Patent Application
20220140265
The present disclosure relates to an organic semiconductor device, a method for manufacturing an organic semiconductor single crystal film, and a method for manufacturing an organic semiconductor device.
In recent years, interest in organic semiconductors has been increasing. As features of organic semiconductors, unlike conventional inorganic semiconductors of amorphous silicon and polycrystalline silicon, it mentions that it is excellent in flexibility, that it can be inexpensively enlarged in area by roll to roll processing, etc., and applications of organic semiconductors as post-silicon semiconductors to electronic devices of the next generation type are examined.
In particular, it is known that an organic semiconductor device having excellent characteristics can be manufactured by forming an organic semiconductor single crystal film on a hydrophobic substrate, such as a fluorine-based polymer insulating film.
In addition, as a method for manufacturing an organic semiconductor device, a film forming method such as a coating method or a vapor phase growth method (PVT: Physical Vapor Transport) has been conventionally used (Patent Literature 1 and Non-Patent Literature 1), and in particular, by using a coating method in a film forming method, an improvement in use efficiency of a material and a drastic cost reduction can be expected.
However, conventionally, when using the vapor phase growth method, only the organic semiconductor single crystal film having a large thickness of about 2 μm could be obtained, and it was difficult to obtain an organic semiconductor single crystal film with a thinner thickness.
In addition, when a coating method is used, an organic semiconductor film could not be formed on a hydrophobic substrate, such as a fluorine-based polymer insulating film.
Further, since an organic solvent is used in the coating method, it has not been possible to apply an organic semiconductor film on a solvent-soluble substrate. Therefore, for example, it has been difficult to form a pn junction structure composed of an organic semiconductor film by a coating method.
Further, when an electrode film, such as Au, is provided on a substrate, a surface of the electrode film is modified with a self-assembled monolayer (SAM: Self-Assembled Monolayer), such as pentafluorobenzenethiol (PFBT) or 4-methylbenzenethiol (MBT), in order to control the work function of the electrode and to improve carrier implantation from the electrode to the organic semiconductor. However, PFBT film and the MBT film have low heat resistance, and the work function control effect is lowered at about 130 to 150° C. for PFBT and about 100° C. for the MBT (Non-Patent Literature 2). Since the coating method is often performed by heating the substrate to about 80 to 150° C., it is sometimes inappropriate to form an organic semiconductor on a substrate having an electrode film of Au or the like by the coating method.
Thus, when using the vapor phase growth method, it has been impossible to obtain an organic semiconductor single crystal film having a thin film thickness, and when using the coating method, there has been a limitation on the substrate.
Therefore, there has been a need for an organic semiconductor single crystal film that can be disposed on a desired substrate and that has a film thickness thinner than the conventional.
(1) An organic semiconductor device comprising: a substrate; and an organic semiconductor single crystal film on the substrate, wherein an average film thickness of the organic semiconductor single crystal film is 2 to 100 nm, and at least a portion of a surface of the substrate in contact with the organic semiconductor single crystal film is hydrophobic, solvent soluble, non-heat resistant, or a combination thereof.
(2) The organic semiconductor device according to (1) above, wherein an area of the organic semiconductor single crystal film is equal to or greater than 2 mm2.
(3) A method for manufacturing an organic semiconductor single crystal film, comprising: forming an organic semiconductor single crystal film having an average film thickness of 2 to 100 nm on a hydrophilic and non-water-soluble first substrate using a coating method; and separating the organic semiconductor single crystal film from the first substrate by applying water to an interface between the first substrate and the organic semiconductor single crystal film.
(4) The method for manufacturing an organic semiconductor single crystal film according to (3) above, wherein an area of the organic semiconductor single crystal film is equal to or greater than 2 mm2.
(5) The method for manufacturing an organic semiconductor single crystal film according to (3) or (4) above, wherein a contact angle of the first substrate is smaller than a contact angle of the organic semiconductor single crystal film, and the difference in the contact angles between the first substrate and the organic semiconductor single crystal film is 80 degrees or more.
