This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2021-0117941, filed on Sep. 3, 2021, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.
Embodiments relate to an organic photoelectric conversion device and an image sensor including the same.
Short wave infrared (SWIR) rays have a wavelength in a range of about 1 μm to about 3 μm. An image sensor including a SWIR photoelectric conversion device may be used for, e.g., environmental contamination, surveillance, bioimages, medical care, agriculture, food, or vehicles.
The embodiments may be realized by providing an organic photoelectric conversion device including an upper electrode; a lower electrode; and an active layer between the upper electrode and the lower electrode, wherein the active layer includes bis-(4-dimethylaminodithiobenzyl)-Ni(II) (BDN) and [6,6]-Phenyl-C71-butyric acid methyl ester (PC70BM).
The embodiments may be realized by providing an organic photoelectric conversion device including an upper electrode; a lower electrode; and an active layer between the upper electrode and the lower electrode, wherein the active layer includes a first organic material and a second organic material, the first organic material and the second organic material form a charge transfer complex, and a light absorption spectrum of the charge transfer complex has a peak at a wavelength of 1.5 μm or more.
The embodiments may be realized by providing an image sensor including the organic photoelectric conversion device according to an embodiment.
The embodiments may be realized by providing an image sensor including a semiconductor substrate; a charge storage in the semiconductor substrate; an insulating layer on the semiconductor substrate; an organic photoelectric conversion device on the insulating layer; and a wiring connecting between the organic photoelectric conversion device and the charge storage, wherein the organic photoelectric conversion device includes a lower electrode connected to the wiring; an active layer on the lower electrode; and an upper electrode on the active layer, the active layer includes a first organic material and a second organic material, the first organic material and the second organic material form a charge transfer complex, and a light absorption spectrum of the charge transfer complex has a peak at a wavelength of 1.5 μm or more.
Features will be apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
Referring to
At least one of the lower electrode 10 and the upper electrode 20 may be a transparent electrode which transmits short wave infrared (SWIR) light therethrough. The lower electrode 10 and the upper electrode 20 may include, e.g., an indium tin oxide (ITO), an indium zinc oxide (IZO), an aluminum doped zinc oxide (AZO), a fluorine doped tin oxide (FTO), a tin oxide (SnO2), a titanium oxide (TiO2), a zinc oxide (ZnO), calcium (Ca), gold (Ag), silver (Ag), aluminum (Al), titanium (Ti), doped polysilicon graphene, a carbon nanotube (CNT), or a combination thereof. As used herein, the term “or” is not an exclusive term, e.g., “A or B” would include A, B, or A and B.
The active layer 30 may include a plurality of organic materials. The plurality of organic materials may include a light absorption material. In an implementation, the light absorption material may include, e.g., bis-(4-dimethylaminodithiobenzyl)-Ni(II) (BDN). BDN may be represented by Chemical Formula 1a.
Chemical Formula, the light absorption material may be represented by, e.g., Chemical Formula 1b.
In Chemical Formula 1b, each R1 may independently be or include, e.g., an alkyl group (e.g., a C1 to C30 alkyl group) and n is a natural number between 1 to 10000. πA may be, e.g., a group represented by Chemical Formula 2a, Chemical Formula 2b, or Chemical Formula 2c. As used herein, “” is a bonding location.
In Chemical Formula 2a, M may be, e.g., sulfur (S) or selenium (Se), and X may be, e.g., CH or nitrogen (N).
In Chemical Formula 2b, each R2 may independently be or include, e.g., an alkyl group (e.g., a C1 to C30 alkyl group).
In an implementation, the light absorption material may be represented by Chemical Formula 1c.
In Chemical Formula 1c, each R3 may independently be, e.g., a group represented by Chemical Formula 3a, Chemical Formula 3b, or Chemical Formula 3c.
In an implementation, the light absorption material may be, e.g., represented by Chemical Formula 1d.
In an implementation, the active layer 30 may further include, e.g., a donor material or an acceptor material.
