentioned above.
Further, in the organic electroluminescent light emitting device shown in
Further, when joining the substrate 11 and the sealing cap 14, it is possible to increase the contact area by making one joining surface to be a convex one and the other surface to be a concave one corresponding to the convex surface.
Further, it is desirable to make the space formed by the substrate 11 and the sealing cap 14 to be a vacuum space or a space filled with an,inert gas. For this purpose, joining of the substrate 11 and the sealing cap 14 is performed in vacuum or in an inert gas atmosphere.
Next, the light emitting laminated body can be manufactured by a method well known to the public. The materials composing the organic EL emitting laminated body are described in detail in “Problems to be solved and Strategy for Practical Use of Organic LED Elements” (Bunshin Publishing Co. 1999), “Functional Organic Materials for Optical and Electronic Use Handbook” (Asakura Book Store 1997) and other publications. A typical method for manufacturing the light emitting laminated body is explained below.
It is preferable to build a light emitting laminated body 13 by laminating the translucent electrode layer 15, the organic EL light emitting material layer 16, and the electrode layer 17 in this order, on one surface of the substrate 11 as mentioned above.
It is preferable to form the translucent anode layer 15 with a metal having a high work function (4 eV or higher), electrically conductive compound or a mixture thereof. As a typical example of the material composing the translucent anode layer 15, ITO (indium oxide doped with tin) and IZO (oxide of indium and zinc) are used.
Examples for a method for forming a translucent anode layer 15 are vacuum evaporation method, DC sputter method, RF sputter method, spin coat method, cast method, and LB method.
The transmittance for visible light of the translucent electrode 15 is preferably 70% or higher and it is more preferable to be 80%, 90% or higher is more. The transmittance for visible light can be adjusted by selecting a material forming the electrode layer, or by adjusting the thickness of the electrode layer. The thickness of the translucent anode layer is in general 1 μm or less, and it is more preferable that the thickness is 200 nm or less. Several hundred Ω/sq. or lower is preferable for the resistance of the translucent anode layer 15.
The organic EL light emitting material layer 16 is made of an organic light emitting material or of an organic material, which is composed of an organic material having carrier transportability (by a hole, an electron or both) (hereinafter referred to as host material) added with a small amount of organic light emitting material. By selecting organic light emitting material used for organic EL emitting material layer, a color of the light emitted from the organic electroluminescent light emitting device can be easily selected.
Materials which are excellent in forming a good film with excellent stability are selected for the organic EL light emitting material layer 16 of the light emitting laminated body. As such materials, a metal complex represented by Alq3 (tris(8-hydroxyquinolinat)aluminum), polyphenylenevinylene (PPV) derivative, polyfluorene derivative etc. are used. As organic light emitting material used with host material, a fluorescent dye which is difficult to form a stable thin film by the dye itself can be used beside the above mentioned organic light emitting material because the adding amount is small. As examples of fluorescent dye, coumalin, DCM derivative, quinacridone, perylene, and rubrene are used. As host materials, Alq3, TPD(triphenyldiamine), electron transportable oxadiazole derivative (PBD), polycarbonate series copolymer, and polyvinylcarbazole etc. are used. Further, a small amount of organic light emitting material such as fluorescent dye can be added for adjusting the luminescence color when preparing organic EL emitting material layer with organic light emitting material as mentioned above.
As the method for forming an organic EL light emitting layer 16, vacuum deposition method, spins coat method, cast method, and LB method are applicable. To realize a practical luminescent efficiency, the organic EL light emitting material layer 16 preferably has a thickness of 200 nm or less.
It is preferable to build the cathode layer 17 with a metal of low work function (4 eV or lower), alloy composition, electrically conductive compound, or a mixture thereof. As a typical material composing the cathode 17, Al, Ti, In, Na, K, Mg, Li, rare earth metal, alloy compositions such as Na—K alloy, Mg—Ag alloy, Mg—Cu alloy, Al—Li alloy are used.
The thickness of the cathode layer 17 is in general 1 μm or less, and more preferably 200 nm or less. The resistance of the cathode layer is preferably several hundred Ω/sq or lower. When forming the cathode layer 17, sometimes the molecules of the material composing the cathode layer 17 collide with the light emitting laminated body 13 to damage the light emitting layer. In order to protect the light emitting laminated body 13 from being damage, a buffer layer (not illustrated) can be provided on the surface of the cathode layer 17 on the organic EL emitting material layer 13 side. As an example of material for the buffer layer, an acetylacetnat complex or its derivative is used. It is preferable that the center metal of the acetylacetnat complex is an alkali metal, alkali earth metal, or a transition metal. As a material for the buffer layer, bisacetylacetnate nickel is especially preferable. The buffer layer is disclosed in for example, Japanese Patent laid open No. 2001-176670.