(6) The method for manufacturing an organic semiconductor single crystal film according to any one of (3) to (5) above, wherein the applying water to the interface between the first substrate and the organic semiconductor single crystal film comprises immersing the first substrate on which the organic semiconductor single crystal film is formed in water.
(7) A method for manufacturing an organic semiconductor device, comprising disposing the organic semiconductor single crystal film manufactured by the method for manufacturing an organic semiconductor single crystal film according to any one of (3) to (6) above on a second substrate, wherein at least a part of a surface of the second substrate in contact with the organic semiconductor single crystal film is hydrophobic, solvent soluble, non-heat resistant, or a combination thereof.
(8) The method for manufacturing an organic semiconductor device according to (7) above, wherein the disposing the organic semiconductor single crystal film on the second substrate comprises disposing the second substrate so as to be in contact with the organic semiconductor single crystal film formed on the first substrate while applying water to the interface between the first substrate and the organic semiconductor single crystal film to separate the organic semiconductor single crystal film from the first substrate and dispose the organic semiconductor single crystal film on the second substrate.
(9) The method for manufacturing an organic semiconductor device according to (7) or (8) above, wherein the at least a portion of the surface of the second substrate in contact with the organic semiconductor single crystal film has at least one of a concave portion, a convex portion, an uneven portion, and an electrode.
According to the present disclosure, it is possible to obtain an organic semiconductor single crystal film that can be disposed on a desired substrate and has a thickness thinner than that of a conventional film.
The present disclosure is directed to an organic semiconductor device comprising: a substrate; and an organic semiconductor single crystal film on the substrate, wherein an average film thickness of the organic semiconductor single crystal film is 2 to 100 nm, and at least a portion of a surface of the substrate in contact with the organic semiconductor single crystal film is hydrophobic, solvent soluble, non-heat resistant, or a combination thereof.
The average film thickness of the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure is 2 to 100 nm, preferably 4 to 20 nm. By having the average film thickness of the organic semiconductor single crystal film in the range, good device characteristics can be obtained. The average film thickness of the organic semiconductor single crystal film can be measured using a stylus type surface profile measuring instrument or an atomic force microscope.
The organic semiconductor single crystal film in the organic semiconductor device of the present disclosure preferably has 1 molecular layer to 50 molecular layers, more preferably 1 molecular layer to 10 molecular layers, and still more preferably 1 molecular layer to 5 molecular layers in the thickness direction. The organic semiconductor single crystal film in the organic semiconductor device of the present disclosure most preferably has one molecular layer, but may have two or more molecular layers in the thickness direction. The number of molecular layers of the organic semiconductor single crystal film can be measured by an atomic force microscope.
The thickness of one molecular layer of the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure is preferably 2 to 6 nm, more preferably 2 to 4 nm. The thickness of one molecular layer of the organic semiconductor single crystal film can be measured by combining with single crystal X-ray structure analysis and atomic force microscope observation.
The area of the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure is preferably 2 mm2 or more, more preferably 10 mm2 or more, even more preferably 100 mm2 or more, even more preferably 1000 mm2 or more, and even more preferably 10000 mm2 or more. The upper limit of the area of the organic semiconductor single crystal film is not particularly limited, and may be limited by the size of the manufacturing facility and may be, for example, 10 m2. Conventionally, when a vapor phase growth method is used, only an organic semiconductor single crystal film having an area of at most about 1 mm2 could be obtained, whereas the organic semiconductor device of the present disclosure can have a large area as described above.
The organic semiconductor single crystal film in the organic semiconductor device of the present disclosure is composed of a single domain or multi-domain, and preferably is composed of a single domain. The domain of the organic semiconductor single crystal film can be measured by single crystal X-ray diffraction. The organic semiconductor single crystal film of the organic semiconductor device of the present disclosure preferably has a single domain with a contiguous area of 0.005 mm2 or more, more preferably 0.5 mm2 or more, and even more preferably 2.0 mm2 or more. It should naturally be understood that the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure may be incorporated into the organic semiconductor device in a state in which the organic semiconductor single crystal film having a single domain of the above preferred contiguous area has been separated. For example, the organic semiconductor single crystal film having a single domain of the above preferred contiguous area may be separated into a plurality of organic semiconductor single crystal films and incorporated into the organic semiconductor device, and/or an unwanted portion of the organic semiconductor single crystal film having a single domain of the above preferred contiguous area may be etched by photolithography or the like, and may be separated into a plurality of organic semiconductor single crystal films and incorporated into the organic semiconductor device. The separation of each organic semiconductor film in the organic semiconductor device allows it to be electrically isolated from the other elements. The fact that each separated organic semiconductor single crystal film is obtained from a single crystal film with aligned crystal axis directions can be confirmed by measurement by single crystal X-ray diffraction or electron diffraction, or by observation with a polarizing microscope.
