This application claims priority from Chinese Patent Application Serial No. 200610016822.4 filed Apr. 29, 2006.
Field of the Invention
The present invention relates to an organic semiconductor crystalline film, a weak oriented epitaxy growth preparation method for preparing the same, and an organic film electronic device such as organic transistor and organic phototransistor comprising the organic crystalline film prepared by the weak oriented epitaxy growth method.
Background Art
In recent years, organic semiconductor materials with high carrier mobility properties and exhibit great potential in the markets of information displays, integrated circuits, photovoltaic cells and sensors. The high carrier mobility property is mainly reflected by organic semiconductor single crystal. The “Physical Vapor Growth” for preparing an organic semiconductor single crystal was reported firstly by Kloc et al., Journal of Crystal Growth, 1997, 182, 416-427.
However, the devices in the practice are required generally to be integrated, and organic semiconductor materials are usually used in the form of films in the devices. Therefore, the “Vapor Phase Deposition” facilitating the preparation of films of a large size becomes a primary method to prepare organic semiconductor polycrystalline films at present. The major controlling factors of single domains polycrystalline films of a large size prepared by vapor phase deposition method are the increase of film growth temperature and the chemical modification of surface (Nature, 2001, 412, 517-520). Because there is no oriented relationship between the organic film prepared by vapor phase deposition method and the substrate, the grain boundary defects can not be controlled effectively, and therefore the carrier mobility of thus prepared organic semiconductor polycrystalline film is lower than that of its single crystal by one order or more. Actually, in the early stage, the preparation technique of controlling the oriented relationship between an organic film and a substrate borrows ideas from the preparation methods of inorganic semiconductor films, in which organic molecular beam epitaxy (OMBE) is a representational one.
In general, the organic molecular beam epitaxy means a technology for growing an organic crystal with a commemsurable modulation and non-commemsurable modulation relationship on a single crystal substrate on the surface of the single crystal substrate (Chem. Rev., 1997, 97, 1793-1896), wherein a relatively low growth temperature is adopted in the early stage, and the sizes of crystals are small, usually about tens of nm, and the organic molecule are grown generally by lying on the substrate; recently, room temperature and high temperature growth methods are employed in the organic molecular beam epitaxy growth, resulting in the increase of crystal sizes, but the organic molecule are grown generally by lying on the substrate, too (Appl. Phys. Lett., 1999, 75, 187-189).
Since an organic molecule is in a geometric form, the epitaxy growth theory of inorganic film cannot be applied directly to the preparation of organic films, and the organic polycrystalline films prepared by this method are not continuous. The oriented polytetrafluoroethylene film method was first employed by Wittman et al. (Nature, 1991, 352, 414-417) to achieve an “Oriented Epitaxy Growth (OEG)” of polymer crystals and organic molecule crystals, which is called herein as “Strong Oriented Epitaxy Growth (SOEG)”. Because of the strong interaction between polytetrafluoroethylene and the epitaxially grown polymer and organic molecules, the molecules in an oriented epitaxially grown crystal are generally arranged parallel to the substrate. As for organic semiconductor, the property of high carrier mobility in the crystal is in the direction of larger inter-molecule π-π interaction. Therefore, as compared with molecular vapor phase deposited film, a better property of carrier mobility is not obtained by the organic semiconductor polycrystalline film grown by polytetrafluoroethylene oriented epitaxy growth method (Thin solid films, 1998, 333, 272; Chem. Mater., 2001, 13, 1341-1348).
In order to overcome the deficiency of the prior art, an organic semiconductor crystalline film is provided in the present invention. The organic semiconductor crystalline film of the present invention is characterized in that organic semiconductor molecules in the organic semiconductor crystalline film are arranged in a stand-up manner on an ordered substrate, and have oriented relationship with the ordered substrate, i.e., the crystalline direction with larger inter-molecular π-π interaction is orderly oriented in the film plane, thus the organic semiconductor crystalline film possesses single crystal-like high mobility property.
