Claims
- 1. A process for preparing a polyimide comprising reacting a diamine of the formula:
- NH.sub.2 --(Y.sub.i -X.sub.i).sub.n --Y.sub.i --NH.sub.2 (III)
- wherein n is a number of at least 2, i is a positive integer not larger than n, Y is an aromatic or substituted aromatic group, and X is O, S, Se, Te or the divalent group --CH.dbd.CH--, and a tetracarboxylic dianhydride of the formula: ##STR7## wherein A is a tetravalent hydrocarbon group in a molar ratio of said diamine to said dianhydride of 1:(1+m) wherein m is a positive number to obtain a polyamic acid, wherein said diamine and said tetracarboxylic dianhydride are reacted in a ratio of said diamine to said dianhydride of 1:(1+m), wherein m is larger than zero and smaller than 1, to form said polyamic acid, and then an additional amount of said carboxylic anhydride is added to said polyamic acid; polymerizing said polyamic acid; and annealing the resultant polymerization product at a temperature of 200.degree. to 400.degree. C. to obtain polyimide.
- 2. A process for preparing an organic polymer comprising evaporating a raw material comprising a diamine of the formula:
- NH.sub.2 --(Y.sub.i -X.sub.i).sub.n --Y.sub.i --NH.sub.2 (III)
- wherein n is a number of at least 2, i is a positive integer not larger than n, Y is an aromatic or substituted aromatic group, and X is O, S, Se, Te or the divalent group --CH.dbd.CH--, and a tetracarboxylic dianhydride of the formula: ##STR8## wherein A is a tetravalent hydrocarbon group, and wherein said diamine and said dianhydride are independently evaporated in an evaporation ratio of said diamine to said dianhydride of 1:(1+m), wherein m is a positive number; and polymerizing them on a substrate, wherein the temperature of said substrate is higher than a melting point of said diamine.
- 3. The process according to claim 2, wherein said substrate is coated with a polyimide film.
- 4. The process according to claim 3, wherein said polyimide film is subjected to rubbing treatment.
- 5. The process according to claim 2, wherein after deposition of said polyimide, said substrate is heated to a temperature of 200.degree. C. or higher.
- 6. The process according to claim 2, wherein said substrate is coated with a silane coupling agent.
- 7. The process according to claim 6, wherein said diamine and said dianhydride are alternately evaporated.
Priority Claims (5)
Number |
Date |
Country |
Kind |
2-073777 |
Mar 1990 |
JPX |
|
2-073778 |
Mar 1990 |
JPX |
|
2-073779 |
Mar 1990 |
JPX |
|
2-074971 |
Mar 1990 |
JPX |
|
2-335910 |
Nov 1990 |
JPX |
|
Parent Case Info
This is a divisional application of Ser. No. 08/090,638 filed Jul. 13, 1993, now U.S. Pat. No. 5,486,442, which is a continuation application of Ser. No. 07/673,759 filed Mar. 25, 1991, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4698295 |
Pfeifer et al. |
Oct 1987 |
|
5084557 |
Murata et al. |
Jan 1992 |
|
5384649 |
Takimoto et al. |
Jan 1995 |
|
Foreign Referenced Citations (5)
Number |
Date |
Country |
0240249 |
Oct 1987 |
EPX |
0283636 |
Sep 1988 |
EPX |
0300326 |
Jan 1989 |
EPX |
0375165 |
Jun 1990 |
EPX |
2400224 |
Mar 1979 |
FRX |
Non-Patent Literature Citations (4)
Entry |
Patent Abstracts of Japan, vol. 13, No. 93 (P-838) (3441) Mar. 6, 1989. |
Patent Abstracts of Japan, vol. 8, No. 257 (P-316) (1694) Nov. 24, 1984. |
World Patents Index, Week 8726, Derwent Publications, AN 87-181570. |
World Patents Index, Week 8818, Derwent Publications, AN 88-123712. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
90638 |
Jul 1993 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
673759 |
Mar 1991 |
|