The organic semiconductor single crystal film in the organic semiconductor device of the present disclosure exhibits a mobility of preferably 0.5 cm2/V·s or more, more favorably 3.0 cm2/V·s or more, more favorably 5.0 cm2/V·s or more, more favorably 7.5 cm2/V·s or more, and more favorably 10 cm2/V·s or more. The mobility of the organic semiconductor single crystal film can be calculated from the measurement results of the organic field effect transistor.
In the organic semiconductor device of the present disclosure, at least a portion of the surface of the substrate in contact with the organic semiconductor single crystal film has characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof. Preferably, the entire surface of the substrate in contact with the organic semiconductor single crystal film has the characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof, and more preferably, the entire substrate has the characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof.
In the present application, hydrophobicity may have preferably a contact angle of 80 degrees or more, more preferably a contact angle of 90 degrees or more, still more preferably 100 degrees or more, still more preferably 110 degrees or more, and still more preferably 150 degrees or more.
In the organic semiconductor device of the present disclosure, at least a part of the surface of the substrate in contact with the organic semiconductor single crystal film, preferably the entire surface of the substrate in contact with the organic semiconductor single crystal film, more preferably the entire substrate exhibits hydrophobicity in the above preferable range, whereby when a device is manufactured using an organic semiconductor single crystal film disposed on the hydrophobic substrate, moisture (adsorbed molecules) that can be attached to the substrate can be reduced or eliminated, and a device having favorable characteristics without influence of moisture can be manufactured.
Examples of the hydrophobic substrate include parylene (contact angle: about 80 to 90 degrees), CYTOP (registered trademark) (contact angle: 110 degrees) which is a fluorine-based polymer, and the like.
In the present application, the solvent soluble means substantially dissolving, decomposing, or swelling in an organic solvent, and means substantially dissolving, decomposing, or swelling with respect to an organic solvent conventionally used in a coating method, for example, toluene, dichlorobenzene, or the like.
In the organic semiconductor device of the present disclosure, at least a part of the surface of the substrate in contact with the organic semiconductor single crystal film, preferably the entire surface of the substrate in contact with the organic semiconductor single crystal film, more preferably the entire substrate may be soluble in a solvent. Therefore, at least a part of the surface of the substrate in contact with the organic semiconductor single crystal film, preferably the entire surface of the substrate in contact with the organic semiconductor single crystal film, more preferably the entire substrate may be a p-type organic semiconductor film or an n-type organic semiconductor film, or may be a laminate comprising a p-type organic semiconductor film and an n-type organic semiconductor film. Therefore, the substrate in the electronic device of the present disclosure may include a pn junction structure, a pnp junction structure, or an npn junction structure formed of an organic semiconductor film.
In the present application, the non-heat resistance preferably means that the glass transition point is 90° C. or less, or sublimation, melting, or decomposition occurs at 90° C. or less, and more preferably means that the glass transition point is 120° C. or less, or sublimation, melting, or decomposition occurs at 120° C. or less.
In the organic semiconductor device of the present disclosure, at least a part of the surface of the substrate in contact with the organic semiconductor single crystal film, preferably the entire surface of the substrate in contact with the organic semiconductor single crystal film, more preferably the entire substrate may be non-heat resistant. Therefore, at least a part of the surface of the substrate in contact with the organic semiconductor single crystal film, preferably the entire surface of the substrate in contact with the organic semiconductor single crystal film, more preferably the entire substrate, may be a substrate having an electrode film of Au or the like modified with a self-assembled monolayer (SAM: self-assembled monolayer), such as pentafluorobenzene thiol (PFBT), for example. The organic semiconductor single crystal film can be disposed on such a modifying material having low heat resistance, such as PFBT or the like.