Accordingly, the invention provides:
1. An organic semiconductor crystalline film (5), wherein organic semiconductor molecules in the organic semiconductor crystalline film (5) are arranged in a stand-up manner on an ordered substrate (9) and have oriented relationship with the ordered substrate (9).
2. The organic semiconductor crystalline film according to item 1, wherein the ordered substrate (9) comprises a substrate (8) and an ordered molecular layer (4), the organic semiconductor crystalline film (5) being contacted with the ordered molecular layer (4) of the ordered substrate (9).
3. The organic semiconductor crystalline film according to item 2, wherein the ordered molecular layer (4) is a p-type organic semiconductor ordered multi-molecular layer.
4. The organic semiconductor crystalline film according to item 2, wherein the ordered molecular layer (4) is a p-type organic semiconductor ordered mono-molecular layer, the ordered mono-molecular layer (4) being continuous or discontinuous.
5. The organic semiconductor crystalline film according to item 3 or 4, wherein the ordered molecular layer (4) is consisted of one of BP2T, NaT4, pentacene, hexathiophene, para-hexaphenyl (6P) or triphenanthrene.
6. The organic semiconductor crystalline film according to item 1 using one or two materials selected from p-type semiconductor material including copper phthalocyanine (CuPc), zinc phthalocyanine (ZnPc), nickel phthalocyanine (NiPc), cobalt phthalocyanine (CoPc), free phthalocyanine (H2Pc), platinum phthalocyanine (PtPc), lead phthalocyanine (PbPc), Pentacene, 6P, BP2T, 5,5′-di(2-naphthyl)-2,2′-dithiophene (NaT2), 5,5″-di(2-naphthyl)-2,2′:5′,2″-trithiophene (NaT3), NaT4, 5,5″″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″:5′″,2″″-pentathiophene (NaT5), 5,5′″″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″:5′″,2″″:5″″,2′″″-hexathiophene (NaT6), 2,5-di(2-naphthyl)-[3,2-b]bidithiophene (NaTT), 5,5′-di(2-naphthyl)-2,2′-di[3,2-b]bidithiophene (NaTT2), 5,5′-di(2-thianaphthenyl)-2,2′-dithiophene (TNT2), 5,5″-di(2-thianaphthenyl)-2,2′:5′,2″-trithiophene (TNT3), 5,5′″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″-tetrathiophene (TNT4), 5,5″″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″:5′″,2″″-pentathiophene (TNT5), 2,5-di(2-thianaphthenyl)-[3,2-b]bidithiophene (TNTT), 5,5′-di(2-thianaphthenyl)-2,2′-di[3,2-b]bidithiophene (TNTT2), 5,5′-di(2-phenanthryl)-2,2′-dithiophene (PhT2), 5,5″-di(2-phenanthryl)-2,2′:5′,2″-trithiophene (PhT3), 5,5′″-di(2-phenanthryl)-2,2′:5′,2″:5″,2′″-tetrathiophene (PhT4), 2,5-di(2-phenanthryl)-[3,2-b]bidithiophene (PhTT), or 5,5′-di(2-phenanthryl)-2,2′-di[3,2-b]bidithiophene (PhTT2), and n-type semiconductor material including copper fluorophthalocyanine (F16CuPc), zinc fluorophthalocyanine (F16ZnPc), iron fluorophthalocyanine (F16FePc), cobalt fluorophthalocyanine (F16CoPc) or fluoro-hexathiophene (DFH-6T).
7. A method for preparing the organic semiconductor crystalline film according to item 1, comprising the steps of preparing the ordered substrate (9) and preparing the organic semiconductor crystalline film (5) grown thereon, wherein the interaction between epitaxial molecules in the organic semiconductor crystalline film (5) and the ordered substrate (9) is controlled by growth temperature to be weaker than the interaction between epitaxial molecules, so that the epitaxial molecules in the organic semiconductor crystalline film (5) are epitaxially grown in a stand-up manner on the ordered substrate (9), and the crystalline direction with larger inter-molecular π-π interaction is orderly oriented in the film plane.
