These and other aspects and advantages of the invention will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
a is a perspective view depicting a bezel in accordance with an embodiment of the present invention;
b is a sectional view depicting a lower surface cut along with a line of A-A′ of
c is a sectional view depicting a lower surface of a bezel in accordance with an embodiment of the present invention;
a is a perspective view depicting a bezel in accordance with an embodiment of the present invention;
b is a sectional view depicting a lower surface cut along with a line of A-A′ of
a to 4f are sectional views depicting sidewalls in accordance with certain embodiments of the present invention;
a is a perspective view depicting a bezel in accordance with an embodiment of the present invention;
b is a perspective view depicting a bezel in accordance with an embodiment of the present invention; and
Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which the same elements has the same reference numerals for the sake of convenience in the following descriptions of embodiments.
The encapsulation substrate 20 is a substrate that encapsulates a pixel area, in which pixels are formed on the deposition substrate 10, on the top of the deposition substrate 10 to prevent the pixels formed on the deposition substrate 10 from being exposed to moisture or oxygen and thereby damaged. The encapsulation substrate 20 is made of a transparent material in cases of a top emission and a dual emission or made of an opaque material in case of a bottom emission. Although the present invention does not limit the material of the encapsulation substrate 20, it is desirable to apply glass, for example, in case of the top emission in accordance with this embodiment. The encapsulation substrate 20 is formed in a plate shape in this embodiment.
The encapsulating material 30 is used to adhere or seal the deposition substrate 10 and the encapsulation substrate 20. The encapsulating material 30 can be made of various materials such as inorganic or organic materials. The encapsulating material 30 is formed by surrounding the pixel array. As an inorganic encapsulating material, it is possible to use a frit, for example, for intercepting the infiltration of moisture and oxygen efficiently. The frit includes at least one selected from the group consisting of MgO, CaO, BaO, Li2O, Na2O, K2O, B2O3, V2O5, ZnO, TeO2, Al2O3, SiO2, PbO, SnO, P2O5, Ru2O, Rh2O, Rh2O, Fe2O3, CuO, TiO2, WO3, Bi2O3, and Sb22O3.
Meanwhile, the display panel is received in a bezel or backing frame 40 for reinforcing the strength of the display panel and assembled in a device which needs a display. That is, the bezel 40 is connected with an outer surface of the display panel to reinforce the display panel. Especially, if the encapsulating material is an inorganic such as frit, the display panel becomes very fragile to an external impact. Accordingly, the role of the bezel 40 becomes more important.
a is a perspective view depicting a bezel in accordance with the embodiment of the present invention, in which the bezel 40 is shown comprising a lower surface or base plate 45 and three sidewalls 41, 42 and 43. The bezel 40 may be made of metal or plastic.
When the display panel is accommodated in the lower surface 45, the lower surface 45 faces the surface of the deposition substrate 10 of the display panel 1. The base plate 45 has concave-convex surfaces or elevated and non-elevated surfaces, of which a portion protrudes or elevated toward the display panel 1, thereby enhancing the impact resistance. Here, the concave-convex surface can be embodied inside the lower surface 45 in various ways. For example, as depicted in
Furthermore, as depicted in
Referring back to
Moreover, it is possible to form the sidewalls 41, 42 and 43 with at least one wall. For example, the sidewalls may be formed in a double-wall structure having an internal wall and an external wall. The sidewalls in the double-wall structure can be formed by bending the edges of the plate to be included in the bezel twice. That is, the edge of the plate to be completed as the bezel is first bent in the direction that the display panel is located and then bent again in the opposite direction to the first bending to be into contact with each other, thus forming a double-wall, and the middle portion not bent corresponds to the lower surface.
Here, the double-wall may be formed in various shapes as depicted in
Meanwhile, a sidewall is not formed on the bottom of the display panel for the purpose of the formation of a pad section 15; however, it is possible to form fourth sidewalls 44 and 44′ as depicted in
The respective sidewalls of the display panel in an embodiment correspond to a first sidewall 141, a second sidewall 142, a third sidewall 143 and a fourth sidewall 144′. The fourth sidewall 144′ is formed in a height that does not shut the pad section 114.
Meanwhile, Table 1 indicates the maximum stresses applied to the substrates during the drop tests of the display panels, in which the Comparative Example did not include a concave-convex surface on the bezel and the sidewalls 141, 142 and 143 were not formed in the double-wall structure, and the Embodiment included a concave-convex surface on the bezel and the sidewalls 41, 42 and 43 were formed in the double-wall structure.
Comparing the stress levels applied to the edges of the substrate in accordance with the test results (most cracks spread from the edges of the substrates to the insides, thus causing the breakages), in the Comparative Example, the maximum stress of 77.82 MPa occurred in the deposition substrate and the maximum stress of 147.57 MPa occurred in the encapsulation substrate, whereas, in the Embodiment, the maximum stress of 99.18 MPa occurred in the deposition substrate and the maximum stress of 79.50 MPa occurred in the encapsulation substrate. Here, the maximum values applied to the overall deposition substrates were 147.6 MPa in the Comparative Example and 99.18 MPa in the Embodiment, thus reducing about 32.7%. That is, in the Embodiment, the stress value of the deposition substrate was increased; however, the maximum stress applied all over the deposition substrate was decreased to a level of 100 MPa or less, thus bringing an effect of reducing the breakage of the panel. For example, supposed that the substrate is broken at a stress value of 100 MPa, the breakage will occur in the Comparative Example, whereas, it will not occur in the Embodiment as the maximum stresses of the deposition substrate and the encapsulation substrate are smaller than 100 MPa.
Moreover, Table 2 indicates the maximum stresses applied to the substrates during the drop tests of the display panels, in which the Comparative Example did not form the sidewalls of the bezel in the double-wall structure, and the Embodiment established the sidewalls of the bezel in the double-wall structure.
It can be seen from the results of Table 2 that the maximum stress occurring in the overall edges of the substrate was reduced 22.53% in the Embodiment.
As above, embodiments of the present invention have been described and illustrated, although not limited thereto. It should be understood that various modifications and variations of the present invention can be made thereto by those skilled in the art without departing from the spirit and the scope of the present invention. For example, those modifications and variations may correspond to the depth, width and shape of the concave-convex portion of the lower surface of the bezel and the shape of the sidewalls. Thus, it is intended that the scope of the present invention covers such modifications and variations.
Number | Date | Country | Kind |
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10-2006-0091834 | Sep 2006 | KR | national |