The type of the organic semiconductor constituting the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure is not particularly limited, and for example, a polycyclic aromatic compound of four or more rings, or a polycyclic compound of four or more rings formed of one or more unsaturated five-membered heterocyclic compounds and a plurality of benzene rings can be used.
The organic semiconductor constituting the organic semiconductor single-crystal film in the organic semiconductor device of the present disclosure is preferably a material having a high self-aggregation ability, such as a p-type organic semiconductor Cn-DNBDT-NW of the following formula (1) exhibiting a high mobility.
In formula (1), n may be 1 to 14. The self-aggregation ability refers to a tendency of molecules to spontaneously aggregate and crystallize as the molecules precipitate from a solvent.
Other examples of the organic semiconductor constituting the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure are shown in the following formulas (2) to (6).
In the polythiophene semiconductor represented by Formula (2), R1 and R2 are each independently a hydrogen atom or an alkyl group having 4 to 10 carbon atoms. The alkyl group may comprise a heteroatom (typically selected from an oxygen atom and a sulfur atom). In addition, R1 and R2 together can form a ring. For reasons of self-aggregation ability, preferably, R1 and R2 are each independently a hydrogen atom or an alkyl group having 5 to 8 carbon atoms. More preferably, each of R1 and R2 is independently a hydrogen atom or a hexyl group.
The n represents an integer of 5 to 100. The n indicates the average number of thiophene monomer units in the polythiophene semiconductor, i.e., the length of the polythiophene chain. From the viewpoint of forming the single crystal film, the n is preferably 50 or less.
In Formula (3), each of R3, R4, R5 and R6 is independently a hydrogen atom or an alkyl group having 1 to 14 carbon atoms. The alkyl group may comprise a heteroatom (typically selected from an oxygen atom and a sulfur atom), and the hydrogen atom in the alkyl group may be substituted with a substituent, such as a halogen atom. For reasons of self-aggregation ability, R4=R5 is preferred, and R3=R6 is preferred. From the viewpoint of solubility, preferably, R4 and R5 are hydrogen atoms, and R3 and R6 are each independently an alkyl group having 1 to 14 carbon atoms, or R3 and R6 are hydrogen atoms, and R4 and R5 are each independently an alkyl group having 1 to 14 carbon atoms. More preferably, R3 and R6 are hydrogen atoms, and R4 and R5 are each independently an alkyl group having 1 to 14 carbon atoms. For reasons of self-aggregation ability, the carbon number of the alkyl group is preferably from 4 to 12, more preferably from 6 to 10.
In Formula (4), each of R7, R8, R9 and R10 is independently a hydrogen atom or an alkyl group having 1 to 14 carbon atoms. The alkyl group may comprise a heteroatom (typically selected from an oxygen atom and a sulfur atom), and the hydrogen atom in the alkyl group may be substituted with a substituent, such as a halogen atom. For reasons of self-aggregation ability, R7=R9 is preferred, and R8=R10 is preferred. From the viewpoint of solubility, preferably, R7 and R9 are hydrogen atoms, and R8 and R10 are each independently an alkyl group having 1 to 14 carbon atoms, or R8 and R10 are hydrogen atoms, and R7 and R9 are each independently an alkyl group having 1 to 14 carbon atoms. More preferably, R8 and R10 are hydrogen atoms, and R7 and R9 are each independently an alkyl group having 1 to 14 carbon atoms. For reasons of self-aggregation ability, the carbon number of the alkyl group is preferably from 6 to 13, more preferably from 8 to 10.