The donor material may include, e.g., poly-3-hexylthiophene (P3HT), poly[2-methoxy-5-(3,7-dimethyoctyoxyl)-1,4-phenylenevinylene] (MDMO-PPV), poly[[4,8-bis[(2-ethylhexyl)oxy]benzo[1,2-b:4,5-b′]dithiophene-2,6-diyl][3-fluoro-2-[(2-ethylhexyl)carbonyl]thieno[3,4-b]thiophenediyl]] (PTB7), poly[2,6-(4,4-bis-(2-ethylhexyl)-4H-cyclopenta [2,1-b;3,4-b]dithiophene)-alt-4,7(2,1,3-benzothiadiazole)] (PCPDTBT), poly[N-9′-heptadecanyl-2,7-carbazole-alt-5,5-(4′,7′-di-2-thienyl-2′,1′,3′-benzothiadiazole)] (PCDTBT), or poly{2,2′-(2,5-bis(2-octyldodecyl)-3,6-dioxo-2,3,5,6-tetrahydropyrrolo[3,4-c]pyrrole-1,4-diyl)dithieno[3,2-b]thiophene-5,5′-diyl-alt-thiophen-2,5-diyl} (DPPTT-T).
P3HT may be represented by Chemical Formula 4a.
MDMO-PPV may be represented by Chemical Formula 4b.
PTB7 may be represented by Chemical Formula 4c.
PCPDTBT may be represented by Chemical Formula 4d.
PCDTBT may be represented by Chemical Formula 4e.
DPPTT-T may be represented by Chemical Formula 4f
The acceptor material may include, e.g., PC70BM, [6,6]-phenyl-C61-butyric acid methyl ester (PC60BM), bis(1-[3-(methoxycarbonyl)propyl]-1-phenyl)-[6,6]C62 (bis-PCBM), poly {[N,N-bis(2-octyldodecyl)-naphthalene-1,4,5,8-bis(dicarboximide)-2,6-diyl]-alt-5,5-(2,29-bisthiophene)} (N2200), perylene diimide (PDI), or naphthalene diimide (NDI).
PC70BM may be represented by Chemical Formula 5a.
Bis-PCBM may be represented by Chemical Formula 5b.
N2200 may be represented by Chemical Formula 5c.
PDI may be represented by Chemical Formula 5d.
In Chemical Formula 5d, R may be a hydrogen, an alkyl group or an aryl group.
NDI may be represented by Chemical Formula 5e.
In Chemical Formula 5e, R may be a hydrogen, an alkyl group, or an aryl group. In an implementation, NDI may include a compound represented by Chemical Formula 5f (e.g., a compound represented by Chemical Formula 5e, in which each R is a dimethylamino-substituted ethyl group.
A light absorption spectrum of the light absorption material may have a peak at a wavelength greater than or equal to about 1 μm and less than about 1.5 μm. A light absorption spectrum of each of the light absorption material, the donor material, and the acceptor material individually may not have a peak at a wavelength greater than or equal to about 1.5 μm. However, a light absorption spectrum of the active layer 30 (e.g., in which all of the materials are combined or mixed) may have a peak at a wavelength greater than or equal to about 1.5 μm. This may be because the light absorption material and the acceptor material form a charge transfer complex (CTC), and a bandgap of the CTC may be less than a bandgap of the light absorption material and a bandgap of the acceptor material. Alternatively, this may be because the light absorption material and the donor material may form a CTC, and the bandgap of the CTC may be less than the bandgap of the light absorption material and a bandgap of the donor material. In general, the less a bandgap, the greater a wavelength of absorbed light.
In an implementation, the active layer 30 may include BDN as the light absorption material and may include PC70BM as the acceptor material. In this case, light absorption spectra of each of BDN and PC70BM may not individually have a peak at a wavelength greater than or equal to about 1.5 μm. In an implementation, the light absorption spectrum of BDN may have a peak at a wavelength greater than or equal to about 1 μm and less than about 1.5 μm. In an implementation, the light absorption spectrum of the entire active layer 30 may have a peak at a wavelength greater than or equal to about 1.5 μm. This is because BDN and PC70BM form a CTC, and the bandgap of the CTC may be less than the bandgap of the light absorption material and the bandgap of the acceptor material. In some embodiments, the active layer 30 may further include P3HT as the donor material.
Referring to
The lower transport layer 40 and the upper transport layer 45 may be a hole transport layer and an electron transport layer, respectively. In an implementation, the lower transport layer 40 and the upper transport layer 45 may be an electron transport layer and a hole transport layer, respectively. The electron transport layer may include, e.g., ZnO, TiO2, polystyrene sulfonate (PSS), bathocuproine, or lithium fluoride (Lif). The hole transport layer may include, e.g., molybdenum oxide (MoO3), nickel oxide (NiO), or poly(3,4-ethylenedioxythiophene) doped with PSS (PEDOT:PSS).
PSS may be represented by Chemical Formula 6a.