Further, a hole transportation layer (not illustrated) can be provided between the organic EL light emitting material layer 16 and anode layer 15, and an electron transportation layer (not illustrated) can be provided between the organic EL emitting material layer and the cathode layer 17, in order to increase the injection efficiency of carriers (holes and electrons) into the light emitting layer.
As a typical example of materials forming the hole transportation layer, a hole transportation material such as tetraarylbenzidine compound, aromatic amines, pyrazoline derivatives, and triphenylene derivatives are known. As a preferable example of the hole transportation material, tetraphenyldiamine (TPD) is known. The thickness of the hole transportation layer is preferably in the range from 2 to 200 nm. The hole transportation layer can be prepared with a similar method to the method for forming the organic EL emitting material layer.
It is desirable to add the electron receptive acceptors to the hole transportation material for improving hole transportability such as hole mobility. As the electron receptive acceptor, metal halide, Lewis acid, and organic acid, are known. Adding the electron receptive acceptor to the hole transportation layer is described in Japanese Patent laid open gazette No. H11-283750. When producing the hole transportation layer with the hole transportation material added with electron receptive material, it is desirable that the thickness of the hole transportation layer is in the range from 2 to 5000 nm.
As a typical example of material for the electron transportation layer, nitro substitute fluorene derivative, diphenylquinone derivative, thiopyrandioxide derivative, heterocyclic tetracarboxylic acid anhydride such as naphthalene pyrilene, carbodiimide, Fluorenyliden Methane derivative anthraquinodimethane and anthrone derivative, oxadiazole derivative, quinoline derivative, quinoxaline derivative, perylene derivative, pyridine derivative, pyrimidine derivative, and stilbene derivative are known. Also, alumiquinolinol complex such as tris(8-hydroxyquinoline) aluminum (Alq) can be used. The thickness of the electron transportation layer is preferable in the range of 5 to 300 nm. The electron transportation layer can be produced by a similar method to the method for forming the organic EL light emitting material layer 16.
The connecting terminals 23 for supplying electric energy to each electrode layers 15, 17 of the light emitting laminated body 13 can be provided in the same way as in the EL emitting device well-known to the public or in an electric bulb having a filament.
Next, the second embodiment of the present invention is explained referring to
It is desirable for the material of the metal substrate 51, which acts as a connection terminal, to be a metal having a thermal expansion coefficient close to that of the substrate 11, to have a good wet ability with the substrate 11. When a glass plate is used as the substrate 11, it is desirable that the both are joined by welding. As materials composing the metal substrate 51, Fe, Fe‘Ni alloy, Fe—Ni—Cr alloy, and Fe—Ni—Co alloy are used. It is desirable that a copper film is formed on the surface of the metal plate made of these materials. Further, glass and metal can be welded by using powder glass (also called as frit glass). The method for joining glass with metal is described in detail in “Glass Engineering Handbook” (Asakura Book Publishing Co. Ltd. 1999).
A shape of the metal plate 51 which acts as connecting terminals may be preferably formed on a part of the end portion of the substrate 11 as shown in
Although the electrodes are lead out from the light emitting laminated body 13 through the electrode layers 15, 17 which are electrically conductive thin film, as shown in
Next, the third embodiment of the present invention is explained with reference to
In this embodiment, an electrically conductive material is used as a part of materials composing the chassis of the organic electroluminescent light emitting device. That is, an electrically conductive substrate 91 is used forming a chassis made of metal, for example, with an open lower end. On an insulating layer 92 formed on a ceiling of the electrically conductive chassis substrate, a light emitting laminated body 13 is formed, which is composed of an electrode layer 17, an organic EL light emitting material layer 16, and a translucent electrode layer 15. The lower open end of the electrically conductive chassis substrate 91 is sealed with a translucent substrate 11. That is, the open end of the electrically conductive chassis substrate 91 is sealed with a translucent substrate 11 using an adhesive 12. The translucent electrode layers 15 and 17 are connected with electrical connecting terminals 93, 93, made of metal, which penetrate the insulating layer 92 and the ceiling portion of the chassis substrate 91. The electrical connecting terminals 93, 93 are fixed in a through hole provided on the ceiling portion of the chassis substrate 91 using insulating adhesive 94, 94. As an insulating layer 92 formed on the ceiling of the chassis substrate 91, a resin layer coated on the surface of the chassis substrate 91 or a plastic film may be used.