In Formula (5), each of R11, R12, R13 and R14 is independently a hydrogen atom or an alkyl group having 1 to 14 carbon atoms. The alkyl group may comprise a heteroatom (typically selected from an oxygen atom and a sulfur atom), and the hydrogen atom in the alkyl group may be substituted with a substituent, such as a halogen atom. For reasons of self-aggregation ability, R11=R13 is preferred, and R12=R14 is preferred. From the viewpoint of solubility, preferably, R11 and R13 are hydrogen atoms, and R12 and R14 are each independently an alkyl group having 1 to 14 carbon atoms, or R12 and R14 are hydrogen atoms, and R11 and R13 are each independently an alkyl group having 1 to 14 carbon atoms. More preferably, R12 and R14 are hydrogen atoms, and R11 and R13 are each independently an alkyl group having 1 to 14 carbon atoms. For reasons of self-aggregation ability, the number of carbon atoms of the alkyl group is preferably from 5 to 12, more preferably from 8 to 10.
In formula (6), R15, R16, R17 and R18 are each independently a hydrogen atom or an alkyl group having 1 to 14 carbon atoms. The alkyl group may comprise a heteroatom (typically selected from an oxygen atom and a sulfur atom), and the hydrogen atom in the alkyl group may be substituted with a substituent, such as a halogen atom. For reasons of self-aggregation ability, R15=R17 is preferred, and R16=R18 is preferred. From the viewpoint of solubility, preferably, R16 and R18 are hydrogen atoms, and R15 and R17 are each independently an alkyl group having 1 to 14 carbon atoms, or R15 and R17 are hydrogen atoms, and R16 and R18 are each independently an alkyl group having 1 to 14 carbon atoms. More preferably, R16 and R18 are hydrogen atoms, and R15 and R17 are each independently an alkyl group having 1 to 14 carbon atoms. For reasons of self-aggregation ability, the number of carbon atoms of the alkyl group is preferably from 5 to 12, more preferably from 8 to 10.
Yet another examples of the organic semiconductor constituting the organic semiconductor single crystal film in the organic semiconductor device of the present disclosure are shown in the following formulas (7) to (15). In Formula (7) to Formula (15), R may be linear alkyl, branched alkyl, fluorinated linear/branched alkyl, triisopropylsilylethynyl, phenyl, or the like.
The organic semiconductor single crystal film can be confirmed to be single crystal by observing the organic semiconductor single crystal film with a transmission electron microscope (TEM).
The organic semiconductor device of the present disclosure can be an organic EL (electroluminescence) element, an organic solar cell element, an organic photoelectric conversion element, an organic transistor element, an organic field effect transistor element, or the like.
The present disclosure is also directed to a method for manufacturing an organic semiconductor single crystal film, comprising: forming an organic semiconductor single crystal film having an average film thickness of 2 to 100 nm on a hydrophilic and non-water-soluble first substrate using a coating method, and separating the organic semiconductor single crystal film from the first substrate by applying water to an interface between the first substrate and the organic semiconductor single crystal film.
According to the method for manufacturing an organic semiconductor single crystal film of the present disclosure, it is possible to provide an organic semiconductor single crystal film that can be disposed on a desired substrate and has a thickness thinner than that of a conventional film.
In the method for manufacturing an organic semiconductor single crystal film of the present disclosure, an organic semiconductor single crystal film having an average film thickness of 2 to 100 nm is formed on a hydrophilic and non-water-soluble first substrate by a coating method. The coating method is a method in which an organic semiconductor is dissolved in an organic solvent to prepare an organic semiconductor solution, the organic semiconductor solution is applied on a substrate, and the organic solvent is evaporated to form a film. As the organic solvent, an organic solvent conventionally used in a coating method can be used, and for example, toluene, dichlorobenzene, or the like can be used.
In the method for manufacturing an organic semiconductor single crystal film of the present disclosure, a method conventionally used can be used as a coating method, and for example, an edge casting method, a continuous edge casting method, a drop casting method, a spin coating method, a printing method (ink jet method or gravure printing method), a dispenser method, a spray method, a dip coating method, a die coater method, a roll coater method, a bar coater method, a blade coating method, or the like can be used.