Bathocuproine may be represented by Chemical Formula 6b.
PEDOT:PSS may be represented by Chemical Formula 6c.
In an implementation, e.g., in which the active layer 30 includes BDN as the light absorption material and includes PC70BM as the acceptor material, external quantum efficiency (EQE) of the organic photoelectric conversion device 200 at −5 V for light of 1,300 nm may be about 0.03% or more. In an implementation, the active layer 30 may have a thickness of about 50 nm to about 100 nm.
In an implementation, e.g., in which the active layer 30 further includes P3HT as the donor material, the EQE of the organic photoelectric conversion device 200 at −5 V for light of 1,300 nm may be about 0.67% or more. In an implementation, by adding P3HT, the EQE of the organic photoelectric conversion device 200 may be improved. This may be because the crystallinity of the active layer 30 is improved by adding P3HT to the active layer 30. In an implementation, the active layer 30 may have a thickness of about 400 nm to about 600 nm.
The following Examples are provided in order to highlight characteristics of one or more embodiments, but it will be understood that the Examples are not to be construed as limiting the scope of the embodiments. Further, it will be understood that the embodiments are not limited to the particular details described in the Examples.
<Material>
BDN and PC70BM were used as materials of an active layer in a First Example, and BDN, PC70BM, and P3HT were used as materials of an active layer in a Second Example.
<Light Absorption Spectrum of BDN>
A light absorption spectrum of a BDN solution (10−5 M) in tetrahydrofuran (THF) and a light absorption spectrum of a BDN film were measured.
Referring to
<Energy Level of BDN>
An energy level of BDN was calculated by using a density functional theory
(DFT) simulation.
<Light Absorption Spectrum of a Film in Which BDN and PC70BM are Mixed>
A light absorption spectrum of a film in which BDN and PC70BM are mixed was measured.
<Manufacturing of First Example>
A glass substrate, on which ITO was grown to about 300 nm, was cleaned using toluene, acetone, or isopropyl alcohol (IPA). Thereafter, about 1 mL of a diethyl zinc solution was mixed with about 2 mL of THF, and then, the mixed solution was coated on the ITO by spin coating to form a ZnO film on the ITO. A thickness of the ZnO film was about 40 nm.
About 10 mg of BDN powder and about 10 mg of PC70BM powder were mixed at a 1:1 weight ratio with about 1 mL of chloroform. This mixture was stirred for two hours or more to produce a BDN:PC70BM solution. The ZnO film was coated with the BDN:PC70BM solution by spin coating to form a BDN:PC70BM mixed film. According to spin coating conditions, a thickness of the BDN:PC70BM mixed film may vary.
MoO3 was formed with a thickness of about 4 nm on the BDN:PC70BM mixed film by thermal evaporation. Thereafter, an Au film was formed with a thickness of about 20 nm on the MoO3 by thermal evaporation. The MoO3 and the Au film were formed by using a shadow mask so as to expose the BDN:PC70BM mixed film therethrough.
The First Example formed as described above had a following structure:
Glass substrate/
ITO (300 nm)/ZnO (40 nm)/BDN:PC70BM/MoO3 (4 nm)/Au (20 nm)
ITO was a lower electrode, ZnO was an electron transport layer, BDN:PC70BM was an active layer, MoO3 was a hole transport layer, and Au was an upper electrode.
<Voltage-Current Measurement 1 of First Example>
A voltage-current graph was measured when sunlight (6 mWcm−2) was irradiated on the First Example.
<Voltage-Current Measurement 2 and EQE Measurement of First Example>
A voltage-current graph was measured when light of about 1,300 nm and about 5 μWcm−2 was irradiated on the First Example.
<Time-Current Measurement and EQE Measurement of First Example>
A time-current graph was measured in real-time while sequentially irradiating light of about 1,100 nm and about 80 μWcm−2, light of about 1,200 nm and about 20 Wcm−2, and light of about 1,300 nm and about 5 μWcm−2 on the First Example.
<Optical Microscopy Image and Atomic Force Microscopy (AFM) Image of Active Layer of First Example>
An optical microscopy image and an AFM image of an active layer of the first embodiment were captured.
<Cross-Sectional Profile of Active Layer of First Example>
A cross-sectional profile of the active layer of the First Example was measured by using AFM.
<Manufacturing of Second Example>
A glass substrate, on which ITO was grown to about 300 nm, was cleaned by using toluene, acetone, or IPA. Thereafter, about 1 mL of a diethyl zinc solution was mixed with about 2 mL of THF, and then, the mixed solution was coated on the ITO by spin coating to form a ZnO film on the ITO. A thickness of the ZnO film was about 40 nm.