8. The method for preparing an organic semiconductor crystalline film according to item 7, wherein the step of preparing the ordered substrate (9) comprises depositing an organic semiconductor ordered molecular layer (4) on a glass or plastic substrate (8) wherein the temperature of the substrate is within 30-200° C. to constitute an ordered substrate (9) by using molecular vapor phase deposition method; and the step of preparing the organic semiconductor crystalline film (5) comprises depositing the organic semiconductor crystalline film (5) on the organic semiconductor ordered molecular layer (4) of the ordered substrate (9) at a temperature of 30-200° C. by using molecular vapor phase deposition method.
9. An organic transistor, comprising a substrate (1), a gate electrode (2), a insulator gate (3), an ordered mono-molecular layer (4), a organic semiconductor crystalline film (5), and source/drain electrodes (6), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the insulator gate (3) and the source/drain electrodes (6), and the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), wherein the organic semiconductor crystalline film (5) is an organic semiconductor crystalline film according to item 1.
10. A organic phototransistor, comprising a substrate (1), a gate electrode (2), a insulator gate (3), an ordered mono-molecular layer (4), a organic semiconductor crystalline film (5), and source/drain electrodes (6), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the insulator gate (3) and the source/drain electrodes (6), and the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), wherein the organic semiconductor crystalline film (5) is an organic semiconductor crystalline film according to item 1.
11. An organic transistor, comprising a substrate (1), a gate electrode (2), a insulator gate (3), an ordered mono-molecular layer (4), a organic semiconductor crystalline film (5), and source/drain electrodes (6), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the insulator gate (3) and the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the ordered mono-molecular layer (4), the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), and the organic semiconductor crystalline film (5) is contacted with source/drain electrodes (6), wherein the organic semiconductor crystalline film (5) is an organic semiconductor crystalline film according to item 1.
12. A organic phototransistor, comprising a substrate (1), a gate electrode (2), a insulator gate (3), an ordered mono-molecular layer (4), a organic semiconductor crystalline film (5), and source/drain electrodes (6), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the insulator gate (3) and the source/drain electrodes (6), the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), wherein the substrate (1) is contacted with the gate electrode (2), the gate electrode (2) is contacted with the insulator gate (3), the insulator gate (3) is contacted with the ordered mono-molecular layer (4), the ordered mono-molecular layer (4) is contacted with the organic semiconductor crystalline film (5), and the organic semiconductor crystalline film (5) is contacted with source/drain electrodes (6), wherein the organic semiconductor crystalline film (5) is an organic semiconductor crystalline film according to item 1.
The various embodiments, features and advances of the present invention will be understood more completely hereinafter as a result of a detailed description thereof in which reference will be made to the following drawings:
One aspect of the present invention is to provide an organic semiconductor crystalline film. As shown by
The materials used for the organic semiconductor crystalline film 5 can be either n-type semiconductor or p-type semiconductor. The semiconductor employed in the present invention is a p-type semiconductor material, and the details can be seen in the following introduction of steps and conditions 2 which are used for the preparation method of organic semiconductor polycrystalline films of the present invention, and the preparation of a weak oriented epitaxially grown organic crystalline film.
The organic semiconductor crystalline film 5 can be either continuous or discontinuous, which is prepared on the ordered substrate 9 by molecular vapor phase deposition method.
Another aspect of the present invention is to provide a preparation method of an organic semiconductor polycrystalline film by using “weak oriented epitaxy growth (WOEG)” process on an ordered substrate. In this method, organic semiconductor molecules are transported onto an ordered substrate mainly by a vapor phase deposition method or a solution process method, and the interaction between epitaxial molecule and the substrate is controlled under a certain growth temperature such that it is weaker than the interaction between epitaxial molecules, so that the epitaxial molecule may be epitaxially grown in a stand-up manner on the ordered substrate, thereby the crystalline direction with a larger inter-molecular π-π interaction is orderly oriented in the film plane.
