Claims
- 1. A method for fabricating an organic light emitting device, the method comprising:depositing a first electrode layer on a substrate; depositing an electrically insulating layer on said first electrode layer; depositing a second electrode layer on said insulating layer; depositing an organic layer on said second electrode layer; forming an aperture in said organic layer; depositing a light transmissive electrically conductive layer on said organic layer; and forming an electrical connection between said conductive layer and one of said first and second electrode layers via said aperture.
- 2. The method of claim 1, wherein said first electrode layer, said second electrode layer, said insulating layer, and said conductive layer each comprise an array of parallel strips, said strip of said first electrode layer extending orthogonal to said strips of said second electrode layer.
- 3. The method of claim 2, wherein said strips of said insulating layer and said conductive layer extend orthogonal to said strips of said first electrode layer.
- 4. The method of claim 2, wherein said strips of said insulating layer and said conductive layer extend orthogonal to said strips of said second electrode layer.
- 5. The method of claim 2, wherein said organic layer includes a plurality of apertures each communicating with one of said first and second electrode layers.
- 6. The method of claim 5, wherein each aperture is located at a different intersection of a strip of said first electrode layer and a strip of said second electrode layer.
- 7. The method of claim 5, wherein each aperture extends in a direction parallel to said strips of said second electrode layer.
- 8. The method of claim 5, wherein each aperture extends in a direction parallel to said strips of said first electrode layer.
- 9. The method of claim 3, wherein said strips of said conductive layer are electrically connected to corresponding strips of said second electrode layer.
- 10. The method of claim 4, wherein said strips of said conductive layer are electrically connected to corresponding strips of said first electrode layer.
- 11. The method of claim 1, wherein said layer structure is disposed on a substrate with said first electrode layer adjacent said substrate.
Parent Case Info
The present application is a divisional of U.S. patent application Ser. No. 09/887,779, filed Jun. 22, 2001 now U.S. Pat. No. 6,552,364.
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