The first substrate is a hydrophilic substrate having a contact angle of water of preferably 20 degrees or less, more preferably 10 degrees or less. The first substrate is non-water-soluble and can be, for example, mica or glass. Since the first substrate is non-water-soluble, when water is applied to the interface between the first substrate and the organic semiconductor single crystal film, components of the first substrate are not eluted and do not adhere to or react with the organic semiconductor single crystal film, so that a high-purity organic semiconductor single crystal film can be obtained. Further, when applying water to the interface between the first substrate and the organic semiconductor single crystal film, in order to maintain the shape of the first substrate without collapsing, it is possible to separate the organic semiconductor single crystal film from the first substrate without distorting the shape of the organic semiconductor single crystal film. The non-water-soluble means that it does not substantially dissolve, decompose, or swell in water. The glass is preferably subjected to a hydrophilic treatment on the surface by UV-ozone treatment or a hydrophilic coating material or the like.
Water is applied to the interface between the first substrate and the organic semiconductor single crystal film to separate the organic semiconductor single crystal film from the first substrate. Since a molecule of the organic semiconductor single crystal film applied to the first substrate is hydrophobic, water enters between the hydrophilic first substrate and the molecule of the hydrophobic organic semiconductor single crystal film, and the organic semiconductor single crystal film can be separated from the first substrate.
The water contact angle of the hydrophilic first substrate is smaller than the water contact angle of the hydrophobic organic semiconductor single crystal film, and the difference in the water contact angle between the first substrate and the organic semiconductor single crystal film is preferably 80 degrees or more, more preferably 90 degrees or more. The contact angle of the organic semiconductor single crystal film is preferably 100 to 120 degrees. When the difference in the contact angle between the hydrophilic first substrate and the hydrophobic organic semiconductor single crystal film is within the preferable range, the organic semiconductor single crystal film can be more stably peeled off from the first substrate.
The method of applying water to the interface between the first substrate and the organic semiconductor single crystal film is not particularly limited, and may include immersing the first substrate on which the organic semiconductor single crystal film is formed in water, dropping a dropper of water at the interface between the first substrate and the organic semiconductor single crystal film, or the like.
The method of applying water to the interface between the first substrate and the organic semiconductor single crystal film preferably comprises immersing the first substrate on which the organic semiconductor single crystal film is formed in water. By immersing the first substrate on which the organic semiconductor single crystal film is formed in water, the organic semiconductor single crystal film is separated from the first substrate in water, and an organic semiconductor single crystal film which is self-standing in water can be obtained. The self-standing organic semiconductor single crystal film can be disposed on any substrate, such as a hydrophobic substrate, a solvent-soluble substrate, a non-heat-resistant substrate, or a substrate having a concave portion, a convex portion, an uneven portion, or an electrode, or a mesh-shaped or grid-shaped substrate in the organic semiconductor device described above.
With respect to the average film thickness, molecular layer, area, domain, and mobility of the organic semiconductor single crystal film obtained by the method for manufacturing the organic semiconductor single crystal film of the present disclosure, the contents relating to the organic semiconductor single crystal film in the organic semiconductor device described above can be applied.
The present disclosure is also directed to a method for manufacturing an organic semiconductor device, comprising disposing an organic semiconductor single crystal film manufactured by the method for manufacturing an organic semiconductor single crystal film described above on a second substrate, wherein at least a portion of a surface of the second substrate in contact with the organic semiconductor single crystal film is hydrophobic, solvent soluble, non-heat resistant, or a combination thereof.
In the method for manufacturing an organic semiconductor device of the present disclosure, the organic semiconductor single crystal film separated from the first substrate by the method for manufacturing the organic semiconductor single crystal film described above is disposed on the second substrate.
At least a portion of the surface of the second substrate on which the organic semiconductor single crystal film is disposed in contact with the organic semiconductor single crystal film has characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof. Preferably, the entire surface of the second substrate in contact with the organic semiconductor single crystal film has the characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof, and more preferably, the entire second substrate has the characteristics of hydrophobicity, solvent solubility, non-heat resistance, or a combination thereof.
As for the contents relating to the hydrophobicity, the solvent solubility, and the non-heat resistance of the second substrate, the contents described in terms of the hydrophobicity, the solvent solubility, and the non-heat resistance of the substrate of the organic semiconductor device described above can be applied.