The preparation method of organic semiconductor crystalline films of the present invention, which comprises preparing an ordered substrate 9 and growing an organic semiconductor crystalline film 5 thereon, is characterized in that the interaction between epitaxial molecule of the organic semiconductor crystalline film 5 and the substrate 9 is controlled such that it is weaker than the interaction between epitaxial molecules by controlling the growth temperature, so that the epitaxial molecule of the organic semiconductor crystalline film 5 are epitaxially grown in a stand-up manner on the ordered substrate 9, thereby the crystalline direction with a larger inter-molecular π-π interaction is orderly oriented in the film plane.
The detailed steps and conditions of the preparation method of organic semiconductor crystalline films are as follows:
1. Preparation of an ordered substrate:
An organic semiconductor ordered molecular layer 4 is deposited on a substrate 8 by using molecular vapor phase deposition method, thereby constituting an ordered substrate 9, under a vacuum degree of 10−4 Pa, at a temperature of the substrate of 35 to 200° C.
The organic semiconductor ordered molecular layer 4, as a part of the ordered substrate 9, may be an ordered multi-molecular layer or a mono-molecular layer, which employs p-type semiconductor materials selected from the group consisting of 5,5′-di(4-biphenyl)-2,2′-dithiophene (BP2T), 5,5′″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″-tetrathiophene (NaT4), pentacene, hexathiophenyl (6T), para-hexaphenyl (6P) or triphenanthrene (Ph3).
2. Preparation of a weak oriented epitaxially grown organic crystalline film:
An organic semiconductor crystalline film 5 having a thickness of 10 nm to 50 nm is deposited on the organic semiconductor ordered molecular layer 4 of the ordered substrate 9 by using molecular vapor phase deposition method, at a temperature of the substrate of 30 to 200° C.;
The crystalline film 5 employs one or more materials selected from a p-type semiconductor material such as copper phthalocyanine (CuPc), zinc phthalocyanine (ZnPc), nickel phthalocyanine (NiPc), cobalt phthalocyanine (CoPc), free phthalocyanine (H2Pc), platinum phthalocyanine (PtPc), lead phthalocyanine (PbPc), Pentacene, 6P, BP2T, 5,5′-di(2-naphthyl)-2,2′-dithiophene (NaT2), 5,5″-di(2-naphthyl)-2,2′:5′,2″-trithiophene (NaT3), NaT4, 5,5″″-di(2-naphthyl)-2,2′:5′,2′:5″,2′″:5′″,2″″-pentathiophene (NaT5), 5,5′″″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″:5′″,2″″:5″″,2″″″-hexathiophene (NaT6), 2,5-di(2-naphthyl)-[3,2-b]bidithiophene (NaTT), 5,5′-di(2-naphthyl)-2,2′-di[3,2-b]bidithiophene (NaTT2), 5,5′-di(2-thianaphthenyl)-2,2′-dithiophene (TNT2), 5,5″-di(2-thianaphthenyl)-2,2′:5′,2″-trithiophene (TNT3), 5,5′″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″-tetrathiophene (TNT4), 5,5″″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″:5′″,2″″-pentathiophene (TNT5), 2,5-di(2-thianaphthenyl)-[3,2-b]bidithiophene (TNTT), 5,5′-di(2-thianaphthenyl)-2,2′-di[3,2-b]bidithiophene (TNTT2), 5,5′-di(2-phenanthryl)-2,2′-dithiophene (PhT2), 5,5″-di(2-phenanthryl)-2,2′:5′,2″-trithiophene (PhT3), 5,5′″-di(2-phenanthryl)-2,2′:5′,2″:5″,2′″-tetrathiophene (PhT4), 2,5-di(2-phenanthryl)-[3,2-b]bidithiophene (PhTT), and 5,5′-di(2-phenanthryl)-2,2′-di[3,2-b]bidithiophene (PhTT2); and n-type semiconductor material such as copper fluorophthalocyanine (F16CuPc), zinc fluorophthalocyanine (F16ZnPc), iron fluorophthalocyanine (F16FePc), cobalt fluorophthalocyanine (F16CoPc) or fluoro-hexathiophene (DFH-6T).
