Claims
- 1. An organosilicon compound represented by the general formula Si[OSiR.sub.2 Q].sub.4 wherein R denotes a monovalent group having from 1 to 8 carbon atoms and free of aliphatic unsaturation, selected from hydrocarbon and halogen-substituted hydrocarbon groups and Q denotes a group R or a group comprising a block of at least two oxyalkylene units and having a terminal group containing a reactive hydrogen atom, provided that not more than one Q group in the molecule denotes an R group.
- 2. An organosilicon compound as claimed in claim 1 wherein at least 80% of the R groups are methyl.
- 3. An organosilicon compound as claimed in claim 1 wherein the groups Q have the general formula --C.sub.s H.sub.2s [OC.sub.2 H.sub.4 ].sub.n [OC.sub.3 H.sub.6 ].sub.m OH, wherein s is an integer of from 3 to 6 inclusive, n is an integer of from 5 to 100 inclusive and m is zero or an integer of from 1 to 80 inclusive, n having a value greater than m.
- 4. An organosilicon compound as claimed in claim 3 wherein at least 85% of the oxyalkylene units in Q are oxyethylene units, any remaining oxyalkylene units being oxypropylene.
- 5. A method of treating a substrate which comprises applying thereto a film-forming resin which comprises 100 parts by weight of a curable polyurethane resin and from 10 to 100 parts by weight of an organosilicon compound represented by the general formula Si[OSiR.sub.2 Q].sub.4 wherein R denotes a monovalent group having from 1 to 8 carbon atoms and free of aliphatic unsaturation, selected from hydrocarbon and halogen-substituted hydrocarbon groups and Q denotes a group R or a group of the general formula --C.sub.s H.sub.2s [OC.sub.2 H.sub.4 ].sub.n [OC.sub.3 H.sub.6 ].sub.m OH, wherein s is an integer of from 3 to 6, n is an integer of from 5 to 100 and m is zero or an integer of from 1 to 80, provided that n>m, and that no more than one Q group denotes a group R, and curing the applied composition.
- 6. A method of treating a substrate which comprises forming a self-supporting film from a film-forming resin which comprises 100 parts by weight of a curable polyurethane resin and from 10 to 100 parts by weight of an organosilicon compound represented by the general formula Si[OSiR.sub.2 Q].sub.4 wherein R denotes a monovalent group having from 1 to 8 carbon atoms and free of aliphatic unsaturation, selected from hydrocarbon and halogen-substituted hydrocarbon groups and Q denotes a group R or a group of the general formula--C.sub.s H2.sub.s [OC.sub.2 H.sub.4 ].sub.n [OC.sub.3 H.sub.6 ].sub.m OH, wherein s is an integer of from 3 to 6, n is an integer of from 5 to 100 and m is zero or an integer of from 1 to 80, provided that n>m and that no more than one Q group denotes a group R, and thereafter laminating said film to said substrate.
- 7. A method as claimed in claim 5, wherein the substrate is a textile fabric.
- 8. A method as claimed in claim 6, wherein the substrate is a textile fabric.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9105371 |
Mar 1991 |
GBX |
|
Parent Case Info
This is a division of application(s) Ser. No. 07/844,090, filed on Mar. 2, 1992, now U.S. Pat. No. 5,246,996.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
3384599 |
Omietanski et al. |
May 1968 |
|
3887601 |
Kanner et al. |
Jun 1975 |
|
4052495 |
Uhlmann et al. |
Oct 1977 |
|
4686137 |
Ward, Jr. et al. |
Aug 1987 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
179916 |
Jul 1988 |
JPX |
2087909 |
Nov 1980 |
GBX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
844090 |
Mar 1992 |
|