BDN powder, PC70BM powder, and P3HT powder were mixed at a 1:1:1 weight ratio with about 1 mL of chloroform. This mixture was stirred for two hours or more to produce a P3HT:BDN:PC70BM solution. The ZnO film was coated with the P3HT:BDN:PC70BM solution by spin coating to form a P3HT:BDN:PC70BM mixed film. According to spin coating conditions, a thickness of the P3HT:BDN:PC70BM mixed film may vary.
MoO3 was formed with a thickness of about 4 nm on the P3HT:BDN:PC70BM mixed film by thermal evaporation. Thereafter, an Au film was formed with a thickness of about 20 nm on the MoO3 by thermal evaporation. The MoO3 and the Au film were formed by using a shadow mask so as to expose the P3HT:BDN:PC70BM mixed film therethrough.
The Second Example formed as described above had a following structure:
Glass substrate/ ITO (300 nm/ZnO (40 nm)/P3HT:BDN:PC70BM/MoO3 (4 nm)/Au (20 nm)
ITO was a lower electrode, ZnO was an electron transport layer,
P3HT:BDN:PC70BM was an active layer, MoO3 was a hole transport layer, and Au was an upper electrode.
<Time-Current Graph of Second Example>
A time-current graph was measured in real-time while sequentially turning on and off light of about 1,300 nm and about 5 μWcm−2 on the Second Example.
<AFM Image of Active Layer of Second Example>
An AFM image of the active layer of the Second Example was captured.
<Cross-Sectional Profile of Active Layer of Second Example>
A cross-sectional profile of the active layer of the Second Example was measured by using AFM.
Referring to
The semiconductor substrate 310 may include a semiconductor material, e.g., a group IV semiconductor material, a group III-V semiconductor material, or a group II-VI semiconductor material. The group IV semiconductor material may include, e.g., silicon (Si), germanium (Ge), or Si—Ge. The group III-V semiconductor material may include, e.g., gallium arsenide (GaAs), indium phosphide (InP), gallium phosphide (GaP), indium arsenide (InAs), indium antimonide (InSb), or indium gallium arsenide (InGaAs). The group II-VI semiconductor material may include, e.g., zinc telluride (ZnTe) or cadmium sulfide (CdS).
The charge storage 55 may be an impurity region in the semiconductor substrate 310. The charge storage 55 may also be referred as a floating diffusion region. The charge storage 55 may be connected to a transmit transistor on the semiconductor substrate 310. Photocharges generated by the organic photoelectric conversion device 100 may be transferred to the charge storage 55 through the wiring 85 and accumulated in the charge storage 55.
The insulating layer 80 may include a silicon oxide, a silicon nitride, or a low dielectric material. The low dielectric material may include, e.g., silicon carbide (SiC), silicon hydroxyl carbon (SiCOH), silicon oxycarbide (SiCO), silicon oxyfluoride (SiOF), flowable oxide (FOX), torene silazene (TOSZ), undoped silica glass (USG), borosilica glass (BSG), phosphosilica glass (PSG), borophosphosilica glass (BPSG), plasma enhanced tetra ethyl ortho silicate (PETEOS), fluoride silicate glass (FSG), carbon doped silicon oxide (CDO), xerogel, aerogel, amorphous fluorinated carbon, organo silicate glass (OSG), parylene, bis-benzocyclobutene (BCB), silicon low-k (SiLK), polyimide, a porous polymer material, or a combination thereof.
The organic photoelectric conversion device 100 may be similar to the organic photoelectric conversion device 100 described with reference to
A plurality of wirings 85 may connect the plurality of parts divided from the lower electrode 10 to a plurality of charge storages 55, respectively. The wiring 85 may include, e.g., tungsten (W), Al, copper (Cu), Ag, Au, polysilicon, or the like.
Referring to
By way of summation and review, silicon cannot absorb SWIR rays, and thus, silicon may not be suitable for SWIR sensing. An image sensor including an indium gallium arsenide (InGaAs) SWIR photoelectric conversion device may be expensive.
One or more embodiments may provide an inexpensive SWIR photoelectric conversion device.
One or more embodiments may provide a short wave infrared (SWIR) organic photoelectric conversion device.
Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated.
Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
Number | Date | Country | Kind |
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10-2021-0117941 | Sep 2021 | KR | national |