The third aspect of the present invention is to provide organic transistor devices using organic semiconductor crystalline films as working substances. These organic transistors facilitate the integrated processes of glass substrates and plastic substrates, and can meet the requirements of organic integrated circuits, active matrix liquid crystal displays, active matrix electronic ink displays and active matrix organic luminescence displays.
The fourth aspect of the present invention is to provide organic phototransistor devices using organic semiconductor crystalline films as working substances. These organic phototransistors have significantly increased photo response characteristics, and obviously increased photo sensitivities.
The steps and conditions for preparing organic transistor devices and organic phototransistors by the weak oriented epitaxy growth preparation method using organic semiconductor crystalline films provided by the present invention are as follows:
1. Preparation of an ordered substrate:
A metal film of Ta, Al, Cr, or Mo is plated on a glass substrate or a plastic substrate 1 by using radio-frequency magnetron sputtering method, under the following conditions of the sputtering: a background vacuum degree of 2×10−3 Pa, a pressure of Ar gas of 1 Pa, and a radio-frequency power of 500 W, and is formed into gate 2 by photolithography; a layer of Ta2O5, Al2O3, TiO2, or SiO2 having a thickness of 150-300 nm as insulation layer 3 is formed on the gate 2 by sputtering continuously using radio-frequency magnetron sputtering method; and then, an organic semiconductor ordered mono-molecular layer 4 is deposited on the insulation layer 3 using molecular vapor phase deposition method, thus constituting an ordered substrate, under a vacuum degree of 10−4 Pa, at the temperature of the substrate of 150° C.
The organic semiconductor ordered molecular layer as a part of the ordered substrate may be an ordered mono-molecular layer which is prepared generally by molecular vapor phase deposition method, and the materials employed may be either n-type semiconductor or p-type semiconductor. The semiconductor used in the examples of the present invention is a p-type semiconductor selecting from the group consisting of 5,5′-di(4-biphenyl)-2,2′-dithiophene (BP2T), 5,5′″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″-tetrathiophene (NaT4), pentacene, hexathiophenyl (6T), para-hexaphenyl (6P) or triphenanthrene (Ph3).
2. Preparation of a weak oriented epitaxially grown organic crystalline film:
An organic semiconductor crystalline film 5 having a thickness of 10 nm to 50 nm is deposited on an ordered substrate by using molecular vapor phase deposition method, at a temperature of the substrate within 30-200° C.