The disposing the organic semiconductor single crystal film on the second substrate preferably comprises separating the organic semiconductor single crystal film from the first substrate by applying water to the interface between the first substrate and the organic semiconductor single crystal film while disposing the second substrate so as to be in contact with the organic semiconductor single crystal film formed on the first substrate, and disposing the organic semiconductor single crystal film on the second substrate. By thus separating the organic semiconductor single crystal film from the first substrate while disposing the second substrate so as to contact the organic semiconductor single crystal film, it is possible to transfer the organic semiconductor single crystal film directly from the first substrate to the second substrate.
Alternatively, the disposing the organic semiconductor single crystal film on the second substrate preferably comprises immersing the first substrate having the organic semiconductor single crystal film formed thereon in water, separating the organic semiconductor single crystal film from the first substrate in water to obtain a self-standing organic semiconductor single crystal film, and disposing the organic semiconductor single crystal film on the second substrate in water. Thus, in water, by disposing a free-standing organic semiconductor single crystal film on the second substrate, it is possible to easily transfer the organic semiconductor single crystal film from the first substrate to the second substrate.
More preferably, the disposing the organic semiconductor single crystal film on the second substrate comprises immersing the first substrate, the organic semiconductor single crystal film, and the second substrate in water while disposing the second substrate so as to be in contact with the organic semiconductor single crystal film formed on the first substrate, and transferring the organic semiconductor single crystal film from the first substrate to the second substrate. In this manner, by separating the organic semiconductor single crystal film from the first substrate while disposing the second substrate in contact with the organic semiconductor single crystal film in water, the organic semiconductor single crystal film can be more easily transferred from the first substrate to the second substrate.
At least a portion of the surface in contact with the organic semiconductor single crystal film of the second substrate may have at least one of a concave portion, a convex portion, an uneven portion, and an electrode.
Conventionally, when fabricating a transistor having a top gate structure by a coating method, it is necessary to apply an organic semiconductor on a substrate in which an electrode is arranged, due to the difference in surface energy between the electrode and the substrate, and the difference in step between the convex portion of the electrode and the concave portion of the substrate, the crystallinity and thickness of the organic semiconductor cannot be uniformly formed, making it difficult to obtain good transistor characteristics.
According to the method for manufacturing an organic semiconductor of the present disclosure, even if the second substrate has an electrode, the organic semiconductor single crystal film peeled off from the first substrate is brought into contact with the second substrate, whereby the organic semiconductor single crystal film can be disposed with a uniform thickness on the second substrate having the electrode.
The second substrate may have a concave portion, a convex portion, or an uneven portion, attributable to the electrode or not attributable to the electrode. The concave portion, convex portion, or an uneven portion can be rectangular in shape, curved in shape, or a combination thereof. The depth of the concave portion, the height of the convex portion, and the depth of the uneven portion (the distance in the thickness direction of the substrate between the lowest portion of the concave portion and the highest portion of the convex portion) on the second substrate are each preferably greater than 0 nm and equal to or less than 30 nm.
A natural mica substrate was prepared as a hydrophilic substrate. As an organic semiconductor, a powder of p-type organic semiconductor C9-DNBDT-NW of the following formula (16), which shows high mobility, was prepared.
3-chlorothiophene was used as a solvent, and the organic semiconductor powder was dissolved in the solvent to prepare an organic semiconductor solution. The prepared organic semiconductor solution was coated on the mica substrate heated to 100° C. by the continuous edge casting method, and an organic semiconductor single crystal film having an average thickness of 12 nm and an area of 200 mm2 as shown in
As shown in
In the same manner as in Example 1, an organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed on a mica substrate.
As a hydrophobic substrate, a CYTOP (registered trademark)/SiO2/Si substrate in which CYTOP (registered trademark)-809M was deposited was prepared.
As shown in
As shown in
In the same manner as in Example 1, an organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed on a mica substrate.
As a hydrophobic substrate, a parylene/SiO2/Si substrate in which parylene (diX-SR (registered trademark)) was deposited was prepared.
As shown in
In the same manner as in Example 1, an organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed on a mica substrate.
