Organic light-emitting display device and method for fabricating the same

Abstract

Disclosed is an organic light-emitting display device capable of blocking the infiltration of oxygen and moisture, etc., simplifying the process and effectively preventing light leakage. In one embodiment, the organic light-emitting display device is a double side emission type organic light-emitting display device having at least two pixel regions emitting light in different directions The device includes a first substrate with first and second pixel regions wherein a plurality of organic light-emitting diodes are formed. The device further includes a non-pixel region around the first and the second pixel-regions, a second substrate disposed on the upper part of the first substrate to be overlapped with the first and the second pixel regions and a part of the non-pixel region, and a frit provided between the first and the second substrates to be overlapped with at least one of the first and the second pixel regions and at least a part of the non-pixel region, where the frit in the non-pixel region is formed to be thicker than the frit opposing the first or the second pixel region. The first and the second substrates are adhered to each other by the frit in the part corresponding to the non-pixel region.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects and advantages of the invention will become apparent and more readily appreciated from the following description of the preferred embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a cross-sectional view of a general organic light-emitting display device.

FIG. 2 is a plan view of an organic light-emitting display device according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of main parts of the pixel shown in FIG. 2.

FIG. 4 and FIG. 5 are cross-sectional views of an organic light-emitting display device taken along A-A′ line in FIG. 2.

FIG. 6 a to FIG. 6d are cross-sectional views showing the fabricating process of the organic light-emitting display device shown in FIG. 4.

FIG. 7A is a schematic exploded view of a passive matrix type organic light emitting display device in accordance with one embodiment

FIG. 7B is a schematic exploded view of an active matrix type organic light emitting display device in accordance with one embodiment.

FIG. 7C is a schematic top plan view of an organic light emitting display in accordance with one embodiment.

FIG. 7D is a cross-sectional view of the organic light emitting display of FIG. 7C, taken along the line d-d.

FIG. 7E is a schematic perspective view illustrating mass production of organic light emitting devices in accordance with one embodiment.

Claims

1. An organic light-emitting device comprising: a first substrate;a second substrate comprising an inner surface facing the first substrate, the inner surface comprising a first portion and a second portion;a first array of light-emitting pixels interposed between the first substrate and the second substrate;a second array of light-emitting pixels interposed between the first substrate and the second substrate;a frit layer formed over the first portion of the inner surface while not formed over the second portion of the inner surface, wherein the first portion generally opposes the first array, and wherein the second portion generally opposes the second array; anda frit seal interconnecting the first and second substrates while surrounding the first array and the second array such that the frit seal, the first substrate and the second substrate form an enclosed space where the first array and the second array are located.

2. The device of claim 1, wherein the pixels of the first array are configured to emit light substantially through the first substrate.

3. The device of claim 1, wherein the pixels of the second array are configured to emit light substantially through the second substrate.

4. The device of claim 3, wherein the first portion of the inner surface opposes the entire first array.

5. The device of claim 1, wherein a portion of the frit seal is adhered to the first substrate and the second substrate.

6. The device of claim 1, wherein the frit comprises a glass material, and at least one of a filler material to adjust absorption characteristics, and a filler material to adjust thermal expansion characteristics.

7. The device of claim 1, wherein the first substrate and the second substrate are transparent substrates.

8. An organic light-emitting device comprising: a first substrate;a second substrate comprising an inner surface facing the first substrate, the inner surface comprising a first portion and a second portion, wherein a thickness of the second substrate in an inner portion comprising the first portion and the second portion is thinner than in an outer portion surrounding the inner portion;a first array of light-emitting pixels interposed between the first substrate and the second substrate;a second array of light-emitting pixels interposed between the first substrate and the second substrate;a frit layer formed over the first portion of the inner surface while not formed over the second portion of the inner surface, wherein the first portion generally opposes the first array, and wherein the second portion generally opposes the second array; anda frit seal formed over the outer portion interconnecting the first and second substrates while surrounding the first array and the second array such that the frit seal, the first substrate and the second substrate form an enclosed space where the first array and the second array are located.

9. The device of claim 8, wherein the frit layer formed over the first portion of the inner surface and the frit seal formed over the outer portion are the same thickness.

10. The device of claim 8, wherein the first portion of the inner surface opposes the entire first array.

11. A method of making an organic light-emitting device, the method comprising: providing an unfinished device comprising a first substrate, a first array of organic light emitting pixels, and a second array of light emitting pixels;providing a second substrate, a frit layer and a peripheral frit, wherein the second substrate comprises a surface comprising a first portion and a second portion, the frit layer being formed over the first portion of the surface while not being formed over the second portion of the surface, the peripheral frit surrounding the first portion and the second portion;placing the second substrate over the unfinished device such that the first array and the second array are interposed between the first substrate, the second substrate and the frit layer, wherein after placing the peripheral frit surrounds the first array and the second array, the first portion generally opposes the first array, and the second portion generally opposes the second array; andmelting and resolidifying at least part of the peripheral frit so as to interconnect the unfinished device and the second substrate via the peripheral frit.

12. The method of claim 11, wherein the peripheral frit is thicker than the frit layer formed over the first portion.

13. The method of claim 11, wherein melting the peripheral frit comprises irradiating by laser or infrared rays.

14. The method of claim 13, wherein the wavelength of the laser or the infrared rays are in a range from about 800 nm to about 1200 nm.

15. The method of claim 13, further comprising masking at least the first portion and the second portion while irradiating.

16. The method of claim 11, wherein the peripheral frit is applied to at least one of the first substrate and the second substrate in a form of a paste comprising a glass material and a filler material to adjust absorption characteristics of laser or infrared rays, the method further comprising heating the peripheral frit to a temperature sufficient to cure the frit paste.

17. The method of claim 16, wherein heating the frit paste comprises irradiating the frit paste with laser or infrared rays.

18. The method of claim 16, wherein the frit paste is heated to a temperature in a range from about 300° C. to about 500° C.

19. The method of claim 11, wherein the first portion of the inner surface opposes the entire first array.

20. An organic light-emitting device comprising: a first substrate;a second substrate comprising an inner surface facing the first substrate, the inner surface comprising a first portion and a second portion;light-emitting pixels interposed between the first substrate and the second substrate;a frit layer formed over the first portion of the inner surface while not formed over the second portion of the inner surface; anda frit seal interconnecting the first and second substrates while surrounding the first array and the second array such that the frit seal, the first substrate and the second substrate form an enclosed space where the first array and the second array are located.

21. The device of claim 20, wherein the light-emitting pixels comprise a first array and a second array.

22. The device of claim 21, wherein the first array is configured to emit light through the first substrate.

23. The device of claim 21, wherein the second array is configured to emit light through the second substrate.

24. The device of claim 21, wherein the first portion generally opposes the first array, and the second portion generally opposes the second array.