This application claims priority to Taiwanese Application Serial Number 102141899, filed Nov. 18, 2013, which is herein incorporated by reference.
Technical Field
The present disclosure relates to an organic light-emitting diode display device and a method of manufacturing the same.
Description of Related Art
Organic light-emitting diodes (OLEDs) are light-emitting devices driven by electrical current. An organic light-emitting diode display device is this kind of display which uses OLEDs as light-emitting devices, and therefore an organic light-emitting diode display device is a self-luminous display. Organic light-emitting diode display devices are regarded as the best choice for replacing liquid crystal displays because they have the advantages of having a wide viewing angle, a high contrast ratio, and a high response speed. Different from the common liquid crystal displays, the organic light-emitting diode display devices in nature do not require a polarizer to achieve their display functions. Hence, the outer surface of the organic light-emitting diode display device is generally smooth and flat. When light is projected from environment to the outer surface of the organic light-emitting diode display device, the incident light is reflected from the surface of the organic light-emitting diode display device to the viewer, thus interfering with the displayed image seen by users. According to the prior art, a polarizer or an anti-reflection film is attached to the otter surface of the organic light-emitting diode display device to resolve the problem mentioned above.
An organic light-emitting diode display device is provided. The organic light-emitting diode display device comprises a substrate, a light-absorption layer, an active array, and an organic light-emitting diode. The substrate has a first surface and a second surface opposite to the first surface. The light-absorption layer is disposed on the first surface. The light-absorption layer has at test one opening exposing a portion of the first surface. An active array structure is positioned on the second surface and comprises at least one data line, at least one gate line, and at least one switching device electrically connected to the gate line and the data line. A projection of the light-absorption layer on the substrate overlaps at least one of a projection of the data line and a projection of the gate line on the substrate in a direction perpendicular to the substrate. The organic light-emitting diode is electrically connected to the switching device. A projection of the organic light-emitting diode on the substrate overlaps a projection of the opening on the substrate in the direction perpendicular to the substrate.
According to one embodiment of the present disclosure, the active array structure further comprises at least one driving line and at least one driver transistor. The driver transistor electrically interconnects the driving line and the organic light-emitting diode. The projection of the light-absorption layer on the substrate overlaps a projection of the driving line on the substrate in the direction perpendicular to the substrate.
According to one embodiment of the present disclosure, the active array structure further comprises at least one capacitor line and at least one capacitor structure connected to the capacitor line. The switching device has a drain electrode connected to the capacitor structure. The projection of the light-absorption layer on the substrate overlaps a projection of the capacitor line on the substrate in the direction perpendicular to the substrate.
According to one embodiment of the present disclosure, the organic light-emitting diode comprises a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. The first electrode is positioned between the organic light-emitting layer and the active array structure.
According to one embodiment of the present disclosure, a width of the organic light-emitting diode is approximately equal to a width of the opening.
This disclosure also provides a method of manufacturing an organic light-emitting diode display device. The method comprises the steps of: (a) providing a substrate having a first surface and a second surface opposite to the first surface; (b) forming an active array structure on the first surface; (c) forming a first protective layer to cover the active array structure: (d) forming a light-absorption layer on the second surface, the light-absorption layer having a plurality of openings exposing a portion of the second surface; (e) forming a second protective layer to cover the light-absorption layer; (f) removing the first protective layer to expose the active array structure; and (g) forming an organic light-emitting diode on the exposed active array structure.
In the foregoing, step (a) to step (g) are sequentially performed.
In the foregoing, the method further comprises: forming a protective substrate to cover the organic light-emitting diode after step (g).
In the foregoing, the method further comprises: removing the second protective layer after step (g).
In the foregoing, the first protective layer comprises a positive photoresist, and the second protective layer comprises a negative photoresist. Or, the first protective layer comprises a negative photoresist, and the second protective layer comprises a positive photoresist.
This disclosure further provides a method of manufacturing an organic light-emitting diode display device. The method comprises the steps of: (p1) providing a substrate having a first surface and a second surface opposite to the first surface; (p2) forming a light-absorption layer on the first surface, the light-absorption layer having a plurality of openings exposing a portion of the first surface; (p3) forming a protective layer to cover the light-absorption layer; (p4) forming an active array structure on the second surface; and (p5) forming an organic light-emitting diode on the active array structure.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the present disclosure as claimed.
The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings,
Reference will now be made in detail to the present embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawings.
The substrate 110 has a first surface 111 and a second surface 112. The first surface 111 is opposite to the second surface 112. In one embodiment, the first surface 111 is approximately parallel with the second surface 112. The substrate 110 may be a rigid substrate or a flexible substrate. For example, the substrate 110 may be a glass substrate, a stainless steel substrate, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, a polyimide substrate, a polycarbonate substrate, or an ultra-thin flexible glass substrate.