Further, when an electrically conductive substrate is used for a substrate of the light emitting laminated body 13, the substrate itself can serve as the electrode layer. That is, the organic EL light emitting material layer 16 is formed directly on the electrically conductive chassis substrate 91, without the electrode layer 17 shown in
In the embodiments mentioned above, the organic EL emitting laminated body has a three layer construction composed of an electrode layer, an organic EL emitting material layer, and a translucent electrode layer. However, it is needless to say that the hole transportation layer or the electron transportation layer can be provided between the electrode layer or the translucent electrode layer and the organic EL emitting material layer. Further, in the above embodiments, although the organic EL emitting laminated body was sealed by the metal sealing cap or by the metal chassis, the entire structure can be built with a non moisture permeable insulating translucent plate. In this case, both of the two electrode layers are translucent electrode layers. Further, an opaque non moisture permeable insulating substrate can be used instead of a translucent insulating plate, where a translucent plate may be embedded in a part of the opaque substrate to serve as a light guide window.
As mentioned above, the organic electroluminescent light emitting device is provided having a structure, in which the thin film electrode layer forming the electrical connecting terminal led out of the light emitting laminated body does not cross the joined portion of the substrate to the chassis surrounding the organic EL emitting laminated body. Thus the moisture resistance of the device is improved and luminescence characteristics of the device seldom vary with time.
The organic electroluminescent light emitting device according to the present embodiment differs from that of the first embodiment in that a non moisture permeable translucent substrate 11 is used, on the periphery of which a metal frame 12 is joined in non moisture permeable way. On a surface of the substrate 11, an light emitting laminated body 13 is formed, around which a metal sealing cap 14 is provided so as not to contact with the light emitting laminated body 13. The light emitting laminated body 13 is composed of an organic light emitting material layer 16 and two electrode layers 15 and 17 which hold 16 there between. Each end of the electrode layers 15 and 17 contacts with two electrical connecting terminals 28 respectively for electrical connection, which are fixed to the substrate 11 by penetrating the substrate 11. Here, the substrate 11 having metal frame 12 and two connecting terminals 28 is called light emitting element substrate 31 as mentioned above.
In the next, the light emitting laminated body 13 is formed by laminating a translucent anode layer 15, an organic light emitting material layer 16, and a cathode layer 17 in this order on the surface of the substrate 11 of light emitting element substrate 31 as shown in
Further, a metal sealing cap 14 is arranged on the surface of the light emitting element substrate 31, on which the light emitting laminated body 13 is formed, so as not to contact with the light emitting laminated body 13 at the inner surface of the metal sealing cap 14, as shown in
The method of joining a metal such as the metal sealing cap 14 to a metal such as the metal frame 12 at low temperature in a short time is known. As examples of method for joining the metal sealing cap to the metal frame, ultrasonic welding, pressure welding, resistance welding, HF induction welding, HF resistance welding etc. are known. The methods for welding are described in detail in “The Metal Handbook” 4th revised edition (Maruzen Co. Ltd.). Further, the joining of the metal sealing cap to the metal frame can be performed by such a mechanical joining as fitting one into another without gap. An actual example of mechanical joining is described later. By joining the metal sealing cap 14 to the metal frame 12 in a short time and at a low temperature in non moisture permeable way, they can be joined directly, because there is no electrode layer at the joining portion of the metal sealing cap to the metal frame different from the conventional one. As a result, moisture intruding through the joining portion can be made less, so that the organic EL light emitting device can be obtained, which hardly changes its luminescence characteristics.
As just described, by sealing the light emitting laminated body using a joining the metal to the metal at low temperature in a short time, the following merits can be obtained.
With this effect, variation of the light emitting characteristics of the organic electroluminescent light emitting device with time decreases, and thus the life of the light emitting device can be made longer.
Further, when joining the metal sealing cap to the metal frame, the joining surface area can be made larger by making one surface to be a convex one and an other surface to be a concave surface corresponding to the convex surface, in a similarly manner as in the embodiment mentioned above.
A metal sealing cap and a metal frame can be joined in non moisture permeable way by a mechanical joining.
Also in the present embodiment, it is possible to make the space formed by a translucent non moisture permeable substrate, a metal frame, and a metal sealing cap to be a vacuum space or a space filled with an inert gas. For this purpose, it is only to join the metal sealing cap to the metal frame in the vacuum or in the inert gas atmosphere.
As mentioned above, by joining the metal sealing cap to the metal frame in a short time and at a low temperature after forming the light emitting laminated body 13, the organic electroluminescent light emitting device can be produced, which hardly changes the light emitting characteristics with time.
Here, the parts or materials composing the above mentioned organic electroluminescent light emitting device are similar to those in the first embodiment, so the details are omitted.
In the next, as shown in
Then, as shown in
Then, as shown in
In the next, as shown in
Here, in the present invention, the number of the light emitting laminated body formed on the non moisture permeable translucent substrate or on the metal plate are not limited to a particular one. A plurality of light emitting laminated body may be aligned and formed on a non moisture permeable translucent substrate or on a metal plate to construct a display device.//
Number | Date | Country | Kind |
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2002-124673 | Apr 2002 | JP | national |
2002-124950 | Apr 2002 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP03/05281 | 4/24/2003 | WO | 12/12/2005 |