The present invention refers to a photodetector in particular of the type
based on an organic semiconductor. The use of organic semiconductor polymers is known in the photodetector sector, such as in the U.S. Pat. No. 5,698,048. It describes a photodetector made up in sequence of a conductor layer of aluminum, a layer of polymer having photosensitive properties, a transparent conductor layer of indium/tin oxide (ITO), and then a layer of glass that acts as substrate. The terminals for connecting the photodetector to the external measuring circuits are applied to the two conductor layers. The light passes through the glass, the transparent conductor layer and hits the layer of photosensitive polymer, activating it.
In view of the state of the art described, an object of the present invention is to provide a photodetector that is simpler to construct and more versatile.
In accordance with the present invention, this and other objects are achieved by means of a photodetector comprising a not electrically conductive substrate having a first surface; characterized in that it comprises: a first and a second conductive electrode deposited on said first surface; an organic semi conductive material deposited on said first surface in contact with said first and second conductive electrodes.
Thanks to the present invention a planar type photodetector can be constructed whose active part receives the light directly without material placed therebetween, therefore the electrodes and the substrate do not need to be transparent. With the structure of the present invention an extremely small capacity between the electrodes is obtained and thus the resolution in reading the electric signal is considerable. In addition the deposit of the electrodes can be carried out before the deposit of the organic material that is sensitive to the light and thus the two technologies can be optimized without disturbing each other.
The characteristics and advantages of the present invention will appear evident from the following detailed description of an embodiment thereof, illustrated as non-limiting example in the enclosed drawings, in which:
Now in reference to
The substrate 10 can be made up of any non-electrically conductive material for example quartz, glass, silicon, silicon oxide, silicon nitride, plastic, fabric, wood, paper. The substrate 10 can thus be rigid or flexible and its surface is not necessarily flat and smooth. Clearly if the substrate is a transparent material the light can reach the organic semi conductive material 13 from both sides.
The material of the electrodes 11 and 12 can be made up of any electrically conductive material, compatibly with the material used for the organic semi conductive material 13, for example conductor metals (aluminum, silver, gold), organic conductive materials, conductor oxides (for example indium and tin oxide), graphite and conductive pastes.
So as to diminish the leakage current the electrodes 11 and 12 can be made up of two conducting materials different from each other, one for the electrode connected to the more positive potential, and another one for the electrode connected to the more negative potential. The material is to be chosen so as to have a suitable work function in relation to the organic semiconductor used, such to reduce the passage of charge when polarized without incident light.
The organic semi conductive material 13 can be made up for example of mLPPP (methyl substituted Ladder type Poly Para Phenylene) particularly suitable for the absorption of ultra-violet radiation with wavelength lower than 450 nm, or of PPV—Poly-PhenyleneVinylene particularly suitable for absorption wavelengths in the visible with wavelength between 350 nm and 520 nm, or of substituted dithiolene metal particularly suitable for the absorption of radiation in the near infrared, with lengths between 850 nm and 1100 nm, and however any organic semi-conductive material sensitive to ultraviolet radiations and/or visible and/or infrared (of wavelengths between about 100 nm and 1700 nm).
In an embodiment of the invention according to the structure of
Other construction processes of the photodetector can be used, in relation to the materials used, well known to a technician in the sector.
We now refer to
In alternative the substrate 10 can be of any other shape, for example circular (as can be seen in
The electrodes 11 and 12 can be made up of one or more couples of spirals interconnected depending on the dimensions and the forms that the substrate 10 can have.
The photodetector is in this case constructed on a cutting surface of an optical fiber 50, that is the substrate in this case is an optical fiber 50.
In this case the light arrives directly via an optical fiber on the organic semi conductive material 13. The electrodes 11 and 12 in this case can be either of the type in
To facilitate fastening the two terminals 14 and 15, or any other connection means, in consideration of the dimensions of an optical fiber, provision can be made to deposit the conductive material of the electrodes 11 and 12 also on the side surface of the fiber itself as can be seen in the portion 51 for the electrode 11. In this manner a wider surface is made available for the connection of the two terminals 14 and 15, or any other connection means, to the photodetector.
The current photodetectors of inorganic semiconductor (Si, GaAs etc.) are devices in themselves mounted in the receiver. Each photodetector has to be aligned with the corresponding optical fiber. Also in the hypothesis of perfect alignment between fiber and detector, one part of the optical power available in fiber has no incidence on the sensitive area of the detector because of the index differences of refraction to the fiber-air and air-detector interfaces. All a possible misalignment between fiber and detector does is to accentuate such losses. The detector in accordance with the present invention is instead directly integrated on the optical fiber and therefore does not suffer from losses of beams by geometric effects. As the active material is made up of an organic semiconductor, it has a refraction index that is very similar to that of the fiber, thus minimizing also the losses by reflection at the interfaces. Having an optical fiber available with one extremity equipped with the detector, the positioning in the connection stage of the optical fiber cable will have to be done from the arrival point (receiver) towards the departure point (transmitter) where the fiber can be cut to measure on site.
An example of an optical fiber with an integrated photodetector has been given, but in accordance with the present invention, the photodetector can also be applied directly onto a printed circuit or onto an integrated circuit, independently of the devices and the circuits constructed in the integrated below the photodetector.
In this manner, starting from an electronic circuit in silicon by simple deposit of the organic material sensitive to the light an integrated optic electronic micro system can be obtained.
Nothing prohibits the application of a plurality of photodetectors on the above mentioned substrates in any spatial arrangement (linear or matrix) depending on the specific application.
Number | Date | Country | Kind |
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MI2002A 000231 | Feb 2002 | IT | national |
Filing Document | Filing Date | Country | Kind |
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PCT/EP03/00886 | 1/29/2003 | WO |