As a solvent-soluble substrate, as shown in
As shown in
An organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed in the same manner as in Example 1 except that an Eagle glass (manufactured by Corning) subjected to UV/ozone treatment was used as an hydrophilic substrate instead of the mica substrate.
As a hydrophobic substrate, a parylene (diX-SR (registered trademark))/polyimide (PI) substrate with Au electrodes as S/D electrodes (source/drain electrodes) was prepared as shown in
The parylene (diX-SR(registered trademark))/polyimide (PI) substrate with the Au electrodes (S/D electrode) modified by PFBT was arranged on the organic semiconductor single crystal film formed on the Eagle glass substrate so that the Au electrodes (S/D electrode) modified by PFBT were in contact with the organic semiconductor single crystal film, water was dropped at the interface between the Eagle glass substrate and the organic semiconductor single crystal film, the organic semiconductor single crystal film was separated from the Eagle glass substrate, and the organic semiconductor single crystal film was transferred onto the Au electrode and the parylene substrate modified by PFBT as shown in
Further, as shown in
An organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed in the same manner as in Example 1 except that an Eagle glass (manufactured by Corning) subjected to UV/ozone treatment was used as the hydrophilic substrate instead of the mica substrate.
As a hydrophobic substrate, a CYTOP (registered trademark)/SiO2/Si substrate with Au electrodes as S/D electrodes (source/drain electrodes) was prepared as shown in
The Eagle glass with PFBT-modified Au electrodes (S/D electrodes) was placed so that the Au electrodes (S/D electrodes) modified with PFBT were in contact with the organic semiconductor single crystal film deposited on the Eagle glass substrate. Water was dropped at the interface between the Eagle glass substrate and the organic semiconductor single crystal film, the organic semiconductor single crystal film was peeled off from the Eagle glass substrate, and the organic semiconductor single crystal film was transferred to the Au electrode modified with PFBT and the CYTOP (registered trademark) substrate as shown in
Further, as shown in
An organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed in the same manner as in Example 1 except that an Eagle glass (manufactured by Corning) subjected to UV/ozone treatment was used as the hydrophilic substrate instead of the mica substrate.
As a hydrophobic substrate, a CYTOP (registered trademark)/SiO2/Si substrate in which CYTOP (registered trademark)-809M was deposited was prepared.
The CYTOP (registered trademark)/SiO2/Si substrate was arranged so that the CYTOP (registered trademark) was in contact with the organic semiconductor single crystal film formed on the Eagle glass subjected to the UV/ozone treatment, water was dropped at the interface between the Eagle glass and the organic semiconductor single crystal film, and the organic semiconductor single crystal film of 1.7 cm2 was peeled off from the Eagle glass substrate and transferred onto the CYTOP (registered trademark).
Twenty-four organic field-effect transistors were fabricated using the obtained organic semiconductor single crystal film, and the mobility of the saturation region and the mobility of the linear region were measured. The average mobility of the saturation region was 10.8±1.8 cm2/V·s, and the average mobility of the linear region was 9.9±2.1 cm2/V·s.
An organic semiconductor single crystal film of the p-type organic semiconductor C9-DNBDT-NW of Formula (16) was formed in the same manner as in Example 1 except that an Eagle glass (manufactured by Corning) subjected to UV/ozone treatment was used as the hydrophilic substrate instead of the mica substrate.
A glass substrate with a thickness of 30 μm was prepared for single crystal X-ray diffraction measurement. The glass substrate was placed so as to be in contact with the organic semiconductor single crystal film formed on the Eagle glass subjected to UV and ozone treatment, and water was dropped at the interface between the organic semiconductor single crystal film and the Eagle glass substrate, and the organic semiconductor single crystal film was peeled off from the Eagle glass substrate and transferred onto the glass substrate.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-030776 | Feb 2019 | JP | national |
The present application is a National Phase of International Application Number PCT/JP2020/006597, filed Feb. 19, 2020, and claims priority to Japanese Application number 2019-030776, filed Feb. 22, 2019.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2020/006597 | 2/19/2020 | WO | 00 |