The light-absorption layer 120 is disposed on the first surface 111 of the substrate 110. The light-absorption layer 120 has at least one opening 122 exposing a portion of the first surface 111. In one embodiment, the light-absorption layer 120 can absorb light with a wavelength between approximately 380 nm and approximately 780 nm, and more specifically, between approximately 400 nm and approximately 700 nm. In one embodiment, the light-absorption layer 120 can absorb light with a wavelength of approximately 400 nm to approximately 700 nm, and the average light absorption rate is between approximately 70% and approximately 100%. In one embodiment, a pattern of the light-absorption layer 120 is arranged approximately in a matrix. In specifics, each of the openings 122 of the light-absorption layer 120 is in a rectangular shape, and each of the openings 122 approximately corresponds to one of sub-pixel areas in the organic light-emitting diode display device 100. In another embodiment, the light-absorption layer 120 is constituted by a plurality of stripe patterns, and the contour of each opening 122 is in a stripe shape. In other embodiments, the pattern of the light-absorption layer 120 is like a network. In one embodiment, the light-absorption layer 120 includes a mixture of black dye (or pigment), photoresist material, and polymeric material. In another embodiment, the light-absorption layer 120 may include a mixture of inorganic black pigment and lead borosilicate glass, and the black pigment is adhered to the substrate 110 through the lead boroslicate glass by utilizing a high temperature sintering process.
In particular, the light-absorption layer 120 is disposed on an outer surface of the organic light-emitting diode display device 100 and used for absorbing light projected from the environment to the panel of the display 100 so as to improve the quality of displayed images. In general, the substrate 110 has a smooth and flat surface, such as the first surface 111 and the second surface 112. When light is projected from the environment to the organic light-emitting diode display device 100, the flat first surface 111 and/or metal layers 131 of the active array structure 130 constitute an excellent reflecting surface. Incident light is thus reflected from the metal layers 131 and/or the first surface 111 to users, thus interfering with the image seen by users. In order to overcome the above-mentioned problem, a polarizer or an anti-reflection coating is attached to an outer surface of a display in some techniques. However, the polarizer or the anti-reflection coating will absorb the light emitted from the display, thus reducing the brightness of the display. This actually creates a big problem for organic light-emitting diode display devices. The reason is that the amount of current flowing through the organic light-emitting diode needs to be increased in order to increase the brightness of an organic light-emitting diode display device and thus reaches the required specification. However, the service lifetime of organic light-emitting diodes is considerably shortened when the amount of current flowing through the organic light-emitting diodes is increased. The present disclosure provides a solution based on the above technical concept. According to embodiments of the present disclosure, the light-absorption layer 120 is disposed on the outer surface of the organic light-emitting diode display device 100 so as to absorb light projected from the environment to the display panel, and thereby decreasing the reflective area provided for the incident light on the outer surface (that is the first surface) of the organic light-emitting diode display device 100. Additionally, the light-absorption layer 120 has a plurality of openings 122 which expose the sub-pixel areas of the panel so that light emitted from the organic light-emitting diodes 150 can be transmitted to the outside through the openings 122.
The active array structure 130 is positioned on the second surface 112 of the substrate 110, and thereby the active array structure 130 and the light-absorption layer 120 are respectively positioned on opposites sides of the substrate 110. In other words, the active array structure 130 is positioned on an inner side of the organic light-emitting diode display device 100, and the light-absorption layer 120 is positioned on the outer surface of the organic light-emitting diode display device 100.
Referring back to
Typically, the organic light-emitting diode display device 100 includes a number of organic light-emitting diodes 150 such as a red organic light-emitting diode 150R, a green organic light-emitting diode 150G and a blue organic light-emitting diode 150B, as shown in
In one embodiment, as shown in
Another aspect of the present disclosure is to provide a method of manufacturing an organic light-emitting diode display device.
In step S1, a substrate 210 is provided, as shown in
In step S2, an active array structure 220 is formed on the first surface 211, as shown in
In step S3, a first protective layer 230 is formed to cover the active array structure 220, as shown in
In step S4, a tight-absorption layer 240 is formed on the second surface 212, as shown in
In step S5, a second protective layer 250 is formed to cover the light-absorption layer 240, as shown in
In step S6, the first protective layer 230 is removed to allow the active array structure 220 to be exposed, as shown in
In step S7, a number of organic light-emitting diodes 260 are formed on the active array structure 220, as shown in
In one embodiment, step S1 to step S7 are sequentially performed.
In another embodiment, the light-absorption layer 240 may be formed first, and then the active array structure 220 is formed. In other words, step S1, step S4, step S5, step S3, step S2, and step S7 are sequentially performed. Specifically, a substrate is provided first. The substrate has a first surface and a second surface opposite to each other. Then, a light-absorption layer is formed on the first surface. The light-absorption layer has a plurality of openings exposing the first surface. After that, a protective layer is formed to cover the light-absorption layer followed by forming an active array structure on the second surface. After the active array structure is formed, organic light-emitting diodes are formed on the active array structure. In one embodiment, the light-absorption layer may includes a mixture of inorganic black pigment and lead borosilicate glass, and the black pigment is adhered to the substrate through the lead borosilicate glass by utilizing a high temperature sintering process.
In still another embodiment, after step S7, the method 200 further includes forming a protective substrate 270 to cover the organic light-emitting diodes 260, as shown in
In another embodiment, after the protective substrate 270 is formed, the second protective layer 250 may be removed so that the light-absorption layer 240 is exposed as shown in
Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the present disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of the present disclosure provided they fall within the scope of the following claims and their equivalents.
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Corresponding Taiwanese Office Action that this art reference was cited on Sep. 24, 2015. |
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