The organic semiconductor crystalline films as working substances of transistors are generally prepared by using a molecular vapor phase deposition method or a solution method. They may be either n-type semiconductors or p-type semiconductors. The semiconductors used in the present invention each is a p-type semiconductor such as copper phthalocyanine (CuPc), zinc phthalocyanine (ZnPc), nickel phthalocyanine (NiPc), cobalt phthalocyanine (CoPc), free phthalocyanine (H2Pc), platinum phthalocyanine (PtPc), lead phthalocyanine (PbPc), Pentacene, 6P, BP2T, 5,5′-di(2-naphthyl)-2,2′-dithiophene (NaT2), 5,5″-di(2-naphthyl)-2,2′:5′,2″-trithiophene (NaT3), NaT4, 5,5″″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″:5′″,2″″-pentathiophene (NaT5), 5,5′″″-di(2-naphthyl)-2,2′:5′,2″:5″,2′″:5′″,2″″:5″″,2″″′-hexathiophene (NaT6), 2,5-di(2-naphthyl)-[3,2-b]bidithiophene (NaTT), 5,5′-di(2-naphthyl)-2,2′-di[3,2-b]bidithiophene (NaTT2), 5,5′-di(2-thianaphthenyl)-2,2′-dithiophene (TNT2), 5,5″-di(2-thianaphthenyl)-2,2′:5′,2″-trithiophene (TNT3), 5,5′″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″-tetrathiophene (TNT4), 5,5″″-di(2-thianaphthenyl)-2,2′:5′,2″:5″,2′″:5′″,2″″-pentathiophene (TNT5), 2,5-di(2-thianaphthenyl)-[3,2-b]bidithiophene (TNTT), 5,5′-di(2-thianaphthenyl)-2,2′-di[3,2-b]bidithiophene (TNTT2), 5,5′-di(2-phenanthryl)-2,2′-dithiophene (PhT2), 5,5″-di(2-phenanthryl)-2,2′:5′,2″-trithiophene (PhT3), 5,5′″-di(2-phenanthryl)-2,2′:5′,2″:5″,2′″-tetrathiophene (PhT4), 2,5-di(2-phenanthryl)-[3,2-b]bidithiophene (PhTT), and 5,5′-di(2-phenanthryl)-2,2′-di[3,2-b]bidithiophene (PhTT2); or a n-type semiconductor such as copper fluorophthalocyanine (F16CuPC), zinc fluorophthalocyanine (F16ZnPc), iron fluorophthalocyanine (F16FePc), cobalt fluorophthalocyanine (F16CoPc) or fluoro-hexathiophene (DFH-6T).
3. A layer of Au having a thickness of 60 nm is composted on the semiconductor crystalline film 5 by using vacuum thermal deposition method. The vacuum degree under which the thermal deposition is performed is 10−4 Pa.
The organic transistor devices and the organic phototransistor devices in which organic semiconductor crystalline films are prepared by weak oriented epitaxy growth method are suitable for use in bottom-contact device and top-contact device structures which are shown in
The advantages of the preparation method of the present invention are as follows: the high carrier mobility direction of organic semiconductor crystals with ordered orientation in the film can be controlled, the contacts between crystals can be enhanced, and the mechanical strength and micro-machining property of the film can be improved, and a high carrier mobility of 0.01 cm2/Vs or more is obtained. For example, taking the carrier mobility property of copper phthalocyanine crystal as an example, the carrier mobility is 0.3-1.0 cm2/Vs for single crystal thereof (Appl. Phys. Lett., 2005, 86, 022103; Adv. Mater., 2006, 18, 719-723), 0.04 cm2/Vs for vapor phase deposited film thereof (Appl. Phys. Lett., 2004, 84, 142-144), and 0.0018 cm2/Vs for strong oriented epitaxially grown film thereof (Chem. Mater., 2001, 13, 1341-1348). The carrier mobility of the weak oriented epitaxially grown film of the present invention is 0.24 cm2/Vs, which is 5 times as large as that of vapor phase deposited film, and is similar to that of single crystal. Another advantage of the preparation method of the present invention is that it is suitable for glass substrates and plastic substrates.
The principle of the present invention is to control the interaction between epitaxial molecule and substrate to be weaker than the interaction between epitaxial molecules, under a certain growth temperature, so that the epitaxial molecule may be epitaxially grown in a stand-up manner on the ordered substrate, thereby the crystalline direction with a larger inter-molecular π-π interaction is orderly oriented in the film plane. The two organic semiconductor layers have an epitaxial relationship, thereby forming a more ordered film structure and reducing defect density in the organic semiconductor film, so that the carrier mobility of the organic semiconductor can be enhanced significantly.
The film of the ordered substrate may be an organic semiconductor mono-molecular layer. A heterojunction effect can exist between the organic semiconductor in the mono-molecular layer and the weak epitaxial organic semiconductor, thus discontinuous domains with high electric conductivity can be formed therebetween, which can reduce significantly the close state current and improve simultaneously the electric transport property of the organic semiconductor, thereby stabilizing significantly the working voltage of the device.
