Claims
- 1. An adhesive binder composition for the preparation of compression moldable lignocellulosic articles which comprises from about 20 to 95 percent by weight of an organic di- or polyisocyanate, from about 5 to 80 percent by weight of a liquid epoxide selected from liquid aromatic epoxides having one .alpha. epoxide group and aromatic or aliphatic based multifunctional epoxides having 2 or more .alpha. epoxide groups and between about 1.0 and 60 weight percent lignin based on the total composition as a diluent.
- 2. The adhesive composition of claim 1 wherein between 10 and 35 weight percent lignin is added as diluent.
- 3. The adhesive composition of claim 1 wherein the aromatic epoxide having one .alpha. epoxide group is styrene oxide.
- 4. The adhesive composition of claim 1 wherein the multifunctional epoxide is a diglycidyl ether of Bisphenol A.
- 5. The adhesive composition of claim 1 wherein the multifunctional epoxide is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
- 6. The adhesive composition of claim 1 wherein the multifunctional epoxide is epoxidized p-aminophenol.
- 7. The adhesive composition of claim 1 wherein the di- or polyisocyanate is a diphenylmethane diisocyanate.
- 8. The adhesive composition of claim 1 wherein the di- or polyisocyanate is a mixture of diphenylmethane diisocyanate and the higher functionality polymethylene polyphenyl isocyanate.
- 9. The adhesive composition of claim 1 wherein from 50 to 75 weight percent organic di- or polyisocyanate, from 50 to 25 weight percent liquid epoxide and from 10 to 20 weight percent lignin based on the total composition is employed.
- 10. A compression moldable lignocellulosic composition comprising lignocellulosic particles and from about 1.5 to 12 percent by weight based on oven dried particles of an adhesive binder composition which comprises from about 20 to 95 weight percent organic di- or polyisocyanate, from about 5 to 80 weight percent liquid epoxide selected from liquid monomeric epoxides having one .alpha. epoxide group and aromatic or aliphatic based multifunctional epoxides having 2 or more .alpha. epoxide groups and between about 1.0 and 60 weight percent lignin based on the total composition as a diluent.
- 11. The compression moldable composition of claim 10 wherein 2.5 to 6.5 weight percent adhesive binder is employed in the composition.
- 12. The compression moldable composition of claim 10 wherein the lignin is between 10 and 35 weight percent.
- 13. The compression moldable composition of claim 10 wherein the aromatic epoxide having one .alpha. epoxide group is styrene oxide.
- 14. The compression moldable composition of claim 10 wherein the multifunctional epoxide is a diglycidyl ether of Bisphenol A.
- 15. The compression moldable composition of claim 10 wherein the multifunctional epoxide is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
- 16. The compression moldable composition of claim 10 wherein the multifunctional epoxide is epoxidized p-aminophenol.
- 17. The compression moldable composition of claim 10 wherein from 50 to 75 weight percent organic di- or polyisocyanate and from 50 to 25 weight percent liquid epoxide is employed in the adhesive binder.
- 18. The compression moldable composition of claim 10 wherein the di- or polyisocyanate is a diphenylmethane diisocyanate.
- 19. The compression moldable composition of claim 10 wherein the di- or polyisocyanate is a mixture of diphenylmethane diisocyanate and the higher functionality polymethylene polphenyl isocyanates.
- 20. A composition board product comprising a compression molded lignocellulosic composition comprising lignocellulosic particles and from about 1.5 to 12 weight percent based on oven dried lignocellulosic particles employed of an adhesive binder composition, said binder composition being a mixture of from about 20 to 95 weight percent organic di- or polyisocyanate, from 5 to 80 weight percent liquid epoxide selected from liquid aromatic epoxides having one .alpha. epoxide group and aromatic or aliphatic based multifunctional epoxides having 2 or more epoxide groups and between about 1.0 and 60 weight percent lignin based on the total composition as diluent.
- 21. The board product of claim 20 wherein the compression molded lignocellulosic composition is wood particle board.
- 22. A method for the preparation of lignocellulosic composite articles comprising the steps of
- (a) mixing together lignocellulosic particles and from about 1.5 to 12 weight percent based on oven dried lignocellulosic particles of an adhesive binder composition comprising from 20 to 95 weight percent organic di- and polyisocyanate, from about 5 to 80 weight percent liquid epoxide selected from liquid aromatic epoxides having one .alpha. epoxide group and aromatic or aliphatic based multifunctional epoxides having 2 or more epoxide groups and between about 1.0 and 60 weight percent lignin based on the total composition as diluent to form a moldable composition;
- (b) introducing said moldable composition onto a metal mold, caul plate or platen which has been sprayed or coated with a release agent;
- (c) compression shaping said composition at temperatures of between about 140.degree. C. to 220.degree. C. at pressures of from about 100 to 600 psi for a period of from about 1 to 10 minutes to form a composite article of desired shape and/or thickness; and
- (d) thereafter releasing said lignocellulosic composite article from said metal mold, caul plate or platen.
- 23. A method according to claim 22 wherein 2.5 to 6.5 weight percent adhesive binder composition is employed and comprises from 50 to 75 weight percent organic di- or polyisocyanates, from 50 to 25 weight percent liquid epoxide and from 10 to 35 weight percent lignin, the release agent is a metallic soap, the compression temperature is between 160.degree. C. to 190.degree. C. and the time period is from 3 to 5 minutes.
- 24. A method according to claim 22 wherein the binder composition is a mixture of diphenylmethane diisocyanate and the higher functionality polymethylene polyphenyl isocyanates, diglycidyl ether of Bisphenol A and lignin.
- 25. A method according to claim 22 wherein the compression molded lignocellulosic composition is wood particle board.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part application of co-pending application Ser. No. 317,805, filed Nov. 11, 1981 and now abandoned and entitled Organic Polyisocyanate-Liquid Aromatic Epoxide Adhesive Binder Compositions.
US Referenced Citations (6)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
317805 |
Nov 1981 |
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