Since interactions exist between the organic semiconductor in the mono-molecular layer and the weak epitaxial organic semiconductor, giving a heterojunction effect therebetween, thus showing a different photo-response characteristic. The phototransistors prepared with the organic heterojunctions have higher photo sensitivities.
The present invention is described further by the following examples.
Target materials of Ta2O5, Al2O3, TiO2, and SiO2 used in the present invention were all commercial products, which were employed directly. Glass substrates and plastic substrates were commercial products, and were employed after washing. 6P, ZnPc, and F16CuPc used herein were commercial products which were employed after being purified by sublimation method.
A layer of Ta2O5, Al2O3, TiO2, or SiO2 film having a thickness of 150-500 nm was formed on a glass substrate or plastic substrate 1 by sputtering continuously using radio-frequency magnetron sputtering method. Thereafter, an organic semiconductor 6P ordered molecular layer 4 having a thickness of 5-20 nm was deposited on the Ta2O5, Al2O3, TiO2, or SiO2 film at a growth temperature of 30-180° C. using molecular vapor phase deposition method, thus an ordered substrate was constituted, under a vacuum degree of 10−4 Pa. Thereafter, an organic semiconductor ZnPc or F16CuPc crystalline film 5 having a thickness of 5-20 nm was deposited continuously at a growth temperature within 30-200° C. on the ordered substrate.
The oriented ZnPc film exhibited excellent electric performance and photo response characteristic, with a field effect mobility ten times bigger than that of un-oriented ZnPc film, reaching 0.32 cm2/V s, threshold voltage was −3.2 V, and on/off current ratio was 105.
A layer of Ta2O5, Al2O3, TiO2, or SiO2 film having a thickness of 150-500 nm was formed on a glass substrate or plastic substrate 1 by sputtering continuously using radio-frequency magnetron sputtering method. Thereafter, an organic semiconductor 6P ordered molecular layer 4 having a thickness of 5-20 nm was deposited on the Ta2O5, Al2O3, TiO2, or SiO2 film at a growth temperature of 30-180° C. using molecular vapor phase deposition method, thus an ordered substrate was constituted, under a vacuum degree of 10−4 Pa. Thereafter, an organic semiconductor ZnPc or F16CuPc crystalline film 5 having a thickness of 5-50 nm was deposited continuously at a growth temperature within 30-200° C. on the ordered substrate. The other conditions and results were the same as those of Example 1.
A layer of Ta2O5, Al2O3, TiO2, or SiO2 film having a thickness of 250 nm was formed on a glass substrate or plastic substrate 1 by sputtering continuously using radio-frequency magnetron sputtering method. Thereafter, an organic semiconductor 6P ordered molecular layer 4 having a thickness of 10 nm was deposited on the Ta2O5, Al2O3, TiO2, or SiO2 film at a growth temperature of 90° C. using molecular vapor phase deposition method, thus an ordered substrate was constituted, under a vacuum degree of 10−4 Pa. Thereafter, an organic semiconductor ZnPc or F16CuPc crystalline film 5 having a thickness of 20 nm was deposited continuously at a growth temperature of 50° C. on the ordered substrate. The other conditions and results were same as those of Example 1.
A layer of Ta2O5, Al2O3, TiO2, or SiO2 film having a thickness of 350 nm was formed on a glass substrate or plastic substrate 1 by sputtering continuously using radio-frequency magnetron sputtering method. Thereafter, an organic semiconductor 6P ordered molecular layer 4 having a thickness of 15 nm was deposited on the Ta2O5, Al2O3, TiO2, or SiO2 film at a growth temperature of 120° C. using molecular vapor phase deposition method, thus an ordered substrate was constituted, under a vacuum degree of 10−4 Pa. Thereafter, an organic semiconductor ZnPc or F16CuPc crystalline film 5 having a thickness of 30 nm was deposited continuously at a growth temperature of 100° C. on the ordered substrate. The other conditions and results were same as those of Example 1.
A layer of Ta2O5, Al2O3, TiO2, or SiO2 film having a thickness of 500 nm was formed on a glass substrate or plastic substrate 1 by sputtering continuously using radio-frequency magnetron sputtering method. Thereafter, an organic semiconductor 6P ordered molecular layer 4 having a thickness of 20 nm was deposited on the Ta2O5, Al2O3, TiO2, or SiO2 film at a growth temperature of 180° C. using molecular vapor phase deposition method, thus an ordered substrate was constituted, under a vacuum degree of 10−4 Pa. Thereafter, an organic semiconductor ZnPc or F16CuPc crystalline film 5 having a thickness of 50 nm was deposited continuously at a growth temperature of 200° C. on the ordered substrate. The other conditions and results were same as those of Example 1.
Target materials of Ta2O5, Al2O3, TiO2, and SiO2, and metal electrodes of Au, Al, Cr, and Mo used in the present invention were all commercial products, which were employed directly. Glass substrates and plastic substrates were commercial products, and were employed after washing. CuPc, ZnPc, NiPc, CoPc, H2Pc, PtPc, PbPc, Pentacene, F16CuPc, F16ZnPc, F16FePc and F16CoPc used herein were commercial products which were employed after being purified by sublimation method. 4T, 5T, 6T, 6P, BP2T, NaT2, NaT3, NaT4, NaT5, NaT6, NaTT, NaTT2, TNT2, TNT3, TNT4, TNT5, TNTT, TNTT2, PhT2, PhT3, PhT4, PhTT, PhTT2 and fluoro-hexathiophene (DFH-6T) were synthesized materials (reference documents: Angew. Chem. Int. Ed. 2000, 39, 4547; Heterocycle, 1983, 20, 1937; Chem. Mater. 1995, 7, 2235; J. Am. Chem. Soc. 1984, 106, 4977; J. Heterocyclic Chem. 2000, 37, 281, and patents: CN200510016895.9, CN200510119001.9, and CN200510119064.4), which were employed after being purified by sublimation method.
The first device structure of organic transistors was shown in
The oriented ZnPc film exhibited excellent electric performance and photo response characteristic, with a field effect mobility ten times larger than that of un-oriented ZnPc film, which reached to 0.32 cm2/V s, threshold voltage was −3.2 V, and on/off current ratio was 105.
Performances of devices assembled by different semiconductors and their photo responses under light illumination are listed in Table 1.
The materials and process methods used in this Example were same as those in Example 2.
The device structure using an organic transistor was shown in
Performances of devices assembled by different semiconductors and their photo responses under light illuminating are listed in Table 2.
The materials and process methods used in this Example were same as those in Example 2. A soluble p-type organic semiconductor, bi(3,3′″-dilauryl-2,2′:5′,2″:5″,2′″-tetrathiophene) (BQT-12) was synthesized according to reference document (J. Am. Chem. Soc., 2004, 126, 3378). A soluble p-type organic semiconductor, tri(3,3′″-dilauryl-2,2′:5′,2″:5″,2′″-tetrathiophene) (TQT-12) was synthesized according to reference documents (Adv. Mater., 1999, 11, 1378; Chem. Mater., 2003, 15, 4352; and Synthesis, 1993, 1099).
The device structure using an organic transistor was shown in
Performances of devices assembled by different semiconductors and their photo responses under light illumination are listed in Table 3.
The present invention is not limited to the above Examples. Generally, the organic semiconductor crystalline films prepared by the weak oriented epitaxy growth method according to the present invention are useful in other organic semiconductor members, and are members for forming two-dimensional and three-dimensional integrated devices. These integrated devices are applicable in flexible integrated circuits, active matrix displays and photovoltaic cells. A low-temperature machining can be achieved by using the electronic members according to the present invention.
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20070262303 A1 | Nov 2007 | US |